Simple monocrystalline silicon pressure sensing module

Abstract

The utility model relates to a simple monocrystalline silicon pressure sensing module which comprises a bearing substrate, a monocrystalline silicon sensing film is arranged at the upper end of the bearing substrate, a pressure sensing cavity is formed between the inner side of the monocrystalline silicon sensing film and the bearing substrate, an arc-shaped structure is arranged on the inner side of the monocrystalline silicon sensing film, a plurality of pressure-sensitive sensing assemblies are arranged in the pressure sensing cavity, and the pressure-sensitive sensing assemblies are arranged in the bearing substrate. The monocrystalline silicon sensing film is located on the outer side of the pressure sensing cavity and provided with a plurality of wiring mechanisms, the wiring mechanisms are connected with the corresponding pressure-sensitive sensing assemblies, the bearing substrate is provided with a wire guiding mechanism, the wire guiding mechanism is connected with the wiring mechanisms, and a pressed transmission mechanism is arranged at the circle center position of the arc-shaped dome structure. Therefore, by adopting the arc-shaped dome structure, proper deformation can be generated when pressure fluctuation occurs, so that the pressure-sensitive sensing assembly can capture the pressure conveniently, and the sensing sensitivity is improved. The pressure-sensitive sensing components are distributed in a quartered manner, so that measurement dead angles are avoided, and the pressure change in the current environment can be effectively sensed.

Description

Technical Field

[0001] The utility model relates to a pressure sensing module, in particular to a simple single crystal silicon pressure sensing module. Background Art

[0002] Pressure sensors have become a common electronic component in the field of industrial data acquisition. The characteristics of the sensor module (or sensor chip) that accompanies a pressure sensor determine its overall performance. Currently, sensor modules primarily acquire pressure data by sensing the internal ambient pressure through a corresponding resistor.

[0003] However, applications with large pressure differentials are prone to significant data deviations and acquisition delays. Furthermore, for applications in diverse environments, such as liquids and gases, a single traditional sensor module structure yields poor data accuracy, requiring continuous, multiple acquisition and calibration. This presents limitations for applications requiring single-shot, high-precision data.

[0004] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a simple single-crystal silicon pressure sensor module to make it more valuable for industrial use. Utility Model Content

[0005] In order to solve the above technical problems, the purpose of the present invention is to provide a simple single crystal silicon pressure sensor module.

[0006] The simplified single-crystal silicon pressure sensing module of the present invention includes a carrier substrate, wherein: a single-crystal silicon sensing film is provided at the upper end of the carrier substrate, a pressure-sensing cavity is formed between the inner side of the single-crystal silicon sensing film and the carrier substrate, an arc-shaped structure is provided on the inner side of the single-crystal silicon sensing film, a plurality of pressure-sensitive components are provided in the pressure-sensing cavity, the single-crystal silicon sensing film is located on the outer side of the pressure-sensing cavity, a plurality of wiring mechanisms are provided, the wiring mechanisms are connected to the corresponding pressure-sensitive components, the carrier substrate is provided with a wire mechanism, the wire mechanism is connected to the wiring mechanism, and a pressure transmission mechanism is provided at the center position of the arc-shaped dome structure.

[0007] Furthermore, in the above-mentioned simplified single crystal silicon pressure sensing module, a connecting groove is provided on the upper surface of the carrier substrate, and the lower edge of the single crystal silicon sensing film is connected to the connecting groove.

[0008] Furthermore, in the above-mentioned simplified single crystal silicon pressure sensing module, a plurality of limiting grooves are provided on the upper end of the pressure sensing cavity, and the pressure sensitive components are embedded in the limiting grooves.

[0009] Furthermore, in the above-mentioned simple single crystal silicon pressure sensing module, there are at least four limiting grooves, which are distributed around the upper end of the pressure sensing cavity at equal distances from each other. The inner side of the limiting groove is preset with bonding glue, and the pressure sensitive component is in contact with the bonding glue.

[0010] Furthermore, in the above-mentioned simplified single crystal silicon pressure sensing module, the pressure sensitive component is a piezoresistor, and the wiring mechanism includes a sensing wire embedded in a single crystal silicon sensing film, and the sensing wire is connected to the piezoresistor.

[0011] Furthermore, in the above-mentioned simplified single crystal silicon pressure sensor module, the sensing wire is covered with a shielding sheath.

[0012] Furthermore, in the above-mentioned simplified single crystal silicon pressure sensing module, the wire mechanism includes a wiring channel provided in the carrier substrate, a wire is passed through the wiring channel, the wire is connected to the wiring mechanism, and a transmission connector is provided on the wire.

[0013] Furthermore, in the above-mentioned simplified single crystal silicon pressure sensing module, the pressure transmission mechanism is an inwardly concave arc segment; or, the pressure transmission mechanism is an outwardly convex arc segment.

[0014] Furthermore, in the above-mentioned simplified single crystal silicon pressure sensing module, a plurality of positioning buckles are provided on the outer side of the carrier substrate.

[0015] Furthermore, in the above-mentioned simplified single crystal silicon pressure sensing module, a label is provided on the outer side of the carrier substrate.

[0016] By means of the above solution, the present invention has at least the following advantages:

[0017] 1. The arc-shaped dome structure can produce appropriate deformation when pressure fluctuations occur, making it easier for pressure-sensitive components to capture and improve sensing sensitivity.

[0018] 2. The pressure-sensitive components are distributed in four equal parts, eliminating blind spots and effectively sensing pressure changes in the current environment.

[0019] 3. The conductor mechanism is distributed in a pre-buried manner, which prevents improper wiring and does not occupy the layout space of external equipment.

[0020] 4. It is equipped with an independent pressure transmission mechanism, which can be equipped with an inward concave arc segment or an outward convex arc segment according to environmental needs to improve the sensing accuracy of the pressure difference.

[0021] 5. The overall structure is simple, easy to manufacture, and can be adapted to multiple external components, making it easy to layout and use.

[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a structural diagram of a simple single-crystal silicon pressure sensor module (inwardly concave arc segment).

[0024] Figure 2 This is a structural diagram of a simple single-crystal silicon pressure sensor module (the arc segment convex outward).

[0025] Figure 3 It is a schematic diagram of the combination of a single-crystal silicon sensing film and a pressure-sensitive component.

[0026] The meanings of the reference numerals in the figures are as follows.

[0027] 1 Carrier substrate 2 Single crystal silicon sensing film

[0028] 3 Pressure-sensing cavity 4 Arc-shaped structure

[0029] 5 Pressure sensitive component 6 Wiring mechanism

[0030] 7 Wire mechanism 8 Transmission connector

[0031] 9 Pressure transmission mechanism 10 Positioning buckle

[0032] 11 Labels DETAILED DESCRIPTION

[0033] The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0034] like Figures 1 to 3The simplified single-crystal silicon pressure sensing module includes a carrier substrate 1. Its unique feature is that a single-crystal silicon sensing film 2 is provided on the upper end of the carrier substrate 1 to sense pressure changes caused by the external environment. Specifically, a pressure-sensing cavity 3 is formed between the inner side of the single-crystal silicon sensing film 2 and the carrier substrate. At the same time, in order to produce appropriate deformation in response to external pressure and to transmit corresponding pressure changes, the utility model provides an arc-shaped structure 4 on the inner side of the single-crystal silicon sensing film 2. This can achieve appropriate flexible deformation buffering when facing sudden external pressure shocks. Furthermore, several pressure-sensitive components 5 are provided in the pressure-sensing cavity 3 to obtain corresponding pressure change data. Considering the wiring requirements for data transmission, the single-crystal silicon sensing film 2 is located outside the pressure-sensing cavity 3 and is provided with several wiring mechanisms 6, which are connected to the corresponding pressure-sensitive components 5. Furthermore, in order to achieve wiring aggregation and enable data transmission with corresponding external devices, the carrier substrate 1 is provided with a wire mechanism 7, which is connected to the wiring mechanism 6. Furthermore, in order to meet the needs of using in certain special pressure difference changing environments, a pressure transmission mechanism 9 is provided at the center of the arc-shaped dome structure.

[0035] In accordance with a preferred embodiment of the present invention, a connection groove is provided on the upper surface of the carrier substrate 1, and the lower edge of the single-crystalline silicon sensing film 2 is connected to the connection groove. Considering the stability of the connection, the two can be bonded together using adhesive bonding or ultrasonic welding. Of course, other bonding methods can also be used to achieve a stable connection between the carrier substrate and the single-crystalline silicon sensing film 2. During processing, the vacuum characteristics within the pressure-sensing cavity 3 must be maintained.

[0036] Looking further, considering the stability of the combination, a number of limiting grooves are provided on the upper end of the pressure-sensing cavity 3 to which the single-crystal silicon sensing film 2 belongs, and the pressure-sensitive component 5 is embedded in the limiting grooves. Specifically, in order to achieve effective pressure difference change sensing, there are at least four limiting grooves, which are distributed around the upper end of the surrounding pressure-sensing cavity 3 at equal distances from each other. That is to say, taking the distribution in the clock direction as an example, the corresponding pressure-sensitive components 5 are respectively arranged at twelve o'clock, three o'clock, six o'clock, and nine o'clock on the inner surface of the single-crystal silicon sensing film 2. In this way, the pressure changes from all around can be sensed by the corresponding pressure-sensitive components 5, and there will be no sensing dead angles. Considering the stability of the combination, a bonding glue is preset on the inner side of the limiting groove, and the pressure-sensitive component 5 is in contact with the bonding glue.

[0037] In practical applications, the pressure-sensitive component 5 employed in this invention is a varistor. Furthermore, the wiring mechanism 6 includes a sensing wire embedded in the single-crystal silicon sensing film 2, which is connected to the varistor. To prevent signal transmission interference, a shielding sheath is provided over the sensing wire. During use, a silicone or rubber sheath can be used to form the shielding sheath. Furthermore, for special environmental requirements, a tinfoil film can also be used to form the shielding sheath.

[0038] To ensure stable external data communication, the wiring mechanism 7 includes a wiring channel disposed within the carrier substrate 1. Furthermore, a wire is passed through the wiring channel and connected to the wiring mechanism 6. The wire is provided with a transmission connector 8. Thus, when in use, the transmission connector 8 can be used to achieve necessary data communication with external devices.

[0039] Furthermore, if the pressure is sensed in a liquid environment, the pressure transmission mechanism 9 is formed as an inwardly concave arc segment to enhance deformation sensitivity. If the pressure is sensed in a gaseous environment, the pressure transmission mechanism 9 can be formed as an outwardly convex arc segment. This makes it easier to sense the fluctuations in gaseous pressure.

[0040] In actual implementation, to effectively integrate this pressure sensing module with other external accessories, several positioning buckles 10 can be provided on the outside of the carrier substrate 1. This allows for a convenient and secure snap-fit ​​with the pre-set connection points of other external accessories, preventing unnecessary movement during use. Furthermore, to accommodate user needs, a label 11 can be provided on the outside of the carrier substrate 1. This label 11 can be labeled with the corresponding model data for easy identification and access.

[0041] It can be seen from the above text description and the accompanying drawings that the present invention has the following advantages:

[0042] 1. The arc-shaped dome structure can produce appropriate deformation when pressure fluctuations occur, making it easier for pressure-sensitive components to capture and improve sensing sensitivity.

[0043] 2. The pressure-sensitive components are distributed in four equal parts, eliminating blind spots and effectively sensing pressure changes in the current environment.

[0044] 3. The conductor mechanism is distributed in a pre-buried manner, which prevents improper wiring and does not occupy the layout space of external equipment.

[0045] 4. It is equipped with an independent pressure transmission mechanism, which can be equipped with an inward concave arc segment or an outward convex arc segment according to environmental needs to improve the sensing accuracy of the pressure difference.

[0046] 5. The overall structure is simple, easy to manufacture, and can be adapted to multiple external components, making it easy to layout and use.

[0047] In addition, the indicated orientations or positional relationships described in the present invention are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or structure referred to must have a specific orientation or be operated in a specific orientation structure. Therefore, they cannot be understood as a limitation on the present invention.

[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A simple single crystal silicon pressure sensor module, including a carrier substrate, characterized in that: A single crystal silicon sensing film is provided at the upper end of the carrier substrate, and a pressure-sensing cavity is formed between the inner side of the single crystal silicon sensing film and the carrier substrate. An arc-shaped structure is provided on the inner side of the single crystal silicon sensing film. A plurality of pressure-sensitive components are provided in the pressure-sensing cavity. The single crystal silicon sensing film is located on the outer side of the pressure-sensing cavity and is provided with a plurality of wiring mechanisms, which are connected to the corresponding pressure-sensitive components. A wire mechanism is provided on the carrier substrate, which is connected to the wiring mechanism. A pressure transmission mechanism is provided at the center of the arc-shaped structure.

2. The simplified single crystal silicon pressure sensor module according to claim 1, characterized in that: A connecting groove is provided on the upper surface of the carrier substrate, and the lower edge of the single crystal silicon sensing film is connected to the connecting groove.

3. The simplified single crystal silicon pressure sensor module according to claim 1, characterized in that: A plurality of limiting grooves are provided on the upper end of the pressure-sensing cavity, and the pressure-sensitive components are embedded in the limiting grooves.

4. The simplified single crystal silicon pressure sensor module according to claim 3, characterized in that: There are at least four limiting grooves, which are distributed around the upper end of the pressure-sensing cavity at equal distances from each other. Binding glue is preset on the inner side of the limiting grooves, and the pressure-sensitive component is in contact with the binding glue.

5. The simplified single crystal silicon pressure sensor module according to claim 1, wherein: The pressure-sensitive component is a varistor, and the wiring mechanism includes a sensing line embedded in a single-crystal silicon sensing film, and the sensing line is connected to the varistor.

6. The simplified single crystal silicon pressure sensor module according to claim 5, characterized in that: The induction wire is coated with a shielding sheath.

7. The simplified single crystal silicon pressure sensor module according to claim 1, characterized in that: The wire mechanism includes a wiring channel arranged in the carrier substrate, a wire is passed through the wiring channel, the wire is connected to the wiring mechanism, and a transmission connector is arranged on the wire.

8. The simplified single crystal silicon pressure sensor module according to claim 1, characterized in that: The pressure transmission mechanism is an inwardly concave arc segment; or, the pressure transmission mechanism is an outwardly convex arc segment.

9. The simplified single crystal silicon pressure sensor module according to claim 1, characterized in that: A plurality of positioning buckles are arranged on the outer side of the carrier substrate.

10. The simplified single crystal silicon pressure sensor module according to claim 1, characterized in that: A label is provided on the outer side of the carrier substrate.

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