Silicon wafer conveying device

Abstract

The utility model relates to the field of photovoltaic equipment manufacturing, in particular to a silicon wafer conveying device. The device comprises a base, a power device and a turntable, the rotating disc is installed on the power device, the power device is installed on the base, and the power device drives the rotating disc to rotate. A plurality of grooves are evenly formed in the rotary disc at intervals in the radial direction, at least one limiting block is arranged at the position, corresponding to the grooves, of the rotary disc, and buffering parts are arranged between the inner walls of the grooves and fixedly arranged on the inner walls of the grooves. By means of the grooves formed in the rotating disc, the silicon wafers can be borne, the silicon wafers which are continuously fed can be temporarily stored, and the overturning efficiency of the silicon wafers and the production efficiency of equipment can be improved; and the silicon wafer can be limited in the left-right direction through the limiting block arranged on the turntable corresponding to the groove, so that the silicon wafer is prevented from deviating from the groove to influence the production precision of the subsequent process.

Description

Technical Field

[0001] The utility model relates to the field of photovoltaic equipment manufacturing, in particular to a silicon wafer conveying device. Background Art

[0002] In the production of crystalline silicon solar cells, with the continuous improvement of silicon wafer processing technology, double-sided processing technology of silicon wafers has become more and more mature. At present, some processes are to process each side of the silicon wafer step by step, which requires the silicon wafer that has been processed on one side to be flipped over and processed again.

[0003] In the prior art, for example, Chinese patent publication number CN208225898U discloses a silicon wafer flipping mechanism, which includes a feed assembly, a flipping assembly, and a discharge assembly arranged in sequence, thereby realizing automatic flipping of the silicon wafer. However, this technology still has disadvantages. When the silicon wafer enters the groove of the flipping assembly of the flipping mechanism and flips, since the width of the groove is much larger than the width of the silicon wafer, when the groove is in a vertical state, the silicon wafer will cause slight swinging and collision on the inner wall of the groove, causing problems such as hidden cracks and fragments of the silicon wafer. In addition, when the equipment is operating at high speed, the silicon wafer will shake left and right in the groove, causing silicon wafer offset or deviation, etc., affecting the subsequent process production accuracy. Utility Model Content

[0004] In view of the problems in the prior art, an object of the present invention is to provide a silicon wafer conveying device.

[0005] The silicon wafer conveyor includes a base, a power unit, and a turntable. The turntable is mounted on the power unit, which is mounted on the base. The power unit drives the turntable to rotate. The turntable has multiple grooves evenly spaced radially, with at least one stopper positioned corresponding to each groove. A buffer is provided between the inner walls of the grooves and is fixed to the inner walls of the grooves.

[0006] The multiple grooves on the turntable can not only carry silicon wafers, but also cache the continuously incoming silicon wafers, which is beneficial to improving the flipping efficiency of the silicon wafers and the production efficiency of the equipment; the limit blocks at the corresponding groove positions on the turntable can limit the silicon wafers in the left and right directions to prevent the silicon wafers from deviating from the grooves and affecting the subsequent process production accuracy; the setting of the buffer part can not only buffer the swinging impact of the silicon wafer in the groove, reducing the risk of silicon wafer cracks, fragments, etc., but also prevent the silicon wafer from generating excessive friction with the inner wall of the groove, which may cause silicon wafer wear.

[0007] Specifically, the limit block is configured as an integrally formed U-shaped block, a silicone pad is provided on the inner wall of the limit block, and the open end of the limit block is fixed on both sides of the groove.

[0008] The silicone pad provided on the inner wall of the limit block can limit the silicon wafer in the left and right directions and also play a buffering role to prevent the limit block from causing risks such as hidden cracks and fragments to the silicon wafer.

[0009] Optionally, the buffer portion is provided on an inner wall on one side of the groove.

[0010] Optionally, the buffer portion is provided on the inner walls on both sides of the groove.

[0011] Optionally, the buffer portion is provided with a guide structure, which is arranged at the buffer portion at the groove opening, and the thickness of the guide structure gradually decreases outward along the groove opening.

[0012] The guide structure provided on the buffer portion can make the silicon wafer enter and exit the groove more convenient.

[0013] Optionally, there are at least four grooves.

[0014] Optionally, there are at least two turntables.

[0015] By providing at least two turntables, both sides of the silicon wafer can be supported to ensure the stability of the silicon wafer flipping.

[0016] Furthermore, the power device is installed on the base, and the power device includes a motor and a support frame. The output end of the motor is connected to a driving pulley, the support frame is provided with a rotating shaft, the turntable is installed on the rotating shaft, and a driven pulley is also fixedly installed on the rotating shaft. The driven pulley and the driving pulley are connected by a synchronous belt.

[0017] To sum up, the multiple grooves provided on the turntable can not only carry the silicon wafers, but also cache the continuously incoming silicon wafers, which is beneficial to improving the flipping efficiency of the silicon wafers and the production efficiency of the equipment; the limit blocks provided at the corresponding groove positions on the turntable can limit the silicon wafers in the left and right directions, preventing the silicon wafers from deviating from the grooves and affecting the subsequent process production accuracy; the setting of the buffer part can not only buffer the swinging impact of the silicon wafer in the groove, reducing the risks of hidden cracks and fragments of the silicon wafers, but also prevent the silicon wafers from generating excessive friction with the inner wall of the groove, causing silicon wafer wear; the silicone pad provided on the inner wall of the limit block can limit the silicon wafer on the left and right sides and also play a buffering role, preventing the limit block from causing risks of hidden cracks and fragments to the silicon wafer; the guide structure provided on the buffer part can make the silicon wafer more convenient to enter and exit the groove; by providing at least two turntables, both sides of the silicon wafer can be carried to ensure the stability of the silicon wafer flipping. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of the silicon wafer conveying device of the present invention;

[0019] Figure 2This is a schematic diagram of the power unit structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the turntable structure of the utility model;

[0021] Figure 4 This is a schematic diagram of the limit block structure of the utility model;

[0022] Figure 5 This is a schematic diagram of the position of the buffer portion of the present utility model;

[0023] Figure 6 for Figure 5 A partial enlarged schematic diagram of the buffer part at A.

[0024] Figure numbers: 10, base; 20, power unit; 21, motor; 22, driving pulley; 23, fixed seat; 24, rotating shaft; 25, driven pulley; 26, supporting frame; 27, synchronous belt; 30, turntable; 31, groove; 32, buffer part; 33, guide structure; 34, limit block; 35, silicone pad. DETAILED DESCRIPTION

[0025] The present application relates to a silicon wafer conveying device, which is explained in detail below through specific implementation methods.

[0026] In some production processes, silicon wafers need to be turned over to facilitate welding in subsequent processes. Existing silicon wafer turning mechanisms are usually set between two assembly lines. Silicon wafers need to be turned over during transportation from one assembly line to another. In order to avoid problems such as silicon wafer cracking, fragmentation, and deviation caused by the automatic turning action of the traditional turning mechanism, the present application provides a silicon wafer conveying device, which includes a base 10, a power device 20, and a turntable 30.

[0027] according to Figure 2 As shown, due to the reasons of subsequent process production, the silicon wafer needs to be turned over before entering the next workstation, so the silicon wafer conveying device includes a power device 20, which includes a driver, a fixed seat 23, a synchronous belt 27, a support frame 26 and a rotating shaft 24, wherein the driver includes a motor 21 and a driving pulley 22 installed on the output shaft of the motor 21, and the driver is installed at one end of the base 10 by passing through the fixed seat 23, and a driven pulley 25 is fixedly installed on one side of the rotating shaft 24, and the rotating shaft 24 is fixedly installed on the other end of the base 10 by passing through the support frame 26, and the driven pulley 25 is connected to the driving pulley 22 by a synchronous belt 27. When the motor 21 drives the driving pulley 22, it drives the driven pulley 25 to rotate, and the driven pulley 25 drives the rotating shaft 24 to rotate, thereby realizing the automatic rotation function of the power device 20.

[0028] according to Figures 1 to 6 As shown, the silicon wafer conveying device also includes a turntable 30 for carrying, flipping and conveying silicon wafers. In this embodiment, the silicon wafer conveying device is provided with two groups of turntables 30 on both sides of the rotating shaft 24. A single turntable 30 is provided with 18 grooves 31 evenly spaced along the radial direction, and the grooves 31 corresponding to each other in the two groups of turntables 30 are parallel to each other. The grooves 31 provided on the two groups of turntables 30 can support both sides of the silicon wafer to ensure the stability of the silicon wafer flipping; the 18 grooves 31 provided on the single turntable 30 can cache the continuously incoming silicon wafers, thereby improving the flipping efficiency of the silicon wafers. Since the groove 31 is in a vertical state when the turntable 30 rotates to a certain angle, the silicon wafer will swing and collide slightly with the inner wall of the groove 31, causing problems such as hidden cracks and fragments of the silicon wafer. Therefore, a buffer portion 32 is provided on the inner walls on both sides of the groove 31. In this embodiment, the buffer portion is made of a polyurethane block with a smooth surface or a foam pad with Teflon material on the surface. The thickness of the buffer portion 32 corresponding to the opening of the groove 31 gradually decreases to form a guide structure 33. The buffer portion 32 provided on the inner wall of the groove 31 can not only buffer the swinging impact of the silicon wafer in the groove 31, reducing the risk of hidden cracks and fragments of the silicon wafer, but also prevent the silicon wafer from generating excessive friction with the inner wall of the groove 31, causing silicon wafer wear; the guide structure 33 is formed at the opening of the groove 31 by the buffer portion 32, so that the silicon wafer can enter and exit the groove 31 more conveniently. Since the silicon wafer may rock left and right in the groove 31 and deviate due to the high-speed operation of the equipment during the flipping process, it is necessary to limit the left and right directions of the silicon wafer in the groove 31. Therefore, a limit block 34 is provided at the position corresponding to each groove 31 on the turntable 30, wherein each limit block 34 is configured as an integrated U-shaped block, and the open end of the limit block 34 is connected to both sides of the groove 31. A silicone pad 35 is provided on the inner wall of the limit block 34. The setting of the limit block 34 can limit the left and right directions of the silicon wafer to prevent the silicon wafer from deviating from the groove 31 and affecting the subsequent process production accuracy; the silicone pad 35 provided on the inner wall of the groove 31 can limit the silicon wafer and also play a buffering role to prevent the silicon wafer from causing hidden cracks, fragments and other risks due to left and right limitation.

Claims

1. A silicon wafer conveying device comprising a base, a power unit, and a turntable, wherein the turntable is mounted on the power unit, which is mounted on the base, and the power unit drives the turntable to rotate, characterized in that: The turntable is provided with a plurality of grooves evenly spaced in the radial direction, at least one limit block is provided on the turntable corresponding to the groove position, a buffer portion is provided between the inner walls of the groove, and the buffer portion is fixedly arranged on the inner wall of the groove.

2. The silicon wafer conveying device according to claim 1, wherein: The limiting block is configured as an integrally formed U-shaped block, a silicone pad is provided on the inner wall of the limiting block, and the open end of the limiting block is fixed on both sides of the groove.

3. The silicon wafer conveying device according to claim 1, wherein: The buffer portion is arranged on an inner wall of one side of the groove.

4. The silicon wafer conveying device according to claim 1, wherein: The buffer portion is arranged on the inner walls of both sides of the groove.

5. The silicon wafer conveying device according to claim 3 or 4, characterized in that: The buffer portion is provided with a guide structure, and the guide structure is arranged at the buffer portion at the opening of the groove. The thickness of the guide structure gradually decreases along the groove opening toward the outside.

6. The silicon wafer conveying device according to claim 1, wherein: There are at least four grooves.

7. The silicon wafer conveying device according to claim 1, wherein: There are at least two turntables.

8. The silicon wafer conveying device according to claim 1, wherein: The power device is installed on the base, and the power device includes a motor and a support frame. The output end of the motor is connected to a driving pulley, and a rotating shaft is provided on the support frame. The turntable is installed on the rotating shaft, and a driven pulley is also fixedly installed on the rotating shaft. The driven pulley is connected to the driving pulley through a synchronous belt.

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