Radiator and servo driver

Abstract

The embodiment of the utility model provides a radiator and a servo driver, the radiator comprises a substrate and a side plate arranged at the side edge of the substrate, the substrate is used for enclosing with a shell to form an accommodating cavity for a circuit board and an electronic element, the edge of the substrate is abutted against the edge of the shell, and the projection area of the substrate and the projection area of the shell on the horizontal plane coincide. According to the embodiment, the side plates are arranged on the side edges of the substrate, and the size of the substrate is set to be the same as that of the shell, so that the heat dissipation area of the radiator is effectively increased, and then the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of servo drivers, in particular to a radiator and a servo driver. Background Art

[0002] A servo drive, also known as a servo controller or servo amplifier, is a controller used to control a servo motor. It controls the servo motor in three ways: position, speed, and torque. It is mainly used in high-precision positioning systems.

[0003] In order to improve the flexibility of industrial equipment or servo systems, it is necessary to use multiple servo drives to drive multiple motors respectively, thereby realizing the movement of industrial equipment or servo systems in multiple directions. However, using multiple servo drives to drive multiple motors respectively will cause the servo drives required to drive multiple motors to occupy a large amount of space. In order to reduce the size of the servo drive, a multi-axis servo drive is proposed, which can control the movement of multiple servo motors with one multi-axis servo drive. Since the multi-axis servo drive needs to control multiple servo motors, a large number of electronic components need to be set up, including power components with large heat generation. At this time, a radiator needs to be installed inside the drive for heat dissipation to ensure the normal operation of the multi-axis servo drive. However, after reducing the size of the servo drive, the volume of the radiator installed inside the drive will also be reduced accordingly, which reduces the heat dissipation area of ​​the radiator, resulting in poor heat dissipation effect, and thus reduces the performance of the multi-axis servo drive. Utility Model Content

[0004] The utility model provides a radiator and a servo driver, aiming to solve the problem that the radiator of the existing multi-axis servo driver is too small and thus has a poor effect.

[0005] An embodiment of the present utility model provides a radiator, which is applied to a servo drive. The servo drive includes a housing, and the radiator includes: a substrate and a side panel arranged on the side of the substrate. The substrate is used to enclose with the housing to form a housing cavity for a circuit board and electronic components. The edge of the substrate and the edge of the housing abut against each other, and the projection areas of the substrate and the housing on the horizontal plane overlap.

[0006] Specifically, the side panels are perpendicular to the base plate; at least two side panels are provided, and at least two side panels are provided on two opposite sides of the base plate, and at least one of the side panels is provided with a plurality of heat dissipation holes.

[0007] Specifically, the side panels are provided with hooks and / or holes that are snap-connected to the shell.

[0008] Specifically, at least one encoder battery box mounting structure is provided on the side panel, and the encoder battery box mounting structure includes two limit baffles arranged in parallel and spaced apart along a first direction and a slot arranged along a second direction, the slot is located at one end of the limit baffle, and an installation area is formed between the two limit baffles. The encoder battery box is installed in the installation area and one end of the battery box is inserted into the slot, and the first direction and the second direction are perpendicular.

[0009] Specifically, the substrate includes a first substrate surface and a second substrate surface opposite to each other. The first substrate surface is provided with a mounting platform for mounting the power module, and the second substrate surface is provided with a plurality of heat dissipation fins in an area corresponding to the mounting platform.

[0010] Specifically, the heat dissipation fins and the mounting platform are integrally formed with the base plate, and mounting holes are provided on at least two sides of the mounting platform.

[0011] Specifically, a mounting groove for mounting a fan assembly is provided on the surface of the second substrate near the first end of the heat dissipation fin, and a wire groove for passing the power cord of the fan assembly is provided in the mounting groove, as well as a card slot and a positioning hole connected and fixed to the fan assembly.

[0012] Specifically, a plurality of avoidance holes are provided on a side of the substrate close to the heat dissipation fins, and a plurality of mounting posts for fixing a circuit board are provided on the first substrate surface.

[0013] Specifically, the radiator further includes a grounding terminal connected to the substrate and the side plate, and mounting portions are respectively provided at both ends of the side plate.

[0014] An embodiment of the present invention further provides a servo driver, comprising the heat sink as described above.

[0015] This embodiment of the utility model provides a heat sink and servo driver. The heat sink includes a base plate and side panels disposed on the sides of the base plate. The base plate is used to enclose a housing to form a cavity for accommodating circuit boards and electronic components. The edges of the base plate and the edges of the housing abut against each other, and the projected areas of the base plate and the housing on a horizontal plane overlap. By providing the side panels on the sides of the base plate and setting the size of the base plate to be the same as that of the housing, this embodiment effectively increases the heat dissipation area of ​​the heat sink, thereby improving heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A schematic structural diagram of a first substrate surface of a radiator provided by an embodiment of the present utility model;

[0018] Figure 2 A schematic structural diagram of a second substrate surface of a radiator provided by an embodiment of the present utility model;

[0019] Figure 3 The present invention provides a schematic diagram of the overall structure of a servo drive.

[0020] Description of the symbols in the figure:

[0021] 1. Radiator; 11. Baseboard; 111. First Baseboard Surface; 1111. Mounting Platform; 1112. Mounting Hole; 112. Second Baseboard Surface; 12. Side Panel; 121. Heat Dissipation Hole; 122. Hook; 123. Hole; 13. Heat Dissipation Fin; 14. Encoder Battery Box Mounting Structure; 141. Limit Stopper; 142. Slot; 15. Avoidance Hole; 16a. Mounting Slot; 16b. Wire Passing Slot; 16c. Slot; 16d. Positioning Hole; 17. Mounting Post; 18. Grounding Terminal; 19. Mounting Portion;

[0022] 2. Shell. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0025] It should also be understood that the terms used in this utility model specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model. As used in this utility model specification and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.

[0026] It should be further understood that the term “and / or” used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0027] See also Figure 1 An embodiment of the present invention provides a heat sink 1, which is applied to a servo drive. The servo drive includes a housing 2. The heat sink 1 includes: a substrate 11 and a side panel 12 arranged on the side of the substrate 11. The substrate 11 is used to enclose with the housing to form a cavity for accommodating circuit boards and electronic components. The edge of the substrate 11 abuts against the edge of the housing, and the projection area of ​​the substrate 11 and the housing on the horizontal plane coincides.

[0028] In this embodiment, the housing 2 includes a cover shell and a bottom shell, and the accommodating cavity includes a first accommodating cavity and a second accommodating cavity. The substrate 11 is installed between the cover shell and the bottom shell. The substrate 11 and the cover shell enclose a first accommodating cavity for the circuit board, and the substrate 11 and the bottom shell enclose a second accommodating cavity. The electronic components can extend from the first accommodating cavity into the second accommodating cavity. Figure 3 As shown, the edges of the substrate 11 abut against the edges of the cover and bottom shells. When the shell 2 is projected on a horizontal plane, the projected areas of the shell 2 and the substrate 11 completely overlap, that is, the length and width of the substrate 11 are the same as those of the shell. By providing side panels 12 on the sides of the substrate 11, the heat dissipation area of ​​the radiator is effectively increased. This embodiment facilitates the rapid conduction of heat generated by the circuit board and electronic components to the radiator through the substrate 11 by bringing the substrate 11 into close contact with the edges of the shell, thereby reducing the operating temperature of the circuit board and electronic components. The provision of the side panels 12 increases the heat dissipation area of ​​the radiator, thereby improving the heat dissipation efficiency. The overlap of the projected areas of the substrate 11 and the shell 2 on the horizontal plane reduces the problem of increased device volume due to the radiator occupying additional space, making the servo drive more compact and efficient.

[0029] Specifically, such as Figure 1-2 As shown, the side panels 12 are perpendicular to the base plate 11 ; at least two side panels 12 are provided, and at least two side panels 12 are provided on opposite sides of the base plate 11 , and at least one of the side panels 12 is provided with a plurality of heat dissipation holes 121 .

[0030] In this embodiment, the vertical arrangement of the side panels 12 and the base plate 11 can increase the surface area of ​​the radiator 1, help improve air flow, and thus enhance heat conduction and heat dissipation. In addition, at least two side panels 12 are provided, and the two side panels 12 are provided on two opposite sides of the base plate 11 to support the base plate 11, so that there is a certain gap between the base plate 11 and the bottom shell. The second accommodating cavity is located in the gap, and a plurality of heat dissipation holes 121 are provided on both side panels 12. The heat dissipation holes 121 on both sides connect the outside world and the accommodating cavity. When the servo drive is running, the heat dissipated inside the servo drive is discharged to the outside world through the plurality of heat dissipation holes 121, thereby achieving heat dissipation of the accommodating cavity and effectively avoiding overheating inside the servo drive. In this embodiment, the coordinated design of the side panels 12 and the base plate 11 of the radiator helps to guide and disperse heat, so that heat can be evenly transferred to the heat dissipation holes 121, which helps to prevent local overheating.

[0031] Specifically, such as Figure 1 As shown, the side panel 12 is provided with a hook 122 and / or a hole 123 that is snap-connected to the housing.

[0032] In this embodiment, the cover and the bottom shell are both connected to the side plate 12 by snap-fitting, that is, the cover and the bottom shell are both provided with hooks, and the side plate 12 is provided with two snap-fitting holes 123 at positions corresponding to the two hooks, or the cover and the bottom shell are provided with snap-fitting holes, and the side plate 12 is provided with two snap-fitting hooks 122 at positions corresponding to the two snap-fitting holes, or the cover or the bottom shell is provided with hooks, and the bottom shell or the cover shell is provided with snap-fitting holes, and the side plate 12 is provided with snap-fitting holes 123 at positions corresponding to the hooks, and the side plate 12 is provided with snap-fitting hooks 122 at positions corresponding to the snap-fitting holes, thereby achieving a stable connection between the radiator 1 and the housing. In this embodiment, the radiator 1 is mounted on the housing by snap-fitting, which facilitates the removal or replacement of the radiator 1. The radiator 1 can be repaired or inspected without disassembling the entire housing.

[0033] Specifically, such as Figure 1 As shown, at least one encoder battery box mounting structure 14 is provided on the side panel 12. The encoder battery box mounting structure 14 includes two limit baffles 141 arranged in parallel and spaced apart along a first direction and a slot 142 arranged along a second direction. The slot 142 is located at one end of the limit baffle 141. An installation area is formed between the two limit baffles 141. The encoder battery box is installed in the installation area and one end of the battery box is inserted into the slot 142. The first direction and the second direction are perpendicular.

[0034] In this embodiment, a plurality of encoder battery box mounting structures 14 are provided on the outer side of the side panel 12. Each encoder battery box mounting structure 14 includes two limit baffles 141 arranged in parallel and spaced apart along a first direction and a slot 142 arranged along a second direction. A mounting area is formed between the two limit baffles 141. The encoder battery box slides into the mounting area through one end of the two limit baffles 141. The mounting area is used to limit the encoder battery box to prevent the encoder battery box from shifting due to vibration or external force during use. The slot 142 is located at the end of the mounting area. The encoder battery box located in the mounting area is inserted into the slot 142 at one end facing the bottom shell. After the encoder battery box of this embodiment is installed, both sides are clamped by the two limit baffles 141 to form a stable structure, which effectively prevents the encoder battery box from shaking during operation. In addition, the two limit baffles 141 are arranged along the first direction, and the slot 142 is arranged along the second direction, and the first direction is perpendicular to the second direction, so that the encoder battery box is well fixed in both the horizontal and vertical directions to avoid accidental falling off due to external force.

[0035] Specifically, such as Figure 1-2 As shown, the substrate 11 includes a first substrate surface 111 and a second substrate surface 112 opposite to each other. The first substrate surface 111 is provided with a mounting platform 1111 for mounting the power module, and the second substrate surface 112 is provided with a plurality of heat dissipation fins 13 in an area corresponding to the mounting platform 1111 .

[0036] In this embodiment, two mounting platforms 1111 are provided on the first substrate surface 111, spaced apart. The power modules are mounted on the two mounting platforms 1111, respectively. Heat dissipation fins 13 are mounted on the second substrate surface 112, located in corresponding areas of the mounting platforms 1111. During operation, the power modules generate heat, which is transferred to the first substrate surface 111. This heat is then conducted through the substrate 11 to the heat dissipation fins 13 on the second substrate surface 112, thereby utilizing the larger surface area of ​​the heat dissipation fins 13 to dissipate heat and improve overall heat dissipation efficiency. This embodiment places the power modules and heat dissipation fins 13 on different surfaces of the substrate 11, effectively saving space and avoiding the space congestion caused by arranging multiple components on the same surface. Moreover, by arranging the power module and the heat sink fins 13 on opposite sides of the substrate 11, the heat sink fins 13 can be in direct contact with the substrate 11, and the heat generated by the power module is guided to the heat sink fins 13 through the thermal conductivity of the substrate 11, thereby simplifying the heat dissipation path. The heat sink fins 13 can more effectively handle the heat generated by the power module, thereby avoiding servo drive failure due to overheating.

[0037] Specifically, such as Figure 1-2 As shown, the heat dissipation fins 13 and the mounting platform 1111 are integrally formed with the base plate 11 , and mounting holes 1112 are provided on at least two sides of the mounting platform 1111 .

[0038] In this embodiment, the heat sink fins 13 and mounting platform 1111 are integrally formed with the base plate 11, reducing the number of assembly steps required to mount components on the base plate 11. This also provides a better thermal conductivity path, allowing heat to be more efficiently transferred from the base plate 11 to the heat sink fins 13, thereby improving overall heat dissipation performance. Mounting holes 1112 on either side of the mounting platform 1111 facilitate the securing and installation of the power module, making the installation process of the power module on the base plate 11 simpler and faster, and enabling close coordination with other components.

[0039] Specifically, such as Figure 2 As shown, a mounting groove 16a for mounting a fan assembly is provided on the first end of the second substrate surface 112 near the heat dissipation fin 13, and a wire groove 16b for the power cord of the fan assembly to pass through is provided in the mounting groove 16a, as well as a card slot 16c and a positioning hole 16d connected and fixed to the fan assembly.

[0040] In this embodiment, in order to achieve better heat dissipation inside the servo drive, the fan assembly is installed on the second substrate surface 112. The second substrate surface 112 is provided with a mounting groove 16a near the first end of the heat dissipation fin 13, and the fan assembly is installed in the mounting groove 16a. In order to fix the fan assembly in the mounting groove 16a, a plurality of card slots 16c and a plurality of positioning holes 16d are provided on the mounting groove 16a. The fan assembly is guided to the precise position of the mounting groove 16a through the positioning holes 16d, and the fan assembly is carded in the card slot 16c, thereby achieving stable installation of the fan assembly, effectively preventing the fan assembly from being displaced or vibrated during operation, thereby improving the stability and reliability of the servo drive. In addition, a wire groove 16b is also provided on the mounting groove 16a for guiding the power cord of the fan assembly, effectively preventing the power cord from being entangled or damaged during installation, and keeping the appearance of the servo drive neat. This embodiment provides mounting slots 16a and latching slots 16c to secure the fan assembly, allowing the fan to be securely mounted on the first end of the heat sink 13, thereby ensuring proper operation of the heat sink 13 and improving heat dissipation. The latching connection between the fan assembly and the radiator 1 facilitates maintenance and replacement of the fan assembly, allowing for removal without disassembling the entire radiator 1 or other components. In practice, the wire groove 16b is located in the middle of the mounting slot 16a, the positioning holes 16d are located on either side of the wire groove 16b, and the latching slots 16c are located around the mounting slot 16a, with two of the latching slots 16c located on the other two sides of the wire groove 16b.

[0041] Specifically, such as Figure 1-2 As shown, a plurality of avoidance holes 15 are provided on one side of the substrate 11 close to the heat dissipation fins 13 , and a plurality of mounting posts 17 for fixing the circuit board are provided on the first substrate surface 111 .

[0042] In this embodiment, multiple escape holes 15 extend through the substrate 11 and connect the first and second accommodating cavities. Electronic components are positioned within the escape holes 15. Because the size of the circuit board matches the first substrate surface 111, the electronic components protrude beyond the first substrate surface 111 when positioned within the escape holes 15. Directly mounting the circuit board on the first substrate surface 111 would hinder the installation of the electronic components. Therefore, multiple mounting posts 17 are provided on the first substrate surface 111 to mount and support the circuit board. This creates a gap between the circuit board and the first substrate surface 111, with the protruding ends of the electronic components positioned within this gap. After installation, the circuit board contacts and connects with the protruding ends of the electronic components. Heat is generated during operation of the circuit board and the electronic components, which is dissipated from the gap through the escape holes 15 to the second accommodating cavity, avoiding local overheating and thereby improving overall heat dissipation efficiency. Furthermore, the mounting posts 17 separate the circuit board from the first substrate surface 111, preventing direct contact between the circuit board and the substrate 11, thereby reducing the risk of short circuits.

[0043] Specifically, such as Figure 1-2 As shown, the heat sink 1 further includes a grounding terminal 18 connected to the base plate 11 and the side plate 12 , and mounting portions 19 are respectively provided at both ends of the side plate 12 .

[0044] In this embodiment, the grounding terminal 18 can effectively prevent the circuit and other components of the substrate 11 from being damaged when the current is too high. Therefore, the electrical noise and interference are guided to the ground through the grounding terminal 18, reducing the impact on the circuit, thereby maintaining the normal operation of the circuit and reducing the occurrence of servo drive failures during operation. In a specific implementation, the grounding terminal 18 is set at the corner position of the substrate 11, and the end of the side panel 12 is provided with a mounting portion 19, which is used to connect the entire servo drive to the external component through the four mounting portions 19 when the radiator 1 is snap-connected to the shell, thereby simplifying the installation steps of the servo drive and the external component. After installation, the servo drive can be kept stable in the entire device, reducing vibration and displacement, thereby improving the reliability of the entire device. In this embodiment, by providing multiple mounting portions 19 at the end of the side panel 12, the servo drive is compatible with a variety of external components, so that the servo drive can adapt to different application requirements and equipment configurations.

[0045] like Figure 3 As shown, an embodiment of the present invention further provides a servo drive, comprising the heat sink as described above.

[0046] In this embodiment, the heat dissipation area of ​​the radiator is increased without increasing the overall size of the servo drive. It can also improve the assembly efficiency of the servo drive housing and simplify the overall structural design of the servo drive.

[0047] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A heat sink applied to a servo drive, wherein the servo drive comprises a housing, characterized in that: The radiator includes: a substrate and a side plate arranged on the side of the substrate. The substrate is used to enclose the shell to form a accommodating cavity for the circuit board and electronic components. The edge of the substrate and the edge of the shell abut against each other, and the projection area of ​​the substrate and the shell on the horizontal plane overlap.

2. The radiator according to claim 1, characterized in that The side panels are perpendicular to the base plate; at least two side panels are provided, and at least two side panels are provided on two opposite sides of the base plate, and at least one of the side panels is provided with a plurality of heat dissipation holes.

3. The radiator according to claim 2, characterized in that The side panels are provided with hooks and / or holes that are snap-connected to the housing.

4. The radiator according to claim 1, wherein At least one encoder battery box mounting structure is provided on the side panel, and the encoder battery box mounting structure includes two limit baffles arranged in parallel and spaced apart along a first direction and a slot arranged along a second direction, the slot is located at one end of the limit baffle, and an installation area is formed between the two limit baffles. The encoder battery box is installed in the installation area and one end of the battery box is inserted into the slot, and the first direction and the second direction are perpendicular.

5. The radiator according to claim 4, characterized in that The substrate includes a first substrate surface and a second substrate surface facing each other. The first substrate surface is provided with a mounting platform for mounting a power module. The second substrate surface is provided with a plurality of heat dissipation fins in an area corresponding to the mounting platform.

6. The radiator according to claim 5, characterized in that The heat dissipation fins and the mounting platform are integrally formed with the base plate, and mounting holes are provided on at least two sides of the mounting platform.

7. The radiator according to claim 5, characterized in that A mounting groove for mounting a fan assembly is provided on the surface of the second substrate near the first end of the heat dissipation fins. The mounting groove is provided with a wire groove for the power cord of the fan assembly to pass through, as well as a card slot and a positioning hole connected and fixed to the fan assembly.

8. The radiator according to claim 5, characterized in that A plurality of avoidance holes are provided on one side of the substrate close to the heat dissipation fins, and a plurality of mounting posts for fixing the circuit board are provided on the first substrate surface.

9. The radiator according to any one of claims 1 to 8, characterized in that: The radiator further includes a grounding terminal connected to the substrate and the side plate, and mounting portions are respectively provided at both ends of the side plate.

10. A servo drive, characterized in that: The heat sink comprises the heat sink as claimed in any one of claims 1 to 9.

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