Bernoulli sheet fork

Abstract

The utility model discloses a Bernoulli slice fork which comprises a slice fork body, an air flow channel is arranged in the slice fork body, a plurality of Bernoulli air outlet holes are distributed in the slice fork body, and the Bernoulli air outlet holes are communicated to the air flow channel. And a plurality of anti-skid supporting pads are distributed along the edge position of the wafer fork body, and the anti-skid supporting pads are used for supporting a taiko ring on the back surface of the silicon wafer. According to the scheme, the problem that in the related technology, particle clusters are generated on the back face of the silicon wafer, and consequently the silicon wafer particle environment is poor can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor processing equipment, and in particular to a Bernoulli fork. Background Art

[0002] With technological advancements, the demand for ultra-thin silicon wafers has been growing in recent years. Thinner silicon wafers offer numerous benefits, including ultra-thin packaging, smaller form factors, improved electrical performance, and enhanced heat dissipation. Currently, the most common wafer thinning method in silicon wafer manufacturing is grinding, which creates taiko wafers through wafer thinning.

[0003] Currently, if Figure 1 As shown in the figure, in a laser annealing machine, the accompanying transfer fork is typically a circular Bernoulli fork A1, which utilizes the Bernoulli effect to attract silicon wafer A2. To prevent silicon wafer A2 from slipping during transport, a non-slip support pad is typically placed in the middle of the circular Bernoulli fork A1, directly contacting the back of silicon wafer A2. However, the presence of this non-slip pad can cause particle clustering at the point where the back of silicon wafer A2 contacts the pad, resulting in a poor particle environment for the silicon wafer. Utility Model Content

[0004] The present application provides a Bernoulli fork, which can solve the problem in the related art that particle clusters are generated on the back of the silicon wafer, resulting in a poor particle environment for the silicon wafer.

[0005] The present application provides a Bernoulli fork, comprising:

[0006] A fork body, wherein an air flow channel is provided in the fork body, and a plurality of Bernoulli air outlet holes are distributed on the fork body, and the Bernoulli air outlet holes are connected to the air flow channel;

[0007] Anti-skid support pads, several of which are distributed along the edge of the wafer fork body, and are used to support the taiko ring on the back of the silicon wafer.

[0008] In some embodiments, the fork body is U-shaped, including two fork fingers arranged at a distance from each other and a connecting portion for connecting the two fork fingers.

[0009] In some embodiments, the air flow channel includes two air paths arranged one-to-one corresponding to the interdigitated fingers.

[0010] In some embodiments, the fork body is formed by combining an upper fork plate and a lower fork plate, and the Bernoulli air outlet is arranged on the upper surface of the upper fork plate.

[0011] In some embodiments, the anti-slip support pad is made of polyetheretherketone.

[0012] In some embodiments, a photoelectric sensor is provided on the wafer fork body, and the photoelectric sensor is used to sense the position of the silicon wafer.

[0013] The technical solution of this application has at least the following advantages:

[0014] 1. By placing the anti-slip support pad at the edge of the fork body, the anti-slip support pad forms a support for the taiko ring on the back of the silicon wafer, avoiding direct contact between the anti-slip support pad and the back of the silicon wafer. At the same time, the Bernoulli air vents distributed on the fork body support the silicon wafer in a non-contact manner, solving the problem of particle clustering at the contact point between the back of the silicon wafer and the anti-slip support pad, resulting in a poor particle environment for the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0016] Figure 1 Schematic diagram of a circular Bernoulli fork loaded with a silicon wafer in the prior art;

[0017] Figure 2 This is a schematic structural diagram of a Bernoulli fork provided by an exemplary embodiment of the present application;

[0018] Figure 3 is a schematic diagram of an airway in a Bernoulli fork provided by an exemplary embodiment of the present application;

[0019] Figure 4 This is a schematic diagram of an exemplary embodiment of the present application, which is used to reflect the distinguishing pattern on the lower surface of the lower plate of the fork.

[0020] Description of reference numerals:

[0021] A1, circular Bernoulli fork; A2, silicon wafer;

[0022] 1. Fork body; 11. Fork fingers; 12. Connecting part; 2. Anti-slip support pad; 3. Bernoulli air outlet; 4. Air path; 5. Photoelectric sensor; 6. Distinguishing pattern. DETAILED DESCRIPTION

[0023] The following is a clear and complete description of the technical solutions in this application in conjunction with the accompanying drawings. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0024] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal connections between two components; they can refer to wireless connections or wired connections. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0026] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0027] The present application provides a Bernoulli fork, which is mainly used to transfer silicon wafers in laser annealing machines and other machines. Figure 1The Bernoulli fork includes a fork body 1 and a number of anti-slip support pads 2 distributed at the edge of the fork body 1, and the upper surface of the anti-slip support pads 2 is higher than the upper surface of the fork body 1. An air flow channel is provided in the fork body 1, and a number of Bernoulli air outlets 3 connected to the air flow channel are distributed on the upper surface of the fork body 1. One end of the air flow channel can be connected to an external blowing device. In actual use, when the silicon wafer is placed on the fork body 1, the anti-slip support pads 2 located at the edge of the fork body 1 contact the taiko ring on the back of the silicon wafer to form support for the silicon wafer. At the same time, the air flow blown out by the external blowing device passes through the air flow channel and is blown out from the Bernoulli air outlet 3. Under the action of the Bernoulli effect, an adsorption force on the silicon wafer is generated, thereby achieving subsequent stable transportation of the silicon wafer. During this process, since the anti-slip support pad 2 supports the taiko ring on the back of the silicon wafer, and the Bernoulli vent 3 supports the silicon wafer in a non-contact manner, it solves the problem of particle clustering at the contact point between the back of the silicon wafer and the anti-slip support pad 2, resulting in a poor particle environment for the silicon wafer.

[0028] Furthermore, the material of the anti-slip support pad 2 can be polyetheretherketone.

[0029] Further, refer to Figure 1 To prevent collisions with the wafer pod due to the fork's large area, the fork can be U-shaped. In this case, the fork includes two parallel, spaced-apart fingers 11 and a connecting portion 12 for connecting the two fingers 11. To ensure stable wafer handling, several Bernoulli air vents 3 are evenly distributed on the fingers 11 and the connecting portion 12.

[0030] Furthermore, the air flow channel can be set to a dual-channel mode, such as Figure 3 As shown, the air flow channel includes two air paths 4 arranged one-to-one corresponding to the interdigital fingers 11.

[0031] Furthermore, in order to facilitate the production of the fork body 1, the fork body 1 is configured to include an upper fork and a lower fork. The fork body 1 with an air flow channel can be obtained by respectively slotting the opposite surfaces of the upper fork and the lower fork, and then fixing the upper fork and the lower fork together. Among them, the Bernoulli air vent 3 is located on the upper surface of the upper fork. Since in actual production, the upper fork and the lower fork are mostly set to dark colors, although the lower fork is slotted on one side, it is not easy to distinguish visually. Therefore, in order to easily distinguish the front and back of the lower fork, refer to Figure 4 The lower surface of the lower piece of the fork is also provided with a distinguishing pattern 6, and the distinguishing pattern 6 can be a different color from the lower piece of the fork.

[0032] Furthermore, in order to improve the transport efficiency, a photoelectric sensor 5 is also installed on the fork body 1, and the photoelectric sensor 5 is connected to the control terminal of the machine. Figure 1 The upper surface of the fork body 1 is provided with a receiving slot, into which the photoelectric sensor 5 is bolted, so that the sensor 5 does not protrude above the slot. The sensing end of the photoelectric sensor 5 is positioned toward the silicon wafer, and it determines whether the wafer is in place by measuring the distance between the sensor and the wafer. When the wafer is in place, the photoelectric sensor 5 identifies it and notifies the machine's control terminal, which then automatically initiates wafer transport.

[0033] A Bernoulli slice fork provided in an embodiment of the present application forms a support for the taiko ring on the back of the silicon wafer by arranging the anti-slip support pad 2 at the edge of the slice fork body 1, thereby avoiding direct contact between the anti-slip support pad 2 and the back of the silicon wafer. At the same time, the Bernoulli air vents 3 distributed on the slice fork body 1 support the silicon wafer in a non-contact manner, solving the problem of particle clustering at the contact position between the back of the silicon wafer and the anti-slip support pad 2, resulting in a poor particle environment for the silicon wafer.

[0034] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of this application.

Claims

1. A Bernoulli fork, characterized in that: include: A fork body (1), wherein an air flow channel is provided in the fork body (1), and a plurality of Bernoulli air outlet holes (3) are distributed on the fork body (1), and the Bernoulli air outlet holes (3) are connected to the air flow channel; A plurality of anti-skid support pads (2) are distributed along the edge of the wafer fork body (1), and the anti-skid support pads (2) are used to support the taiko ring on the back of the silicon wafer.

2. The Bernoulli fork according to claim 1, characterized in that: The fork body (1) is arranged in a U-shape, comprising two fork fingers (11) arranged at a distance and a connecting portion (12) for connecting the two fork fingers (11).

3. The Bernoulli fork according to claim 2, characterized in that: The air flow channel comprises two air paths (4) arranged one-to-one corresponding to the interdigitated fingers (11).

4. The Bernoulli fork according to claim 1, characterized in that: The fork body (1) is formed by combining an upper fork plate and a lower fork plate, and the Bernoulli air outlet (3) is arranged on the upper surface of the upper fork plate.

5. The Bernoulli fork according to claim 1, characterized in that: The material of the anti-slip support pad (2) is polyetheretherketone.

6. The Bernoulli fork according to claim 1, characterized in that: A photoelectric sensor (5) is provided on the wafer fork body (1), and the photoelectric sensor (5) is used to sense the position of the silicon wafer.

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