Sucking disc, sucking assembly and carrying device

Abstract

The utility model relates to the technical field of semiconductor processing equipment, and particularly discloses a suction cup, a suction assembly and a carrying device.The suction cup comprises a suction cup body and two or more protruding parts, an air path is arranged in the suction cup body, and one end of the air path penetrates through the suction cup body. The protruding part is arranged on the suction cup body in a protruding mode, and the orthographic projection of the protruding part is located in the orthographic projection of the suction cup body. The protruding part is provided with an adsorption hole which is communicated with the air channel, and the suction cup adsorbs a target workpiece through the adsorption hole. According to the suction cup, original whole-surface large-area contact between the silicon wafer and the suction cup can be changed into local small-area contact through the arrangement of the protruding part, the risk of subfissure of the silicon wafer caused by dust particles is reduced, and the quality of the silicon wafer is improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor processing equipment, and in particular to a suction cup, a suction component, and a transport device. Background Art

[0002] With the development of the photovoltaic industry, silicon wafers are becoming thinner and thinner, and the requirements for wafer transportation are becoming increasingly stringent. Currently, suction cups are commonly used to pick up silicon wafers and transport them between various processes. However, because the machines cannot completely clean the silicon wafers, some dust and impurities may still be adsorbed on the silicon wafers and suction cups. This can easily cause defects such as surface cracks when the suction cups are used to pick up the silicon wafers, affecting the quality of the silicon wafers. Utility Model Content

[0003] In view of this, the present application provides a suction cup, a suction assembly, and a transport device to improve the technical problem that the existing suction cup easily causes hidden cracks in the silicon wafer when adsorbing the silicon wafer.

[0004] One embodiment of the present application provides a suction cup. The suction cup includes a suction cup body and two or more raised portions. An air path is provided within the suction cup body, one end of which extends through the suction cup body. The raised portion is protruding from the suction cup body, with the orthographic projection of the raised portion located within the orthographic projection of the suction cup body. The raised portion is provided with a suction hole, which is connected to the air path. The suction cup absorbs the target workpiece through the suction hole. The sum of the thickness of the suction cup body and the thickness of the raised portion is 1 mm to 3 mm.

[0005] In the aforementioned suction cup, the raised portion protrudes from the cup body, and its orthographic projection lies within the cup body's orthographic projection. When the cup attaches a silicon wafer through the suction hole, the wafer contacts the raised portion, reducing the contact between the wafer and the cup from the original full-surface, large-area contact to a localized, smaller area. This reduces the risk of wafer cracks caused by dust particles and improves wafer quality.

[0006] In at least one embodiment, the suction cup body includes a main body and at least one arm, wherein the arm connects to a side edge of the main body along a first direction, and the main body and the arm are arranged coplanarly. If there are multiple arms, the arms are arranged along a second direction, and the first and second directions intersect. A surface of the main body and a surface of at least one arm are provided with a raised portion.

[0007] In at least one embodiment, the protrusion located on the main body is defined as a first protrusion, and the protrusion located on the support arm is defined as a second protrusion. The main body has one or more first protrusions disposed on its surface along the second direction, and each support arm has one or more second protrusions disposed on its surface. Along the first direction, the first protrusions and the second protrusions are aligned or offset.

[0008] In at least one embodiment, the protrusion located on the main body is defined as a first protrusion, and the protrusion located on the support arm is defined as a second protrusion. The first protrusion is arranged near the side of the main body away from the support arm, and the second protrusion is arranged at the end of the support arm away from the main body.

[0009] In at least one embodiment, the suction cup body includes a main plate and a cover plate. The main plate is provided with an airflow groove, one end of which extends through the main plate. The raised portion is provided on a side of the main plate facing away from the airflow groove. The cover plate is connected to the main plate and seals the airflow groove to form an air path.

[0010] In at least one embodiment, when the cover plate is connected to the main board and seals the airflow slot, the top surface of the cover plate is flush with the top surface of the main board.

[0011] In at least one embodiment, the suction cup body is made of ceramic, the raised portion is made of ceramic, and the raised portion is integrally formed with the suction cup body.

[0012] In at least one embodiment, the suction cup body further includes a connecting portion, and the suction cup body is mounted on the suction assembly via the connecting portion.

[0013] One embodiment of the present application provides a suction assembly, comprising an air extraction assembly and two or more suction cups as described in any of the above embodiments, wherein the two or more suction cups are arranged in a sequence with equal spacing along a third direction perpendicular to the surfaces of the suction cups. The air paths in the two or more suction cups are connected to the air extraction assembly.

[0014] In the above-mentioned suction assembly, by adopting the above-mentioned suction cup, the entire large-area contact between the silicon wafer and the suction cup can be changed to a local small-area contact, thereby reducing the risk of hidden cracks in the silicon wafer caused by dust particles and improving the quality of the silicon wafer.

[0015] An embodiment of the present application provides a transport device, including a driving host and the above-mentioned suction component, wherein the suction component is installed on the driving host.

[0016] In the above-mentioned transport device, by adopting the above-mentioned suction component, the entire large-area contact between the silicon wafer and the suction cup can be changed to a local small-area contact, thereby reducing the risk of hidden cracks in the silicon wafer caused by dust particles and improving the quality of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope.

[0018] Figure 1 This is a three-dimensional schematic diagram of a suction cup in a see-through state sucking up a silicon wafer in one embodiment of the present application;

[0019] Figure 2 for Figure 1 Schematic diagram of the three-dimensional structure of the middle suction cup Figure 1 , wherein the first protrusion and the second protrusion are flush along the first direction;

[0020] Figure 3 for Figure 1 Schematic diagram of the three-dimensional structure of the middle suction cup Figure 2 , wherein the first protrusion and the second protrusion are staggered along the first direction;

[0021] Figure 4 for Figure 2 Rear view of the middle suction cup;

[0022] Figure 5 for Figure 4 Schematic diagram of the structure of the middle suction cup after omitting the cover plate;

[0023] Figure 6 This is a structural diagram of a suction component in one embodiment of the present application;

[0024] Figure 7 Schematic diagram of the structure of a transport device in one embodiment of the present application.

[0025] Description of main component symbols:

[0026] 1. Handling device; 100. Suction component; 200. Drive host; 300. Silicon wafer;

[0027] 10. Suction cup; 11. Suction cup body; 111. Main body; 112. Support arm; 113. Main board; 1131. Air flow slot; 114. Cover; 115. Connecting portion; 12. Air path; 121. First air path; 122. Second air path; 13. Raised portion; 131. Suction hole; 132. First raised portion; 133. Second raised portion;

[0028] 20. Air extraction assembly;

[0029] X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0032] One embodiment of the present application provides a suction cup. The suction cup includes a suction cup body and two or more raised portions. An air path is provided within the suction cup body, one end of which passes through the suction cup body. The raised portion is protruding from the suction cup body, and the orthographic projection of the raised portion is located within the orthographic projection of the suction cup body. The raised portion is provided with an adsorption hole, which is connected to the air path, and the suction cup adsorbs the target workpiece through the adsorption hole. The sum of the thickness of the suction cup body and the thickness of the raised portion is 1 mm to 3 mm.

[0033] In the aforementioned suction cup, the raised portion protrudes from the cup body, and its orthographic projection lies within the cup body's orthographic projection. When the cup attaches a silicon wafer through the suction hole, the wafer contacts the raised portion, reducing the contact between the wafer and the cup from the original full-surface, large-area contact to a localized, smaller area. This reduces the risk of wafer cracks caused by dust particles and improves wafer quality.

[0034] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features of the embodiments may be combined with each other.

[0035] In some embodiments, a third direction is defined as being perpendicular to the surface of the suction cup, the first direction intersects the second direction, and the third direction intersects the first and second directions. The first direction is the direction parallel to X in the diagram, the second direction is the direction parallel to Y in the diagram, and the third direction is the direction parallel to Z in the diagram.

[0036] For ease of reference, the first direction is hereinafter referred to as "first direction X," the second direction is hereinafter referred to as "second direction Y," and the third direction is hereinafter referred to as "third direction Z." Optionally, in some embodiments, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

[0037] An embodiment of the present application provides a suction cup 10 for sucking a target workpiece, such as a silicon wafer, a wafer, a battery cell, etc. For ease of description, a silicon wafer 300 will be used as an example for description.

[0038] like Figure 1 and Figure 2 As shown, the suction cup 10 includes a suction cup body 11 and two or more protrusions 13. An air path 12 is provided inside the suction cup body 11, and one end of the air path 12 passes through the suction cup body 11 to connect to an external suction component 20. The suction component 20 can be an air pump, vacuum pump or other suction device.

[0039] The protrusion 13 is protruding from the suction cup body 11, and its orthographic projection is located within the orthographic projection of the suction cup body 11. The protrusion 13 is provided with a suction hole 131, which is connected to the air path 12. The suction cup 10 absorbs the silicon wafer 300 through the suction hole 131.

[0040] For example, the raised portion 13 is cylindrical and protrudes from the surface of the suction cup body 11. A suction hole 131 is formed on the top surface of the raised portion 13. In other embodiments, the raised portion 13 may also be rectangular, square, or other shapes, which is not limited in this application and can be selected by those skilled in the art based on actual conditions.

[0041] As can be understood, when sucking silicon wafer 300, the vacuum assembly 20 draws air from the air path 12, generating negative pressure at the suction holes 131 in the raised portion 13, causing the silicon wafer 300 to be sucked onto the raised portion 13. Because the orthographic projection of the raised portion 13 lies within the orthographic projection of the suction cup body 11, the contact between the silicon wafer 300 and the suction cup 10 changes from the original large-scale contact over the entire surface to a small, localized contact.

[0042] It should be noted that the entire large-area contact specifically refers to the area where the entire suction surface of the suction cup 10 contacts the silicon wafer 300 , while the local small-area contact specifically refers to the area where the suction surface of the protrusion 13 contacts the silicon wafer 300 .

[0043] Compared with the suction cup in the prior art, the suction cup 10 in the present application can reduce the contact area between the silicon wafer 300 and the suction cup 10 by setting the protrusion 13, thereby reducing the risk of hidden cracks in the silicon wafer 300 caused by dust particles and improving the quality of the silicon wafer 300.

[0044] It is worth noting that since the adsorption holes 231 of each protrusion 13 are connected to an air path 12, and the adsorption area of ​​each protrusion 13 (specifically, the area in contact between the protrusion 13 and the silicon wafer 300) is the same, when the vacuum assembly 20 extracts the air in the air path 12, the pressure generated at the corresponding adsorption holes 131 in each protrusion 13 is relatively uniform, which is beneficial to ensure that the silicon wafer 300 is evenly stressed.

[0045] In some embodiments, as Figure 2 As shown, the protrusion 13 is provided on one side of the suction cup body 11 , which is beneficial for ensuring that the processing surface and the non-processing surface of each silicon wafer 300 face the same direction when multiple suction cups 10 adsorb multiple silicon wafers 300, thereby facilitating subsequent processing of the silicon wafers 300.

[0046] In some embodiments, the protrusions 13 are provided on opposite sides of the suction cup body 11. When sucking the silicon wafer 300, the protrusions 13 on both sides of the suction cup 10 simultaneously suck the silicon wafers 300, that is, the suction cup 10 sucks two silicon wafers 300 at a time, thereby improving the transfer efficiency of the silicon wafers 300.

[0047] It is worth noting that the combined thickness of the suction cup body 11 and the raised portion 13 in this application is 1mm-3mm, which is roughly the same as the overall thickness of a suction cup without the raised portion 13 in the prior art. In other words, although the raised portion 13 is added to the suction cup body 11 in this application, the thickness of the suction cup body 11 is correspondingly reduced, and the overall thickness of the suction cup 10 is not increased.

[0048] For example, the overall thickness of the suction cup without the raised portion 13 in the prior art is defined as 3 mm, while in this application, the thickness of the suction cup body 11 is 2 mm, and the thickness of the raised portion 13 is 1 mm.

[0049] By setting the sum of the thickness of the suction cup body 11 and the protrusion 13 to be the same as the overall thickness of the suction cup without the protrusion 13 in the prior art, it is beneficial to ensure that after multiple suction cups 10 are arranged and combined, the placement space for the silicon wafer 300 between two adjacent suction cups 10 is the same as the size of the placement space for the silicon wafer 300 between two adjacent suction cups in the prior art. Technicians do not need to redesign or adjust other structures of the conveying device 1, and can directly install and use the suction cup 10 in this application, thereby improving the versatility of the suction cup 10.

[0050] In some embodiments, as Figure 1 and Figure 2 As shown, the suction cup body 11 includes a main body 111 and at least one arm 112. The arm 112 connects to the side of the main body 111 along the first direction X, and the main body 111 and the arm 112 are arranged coplanar. The surface of the main body 111 and the surface of the at least one arm 112 are provided with a protrusion 13.

[0051] As can be understood, when the suction cup 10 attracts the silicon wafer 300, it does so through the protrusions 13 on the surface of the main body 111 and the protrusions 13 on the middle surface of the support arms 112. Because the main body 111 and the support arms 112 are coplanar, the silicon wafer 300 remains vertical and prevents tilting, which helps reduce the risk of interference and damage to the silicon wafer 300 from other components.

[0052] In some embodiments, there are multiple arms 112 , and the multiple arms 112 are arranged along the second direction Y, which is beneficial to improving the stability of the suction cup 10 in adsorbing the silicon wafer 300 and reducing the risk of the silicon wafer 300 accidentally falling or falling off.

[0053] In some embodiments, as Figure 1 and Figure 2 As shown, multiple raised portions 13 are spaced apart along the path of air passage 12, simplifying the structure of suction cup 10 and reducing the need for additional connecting channels. It is understood that when creating suction hole 131, technicians only need to drill along the orthographic projection of suction hole 131 to connect it to air passage 12, eliminating the need for additional connecting channels.

[0054] In other words, suppose the protrusion 13 is not located on the path of the air path 12. In this case, the suction hole 131 in the protrusion 13 cannot be directly connected to the air path 12. Technicians need to add one or more connecting channels to connect the air path 12 with the suction hole 131, which not only increases the structural complexity of the suction cup 10, but also increases the number of processing steps and operational difficulty.

[0055] In some embodiments, as Figure 1 and Figure 5 As shown, the air path 12 includes a first air path 121 and a second air path 122. The first air path 121 is arranged along a first direction X, and one end of the first air path 121 passes through the suction cup body 11. The second air path 122 is arranged along a second direction Y and communicates with the first air path 121. A portion of the plurality of protrusions 13 is disposed in the first air path 121, and a portion of the plurality of protrusions 13 is disposed in the second air path 122.

[0056] By adopting staggered air paths 12, the protrusions 13 can be evenly distributed on the suction cup body 11, to ensure that when the suction cup 10 sucks the silicon wafer 300, the adsorption points are evenly distributed on the surface of the silicon wafer 300, thereby improving the uniformity of the force applied to the silicon wafer 300 and further improving the stability of the suction cup 10 in adsorbing the silicon wafer 300.

[0057] In some embodiments, the protrusions 13 on the main body 111 are defined as first protrusions 132, and the protrusions 13 on the arms 112 are defined as second protrusions 133. At least one first protrusion 132 is provided on the surface of the main body 111 along the second direction Y, and at least one second protrusion 133 is provided on the surface of each arm 112.

[0058] In some embodiments, as Figure 2 As shown, along the first direction X, the first protrusion 132 and the second protrusion 133 are flush, facilitating the machining of the adsorption hole 131. For example, when machining the adsorption hole 131, the user only needs to move the drill bit in one direction (specifically, the first direction X) to complete the machining of the adsorption hole 131 in the first protrusion 132 and the adsorption hole 131 in the second protrusion 133 without changing the direction of the drill bit.

[0059] In some embodiments, as Figure 3 As shown, along the first direction X, the first protrusion 132 and the second protrusion 133 are staggered, which is beneficial to disperse the adsorption points of the suction cup 10 to ensure the adsorption effect of the suction cup 10 and reduce the risk of the silicon wafer 300 falling off.

[0060] In some embodiments, the protrusion 13 located on the main body 111 is defined as a first protrusion 132, and the protrusion 13 located on the support arm 112 is defined as a second protrusion 133. The first protrusion 132 is arranged near the side of the main body 111 facing away from the support arm 112, while the second protrusion 133 is located at the end of the support arm 112 facing away from the main body 111. This helps to increase the active area of ​​the suction cup 10 (specifically, the area enclosed by the first protrusion 132 and the second protrusion 133), thereby further improving the suction effect of the suction cup 10 and reducing the risk of silicon wafer 300 falling off.

[0061] In some embodiments, as Figure 4 and Figure 5 As shown, the suction cup body 11 includes a main plate 113 and a cover plate 114. The main plate 113 is provided with an airflow groove 1131, one end of which passes through the main plate 113. The raised portion 13 is provided on the side of the main plate 113 facing away from the airflow groove 1131. The cover plate 114 is connected to the main plate 113 and seals the airflow groove 1131 to form an air path 12.

[0062] On the one hand, when the air path 12 becomes clogged or leaks, the operator only needs to disconnect the cover plate 114 from the main board 113 and remove the cover plate 114 from the main board 113, which facilitates maintenance and inspection of the suction cup 10. On the other hand, compared to the method of creating the air path 12 on the integrally molded suction cup body 11, the operator can independently process the main board 113 in an open environment to create the air flow groove 1131, which is less difficult to operate.

[0063] In some embodiments, when the cover 114 is connected to the main board 113 and seals the airflow groove 1131, the top surface of the cover 114 is flush with the top surface of the main board 113. This can prevent the cover 114 from protruding and interfering with other components or the silicon wafer 300, thereby damaging the silicon wafer 300. Secondly, it can make the suction cup 10 more beautiful.

[0064] In some embodiments, the suction cup body 11 is made of ceramic. The raised portion 13 is also made of ceramic. It should be noted that ceramic is a type of inorganic, non-metallic material made by forming and sintering natural or synthetic compounds at high temperatures. Ceramics have a high melting point, high hardness, high wear resistance, and oxidation resistance, which can effectively extend the service life of the suction cup 10.

[0065] In some embodiments, the protrusion 13 and the suction cup body 11 are integrally formed, which helps to simplify the manufacturing process of the suction cup 10 and thus improve the production efficiency of the suction cup 10.

[0066] In other embodiments, the material of the suction cup body 11 and the material of the raised portion 13 may also include other suitable materials, and the raised portion 13 and the suction cup body 11 may also be formed in other ways. This application does not limit this, and those skilled in the art can choose according to actual conditions.

[0067] In some embodiments, the suction cup 10 further includes a flexible layer (not shown). This layer is disposed on the side of the suction cup body 11 where the protrusion 13 is located, and helps protect the silicon wafer 300. The flexible layer can be made of a flexible material such as rubber or plastic. When the suction cup 10 is attached to the silicon wafer 300, the flexible layer provides a cushioning effect, reducing the impact force (specifically, instantaneous pressure) between the silicon wafer 300 and the suction cup 10, thereby further reducing the risk of damage to the silicon wafer 300.

[0068] In some embodiments, as Figure 2 and Figure 6 As shown, the suction cup body 11 further includes a connecting portion 115 , and the suction cup body 11 is mounted on the suction assembly 20 via the connecting portion 115 , which facilitates installation or removal of the suction cup 10 and improves efficiency.

[0069] In some embodiments, the connection portion 115 includes a buckle (not shown) and a slot (not shown) that cooperates with the buckle. The buckle is provided on the suction cup body 11, and the slot is provided on the suction assembly 20. When the suction cup 10 needs to be installed on the drive assembly 20, the operator snaps the buckle into the slot to connect the suction cup 10 to the suction assembly 20.

[0070] When the suction cup 10 needs to be removed from the suction assembly 20 , the operator only needs to release the fit between the buckle and the slot. This operation is simple and will not damage the suction cup 10 and the suction assembly 20 .

[0071] In other embodiments, the buckle and the slot can also be reversed, for example, the slot is provided on the suction cup body 11 and the buckle is provided on the suction assembly 20. The connecting portion 113 can also be a magnetic structure or a threaded structure, which is not limited in this application and can be selected by those skilled in the art according to actual conditions.

[0072] An embodiment of the present application provides a suction assembly 100, such as Figure 6 As shown, the suction assembly 100 includes an air extraction assembly 20 and two or more suction cups 10 described above. The two or more suction cups 10 are arranged in sequence and at equal intervals along the third direction Z. The air paths 12 in the two or more suction cups 10 are connected to the air extraction assembly 20. The air extraction assembly 20 is configured to extract air from the air paths 12 so that the corresponding suction cups 10 can absorb the silicon wafer 300.

[0073] The suction component 100 in the present application adopts the above-mentioned suction cup 10, which can change the entire large-area contact between the silicon wafer 300 and the suction cup 10 into a local small-area contact, thereby reducing the risk of hidden cracks in the silicon wafer 300 caused by dust particles and improving the quality of the silicon wafer 300.

[0074] An embodiment of the present application provides a transport device 1, such as Figure 7 As shown, the transport device 1 includes a driving host 200 and the aforementioned suction assembly 100. The suction assembly 100 is mounted on the driving host 200. The driving host 200 is configured to drive the suction assembly 100 to move to suction the silicon wafer 300. The driving host 200 may be a robot, a gantry, or the like.

[0075] The handling device 1 in the present application adopts the above-mentioned suction component 100, which can change the entire large-area contact between the silicon wafer 300 and the suction cup 10 into a local small-area contact, thereby reducing the risk of hidden cracks in the silicon wafer 300 caused by dust particles and improving the quality of the silicon wafer 300.

[0076] In addition, those skilled in the art should recognize that the above embodiments are merely intended to illustrate the present application and are not intended to limit the present application. As long as they are within the spirit of the present application, appropriate changes and modifications to the above embodiments are within the scope of disclosure of the present application.

Claims

1. A suction cup, characterized in that: include: The suction cup body has an air path provided therein, one end of the air path passing through the suction cup body; Two or more protrusions are protrudingly provided on the suction cup body, and the orthographic projections of the protrusions are located within the orthographic projection of the suction cup body; the protrusions are provided with adsorption holes, the adsorption holes are connected to the air path, and the suction cup adsorbs the target workpiece through the adsorption holes; The sum of the thickness of the suction cup body and the thickness of the protruding portion is 1 mm to 3 mm.

2. The suction cup according to claim 1, wherein The suction cup body includes a main body and at least one arm, wherein the arm is connected to a side of the main body along a first direction, and the main body and the arm are arranged coplanarly; when there are multiple arms, the multiple arms are arranged along a second direction, and the first direction and the second direction intersect; The protrusion is provided on a surface of the main body and a surface of at least one of the arms.

3. The suction cup according to claim 2, wherein The protrusion located on the main body is defined as a first protrusion, and the protrusion located on the support arm is defined as a second protrusion; The surface of the main body is provided with at least one first protrusion along the second direction, and the surface of each arm is provided with at least one second protrusion; Along the first direction, the first protrusion and the second protrusion are aligned or staggered.

4. The suction cup according to claim 2, wherein The protrusion located on the main body is defined as a first protrusion, and the protrusion located on the support arm is defined as a second protrusion; The first protrusion is arranged close to a side of the main body away from the support arm, and the second protrusion is arranged at an end of the support arm away from the main body.

5. The suction cup according to any one of claims 1 to 4, characterized in that The suction cup body comprises: The main board is provided with an air flow groove, one end of which passes through the main board; the raised portion is provided on a side of the main board away from the air flow groove; The cover plate is connected to the main board and seals the air flow groove to form the air path.

6. The suction cup according to claim 5, wherein When the cover plate is connected to the main board and seals the air flow groove, the top surface of the cover plate is flush with the top surface of the main board.

7. The suction cup according to claim 1, wherein The material of the suction cup body includes ceramic, and the material of the protrusion includes ceramic; the protrusion and the suction cup body are integrally formed.

8. The suction cup according to claim 1, wherein The suction cup body further includes a connecting portion, through which the suction cup body is mounted on the air extraction assembly.

9. A suction component, characterized in that: The device comprises an air extraction assembly and two or more suction cups according to any one of claims 1 to 8, wherein the two or more suction cups are arranged in sequence with equal intervals along a third direction, and the third direction is perpendicular to the surface of the suction cup; The air paths in the two or more suction cups are commonly connected to the air extraction component.

10. A transport device, characterized in that: It comprises a driving host and a suction component as claimed in claim 9, wherein the suction component is installed on the driving host.

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