Silicon wafer cleaning machine with drying function
By designing a silicon wafer cleaning machine with drying function, the cleaning and drying of silicon wafers are integrated, the problem of drying dead corners is solved, and the drying effect and quality of silicon wafers are improved.
Patent Information
- Application Number
- CN202422725040.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-11-08
AI Technical Summary
Existing silicon wafer cleaning methods cannot achieve integrated cleaning and drying, resulting in drying dead corners, affecting the drying effect and quality of silicon wafers.
A silicon wafer cleaning machine with drying function is designed. After cleaning with a spray head, it is dried with heated air. The motor drives the support block to rotate the silicon wafer to avoid drying dead corners. The threaded rod and slider structure are combined to clamp the silicon wafer.
It realizes all-round cleaning and drying of silicon wafers, improves production efficiency and ensures the overall drying effect and quality of silicon wafers.
Smart Images
Figure CN223393941U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafers, in particular to a silicon wafer cleaning machine with a drying function. Background Art
[0002] Silicon wafers are the cornerstone of the semiconductor industry, supporting the development of modern electronic devices. They are thin, flat, circular sheets of silicon substrate material, also known as wafers, and are an important raw material for manufacturing chips and various semiconductor devices.
[0003] Currently, existing silicon wafer cleaning methods have certain limitations. A separate drying step is required after cleaning, and integrated cleaning and drying operations cannot be achieved. In addition, since the silicon wafers are laid flat during the drying process, some areas become drying dead corners, making it difficult to ensure the overall drying effect of the silicon wafers. This not only reduces production efficiency, but may also affect the quality of the silicon wafers and their subsequent performance. Utility Model Content
[0004] The purpose of the utility model is to solve the problem that there are blind spots in the existing drying process, which makes it difficult to ensure the overall drying effect of silicon wafers and affects the quality of silicon wafers, and to propose a silicon wafer cleaning machine with a drying function.
[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:
[0006] A silicon wafer cleaning machine with a drying function includes a first installation box and a cleaning mechanism, wherein one side of the first installation box is connected to a cabinet door by a hinge, a first installation box is inserted into the top of the first installation box, two air intake fans are embedded in the top of the first installation box, two heating wires are fixedly connected between the inner walls at both ends of the first installation box, a connecting plate is fixedly connected between the inner walls at both ends of the first installation box located below the heating wires, a plurality of air outlet holes are provided on the connecting plate, the inner walls at both ends of the first installation box are rotatably connected to support blocks, one side of the support block is slidably connected to two first sliders by providing a slide groove, two guide rods are fixedly connected between each two relative first sliders, two second sliders are slidably sleeved between the two guide rods, the top of the second slider is fixedly connected to a placement box, and the outer wall of the placement box is provided with a plurality of through holes.
[0007] Furthermore, two supporting legs are fixedly connected to the bottom outer wall of the first installation box.
[0008] Furthermore, an observation window is provided on one side of the cabinet door.
[0009] Furthermore, a guide bucket is connected to the bottom of the first installation box, and the cleaning mechanism includes a water tank, which is arranged at the bottom end of the guide bucket. A mounting plate is fixedly connected to the outer wall of one side of the water tank, and a water pump is fixedly connected to the top of the mounting plate. The water inlet end of the water pump is connected to an inlet pipe, and the other end of the inlet pipe is connected to the water tank. The water outlet end of the water pump is connected to an outlet pipe, and a plurality of sprinkler heads are connected to the outer wall of the outlet pipe.
[0010] Furthermore, a second installation box is plugged into one side of the first installation box, and the water outlet pipe is arranged in the second installation box.
[0011] Furthermore, a second installation box is fixedly connected to an outer wall of one end of the first installation box, a motor is fixedly connected inside the second installation box, and an output end of the motor is fixedly connected to one of the support blocks.
[0012] Furthermore, a bidirectional threaded rod is rotatably inserted into one side of the two first sliders, and two connecting blocks are provided on the outer wall thread sleeve of the bidirectional threaded rod. One end of the connecting block is fixed to one end of the second slider, and one end of the bidirectional threaded rod is fixedly connected to an adjusting nut.
[0013] Furthermore, a fastening bolt is threadedly inserted into one side of the first sliding block.
[0014] The beneficial effects of the utility model are:
[0015] 1. The silicon wafers are cleaned through a spray head, and then the outside air is drawn into the first installation box through an air intake fan. The air is heated by the heating wire and blown downward from the air outlet, and then blown through the through hole to the silicon wafers in the placement box, thereby drying the silicon wafers, thereby achieving integrated cleaning and drying.
[0016] 2. By rotating the support block driven by the motor, the silicon wafer is driven to rotate, thereby fully cleaning and drying the silicon wafer, thereby avoiding drying dead corners.
[0017] 3. By turning the adjusting nut, the bidirectional threaded rod is driven to rotate, thereby driving the second slider to move toward the middle along the guide rod, thereby clamping the silicon wafer for subsequent cleaning and drying of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of the silicon wafer cleaning machine with drying function proposed by the present invention;
[0019] Figure 2 This is a rear structural schematic diagram of the silicon wafer cleaning machine with drying function proposed by the present invention;
[0020] Figure 3 This is a partial structural diagram of a silicon wafer cleaning machine with a drying function proposed by the present invention;
[0021] Figure 4 This is a structural schematic diagram of the clamping part of the silicon wafer cleaning machine with drying function proposed by the present invention.
[0022] In the figure: 1. Support leg; 2. First installation box; 3. Cabinet door; 4. Observation window; 5. First installation box; 6. Inlet fan; 7. Heating wire; 8. Connecting plate; 9. Air outlet; 10. Water tank; 11. Mounting plate; 12. Water pump; 13. Water inlet pipe; 14. Water outlet pipe; 15. Sprinkler head; 16. Second installation box; 17. Motor; 18. Support block; 19. First slider; 20. Guide rod; 21. Second slider; 22. Placement box; 23. Through hole; 24. Connecting block; 25. Bidirectional threaded rod; 26. Adjusting nut; 27. Second installation box; 28. Fastening bolt. DETAILED DESCRIPTION
[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0024] Reference Figure 1-Figure 4 , a silicon wafer cleaning machine with a drying function, includes a first installation box 2 and a cleaning mechanism, one side of the first installation box 2 is connected to a cabinet door 3 by a hinge, the top of the first installation box 2 is plugged with a first installation box 5, the top of the first installation box 5 is embedded with two air intake fans 6, two heating wires 7 are fixed between the inner walls at both ends of the first installation box 5 by bolts, and a connecting plate 8 is fixed between the inner walls at both ends of the first installation box 5 below the heating wire 7 by bolts, and a plurality of air outlet holes 9 are provided on the connecting plate 8. The inner walls at both ends of the first installation box 2 are rotatably connected to support blocks 18, which support One side of the support block 18 is slidably connected to two first sliders 19 by opening a slide groove, and two guide rods 20 are welded between each two relative first sliders 19. Two second sliders 21 are slidably sleeved between the two guide rods 20. The top of the second slider 21 is fixed with a placement box 22 by bolts. The outer wall of the placement box 22 is provided with multiple through holes 23. The outside air is drawn into the first installation box 5 through the air intake fan 6. The air is heated by the heating wire 7 and blown downward from the air outlet 9, and then blown to the silicon wafers in the placement box 22 through the through holes 23, thereby drying the silicon wafers.
[0025] The bottom outer wall of the first installation box 2 is fixed with two supporting legs 1 by bolts, and an observation window 4 is provided on one side of the cabinet door 3, so that the cleaning and drying conditions of the silicon wafers can be observed through the observation window 4. A diversion bucket is plugged into the bottom of the first installation box 2, and the cleaning mechanism includes a water tank 10. The sewage generated by cleaning flows into the water tank 10 through the diversion bucket for collection. The water tank 10 is set at the bottom end of the diversion bucket. A mounting plate 11 is welded to the outer wall of one side of the water tank 10. A water pump 1 is fixed to the top of the mounting plate 11 by bolts. 2. The water inlet end of the water pump 12 is connected with an inlet pipe 13, and the other end of the inlet pipe 13 is connected with the water tank 10. The water outlet end of the water pump 12 is connected with an outlet pipe 14. The outer wall of the outlet pipe 14 is connected with multiple spray heads 15. The water in the water tank 10 is pumped into the inlet pipe 13 by the water pump 12, and then transported to the spray head 15 through the outlet pipe 14. Then, the water is sprayed from the spray head 15 through the through hole 23 to the silicon wafer in the placement box 22, thereby cleaning the silicon wafer. One side of the first installation box 2 is connected with the second Two installation boxes 27, the water outlet pipe 14 is arranged in the second installation box 27, the outer wall of one end of the first installation box 2 is fixed with the second installation box 16 by bolts, and the motor 17 is fixed in the second installation box 16 by bolts. The output end of the motor 17 is fixedly connected to one of the support blocks 18. Driven by the motor 17, the support block 18 rotates, thereby driving the silicon wafer to rotate, and then fully cleaning and drying the silicon wafer. One side of the two first sliders 19 is rotatably inserted with a bidirectional threaded rod 25, and the outer wall of the bidirectional threaded rod 25 is threadedly sleeved with two connecting blocks 24, one end of the connecting block 24 is fixed to one end of the second slider 21, and one end of the bidirectional threaded rod 25 is welded with an adjusting nut 26. Twisting the adjusting nut 26 drives the bidirectional threaded rod 25 to rotate, thereby driving the second slider 21 to move toward the middle along the guide rod 20, thereby clamping the silicon wafer, and one side of the first slider 19 is threadedly inserted with a fastening bolt 28, and the first slider 19 is fixed with the fastening bolt 28.
[0026] The working principle of this embodiment is as follows: when in use, first, the silicon wafer is placed between the two placement boxes 22, then, the adjusting nut 26 is screwed to drive the bidirectional threaded rod 25 to rotate, thereby driving the second slider 21 to move toward the middle along the guide rod 20, thereby clamping the silicon wafer, then, the first slider 19 is inserted into the support block 18, thereby pushing the silicon wafer into the first installation box 2, and then fixing the first slider 19 with the fastening bolt 28, then closing the cabinet door 3, then, the water in the water tank 10 is pumped into the water inlet pipe 13 by the water pump 12, and then transported to the spray head 15 through the outlet pipe 14, and then, from the spray head 15, through the through hole 23, sprayed to the silicon wafer in the placement box 22, thereby cleaning the silicon wafer, during the cleaning process, the support block 18 is driven by the motor 17 to rotate, thereby driving the silicon wafer to rotate, thereby fully cleaning the silicon wafer, and the sewage generated by cleaning flows into the water tank 10 through the diversion bucket for collection;
[0027] After cleaning, the outside air is drawn into the first installation box 5 through the air intake fan 6. The air is heated by the heating wire 7 and blown downward from the air outlet 9. Then, it is blown toward the silicon wafers in the placement box 22 through the through hole 23, thereby drying the silicon wafers. During the drying process, the silicon wafers in the placement box 22 are driven to rotate by the motor 17, thereby fully drying the silicon wafers.
[0028] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A silicon wafer cleaning machine with a drying function, comprising a first installation box (2) and a cleaning mechanism, characterized in that: One side of the first installation box (2) is connected to a cabinet door (3) through a hinge, the top of the first installation box (2) is plugged with a first installation box (5), the top of the first installation box (5) is embedded with two air intake fans (6), two heating wires (7) are fixedly connected between the inner walls at both ends of the first installation box (5), a connecting plate (8) is fixedly connected between the inner walls at both ends of the first installation box (5) located below the heating wires (7), and a plurality of air outlet holes (9) are provided on the connecting plate (8), the inner walls at both ends of the first installation box (2) are rotatably connected to support blocks (18), one side of the support block (18) is slidably connected to two first sliders (19) by providing a sliding groove, two guide rods (20) are fixedly connected between each two relative first sliders (19), two second sliders (21) are slidably sleeved between the two guide rods (20), the top of the second slider (21) is fixedly connected to a placement box (22), and the outer wall of the placement box (22) is provided with a plurality of through holes (23).
2. The silicon wafer cleaning machine with drying function according to claim 1, characterized in that: Two supporting legs (1) are fixedly connected to the bottom outer wall of the first installation box (2).
3. The silicon wafer cleaning machine with drying function according to claim 1, characterized in that: An observation window (4) is provided on one side of the cabinet door (3).
4. The silicon wafer cleaning machine with drying function according to claim 1, characterized in that: The bottom of the first installation box (2) is plugged with a diversion bucket, and the cleaning mechanism includes a water tank (10). The water tank (10) is arranged at the bottom end of the diversion bucket. The outer wall of one side of the water tank (10) is fixedly connected with a mounting plate (11), and the top of the mounting plate (11) is fixedly connected with a water pump (12). The water inlet end of the water pump (12) is plugged with a water inlet pipe (13), and the other end of the water inlet pipe (13) is plugged with the water tank (10). The water outlet end of the water pump (12) is plugged with a water outlet pipe (14), and the outer wall of the water outlet pipe (14) is plugged with a plurality of spray heads (15).
5. The silicon wafer cleaning machine with drying function according to claim 4, characterized in that: A second installation box (27) is plugged into one side of the first installation box (2), and the water outlet pipe (14) is arranged in the second installation box (27).
6. The silicon wafer cleaning machine with drying function according to claim 1, characterized in that: A second installation box (16) is fixedly connected to the outer wall of one end of the first installation box (2), a motor (17) is fixedly connected inside the second installation box (16), and an output end of the motor (17) is fixedly connected to one of the support blocks (18).
7. The silicon wafer cleaning machine with drying function according to claim 1, characterized in that: A bidirectional threaded rod (25) is rotatably inserted into one side of the two first sliders (19), and two connecting blocks (24) are threadedly sleeved on the outer wall of the bidirectional threaded rod (25). One end of the connecting block (24) is fixed to one end of the second slider (21), and one end of the bidirectional threaded rod (25) is fixedly connected to an adjusting nut (26).
8. The silicon wafer cleaning machine with drying function according to claim 1, characterized in that: A fastening bolt (28) is threadedly inserted into one side of the first sliding block (19).