Laser welding equipment and transposition device thereof

Abstract

The utility model relates to laser welding equipment and a transposition device thereof. The transposition device comprises a mounting body, a pickup head, an adjusting mechanism and an optical element. The pick-up head is fixedly arranged on the installation body and comprises a pick-up face and a light receiving face. The pickup surface picks up a plurality of light-emitting elements by a pickup force. The light receiving surface faces the pickup surface. The adjusting mechanism is arranged on the mounting body. The optical element is connected with the adjusting mechanism, faces the light receiving surface at intervals, and comprises a plurality of micro lenses. The optical element is used for receiving laser light, and the laser light is processed into multiple welding light beams through the multiple micro lenses and projected to the light receiving face. Wherein the adjusting mechanism translates the position of the optical element relative to the pickup head so as to change the relative position of the plurality of welding beams correspondingly projected to the light receiving surface, so that at least one of the plurality of picked light emitting elements is welded to the circuit substrate.

Description

Technical Field

[0001] The utility model relates to mass transfer welding equipment, in particular to a laser welding equipment and a transfer device thereof. Background Art

[0002] Currently, the pickup head of mass transfer welding equipment operates by first moving to a relative position with a temporary substrate, aligning with the target light-emitting element on the temporary substrate, and then picking it up. It then moves from the temporary substrate to the circuit substrate, aligning the picked-up light-emitting element with the pixel of the circuit substrate, and then bonding it. Finally, the bonded light-emitting element is welded together with the pixel of the circuit substrate.

[0003] Because the current transfer soldering method requires that the number of light-emitting components picked up each time must be consistent with the distribution of some pixels on the circuit substrate, after completing a single soldering operation, it is necessary to return to the temporary substrate to pick up the next batch of light-emitting components. This repeated round trip and alignment time consumes a lot of time, resulting in poor production efficiency. Utility Model Content

[0004] In response to the above-mentioned deficiencies in the prior art, the laser welding equipment and its transfer device of the present invention are not limited by the number and distribution of pixels on the circuit substrate, but can pick up more light-emitting elements at a time and weld them on the circuit substrate one by one.

[0005] In order to achieve the above-mentioned purpose, the laser welding equipment of the present invention includes a workbench, a laser device and a transposition device. The workbench is used to carry a circuit substrate. The laser device is arranged on the workbench and is used to project a laser light. The transposition device is arranged on the workbench and includes a mounting body, a pickup head, an adjustment mechanism and an optical element. The pickup head is fixedly mounted on the mounting body and includes a pickup surface and a light receiving surface. The pickup surface picks up a plurality of light-emitting elements through a pickup force. The light receiving surface is aligned with the pickup surface. The adjustment mechanism is arranged on the mounting body. The optical element is connected to the adjustment mechanism and faces the light receiving surface at intervals, and includes a plurality of micro lenses arranged in an array. The optical element is used to receive the laser light and process it into multiple welding beams through a plurality of micro lenses and project them onto the light receiving surface. When the picked-up multiple light-emitting elements are attached to the circuit substrate, the adjustment mechanism translates the position of the optical element relative to the pickup head to change the relative position of the multiple welding beams projected onto the light-receiving surface to weld at least one of the picked-up multiple light-emitting elements to the circuit substrate.

[0006] In this way, the laser welding equipment of the present invention can pick up more light-emitting elements each time through the pickup head of the transposition device, and translate the optical element through the adjustment mechanism so that the microlens can be aligned with the picked light-emitting elements at different positions each time, so that the light-emitting elements can be welded to the circuit substrate in batches one by one, thereby reducing the time consumed by the current transposition device's repeated back and forth movement and alignment.

[0007] In order to achieve the above-mentioned purpose, the transposition device of the laser welding equipment of the present invention includes a mounting body, a pickup head, an adjustment mechanism and an optical element. The pickup head is fixedly arranged on the mounting body and includes a pickup surface and a light receiving surface. The pickup surface picks up multiple light-emitting elements through a pickup force. The light receiving surface is facing the pickup surface. The adjustment mechanism is arranged on the mounting body. The optical element is connected to the adjustment mechanism and faces the light receiving surface at intervals, and includes a plurality of micro lenses. The optical element is used to receive laser light and is processed into multiple welding beams through multiple micro lenses and projected onto the light receiving surface. The adjustment mechanism translates the position of the optical element relative to the pickup head to change the relative position of the multiple welding beams projected onto the light receiving surface to weld at least one of the multiple light-emitting elements picked up to the circuit substrate.

[0008] In this way, the pickup head of the transfer device of the laser welding equipment of the present invention picks up more light-emitting components each time, and through the adjustment mechanism, the optical element is translated so that the microlens is aligned with the picked light-emitting components at different positions each time, so that the light-emitting components are welded to the circuit substrate in batches one by one, thereby reducing the time consumed by the current transfer device's repeated back and forth movement and alignment.

[0009] The detailed structure and features of the laser welding equipment and its transfer device provided by the present invention will be described in the detailed description of the following embodiments. However, those skilled in the art should understand that the detailed description and the specific embodiments listed in the implementation of the present invention are only for the purpose of illustrating the present invention and are not intended to limit the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic diagram of an embodiment of the present invention in which a temporary substrate and a circuit substrate are located on the laser welding equipment;

[0011] Figure 2 yes Figure 1 a schematic cross-sectional view of the transfer device;

[0012] Figure 3 yes Figure 1 A top view of the transfer device, but omitted Figure 2 The upper end portion structure of the middle mounting body;

[0013] Figure 4 is a schematic diagram of a transfer device picking up a light-emitting element from a temporary substrate;

[0014] Figure 5 This is a schematic diagram of a laser device soldering a picked-up light-emitting element to a circuit board via a transposition device;

[0015] Figure 6 It is a continuation Figure 5, a schematic diagram of the transposition device being moved above the circuit substrate;

[0016] Figure 7 It is a continuation Figure 6 , a schematic diagram of the transposition device attaching the picked-up light-emitting elements to the circuit substrate again and aligning the microlenses of the optical element with each light-emitting element for welding;

[0017] Wherein, the reference numerals:

[0018] 10: Laser welding equipment

[0019] 11: Workbench

[0020] 13: Laser device

[0021] 131: Laser Light

[0022] 15: Transposition device

[0023] 151: Install the main body

[0024] 1511: Upper mounting portion

[0025] 1513: Lower mounting portion

[0026] 153: Pickup head

[0027] 1531: Pick up face

[0028] 1533: light-receiving surface

[0029] 155: Adjustment mechanism

[0030] 1551: First driving member

[0031] 1552: First single-axis slide

[0032] 1553: First dual-axis slide

[0033] 1554: Second driving member

[0034] 1555: Second single-axis slide

[0035] 1556: Second dual-axis slide

[0036] 1557: First motion axis

[0037] 1558: Second motion axis

[0038] 157: Optical components

[0039] 1571:Microlens

[0040] 20: Temporary substrate

[0041] 30: Circuit board

[0042] 31: Pixels

[0043] 33: Solder pad

[0044] 50: Light-emitting element

[0045] 51: Metal block. DETAILED DESCRIPTION

[0046] The applicant first clarifies that throughout this specification, including the embodiments described below and the claims of the patent application, directional terms are based on the directions in the drawings. Furthermore, in the embodiments and drawings described below, identical component numbers represent identical or similar components or structural features.

[0047] like Figure 1 As shown, the laser welding apparatus 10 of the present invention includes a workbench 11, a laser device 13, and a transfer device 15. The workbench 11 is used to support a temporary substrate 20 and a circuit substrate 30. The temporary substrate 20 is used to temporarily secure multiple light-emitting elements (e.g., LEDs) 50 for subsequent transfer processing. The circuit substrate 30 has multiple pixels 31. In this embodiment, each pixel 31 includes three pairs of bonding pads 33, each pair of bonding pads 33 being used to connect to a light-emitting element 50. The three pairs of bonding pads 33 are used to connect to light-emitting elements 50 of three primary colors (e.g., red, blue, and green).

[0048] In other embodiments, the temporary substrate 20 may also be placed on other platforms, and is not limited to being placed on the workbench 11 of the laser welding equipment 10 .

[0049] The laser device 13 is disposed on the workbench 11 and is used to project a laser beam. Although the laser device 13 is shown above the transfer device 15 in the figure, in fact, the laser device 13 can also be disposed at other locations and is not limited to being disposed above the transfer device 15.

[0050] The transfer device 15 is disposed on the workbench 11 and is located opposite the laser device 13 to receive laser light. The transfer device 15 can be moved from the temporary substrate 20 to the circuit substrate 30, or from the circuit substrate 30 back to the temporary substrate 20. When the transfer device 15 is located opposite the temporary substrate 20, the transfer device 15 is moved close to the temporary substrate 20 to pick up the light-emitting element 50 on the temporary substrate 20. When the transfer device 15 is located opposite the circuit substrate 30, the transfer device 15 is moved close to the circuit substrate 30 to allow the picked-up light-emitting element to contact the solder pad of the pixel on the circuit substrate 30, thereby soldering the light-emitting element 50 to the corresponding solder pad of the pixel on the circuit substrate 30 using the laser light.

[0051] like Figure 2 As shown, the transfer device 15 includes a mounting body 151 , a pickup head 153 , an adjustment mechanism 155 and an optical element 157 .

[0052] The mounting body 151 is a hollow structure, and can be divided into an upper mounting portion 1511 and a lower mounting portion 1513 from the hollow structure. The upper mounting portion 1511 is used for installing the adjustment mechanism 155 and the optical element 157, and the lower mounting portion 1513 is used for installing the pickup head 153.

[0053] The pickup head 153 is fixedly mounted on the mounting body 151 and includes a pickup surface 1531 and a light-receiving surface 1533. The pickup head 153 is made of an optically transparent elastic polymer material (e.g., PDMS). The pickup surface 1531 picks up the light-emitting element 50 using a pickup force, such as the viscosity of the PDMS itself or a sticky adhesive formed on the pickup surface 1531. The light-receiving surface 1533 faces away from the pickup surface 1531.

[0054] Adjustment mechanism 155 is mounted on mounting body 151. Optical element 157 is connected to adjustment mechanism 155 and faces light-receiving surface 1533. It includes a plurality of microlenses 1571 arranged in an array. Optical element 157 receives laser light 131 and processes it through microlenses 1571 into multiple welding beams 133, which are then projected onto light-receiving surface 1533. The position of welding beam 133 projected onto the light-receiving surface is related to the focal point of microlenses 1571, which is fixed.

[0055] In order to change the position where the welding beam is projected onto the light receiving surface 1533 , the adjustment mechanism 155 can translate the optical element 153 , thereby changing the position where the welding beam is projected onto the light receiving surface 1533 .

[0056] like Figure 3 As shown, the adjustment mechanism 155 includes a first driving member 1551, a first uniaxial slide 1552, a first biaxial slide 1553, a second driving member 1554, a second uniaxial slide 1555 and a second biaxial slide 1556. The first driving member 1551 and the second driving member 1554 are motors, and other embodiments may also use pneumatic pistons, linear elements, etc. The first uniaxial slide 1552 and the second uniaxial slide 1555 are the same components and are composed of a track, allowing the first driving member 1551 and the second driving member 1554 to slide along the track. The first biaxial slide 1553 and the second biaxial slide 1556 are the same components and are composed of a slide rail configured on the first motion axis and a slide rail configured on the second motion axis.

[0057] The first driving member 1551 is connected to the optical element 153 and is used to drive the optical element 153 along a first motion axis 1557, such as the X-axis direction of a two-dimensional plane. The first single-axis slide 1552 is connected to the first driving member 1551 to allow the first driving member 1551 to slide along a second motion axis (such as the Y-axis direction of a two-dimensional plane) 1558. The first dual-axis slide 1553 is connected to the optical element 153 and is located relative to the first driving member 1551 in a position relative to the first motion axis 1557. The second motion axis 1558 is perpendicular to the first motion axis 1557.

[0058] The second driving member 1554 is connected to the optical element 153 and is used to drive the optical element 153 along the second motion axis 1558. The second single-axis slide 1555 is connected to the second driving member 1554 to allow the second driving member 1554 to slide along the first motion axis 1557. The second dual-axis slide 1556 is connected to the optical element 153 and is located relative to the second driving member 1554 on the second motion axis. In this way, the optical element 153 is driven to translate by the two first driving members 1551 or the two second driving members 1554 of the adjustment mechanism 155. During the translation process, the configuration of each slide can be used to allow the optical element 153 to remain at the target position, thereby adjusting the relative position of the welding beam projected on the light-receiving surface.

[0059] The purpose of the motor drive is to obtain a more stable, fast and accurate positioning. Although in this embodiment, a motor and a slide are respectively configured on the X-axis and the Y-axis, in other embodiments, when only a single-axis translation is required, only one motor and a corresponding slide can be set in the X-axis or Y-axis direction.

[0060] Then through Figures 4 to 7 The operation of the laser welding apparatus 10 is described. Figures 4 to 7 The laser device is omitted, and only the laser light 131 generated by the laser device is shown. Furthermore, the adjustment mechanism is explained using two first drive members 1551 in the X-axis direction as an example. Because the operation and purpose of the second drive member are substantially the same as those of the first drive member, the difference lies in the different axial movement. Therefore, the operation of the second drive member is not further described.

[0061] like Figure 4 As shown, the transfer device 15 moves to a position relative to the temporary substrate 20 and presses down to attach the pickup surface 1531 of the pickup head 153 to the light emitting element 50 . Subsequently, the transfer device 15 moves upward to pick up eight light emitting elements 50 .

[0062] like Figure 5As shown, the transfer device 15 moves rightward to above the circuit substrate 30 to allow the metal block 51 of the picked-up light-emitting element 50 to contact the soldering pad 33. In the figure, there are eight light-emitting elements 50 picked up, but the metal blocks 51 of only four of the light-emitting elements 50 are in contact with the soldering pad 33. The metal blocks 51 of the other four light-emitting elements 50 are not in contact with the soldering pad 33. Subsequently, the laser light 131 projected by the laser device is directed to the transfer device 15, causing the microlens 1571 of the optical element 157 to focus and project welding beams 133. The four welding beams 133 are correspondingly projected onto the metal blocks 51 of the four light-emitting elements 50 in contact with the soldering pad 33, completing the soldering.

[0063] Figure 5 After welding is completed, Figure 6 As shown, the transfer device 15 moves upward away from the position of the soldered pad 33. At this time, there are still four unsoldered light-emitting elements 50 on the transfer device 15. Then, it moves to the right to the adjacent pixel area. In this way, the transfer device 15 of the laser welding equipment of the present invention can pick up more light-emitting elements 50 and can directly move to the adjacent pixel area after the previous soldering operation, thereby reducing the moving distance and time and improving the repeated travel between the temporary substrate 20 and the circuit substrate 30.

[0064] Figure 6 The focus of the micro lens 1571 is not aligned with the attached light emitting element 30. Then, after the metal block 51 of the picked light emitting element 50 is aligned with the soldering pad 33, it can contact the soldering pad 33 downwards. Figure 7 As shown, the drive shaft of the first driving member 1551 then drives the optical element 157 rightward along the X-axis. The first dual-axis slide 1553 connected to the other end of the optical element 157 can also slide to a position via the slide rail of the first dual-axis slide 1553 configured on the first motion axis, so that the microlens 1571 corresponds to the picked light-emitting element 50. Although not shown in the figure, it can be understood that when the optical element 157 translates to the right, the second driving member can slide to the right to a position via the slide rail of the second single-axis slide and the second dual-axis slide configured on the first motion axis. Then, the laser light 131 projected by the laser device is again transmitted to the transposition device 15, so that the microlens 1571 of the optical element 157 focuses and projects the welding beam 133. The four welding beams 133 are correspondingly projected onto the metal block 51 of the four light-emitting elements 50 with contact pads 33, completing the welding. Thus, the laser welding equipment of the present invention can effectively reduce the time and distance of the transfer device 15 traveling back and forth between the temporary substrate 20 and the circuit substrate 30 , and can reduce the number of times of picking up and aligning the temporary substrate 20 , thereby effectively improving production efficiency.

[0065] The distance that the first driving member 1551 of the adjustment mechanism translates the optical element 157 is related to the distance between adjacent light-emitting elements 50 picked up by the pickup surface of the pickup head 153, that is, the distance to the next light-emitting element 50 to be soldered. This distance is much shorter than the round-trip distance between the substrate 20 and the circuit board 30. In other embodiments, the pickup head 153 may also pick up more or fewer light-emitting elements 50 and is not limited to the embodiment depicted and described.

[0066] Finally, the constituent elements disclosed in the aforementioned embodiments of the present invention are merely illustrative and are not intended to limit the scope of the present invention. Replacements or modifications of other equivalent elements should also be covered by the patent application scope of the present invention.

Claims

1. A laser welding device, characterized in that: include: a workbench for carrying a circuit substrate; a laser device, disposed on the workbench and used for projecting a laser beam; and A transposition device is arranged on a workbench and includes a mounting body, a pickup head, an adjustment mechanism and an optical element. The pickup head is fixedly arranged on the mounting body and includes a pickup surface and a light-receiving surface. The pickup surface picks up multiple light-emitting elements through a pickup force, and the light-receiving surface faces away from the pickup surface. The adjustment mechanism is arranged on the mounting body. The optical element is connected to the adjustment mechanism, and The optical element is spaced apart from the light-receiving surface and includes a plurality of micro lenses arranged in an array. The optical element is used to receive the laser light and process it into multiple welding beams through the multiple micro lenses and project them onto the light-receiving surface. When the multiple light-emitting elements picked up are attached to the circuit substrate, the adjustment mechanism translates the position of the optical element relative to the pickup head to change the relative position of the multiple welding beams projected onto the light-receiving surface, so as to weld at least one of the multiple light-emitting elements picked up to the circuit substrate.

2. The laser welding equipment according to claim 1, wherein in, The adjustment mechanism includes a first driving component connected to the optical element and used for driving the optical element along a first movement axis.

3. The laser welding equipment according to claim 2, wherein: in, The adjustment mechanism includes a first uniaxial slide, a second driving member and a second uniaxial slide. The first uniaxial slide is connected to the first driving member to allow the first driving member to slide along a second motion axis. The second driving member is connected to the optical element and is used to drive the optical element along the second motion axis. The second uniaxial slide is connected to the second driving member to allow the second driving member to slide along the first motion axis. The second motion axis is perpendicular to the first motion axis.

4. The laser welding equipment according to claim 3, wherein: in, The adjustment mechanism includes a first dual-axis slide and a second dual-axis slide. The first dual-axis slide is connected to the optical element and is located relative to the first driving member on the first motion axis. The second dual-axis slide is connected to the optical element and is located relative to the second driving member on the second motion axis. The first dual-axis slide and the second dual-axis slide allow the optical element to slide on the first motion axis and the second motion axis.

5. The laser welding equipment according to claim 4, characterized in that in, The first driving component and the second driving component each include a motor.

6. The laser welding equipment according to claim 1, wherein: in, The distance that the adjustment mechanism translates the optical element is related to the distance between adjacent light-emitting elements among the plurality of light-emitting elements picked up by the picking surface of the picking head.

7. A transposition device for a laser welding device, the laser welding device comprising: A laser device is disposed on a workbench and is used to project a laser beam, wherein the transfer device of the laser welding equipment includes: - Installing the body; a pickup head fixedly mounted on the mounting body and comprising a pickup surface and a light-receiving surface, wherein the pickup surface picks up the plurality of light-emitting elements by a pickup force, and the light-receiving surface faces away from the pickup surface; an adjustment mechanism disposed on the mounting body; and An optical element is connected to the adjustment mechanism and faces the light-receiving surface at intervals and includes a plurality of micro lenses. The optical element is used to receive the laser light and process it into multiple welding beams through the multiple micro lenses and project them onto the light-receiving surface. The adjustment mechanism translates the position of the optical element relative to the pickup head to change the relative position of the multiple welding beams projected onto the light-receiving surface to weld at least one of the plurality of light-emitting elements picked up.

8. The transfer device of the laser welding equipment according to claim 7, wherein: in, The adjustment mechanism includes a first driving component connected to the optical element and used for driving the optical element along a first movement axis.

9. The transfer device of the laser welding equipment according to claim 8, wherein: in, The adjustment mechanism includes a first uniaxial slide, a second driving member and a second uniaxial slide. The first uniaxial slide is connected to the first driving member to allow the first driving member to slide along a second motion axis. The second driving member is connected to the optical element and is used to drive the optical element along the second motion axis. The second uniaxial slide is connected to the second driving member to allow the second driving member to slide along the first motion axis. The second motion axis is perpendicular to the first motion axis.

10. The transfer device of the laser welding equipment according to claim 9, characterized in that: in, The adjustment mechanism includes a first dual-axis slide and a second dual-axis slide. The first dual-axis slide is connected to the optical element and is located relative to the first driving member on the first motion axis. The second dual-axis slide is connected to the optical element and is located relative to the second driving member on the second motion axis. The first dual-axis slide and the second dual-axis slide allow the optical element to slide on the first motion axis and the second motion axis.

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