Semiconductor test tool table

By introducing adjustment structures and auxiliary structures into the semiconductor test fixture, the problem of having to replace the entire fixture when testing different chips in the existing technology is solved, flexible test needle group installation and equipment protection are achieved, and testing costs are reduced.

CN223400936UActive Publication Date: 2025-09-30SHENZHEN LI TI KE TECH CO LTD
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Patent Information

Application Number
CN202422559459.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-22
Publication Date
2025-09-30
Estimated Expiration
2034-10-22

AI Technical Summary

Technical Problem

In the prior art, the movable plate and the test probe of the semiconductor test fixture are of an integrated design, which results in the need to replace the entire test fixture when testing different chips, thereby increasing the cost of the test operation.

Method used

A semiconductor test fixture is designed, which includes an adjustment structure and an auxiliary structure. The test needle group is clamped and fixed by a combination of a support frame and a limit plate, so that the installation height and lateral position can be flexibly adjusted. The test needle group is protected by a protective cover and a drying box.

Benefits of technology

It is achieved that when testing different chips, only the test needle group needs to be replaced, avoiding the replacement of the entire tooling, saving costs, and improving the protection effect of the equipment through the protective cover and drying box.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of semiconductor testing, in particular to a semiconductor testing tool table. Comprising a workbench and two test needle sets, a test instrument is installed on the upper surface of the workbench, a jig plate is installed on the upper surface of the workbench, a chip is fixedly connected to the upper surface of the jig plate, an adjusting structure is arranged on the upper surface of the workbench, the adjusting structure comprises two fixing plates, and the fixing plates are arranged on the workbench. The two fixing plates are fixedly connected with the workbench, the sides, close to the chip, of the fixing plates are fixedly connected with two fixing rods, the arc surfaces of the two fixing rods are slidably connected with a moving plate, and the side, away from the chip, of the moving plate is fixedly connected with an operating rod. The semiconductor test tool table provided by the utility model has the advantages that the support frame is matched with the limiting plate to clamp and fix the test needle group, the installation height and the transverse position are flexible and adjustable, the whole test tool does not need to be replaced when different chips are tested, and the cost is saved.
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Description

Technical Field

[0001] The utility model relates to the field of semiconductor testing, in particular to a semiconductor testing tooling platform. Background Art

[0002] In semiconductor testing, test probes, test instruments and other test components are used to test the performance indicators of semiconductor chips such as conduction, current, function and aging.

[0003] In the prior art, when using a test tool to test a semiconductor, a fixture plate with a chip to be tested is fixed on a workbench, a movable plate is operated to approach the chip, a set of test probes with connecting wires are connected to the chip, and then another set of test probes are moved to connect to the chip, and the readings of the test instrument are observed to judge the chip's performance indicators such as conduction and current. However, this operation will cause the following problems: the movable plate and the test probes in the test tool are integrated and designed and manufactured according to the integrated design of the chip to be tested. When testing different chips, the corresponding test tool needs to be remade, resulting in high testing operation costs. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings in the prior art that when testing different semiconductor chips, the test tooling table needs to be replaced as a whole, which is costly.

[0005] In order to solve the above technical problems, the utility model provides a semiconductor test tooling station, comprising: a workbench and two test needle groups, a test instrument is installed on the upper surface of the workbench, one side of the test instrument is electrically connected to a connecting wire, and the end of the connecting wire away from the test instrument is electrically connected to one of the test needle groups, a fixture plate is installed on the upper surface of the workbench, a chip is fixedly connected to the upper surface of the fixture plate, an adjustment structure is provided on the upper surface of the workbench, and the adjustment structure includes two fixing plates, the two fixing plates are fixedly connected to the workbench, and the side of the fixing plate close to the chip is fixedly connected to two fixing rods, and the two fixing rods are fixedly connected to the workbench. The arc surface of the fixed rod is slidably connected to a movable plate, and the side of the movable plate away from the chip is fixedly connected to a joystick, the arc surface of the joystick is slidably connected to the fixed plate, an adjusting groove is opened on the surface of the movable plate, the inner wall of the adjusting groove is rotatably connected to the adjusting rod, the arc surface of the adjusting rod is threadedly connected to the support frame, the support frame is slidably connected to the inner wall of the adjusting groove, the upper surface of the movable plate is rotatably connected to the limiting rod, the arc surface of the limiting rod is threadedly connected to the limiting plate, the lower surface of the limiting plate is fixedly connected to a slide plate, the surface of the slide plate is slidably connected to the movable plate, and the test needle group is located on the side where the limiting plate and the support frame are close to each other.

[0006] The effect achieved by the above components is: the support frame cooperates with the limit plate to clamp and fix the test needle group, and the installation height and lateral position are flexibly adjustable. When testing different chips, only the corresponding test needle group needs to be replaced, and there is no need to replace the entire test tooling, which saves costs.

[0007] Preferably, a positioning rod is fixedly connected to the bottom side of the inner wall of the adjustment groove, and the surface of the positioning rod is slidably connected to the support frame.

[0008] The effect achieved by the above components is: the support frame is further limited by the positioning rod, so that the support frame is more stable when moving along the adjustment slot.

[0009] Preferably, the surfaces of the slide plate and the limiting plate are both provided with scales.

[0010] The effect achieved by the above components is that the installation height and lateral position of the test needle group can be intuitively judged through the scale, which is convenient for the user to operate the test needle group on the chip to be tested.

[0011] Preferably, a plurality of anti-slip grooves are provided on the side where the support frame and the limiting plate are close to each other.

[0012] The effects achieved by the above components are: increasing the friction on the surfaces of the support frame and the limiting plate through the anti-slip grooves, so that the support frame and the limiting plate have a better limiting effect on the test needle group.

[0013] Preferably, an auxiliary structure is provided on one side of the workbench, and the auxiliary structure includes an auxiliary frame, the auxiliary frame is fixedly connected to the workbench, the arc surface of the auxiliary frame is rotatably connected to a protective cover, one side of the inner wall of the protective cover is fixedly connected to a drying box, and the inner wall of the drying box is abutted against a desiccant.

[0014] The effects achieved by the above components are: when the equipment is not in use, the protective cover is used to shield and protect the workbench, the drying box is used to conveniently store desiccant, the moisture-proof effect inside the protective cover is improved, and parts such as the test needle group are effectively protected.

[0015] Preferably, a handle is fixedly connected to one side of the protective cover, and the cross-section of the handle is "U"-shaped.

[0016] The effects achieved by the above components are: the operating handle drives the protective cover to rotate, making it convenient for the user to rotate the protective cover.

[0017] Preferably, the arc surface of the handle is fixedly connected with an anti-slip sleeve, and the anti-slip sleeve is a rubber sleeve.

[0018] The effect achieved by the above components is: increasing the friction on the handle surface through the anti-slip sleeve, making it easier for users to operate the handle.

[0019] Compared with related technologies, the semiconductor test fixture provided by the present invention has the following beneficial effects:

[0020] The utility model provides a semiconductor test fixture. When the test fixture is used to test a semiconductor, a fixture plate with a chip to be tested is fixed on a workbench, a movable plate is operated to approach the chip, a group of test probes with connecting wires are connected to the chip, and then another group of test probes are moved to connect to the chip, the readings of the test instrument are observed, and the performance indicators of the chip such as conduction and current are judged. However, this operation may cause the following problems: the movable plate and the test probes in the test fixture are integrated, and are designed and manufactured according to the integrated chip to be tested. When testing different chips, the corresponding test fixture needs to be remade, resulting in high testing operation costs. By setting an adjustment structure, the support frame cooperates with the limit plate to clamp and fix the test needle group, and the installation height and lateral position are flexibly adjustable. When testing different chips, only the corresponding test needle group needs to be replaced, and there is no need to replace the entire test fixture, thereby saving costs.

[0021] When the test fixture is not in use, parts such as the test needle group need to be protected. By setting up auxiliary structures, the workbench can be shielded and protected with a protective cover when the equipment is not in use, and a drying box can be used to conveniently store desiccant, thereby improving the moisture-proof effect inside the protective cover and effectively protecting parts such as the test needle group. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a structural diagram of a semiconductor test fixture provided by the present invention;

[0023] Figure 2 for Figure 1 A schematic structural diagram of the regulatory structure shown;

[0024] Figure 3 for Figure 2 A schematic structural diagram of the fixed plate shown;

[0025] Figure 4 for Figure 3 Schematic diagram of the disassembled structure of the mobile plate shown;

[0026] Figure 5 for Figure 1 Schematic diagram of the auxiliary structure shown.

[0027] Numbers in the figure: 1. Workbench; 2. Test needle group; 3. Test instrument; 4. Connecting line; 5. Adjustment structure; 501. Fixed plate; 502. Fixed rod; 503. Moving plate; 504. Joystick; 505. Adjustment slot; 506. Adjustment rod; 507. Support frame; 508. Positioning rod; 509. Limit rod; 510. Limit plate; 511. Slide plate; 512. Scale; 513. Anti-slip groove; 6. Auxiliary structure; 61. Auxiliary frame; 62. Protective cover; 63. Drying box; 64. Desiccant; 65. Handle; 66. Anti-slip sleeve; 7. Fixture plate; 8. Chip. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0030] See also Figures 1 to 5 A semiconductor test tooling platform provided by an embodiment of the present invention includes: a workbench 1 and two test needle groups 2, a test instrument 3 is installed on the upper surface of the workbench 1, one side of the test instrument 3 is electrically connected to a connecting wire 4, and the end of the connecting wire 4 away from the test instrument 3 is electrically connected to one of the test needle groups 2, a fixture plate 7 is installed on the upper surface of the workbench 1, and a chip 8 is fixedly connected to the upper surface of the fixture plate 7, an adjustment structure 5 is provided on the upper surface of the workbench 1, and an auxiliary structure 6 is provided on one side of the workbench 1.

[0031] In the embodiments of the present invention, please refer to Figures 2 to 4The adjustment structure 5 includes two fixed plates 501, which are fixedly connected to the workbench 1. The fixed plate 501 is fixedly connected to the side of the chip 8 with two fixed rods 502. The arc surfaces of the two fixed rods 502 are slidably connected to a movable plate 503. The movable plate 503 is fixedly connected to the side away from the chip 8 with an operating rod 504. The arc surface of the operating rod 504 is slidably connected to the fixed plate 501. The surface of the movable plate 503 is provided with an adjustment groove 505, and the inner wall of the adjustment groove 505 is rotatably connected to the movable plate 503. The adjusting rod 506, the arc surface of the adjusting rod 506 is threadedly connected to the support frame 507, the support frame 507 is slidably connected to the inner wall of the adjusting groove 505, the upper surface of the movable plate 503 is rotatably connected to the limiting rod 509, the arc surface of the limiting rod 509 is threadedly connected to the limiting plate 510, the lower surface of the limiting plate 510 is fixedly connected to the slide plate 511, the surface of the slide plate 511 is slidably connected to the movable plate 503, the test needle group 2 is located on the side where the limiting plate 510 and the support frame 507 are close to each other, and the support frame 50 7 cooperates with the limiting plate 510 to clamp and fix the test needle group 2. The installation height and lateral position are flexibly adjustable. When testing different chips 8, only the corresponding test needle group 2 needs to be replaced, and the entire test tooling does not need to be replaced, which saves costs. The bottom side of the inner wall of the adjustment groove 505 is fixedly connected with a positioning rod 508. The surface of the positioning rod 508 is slidably connected to the support frame 507. The positioning rod 508 further limits the support frame 507, making the support frame 507 more stable when moving along the adjustment groove 505. The surfaces of the slide plate 511 and the limiting plate 510 are both provided with a scale 512, through which the installation height and lateral position of the test needle group 2 can be intuitively judged, making it convenient for the user to operate the test needle group 2 on the chip 8 to be tested. The side where the support frame 507 and the limiting plate 510 are close to each other is provided with a plurality of anti-slip grooves 513. The anti-slip grooves 513 increase the friction between the surfaces of the support frame 507 and the limiting plate 510, so that the support frame 507 and the limiting plate 510 have a better limiting effect on the test needle group 2;

[0032] In the embodiments of the present invention, please refer to Figure 5The auxiliary structure 6 includes an auxiliary frame 61, which is fixedly connected to the workbench 1. The arc surface of the auxiliary frame 61 is rotatably connected to a protective cover 62. A drying box 63 is fixedly connected to one side of the inner wall of the protective cover 62. The inner wall of the drying box 63 is abutted with a desiccant 64. When the equipment is not in use, the protective cover 62 is used to shield and protect the workbench 1. The drying box 63 is used to conveniently store the desiccant 64, thereby improving the moisture-proof effect inside the protective cover 62 and effectively protecting parts such as the test needle group 2. A handle 65 is fixedly connected to one side of the protective cover 62. The cross-section of the handle 65 is "U"-shaped. The operating handle 65 drives the protective cover 62 to rotate, which is convenient for the user to rotate the protective cover 62. The arc surface of the handle 65 is fixedly connected to an anti-slip sleeve 66. The anti-slip sleeve 66 is a rubber sleeve. The anti-slip sleeve 66 increases the friction on the surface of the handle 65, making it convenient for the user to operate the handle 65.

[0033] The working principle of a semiconductor test fixture provided by the present invention is as follows: by setting an adjustment structure 5, first rotate the limit rod 509, and the limit rod 509 drives the limit plate 510 and the slide 511 to move upward with the help of a thread. After the limit plate 510 is away from the support frame 507 for a certain distance, rotate the adjustment rod 506, and the adjustment rod 506 drives the support frame 507 to move upward along the adjustment groove 505 with the help of a thread, and place the test needle group 2 on the upper surface of the support frame 507, continue to rotate the adjustment rod 506 to ensure that the height of the test needle group 2 is aligned with the chip 8 to be tested, and then move the test needle group 2 laterally along the upper surface of the support frame 507 to ensure that the test needle group 2 is aligned with the chip 8 in the horizontal position, and then rotate the limit rod 509 in the opposite direction, and the limit rod 509 drives the limit plate 510 and the slide 511 to move downward with the help of a thread. The movable plate 503 is moved along the fixed rod 502, and the movable plate 503 drives the test needle group 2 to connect with the chip 8. Among them, the support frame 507 is further limited by the positioning rod 508, so that the support frame 507 is more stable when moving along the adjustment slot 505. The installation height and lateral position of the test needle group 2 can be intuitively judged by the scale 512, which is convenient for the user to operate the test needle group 2 to the chip 8 to be tested. The friction between the surface of the support frame 507 and the limiting plate 510 is increased by the anti-slip groove 513, so that the limiting effect of the support frame 507 and the limiting plate 510 on the test needle group 2 is better.

[0034] By providing the auxiliary structure 6, the protective cover 62 is rotated along the auxiliary frame 61 and rotated to cover the workbench. When the desiccant 64 needs to be replaced, the cover on the drying box 63 is slid to replace the desiccant 64. The operating handle 65 drives the protective cover 62 to rotate, making it easier for the user to rotate the protective cover 62. The anti-slip sleeve 66 increases the friction on the surface of the handle 65, making it easier for the user to operate the handle 65.

[0035] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0036] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor test fixture, characterized in that: include: A workbench (1) and two test needle groups (2); a test meter (3) is installed on the upper surface of the workbench (1); a connecting wire (4) is electrically connected to one side of the test meter (3); an end of the connecting wire (4) away from the test meter (3) is electrically connected to one of the test needle groups (2); a fixture plate (7) is installed on the upper surface of the workbench (1); a chip (8) is fixedly connected to the upper surface of the fixture plate (7); an adjustment structure (5) is provided on the upper surface of the workbench (1); the adjustment structure (5) includes two fixed plates (501); the two fixed plates (501) are fixedly connected to the workbench (1); two fixed rods (502) are fixedly connected to the side of the fixed plate (501) close to the chip (8); the arc surfaces of the two fixed rods (502) are slidably connected to a movable plate (503); the movable plate (503) is away from the chip (8) One side of the movable plate (503) is fixedly connected with a joystick (504), the arc surface of the joystick (504) is slidably connected to the fixed plate (501), the surface of the movable plate (503) is provided with an adjustment groove (505), the inner wall of the adjustment groove (505) is rotatably connected with an adjustment rod (506), the arc surface of the adjustment rod (506) is threadedly connected with a support frame (507), the support frame (507) is slidably connected to the inner wall of the adjustment groove (505), the upper surface of the movable plate (503) is rotatably connected with a limit rod (509), the arc surface of the limit rod (509) is threadedly connected with a limit plate (510), the lower surface of the limit plate (510) is fixedly connected with a slide plate (511), the surface of the slide plate (511) is slidably connected to the movable plate (503), and the test needle group (2) is located on the side where the limit plate (510) and the support frame (507) are close to each other.

2. The semiconductor test fixture according to claim 1, characterized in that: A positioning rod (508) is fixedly connected to the bottom side of the inner wall of the adjustment groove (505), and the surface of the positioning rod (508) is slidably connected to the support frame (507).

3. The semiconductor test fixture according to claim 1, characterized in that: The surfaces of the slide plate (511) and the limiting plate (510) are both provided with scales (512).

4. The semiconductor test fixture according to claim 1, characterized in that: A plurality of anti-slip grooves (513) are provided on the side where the support frame (507) and the limiting plate (510) are close to each other.

5. The semiconductor test fixture according to claim 1, characterized in that: An auxiliary structure (6) is provided on one side of the workbench (1), and the auxiliary structure (6) includes an auxiliary frame (61). The auxiliary frame (61) is fixedly connected to the workbench (1). The arc surface of the auxiliary frame (61) is rotatably connected to a protective cover (62). A drying box (63) is fixedly connected to one side of the inner wall of the protective cover (62), and a desiccant (64) is abutted against the inner wall of the drying box (63).

6. The semiconductor test fixture according to claim 5, characterized in that: A handle (65) is fixedly connected to one side of the protective cover (62), and the cross section of the handle (65) is U-shaped.

7. The semiconductor test fixture according to claim 6, characterized in that: The arc surface of the handle (65) is fixedly connected with an anti-slip sleeve (66), and the anti-slip sleeve (66) is a rubber sleeve.