Thermal oxidation device for preparing silicon oxide wafer

Abstract

The utility model relates to the technical field of thermal oxidation devices for oxidized silicon wafers, in particular to a thermal oxidation device for preparing the oxidized silicon wafers, which comprises a support frame, a plurality of electric heating rods are fixedly arranged between a front plate body and a rear plate body of the support frame, two rotating shafts are connected through a mesh conveying belt, and a driving motor is coaxially arranged at the tail end of one rotating shaft. A heat preservation box is fixedly installed on the supporting frame, a ventilation assembly is arranged on the heat preservation box and comprises an air cylinder, a telescopic shaft of the air cylinder penetrates through a top plate body of the heat preservation box and is fixedly provided with an air outlet cover, a left vertical pipe and a right vertical pipe are fixedly installed on the top face of the air outlet cover, and the vertical pipes are in sliding connection with the top plate body of the heat preservation box. An air source pump is arranged on one side of the heat preservation box, an air inlet pipe is fixedly installed at the air inlet end of the air source pump, a hose is fixedly installed at the air outlet end of the air source pump, and the tail end of the hose is fixedly installed on a top pipe body of the vertical pipe. The air outlet height adjustment and the thermal oxidation treatment operation are convenient, and the use is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal oxidation devices for silicon oxide slices, in particular to a thermal oxidation device for preparing silicon oxide slices. Background Art

[0002] With the rapid development of semiconductor technology, especially in the field of integrated circuit and ultra-large-scale integrated circuit manufacturing, silicon oxide, as a key insulating and dielectric material, has a vital impact on the reliability and overall performance of the device. In the preparation of silicon oxide wafers, the thermal oxidation process has become an indispensable part of the semiconductor process because it can generate high-quality and highly uniform silicon dioxide layers.

[0003] Currently, the preparation of silicon oxide wafers mainly adopts thermal oxidation technology. By placing the silicon wafer in an environment containing oxidizing gas under high temperature conditions, a chemical reaction occurs between the silicon wafer surface and the gas to form a dense silicon dioxide film. The silicon dioxide film can protect and improve the performance of the wafer.

[0004] Thermal oxidation is usually performed using a corresponding thermal oxidation device. There are many types of thermal oxidation devices on the market. Most of these devices deliver oxidizing gas to the heated area of ​​a silicon oxide wafer through a fixed pipe for thermal oxidation. However, the position of these delivery pipes is fixed, and the distance between the gas outlet at the end of the pipe and the silicon oxide wafer cannot be adjusted. This inability to adjust the distance prevents the oxidizing gas from being blown out of the gas outlet from reaching the silicon oxide wafer more comprehensively. Furthermore, this inability to adjust the distance prevents the oxidizing gas from being blown out of the gas outlet from reaching the silicon oxide wafer more comprehensively. Furthermore, this inability to adjust the distance also prevents the device from being used properly for silicon oxide wafers of different thicknesses, limiting its scope of use and causing inconvenience to users. In light of this, we propose a thermal oxidation device for preparing silicon oxide wafers. Utility Model Content

[0005] The purpose of the present invention is to provide a thermal oxidation device for preparing oxidized silicon wafers to solve the defects mentioned in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] The thermal oxidation device for preparing silicon oxide wafers includes a support frame, a plurality of electric heating rods arranged linearly and equidistantly are fixedly installed between the front and rear side plates of the support frame, two symmetrical rotating shafts are rotatably connected between the front and rear side plates of the support frame, the two rotating shafts are connected by a mesh conveyor belt connected end to end, a driving motor is coaxially arranged at the end of one of the rotating shafts, an insulation box is fixedly installed on the support frame, a ventilation component is provided on the insulation box, and the ventilation component includes a fixedly installed A cylinder on the top plate, the telescopic shaft of the cylinder passes through the top plate of the insulation box and is fixedly installed with an air outlet hood, two symmetrical vertical tubes on the left and right are fixedly installed on the top surface of the air outlet hood, the vertical tubes pass through the top plate of the insulation box and are slidably connected with the top plate of the insulation box, an air source pump is provided on one side of the insulation box, an air inlet pipe is fixedly installed at the air inlet end of the air source pump, a hose is fixedly installed at the air outlet end of the air source pump, and the end of the hose is fixedly installed on the top tube body of the vertical tube.

[0008] Preferably, the electric heating rod is located between the upper and lower belt bodies of the mesh conveyor belt, and the mesh conveyor belt is a mesh structure.

[0009] Preferably, a plurality of support legs arranged in a matrix are fixedly mounted on the bottom surface of the support frame, and the height of the support legs is 90 cm to 120 cm.

[0010] Preferably, a fixing plate is fixedly mounted on the end of the telescopic shaft of the cylinder, and the air outlet hood is fixedly mounted on the bottom surface of the fixing plate.

[0011] Preferably, a sliding sleeve is slidably connected to the vertical tube, a blocking cover is fixedly installed on the bottom end of the sliding sleeve, and the blocking cover is against the top surface of the heat preservation box.

[0012] Preferably, material holes are provided on the left and right side plates of the thermal insulation box, and a plurality of thermal barrier curtains arranged linearly and equidistantly are fixedly mounted on the top walls of the material holes.

[0013] Preferably, an inspection hole is provided on the front side plate of the insulation box, a vertical beam is fixedly installed between the bottom wall and the top wall at the middle position of the inspection hole, and two symmetrical box doors on the left and right are hinged on the front side of the insulation box.

[0014] Preferably, a transparent plate is provided on the box door, a door lock is provided on the box door, and a handle is fixedly installed on the box door.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. The utility model uses an electric heating rod for heating operation and a mesh conveyor belt to realize the conveying operation of silicon oxide wafers. In addition, the heat preservation box is provided to reduce heat loss. The ventilation component is provided to use an air source pump to convey oxidizing gas for oxidation operation. The air cylinder is provided to adjust the distance between the air outlet hood and the silicon oxide wafers conveyed on the mesh conveyor belt as needed, thereby achieving the effect that the distance of the air outlet hood can be adjusted.

[0017] 2. The utility model is provided with an inspection hole and a box door. After the box door is opened, maintenance operations can be carried out normally at the inspection hole, which is convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the explosion structure of the utility model;

[0020] Figure 3 This is one of the partial structural diagrams of the utility model;

[0021] Figure 4 This is the second schematic diagram of the partial structure of the utility model;

[0022] Figure 5 This is a schematic diagram of the structure of the ventilation assembly of the utility model;

[0023] The meaning of each number in the figure is:

[0024] 1. Support frame; 10. Electric heating rod; 11. Support legs; 12. Rotating shaft; 13. Mesh conveyor belt; 14. Drive motor;

[0025] 2. Insulation box; 20. Material hole; 21. Temperature barrier curtain; 22. Inspection hole; 23. Vertical beam; 24. Box door; 241. Transparent panel; 25. Door lock; 26. Handle;

[0026] 3. Ventilation assembly; 30. Cylinder; 301. Fixed plate; 31. Air outlet hood; 32. Vertical pipe; 33. Sliding sleeve; 34. Sealing hood; 35. Air source pump; 36. Hose; 37. Air inlet pipe. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] See also Figure 1-Figure 5 The utility model provides a technical solution: a thermal oxidation device for preparing silicon oxide wafers, comprising a support frame 1, wherein a plurality of electric heating rods 10 arranged linearly and equidistantly are fixedly installed between the front and rear plates of the support frame 1, and the electric heating rods 10 are used for heating operation; two symmetrical rotating shafts 12 are rotatably connected between the front and rear plates of the support frame 1, and the two rotating shafts 12 are connected by a mesh conveyor belt 13 connected end to end, and the electric heating rods 10 are located between the upper and lower belt bodies of the mesh conveyor belt 13, and the mesh conveyor belt 13 is a mesh structure, and the mesh conveyor belt 13 is a steel mesh conveyor belt, which has the characteristics of high temperature resistance and is not easily damaged by high temperature;

[0029] Specifically, a drive motor 14 is coaxially provided at the end of one of the rotating shafts 12, and the output shaft end of the drive motor 14 is fixedly mounted on the rotating shaft 12. The drive motor 14 is fixedly mounted on the support frame 1, so that the drive motor 14 is used to drive the mesh conveyor belt 13 to rotate for conveying operation;

[0030] Specifically, an insulation box 2 is fixedly installed on the support frame 1, and a ventilation assembly 3 is provided on the insulation box 2. The ventilation assembly 3 includes a cylinder 30 fixedly installed on the top plate of the insulation box 2. The telescopic shaft of the cylinder 30 passes through the top plate of the insulation box 2 and is fixedly installed with an air outlet hood 31. The bottom end of the air outlet hood 31 is connected to the outside world. Two symmetrical vertical pipes 32 on the left and right are fixedly installed on the top surface of the air outlet hood 31. The vertical pipes 32 are connected to the inside of the air outlet hood 31, and the vertical pipes 32 pass through the top plate of the insulation box 2 and are slidably connected between the top plate of the insulation box 2. An air source pump 35 is provided on one side of the insulation box 2, and an air inlet pipe 37 is fixedly installed on the air inlet end of the air source pump 35, and a hose 36 is fixedly installed on the air outlet end of the air source pump 35. The end of the hose 36 is fixedly installed on the top pipe body of the vertical pipe 32, so that the cylinder 30 can be used to drive the air outlet hood 31 to move, thereby adjusting the height of the air outlet hood 31.

[0031] In this embodiment, a plurality of support legs 11 arranged in a matrix are fixedly mounted on the bottom surface of the support frame 1 . The height of the support legs 11 is 90 cm to 120 cm, so that a stable supporting operation can be achieved using the support legs 11 .

[0032] Specifically, a fixing plate 301 is fixedly mounted on the end of the telescopic shaft of the cylinder 30 , and the air outlet cover 31 is fixedly mounted on the bottom surface of the fixing plate 301 by a plurality of fastening bolts, so as to facilitate the fixing and mounting operation.

[0033] Furthermore, a sliding sleeve 33 is slidably connected to the vertical tube 32, and a sealing cover 34 is fixedly installed on the bottom end of the sliding sleeve 33. The sealing cover 34 rests on the top surface of the insulation box 2, so that the sealing cover 34 is used to perform appropriate sealing operations on the through-hole portion of the vertical tube 32 passing through the insulation box 2, thereby reducing heat loss.

[0034] In addition, material holes 20 are provided on the left and right side plates of the insulation box 2, and a plurality of thermal barrier curtains 21 arranged linearly and evenly spaced are fixedly installed on the top wall of the material hole 20. The left and right material holes 20 are used for feeding and discharging operations respectively. When the thermal barrier curtains 21 are normally in a vertical shape, the thermal barrier curtains 21 block the material hole 20 to reduce heat loss.

[0035] It is worth mentioning that an inspection hole 22 is provided on the front side plate of the insulation box 2, and a vertical beam 23 is fixedly installed between the bottom wall and the top wall at the middle position of the inspection hole 22. Two symmetrical box doors 24 are hinged on the front side of the insulation box 2, which is convenient for maintenance operations from the inspection hole 22 after opening the box door 24.

[0036] It is worth noting that a transparent plate 241 is provided on the box door 24. The transparent plate 241 is made of transparent material to facilitate observation and operation. A door lock 25 is provided on the box door 24. A handle 26 is fixedly installed on the box door 24.

[0037] When the thermal oxidation device for preparing silicon oxide wafers of the present invention is in use, after the silicon oxide wafers are placed on the mesh conveyor belt 13, the drive motor 14 is started and put into operation. When the drive motor 14 is working, the output shaft thereon rotates to drive the rotating shaft 12 and the mesh conveyor belt 13 to rotate, thereby conveying the silicon oxide wafers to the position of the electric heating rod 10. The electric heating rod 10 is connected to an external power supply and is put into operation. When the electric heating rod 10 is working, the silicon oxide wafers begin to be heated. In addition, the air inlet pipe 37 is connected to an external oxidizing gas delivery pipeline, and the air source pump 35 is connected to an external power supply and is put into operation. When the air source pump 35 is working, the oxidizing gas is delivered to the position of the heated silicon oxide wafers from the bottom end of the gas outlet hood 31, thereby performing a thermal oxidation operation.

[0038] In addition, depending on the thickness of the silicon oxide wafer, the cylinder 30 can be started and made to work. When the cylinder 30 works, the telescopic shaft on it extends or shortens, which can drive the gas outlet hood 31 to move upward or downward, thereby adjusting the distance between the gas outlet hood 31 and the transported silicon oxide wafer.

[0039] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A thermal oxidation device for preparing oxidized silicon wafers, comprising a support frame (1), characterized in that: A plurality of electric heating rods (10) arranged at equal intervals in a linear manner are fixedly mounted between the front and rear side plates of the support frame (1); two symmetrical rotating shafts (12) are rotatably connected between the front and rear side plates of the support frame (1); the two rotating shafts (12) are connected by a mesh conveyor belt (13) connected end to end; a driving motor (14) is coaxially arranged at the end of one of the rotating shafts (12); an insulation box (2) is fixedly mounted on the support frame (1); a ventilation assembly (3) is provided on the insulation box (2); the ventilation assembly (3) comprises a cylinder (30) fixedly mounted on the top plate of the insulation box (2); the cylinder The telescopic shaft of (30) passes through the top plate of the heat preservation box (2) and is fixedly installed with an air outlet hood (31), and two mutually symmetrical vertical pipes (32) are fixedly installed on the top surface of the air outlet hood (31). The vertical pipes (32) pass through the top plate of the heat preservation box (2) and are slidably connected to the top plate of the heat preservation box (2). An air source pump (35) is provided on one side of the heat preservation box (2), and an air inlet pipe (37) is fixedly installed at the air inlet end of the air source pump (35), and a hose (36) is fixedly installed at the air outlet end of the air source pump (35), and the end of the hose (36) is fixedly installed on the top pipe body of the vertical pipe (32).

2. The thermal oxidation device for preparing oxidized silicon wafers according to claim 1, characterized in that: The electric heating rod (10) is located between the upper and lower belt bodies of the mesh conveyor belt (13), and the mesh conveyor belt (13) is a mesh structure.

3. The thermal oxidation device for preparing oxidized silicon wafers according to claim 1, characterized in that: A plurality of support legs (11) arranged in a matrix are fixedly mounted on the bottom surface of the support frame (1), and the height of the support legs (11) is 90 cm to 120 cm.

4. The thermal oxidation device for preparing oxidized silicon wafers according to claim 1, characterized in that: A fixing plate (301) is fixedly mounted on the end of the telescopic shaft of the cylinder (30), and the air outlet cover (31) is fixedly mounted on the bottom surface of the fixing plate (301).

5. The thermal oxidation device for preparing silicon oxide wafers according to claim 1, characterized in that: A sliding sleeve (33) is slidably connected to the vertical tube (32), and a blocking cover (34) is fixedly installed on the bottom end of the sliding sleeve (33), and the blocking cover (34) is against the top surface of the heat preservation box (2).

6. The thermal oxidation device for preparing oxidized silicon wafers according to claim 1, characterized in that: Material holes (20) are provided on both left and right side plates of the heat preservation box (2), and a plurality of heat-blocking curtains (21) arranged linearly and at equal intervals are fixedly mounted on the top walls of the material holes (20).

7. The thermal oxidation device for preparing oxidized silicon wafers according to claim 1, characterized in that: An inspection hole (22) is provided on the front side plate of the insulation box (2), a vertical beam (23) is fixedly installed between the bottom wall and the top wall at the middle position of the inspection hole (22), and two symmetrical box doors (24) are hinged on the front side of the insulation box (2) via hinges.

8. The thermal oxidation device for preparing oxidized silicon wafers according to claim 7, characterized in that: The box door (24) is provided with a transparent plate (241), the box door (24) is provided with a door lock (25), and the box door (24) is fixedly provided with a handle (26).

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