Proximity light sensor

Abstract

The embodiment of the utility model provides a proximity light sensor, and the proximity light sensor comprises a substrate which is provided with a surface; the light emitter is arranged on the surface and is used for emitting a light beam; the distance between the emitting surface of the light emitter and the surface is a first size; a light receiver provided on the surface for sensing reflected light of the light beam; the distance between the receiving surface of the light receiver and the surface is a second size; wherein the first size is larger than the second size, and the transmitting surface and the receiving surface are located in different media. According to the proximity light sensor without an isolation strip, device miniaturization is achieved, and meanwhile small crosstalk between the light emitter and the light receiver can be guaranteed.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to a proximity light sensor. Background Art

[0002] In a miniature proximity light sensor, an isolation zone needs to be directly provided between the transmitting end and the receiving end to reduce crosstalk from the transmitting end to the receiving end. The provision of the isolation zone in the miniature proximity light sensor will inevitably cause the proximity sensor to occupy a larger volume. Utility Model Content

[0003] In view of this, an embodiment of the present application provides a proximity light sensor, which includes: a substrate having a surface; a light emitter, which is arranged on the surface and is used to emit a light beam; the distance between the emitting surface of the light emitter and the surface is a first size; a light receiver, which is arranged on the surface and is used to sense reflected light of the light beam; the distance between the receiving surface of the light receiver and the surface is a second size; wherein the first size is greater than the second size, and the emitting surface and the receiving surface are in different media.

[0004] In some embodiments, the emission angle of the light emitter is no greater than 20 degrees.

[0005] In some embodiments, the receiving angle of the light receiver is no greater than 110 degrees.

[0006] In some embodiments, a first transparent film layer is further included, the first transparent film layer is used to surround the packaged light emitter and expose the emitting surface, and surround the packaged light receiver and cover the receiving surface; the top surface of the first transparent film layer has a third size between the surface; the third size is smaller than the first size and larger than the second size.

[0007] In some embodiments, a second transparent film layer and a third transparent film layer are further included, the second transparent film layer is used to surround the encapsulated light emitter, and the third transparent film layer is used to surround the encapsulated light receiver and cover the receiving surface; wherein, the distance between the second transparent film layer and the surface is a fourth dimension, and the fourth dimension is greater than the second dimension.

[0008] In some embodiments, the distance between the third transparent film layer and the surface is a fifth dimension. If the fifth dimension is greater than the first dimension, there is a first spacing between the light emitter and the light receiver; if the fifth dimension is smaller than the first dimension, there is a second spacing between the light emitter and the light receiver; wherein the first spacing is greater than the second spacing.

[0009] In some embodiments, a transparent film layer is further included, which is used to surround the encapsulated light receiver and cover the receiving surface; there is a distance between the transparent film layer and the light emitter; the two opposite surfaces of the transparent film layer along the first direction both have curved surfaces or inclined surfaces; the first direction is the direction from the center of the light emitter to the center of the light receiver.

[0010] In some embodiments, the substrate has a first surface and a second surface, the light emitter is disposed on the first surface, the light receiver is disposed on the second surface, the first surface is higher than the second surface, or, there is a raised film layer between the light emitter and the surface so that the bottom surface of the light emitter is higher than the bottom surface of the light receiver.

[0011] In some embodiments, the receiving surface includes a first area and a second area; wherein the first area is used to sense the reflected light of the light beam; the second area is used to sense ambient light; the ambient light includes the light in the external environment where the detected object is located; both the ambient light and the reflected light are used to determine the physical characteristics of the detected object.

[0012] In some embodiments, projections of the center of the emission surface of the light emitter, the center of the first area, and the center of the second area of ​​the light receiver onto the substrate are coaxial.

[0013] In each embodiment of the present application, the emitting surface of the light emitter and the receiving surface of the light receiver are in different media, which makes it less likely for crosstalk to occur on the light receiver due to multiple reflections of the light emitter's light beam in the same medium. Therefore, there is no need to set a barrier strip between the light emitter and the light receiver, which can reduce the distance between the light emitter and the light receiver, thereby reducing the size of the sensor. At the same time, because the emitting surface of the emitter is higher than the receiving surface of the light receiver, the light emitter's light beam is emitted above the receiving surface of the light receiver, which can further reduce the crosstalk to the light receiver. Therefore, the distance between the light emitter and the light receiver can be further reduced, thereby further reducing the size of the sensor. That is, while reducing crosstalk, the size of the sensor is also reduced. The present application provides a proximity light sensor that does not require a barrier strip, which can achieve device miniaturization while ensuring low crosstalk between the light emitter and the light receiver. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A three-dimensional perspective schematic diagram of a proximity light sensor provided in an embodiment of the present application;

[0015] Figure 2 for Figure 1 A top view schematic diagram of a proximity light sensor;

[0016] Figure 3 for Figure 1 A front view schematic diagram of a proximity light sensor;

[0017] Figure 4 for Figure 1 A right-view plane diagram of a proximity light sensor;

[0018] Figure 5A three-dimensional perspective diagram of a proximity light sensor and its emission angle range and receiving angle range provided in an embodiment of the present application;

[0019] Figure 6 for Figure 5 A front view plane diagram of a proximity light sensor and its emission angle range and receiving angle range;

[0020] Figure 7 One of the situations in which the light beam emission path and the light beam received is obtained when the light emitter provided in the embodiment of the present application is at the same emission angle and the light emitter and the light receiver are at different heights;

[0021] Figure 8 The second embodiment of the present application provides a light beam emission path and its received state when the light emitter is at the same emission angle and the light emitter and light receiver are at different heights.

[0022] Figure 9 One of the situations in which the light beam emission path and the light receiver are received when the light transmitter and the light receiver provided in the embodiment of the present application are at the same height and the light transmitter has different emission angles;

[0023] Figure 10 The second embodiment of the present application provides a light beam emission path and a light receiver that are at the same height and have different emission angles, and the light beam is received.

[0024] Figure 11 This is one of the front plan schematic diagrams of the proximity light sensor provided in an embodiment of the present application;

[0025] Figure 12 This is a second front plan view schematic diagram of the proximity light sensor provided in an embodiment of the present application;

[0026] Figure 13 This is a third front plan view schematic diagram of the proximity light sensor provided in an embodiment of the present application;

[0027] Figure 14 This is the fourth front plan view schematic diagram of the proximity light sensor provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The following will be combined with the embodiments of this application and the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of this application. The described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0029] The present application embodiment provides a proximity light sensor, referring to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The proximity light sensor 100 includes: a substrate 102 having a surface SUR; a light emitter 110, which is disposed on the surface SUR and is used to emit a light beam; the distance between an emitting surface 112 of the light emitter 110 and the surface SUR is a first dimension H1; a light receiver 106, which is disposed on the surface SUR and is used to sense reflected light of the light beam; a second dimension H2 is defined between a receiving surface 113 of the light receiver 106 and the surface SUR; wherein the first dimension H1 is greater than the second dimension H2, and the emitting surface 112 and the receiving surface 113 are in different media.

[0030] Figure 7 The embodiment of the present application provides a light beam emission path and one of the received light beam situations when the light emitter is at the same emission angle and the light emitter and light receiver are at different heights.

[0031] refer to Figure 7 When the light transmitter is in the low position (position 1, far from the detected object) and emits a light beam, the light receiver is in position 3 and can receive the light reflected from the detected object. When the light transmitter is in the high position (position 2, close to the detected object) and emits a light beam, the light receiver is in position 3 and cannot receive the light reflected from the detected object.

[0032] Figure 8 The second example of the light beam emission path and its reception when the light emitter provided in the embodiment of the present application is at the same emission angle and the light emitter and light receiver are at different heights. Figure 7 The situation shown can also be understood as Figure 8 The situation when the optical receiver is in position three.

[0033] refer to Figure 8 When the light emitter is in the low position (position 1) and emitting a light beam, the light receiver is in position 3 and can receive the light reflected from the detected object. When the light emitter is in the high position (position 2) and emitting a light beam, the light receiver moves from position 3 to position 4 and can receive the light reflected from the detected object. The larger the distance between the light emitter and the light receiver in the Z direction, the smaller the distance between the light emitter and the light receiver in the X direction can be, thereby further reducing the size.

[0034] In the embodiments of the present application, the emitting surface of the light emitter and the receiving surface of the light receiver are in different media, which makes it less likely for crosstalk to occur on the light receiver due to multiple reflections of the light emitter's light beam in the same medium. Therefore, no barrier strip is required between the light emitter and the light receiver, which can reduce the distance between the light emitter and the light receiver, thereby reducing the size of the sensor. At the same time, because the emitting surface of the emitter is higher than the receiving surface of the light receiver, the light emitter's light beam is emitted above the receiving surface of the light receiver, which can further reduce the crosstalk to the light receiver. Therefore, the distance between the light emitter and the light receiver can be further reduced, thereby further reducing the size of the sensor. That is, while reducing crosstalk, the size of the sensor is also reduced. The present application provides a proximity light sensor that does not require a barrier strip, which can achieve device miniaturization while ensuring low crosstalk between the light emitter and the light receiver.

[0035] The substrate 102 serves as a carrier to mechanically support and electrically connect the components of the proximity light sensor 100, for example, by providing conductive pathways, pads, and other features. For example, the substrate 102 comprises a printed circuit board (PCB) including a plurality of terminals or pads, and provides electrical connections from the pads to, for example, a package (not shown) located on the bottom side of the substrate 102. For example, the light emitter 110 is mounted and electrically connected to the surface SUR of the substrate 102 through electrical connectors such as wire bonds or through-silicon vias, and the light receiver 106 is mounted and electrically connected to the surface SUR of the substrate 102. The light emitter 110 and the light receiver 106 are electrically connected to each other through the conductive pathways of the substrate 102. The light emitter 110 and the light receiver 106 can also be electrically connected to the bottom side of the substrate 102 through electrical connectors such as wire bonds or through-silicon vias.

[0036] The optical receiver 106 includes a plurality of terminals or pads that are electrically connected to pads on the surface of the substrate 102 by means of a solder layer 104. The solder layer 104 includes solder flux.

[0037] The light emitter 110 includes a plurality of terminals or pads that are electrically connected to pads on the surface of the substrate 102 by means of bonding wires.

[0038] The light emitter 110 is used to emit a light beam in a wavelength range, and the light receiver 106 is used to sense the reflected light of the light beam in the wavelength range. The reflected light includes the light reflected after the light beam hits the detected object, and the reflected light is used to determine the physical characteristics of the detected object.

[0039] The emitting surface of the light emitter and the receiving surface of the light receiver are set in different media. It can be understood that only one of the emitting surface of the light emitter and the receiving surface of the light receiver is set in the medium, and the other is set in the air. Among them, if the emitting surface of the light emitter is in the air, it can also prevent the refraction angle of the emitted light beam from becoming larger; alternatively, the emitting surface of the light emitter and the receiving surface of the light receiver are respectively set in media of different materials.

[0040] In some embodiments, the proximity light sensor 100 further includes a transparent film layer 108; the receiving surface 113 of the light receiver 106 is disposed in the transparent film layer 108, and the emitting surface 112 of the light emitter 110 is disposed in the air. In some embodiments, the light receiver 106 is disposed in the transparent film layer 108, and the light emitter 110 is disposed in an optically opaque film layer having an opening that exposes the emitting surface of the light emitter. The transparent film layer 108 may include epoxy resin. The optically opaque film layer may include a potting material or a mold material, such as vinyl.

[0041] refer to Figure 1 , combined with Figure 5 and Figure 6 As shown, in some embodiments, the emission angle of the light emitter 110 is no greater than 20°.

[0042] Figure 9 The embodiment of the present application provides one of the situations in which the light beam emission path and its reception are performed when the light emitter and the light receiver are at the same height and the light emitter has different emission angles.

[0043] refer to Figure 9 When the light transmitter is in position 1 and emits a beam at a large angle (beam 1), the light receiver is in position 2 and can receive the light reflected from the detected object. When the light transmitter is in position 1 and emits a beam at a small angle (beam 2), the light receiver is in position 2 and cannot receive the light reflected from the detected object.

[0044] Figure 10 The light emitter and light receiver provided in the embodiment of the present application are at the same height, and the light emitter has different emission angles, and the light beam emission path and its received state are shown in the second example. Figure 9 The situation shown can also be understood as Figure 10 The situation when the optical receiver is in position two.

[0045] refer to Figure 10When the light emitter is in position one and emits a beam at a large angle (beam one), the light receiver is in position two and can receive the light reflected from the detected object. When the light emitter is in position one and emits a beam at a small angle (beam two), the light receiver moves from position two to position three and can receive the light reflected from the detected object. The smaller the light emitter's emission angle, the more concentrated the light emitted by the light emitter. The closer the light emitters can be placed in the X direction, further reducing their size.

[0046] Among them, limiting the emission angle of the light emitter to form a concentrated light source can be achieved by selecting a vertical surface emitting laser (VSCEL), or by setting a suitable embedded structure for the infrared ray light emitting diode (IR LED) to control the light emission angle of the LED. While concentrating the light source reduces the possibility of crosstalk, it can also shorten the distance between the light emitter and the light receiver, thereby reducing the size of the light sensor. For example, a concentrating, small-angle VCSEL or an aluminum gallium arsenide IR LED can achieve a light beam emission angle range of no more than 20 degrees.

[0047] refer to Figure 1 , combined with Figure 5 and Figure 6 As shown, in some embodiments, the receiving angle of the optical receiver 106 is no greater than 110 degrees. Compared to the receiving angle of the optical receiver being greater than 110 degrees, the receiving angle of the optical receiver being no greater than 110 degrees ensures the optical receiver's ability to receive light while reducing the possibility of crosstalk from the optical transmitter.

[0048] refer to Figure 1 and Figure 2 In some embodiments, the receiving surface 113 of the optical receiver 106 includes a first region 114 and a second region 116; the first region 114 is located between the second region 116 and the optical transmitter 110. The first region 114 is used to sense reflected light from the optical beam; the second region 116 is used to sense ambient light, which includes light in the external environment of the detected object. Both the ambient light and the reflected light are used to determine the physical characteristics of the detected object.

[0049] Specifically, the first region 114 can be understood as a proximity optical detector, serving as the primary optical detector of the light receiver 106. The second region 116 can be understood as an ambient optical detector, serving as a reference optical detector for the light receiver 106. The first region 114 and the second region 116 are disposed in or on the wafer of the light receiver 106. The first region 114 and the second region 116 can each be a single photodiode, such as an infrared-sensitive photodiode, or an array of multiple such photodiodes.

[0050] refer to Figure 1 and Figure 2 In some embodiments, the projections of the center of the emitting surface of the light emitter 110, the center of the first region 114 of the light receiver 106, and the center of the second region 116 of the light receiver 106 onto the substrate 102 are coaxial. For example, the projections of the center of the second region 116 of the light receiver 106, the center of the first region 114 of the light receiver, and the center of the emitting surface 112 of the light emitter 110 onto the substrate 102 are aligned along the X direction. For another example, the projections of the second region 116 of the light receiver 106, the first region 114 of the light receiver 106, and the light emitter 110 onto the substrate 102 are all symmetrically arranged along the Y direction. This reduces the distance between the light emitter and the light receiver along the Y direction, thereby reducing the spacing between the light emitter and the light receiver, and thus reducing the size of the sensor.

[0051] In some embodiments, the emission area of ​​the light emitter 110 and the receiving area of ​​the light receiver 106 may be placed close to the edge of the proximity light sensor 100 along the Y direction, or may be placed in the center of the proximity light sensor 100 .

[0052] The emitting surface 112 of the light emitter 110 is arranged above the receiving surface of the light receiver 106. The height of the emitting surface 112 of the light emitter 110 can be higher than the height of the receiving surface 113 of the light receiver 106 by raising the light emitter 110 or making the light emitter 110 of a suitable height.

[0053] In some embodiments, the substrate has a first surface ( Figure 1 not shown) and the second surface ( Figure 1 Not shown), the light emitter is arranged on the first surface, the light receiver is arranged on the second surface, and the first surface is higher than the second surface; or, there is a padding film layer ( Figure 1(not shown) so that the bottom surface of the light emitter 110 is higher than the bottom surface of the light receiver 106. In other words, by providing a height difference by having a first surface and a second surface of different heights on the substrate, the height of the emitting surface 112 of the light emitter 110 can be made higher than the height of the receiving surface 113 of the light receiver 106; or, by providing a spacer film layer between the light emitter and the surface, by providing a spacer film layer on the surface used to mount the light emitter, the height of the emitting surface 112 of the light emitter 110 can be made higher than the height of the receiving surface 113 of the light receiver 106.

[0054] It should be noted that, unless otherwise specified, components / layers / materials / structures, etc. identified by the same reference numerals in the following drawings are to be understood as the same or similar components / layers / materials / structures.

[0055] Figure 11 、 Figure 12 、 Figure 13 and Figure 14 Schematic diagrams of front views of other proximity light sensors provided in embodiments of the present application.

[0056] Compared to Figure 3 The proximity light sensor shown, Figure 11 The difference of the proximity light sensor shown is mainly that it has a first transparent film layer 118, and the first transparent film layer 118 surrounds the packaged light emitter 110 and exposes the emitting surface 112, and surrounds the packaged light receiver 106 and covers the receiving surface 113. There is a third dimension H3 between the top surface and the surface of the first transparent film layer 118, and the third dimension H3 is smaller than the first dimension H1 and larger than the second dimension H2.

[0057] Compared to Figure 3 The proximity light sensor shown, Figure 12 The difference between the proximity light sensor shown in the figure is that it has a second transparent film layer 128, which surrounds the packaged light emitter 110 and covers the emitting surface 112. The top surface of the second transparent film layer 128 is higher than the top surface of the third transparent film layer 138; wherein the third transparent film layer 138 can be understood as Figure 3 The transparent film layer 108 , the second transparent film layer 128 , and the third transparent film layer 138 are spaced apart along the X direction.

[0058] Compared to Figure 3 The proximity light sensor shown, Figure 13 The difference between the proximity light sensor shown in the figure is that it has a second transparent film layer 128, which surrounds the packaged light emitter 110 and exposes the emitting surface 112. The top surface of the second transparent film layer 128 can be higher than or lower than the top surface of the third transparent film layer 138; wherein the third transparent film layer 138 can be understood as Figure 3 The transparent film layer 108 , the second transparent film layer 128 , and the third transparent film layer 138 are spaced apart along the X direction.

[0059] Compared to Figure 13 The proximity light sensor shown, Figure 14 The difference of the illustrated proximity light sensor is that the distance between the third transparent film layer 138 and the surface SUR is a fifth dimension H5 , which is greater than the first dimension H1 .

[0060] refer to Figure 11 In some embodiments, the proximity light sensor 100 further includes a first transparent film layer 118, which is used to surround the packaged light emitter 110 and expose the emitting surface 112, and surround the packaged light receiver 106 and cover the receiving surface 113; a third dimension H3 is defined between the top surface of the first transparent film layer 118 and the surface SUR; the third dimension H3 is smaller than the first dimension H1 and larger than the second dimension H2.

[0061] refer to Figure 12 and Figure 13 In some embodiments, the proximity light sensor 100 further includes a second transparent film layer 128 and a third transparent film layer 138, wherein the second transparent film layer 128 is used to surround the encapsulated light emitter 110, and the third transparent film layer 138 is used to surround the encapsulated light receiver 106 and cover the receiving surface 113; wherein, the distance between the second transparent film layer 128 and the surface SUR is a fourth dimension H4, and the fourth dimension H4 is greater than the second dimension H2.

[0062] like Figure 12 As shown, the material of the second transparent film layer 128 is different from the material of the third transparent film layer 138 (for example, the refractive index of the second transparent film layer 128 is less than the refractive index of the third transparent film layer 138), and the second transparent film layer 128 surrounds the packaged light emitter 110 and covers the emitting surface 112. At this time, the fourth dimension H4 is larger than the second dimension H1 and larger than the first dimension H1. Figure 13 As shown, the second transparent film layer 128 surrounds the packaged light emitter 110 and exposes the emitting surface 112 . At this time, the fourth dimension H4 is larger than the second dimension H1 and not larger than the first dimension H1 .

[0063] refer to Figure 3 、 Figure 11 and Figure 13 The light emitter emits light beams towards the sky, which can prevent the emitted light beam from having a larger refraction angle due to light refraction. Figure 3 、 Figure 11 、 Figure 12 and Figure 13 , the emitting surface of the light emitter emits light beams into the air, and the receiving surface of the light receiver is on the film layer (such as Figure 3The transparent film layer 108 shown, Figure 11 The first transparent film layer 118 shown or Figure 12 、 Figure 13 The third transparent film layer 138 shown in FIG. 1 can reduce the crosstalk caused by multiple reflections in the same medium. Figure 12 , the optical transmitter and optical receiver are in different media, which can reduce the crosstalk caused by multiple reflections in the same medium.

[0064] refer to Figure 13 and Figure 14 In some embodiments, the distance between the third transparent film layer 138 and the surface is a fifth dimension H5. If the fifth dimension H5 is greater than the first dimension H1 (refer to Figure 14 ), there is a first distance L1 between the light emitter 110 and the light receiver 106; if the fifth size is smaller than the first size (reference Figure 13 ), there is a second distance L2 between the light emitter and the light receiver; wherein the first distance L1 is greater than the second distance L2.

[0065] Specifically, refer to Figure 13 When the third transparent film layer 138 covering the light receiver 106 is lower than the emitting surface 112 of the light emitter 110, crosstalk is less likely to occur, and the distance between the light emitter 110 and the light receiver 106 can be closer, thereby reducing the size of the proximity light sensor. When the light beam within the emission angle range of the light emitter 110 does not pass through the third transparent film layer 138, the smaller the fifth dimension H5 is, the smaller the distance between the light emitter 110 and the light receiver 106 can be set. For example, when the first dimension H1 is greater than or equal to the fifth dimension H5, the greater the difference between the first dimension H1 and the fifth dimension H5, the smaller the distance L1 between the light emitter 110 and the light receiver 106 can be set. Figure 7 、 Figure 8 , the distance between the light emitter and the light sensor is close for understanding.

[0066] refer to Figure 13 In some embodiments, the second distance L2 is less than or equal to 0.2 mm.

[0067] refer to Figure 1 and Figure 3 In some embodiments, when the receiving angle range of the light receiver 106 after passing through the transparent film layer 108 can reach 110 degrees, the light emitter 110 is disposed on the transparent film layer 108 of the light receiver 106 .

[0068] refer to Figure 1 and Figure 3In some embodiments, the transparent film layer 108 has a dimension H0 between the top surface and the surface; the dimension H0 is larger than the first dimension H1. In other embodiments, the dimension H0 (which can be understood as Figure 13 The fifth dimension H5) is smaller than or equal to the first dimension H1 and larger than the second dimension H2.

[0069] refer to Figure 1 and Figure 3 In some embodiments, the dimension H0 is less than or equal to 0.3 mm. In some embodiments, the thickness of the substrate 102 has a sixth dimension H6, which is less than or equal to 0.2 mm.

[0070] refer to Figure 1 and Figure 3 In some embodiments, the proximity light sensor 100 further includes a transparent film layer 108, which is used to surround and encapsulate the light receiver 106 and cover the receiving surface 113; a distance G1 is provided between the transparent film layer 108 and the light emitter 110; the two opposite surfaces of the transparent film layer 108 along the first direction both have curved surfaces or inclined surfaces; the first direction is the direction from the center of the light emitter to the center of the light receiver.

[0071] refer to Figure 14 In some embodiments, a spacing G1 is defined between the third transparent film layer 138 and the light emitter 110. Two opposing surfaces of the third transparent film layer 138 along a first direction each have curved or inclined surfaces. The first direction is the direction from the center of the light emitter to the center of the light receiver. The first direction is indicated as the X direction in the drawings, the second direction is indicated as the Y direction in the drawings, and the third direction is indicated as the Z direction in the drawings. The curved surfaces S1 and S2 introduced onto opposing sidewalls of the transparent film layer 108 can reduce the spacing between the transparent film layer 108 and the light emitter 110 in the X direction, which advantageously reduces the size of the proximity light sensor 100.

[0072] refer to Figure 1 and Figure 2 In some embodiments, a dimension L0 of the proximity light sensor 100 along a first direction is less than or equal to 2 mm; a dimension W0 of the proximity light sensor 100 along a second direction is less than or equal to 1 mm; and the second direction is perpendicular to the first direction.

[0073] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. The above-mentioned serial numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments.

[0074] The above description is only a preferred embodiment of the present application and does not limit the scope of protection of the present application. All equivalent structural transformations made based on the contents of the present application description and drawings, or direct / indirect applications in other related technical fields, are included in the scope of protection of the present application.

Claims

1. A proximity light sensor, characterized in that: include: a substrate having a surface; a light emitter, disposed on the surface and configured to emit a light beam; The distance between the emitting surface of the light emitter and the surface is a first size; a light receiver disposed on the surface for sensing reflected light of the light beam; The distance between the receiving surface of the light receiver and the surface is a second size; wherein the first size is greater than the second size, and the emitting surface and the receiving surface are in different media.

2. The proximity light sensor according to claim 1, wherein: The emission angle of the light emitter is no greater than 20 degrees.

3. The proximity light sensor according to claim 1, wherein: The receiving angle of the optical receiver is no greater than 110 degrees.

4. The proximity light sensor according to claim 1, wherein: The device further comprises a first transparent film layer, wherein the first transparent film layer is used to surround and encapsulate the light emitter and expose the emitting surface, and surround and encapsulate the light receiver and cover the receiving surface; There is a third dimension between the top surface of the first transparent film layer and the surface; The third size is smaller than the first size and larger than the second size.

5. The proximity light sensor according to claim 1, wherein: It also includes a second transparent film layer and a third transparent film layer, the second transparent film layer is used to surround and encapsulate the light emitter, and the third transparent film layer is used to surround and encapsulate the light receiver and cover the receiving surface; wherein the distance between the second transparent film layer and the surface is a fourth dimension, and the fourth dimension is greater than the second dimension.

6. The proximity light sensor according to claim 5, wherein: The distance between the third transparent film layer and the surface is a fifth dimension. If the fifth dimension is greater than the first dimension, a first distance exists between the light emitter and the light receiver. If the fifth size is smaller than the first size, there is a second distance between the optical transmitter and the optical receiver; wherein the first distance is larger than the second distance.

7. The proximity light sensor according to claim 1, wherein: It also includes a transparent film layer, which is used to surround and encapsulate the light receiver and cover the receiving surface; there is a distance between the transparent film layer and the light emitter; the two opposite surfaces of the transparent film layer along the first direction both have curved surfaces or inclined surfaces; the first direction is the direction from the center of the light emitter to the center of the light receiver.

8. The proximity light sensor according to claim 1, wherein: The substrate has a first surface and a second surface, the light emitter is arranged on the first surface, and the light receiver is arranged on the second surface, the first surface is higher than the second surface, or, there is a raised film layer between the light emitter and the surfaces so that the bottom surface of the light emitter is higher than the bottom surface of the light receiver.

9. The proximity light sensor according to claim 1, wherein: The receiving surface includes a first area and a second area; wherein, The first area is used to sense the reflected light of the light beam; The second area is used to sense ambient light; the ambient light includes light in the external environment where the detected object is located; the ambient light and the reflected light are both used to determine the physical characteristics of the detected object.

10. The proximity light sensor according to claim 9, wherein: Projections of the center of the emission surface of the light emitter, the center of the first area of ​​the light receiver, and the center of the second area on the substrate are coaxial.

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