Endoscope host and endoscope system

Abstract

The utility model relates to an endoscope host and an endoscope system. The endoscope host comprises a main board, a heat dissipation support, a heat conduction piece, heat dissipation fins and a fan, and the main board is provided with a heating device. The heat dissipation support is arranged on the mainboard and matched with the heating device in an attached mode, the heat conduction piece is arranged on the heat dissipation support, the heat dissipation fins are arranged on the heat dissipation support and matched with the heat conduction piece in an attached mode, the fan is arranged on the heat dissipation support, and the air outlet side of the fan faces the heat dissipation fins. According to the endoscope host and the endoscope system, the heat transfer efficiency of the heat dissipation support and the heat dissipation fins is improved through the heat conduction piece, and the problem that the heat transfer efficiency is low due to the fact that the heat dissipation support and the heat dissipation fins cannot be completely attached is solved. And meanwhile, the heat dissipation area is increased and the heat dissipation efficiency is improved by utilizing the heat dissipation fins, and the air circulation in the heat dissipation fins is accelerated by utilizing the fan, so that the heat of the heat dissipation fins can be quickly discharged, and the heat dissipation efficiency is further improved.

Description

Technical Field

[0001] The present application relates to the technical field of endoscopes, and in particular to an endoscope host. Background Art

[0002] The endoscope system is a commonly used medical device. When in use, the endoscope enters the patient's body through a natural orifice in the human body or an incision formed during surgery. After the endoscope is introduced into the organ to be examined, the doctor can directly view the image of the lesion in the relevant part on the display screen of the host computer, thereby making a medical diagnosis.

[0003] Because the chip inside the endoscope's mainframe needs to process large amounts of image information in real time and performs a significant amount of computation, it generates a significant amount of heat during operation. This heats up the chip itself and affects the normal operation of the surrounding electronic components. Therefore, a heat dissipation system is typically designed to address this heat. However, in related technologies, these chip-specific heat dissipation systems have poor heat dissipation efficiency and are unable to dissipate heat from the endoscope mainframe in a timely manner, affecting the operational stability of the chip itself and its surrounding electronic components. Utility Model Content

[0004] Based on this, it is necessary to provide an endoscope host and an endoscope system to improve heat dissipation efficiency.

[0005] In one aspect, the present application provides an endoscope host, comprising:

[0006] A mainboard, wherein the mainboard is provided with a heating device;

[0007] A heat dissipation bracket, which is arranged on the mainboard and fits in with the heating element;

[0008] A heat conducting member, the heat conducting member being arranged on the heat dissipation bracket;

[0009] heat dissipation fins, which are arranged on the heat dissipation bracket and fit closely with the heat conducting member; and

[0010] A fan is arranged on the heat dissipation bracket and an air outlet side of the fan faces the heat dissipation fins.

[0011] The technical solution is further described below:

[0012] In one embodiment, the endoscope host further includes a shielding cover, the shielding cover is provided with a first air inlet and a first air outlet, and the first air inlet and the first air outlet are respectively located on different surfaces of the shielding cover, the mainboard, the heat dissipation bracket, the heat conductor and the fan are all located in the shielding cover, and the air inlet side of the fan faces the first air inlet, and the air outlet side of the fan faces the first air outlet.

[0013] In one embodiment, the shielding cover includes an upper shell and a lower shell arranged relative to each other along the height direction of the endoscope host, the main board is arranged in the lower shell, the first air inlet is arranged in the upper shell, and the first air outlet is located between the upper shell and the lower shell.

[0014] In one embodiment, the fan includes a hood and a centrifugal impeller arranged in the hood, the hood is provided with a second air inlet on the axial side corresponding to the centrifugal impeller to form the air inlet side, and the hood is provided with a second air outlet on the circumferential side corresponding to the centrifugal impeller to form the air outlet side, wherein the second air inlet faces the first air inlet, and the second air outlet faces the heat dissipation fins and the first air outlet.

[0015] In one embodiment, the heat sink fin has an air inlet end and an air outlet end, and an air duct is formed in the heat sink fin. The air duct runs through the air inlet end and the air outlet end. The air inlet end is connected to the air outlet side of the fan, and the air outlet end extends from the first air outlet to the shielding cover.

[0016] In one embodiment, the heat dissipation bracket includes a heat absorption area attached to the heating device and a heat dissipation area extending from the heating device, the heat conductor extends from the heat absorption area to the heat dissipation area, the fan is arranged in the heat absorption area, and the heat dissipation fins are arranged in the heat dissipation area.

[0017] In one embodiment, there are multiple heat conducting members, and the multiple heat conducting members are arranged at intervals on the heat dissipation bracket.

[0018] In one embodiment, the arrangement interval of the heat conducting members in the heat dissipation area is greater than the arrangement interval of the heat conducting members in the heat absorption area.

[0019] In one embodiment, a groove is formed on the side of the heat dissipation bracket facing away from the heating device, the heat conductor is arranged in the groove, and the surface of the heat conductor facing away from the heating device is flush with the surface of the heat dissipation bracket facing away from the heating device.

[0020] In one embodiment, the heat conducting member is a heat pipe.

[0021] On the other hand, the present application also provides an endoscope system, including the above-mentioned endoscope host.

[0022] In the above-mentioned endoscope host and endoscope system, a heat dissipation bracket is provided on the mainboard and the heat dissipation bracket is fitted with the heat dissipation component. A heat conductor, heat dissipation fins and a fan are then provided on the heat dissipation bracket. At the same time, the heat dissipation fins are fitted with the heat conductor, and the air outlet side of the fan faces the heat dissipation fins. In this way, during operation, the heat generated by the heat dissipation component can be transferred to the heat conductor through the heat dissipation bracket, and then transferred to the heat dissipation fins by the heat conductor. Then, the air outlet side of the fan blows air toward the heat dissipation fins, and the wind is used to carry the heat out of the endoscope host to achieve heat dissipation. Among them, the use of the heat conductor accelerates the heat transfer efficiency between the heat dissipation bracket and the heat dissipation fins, and avoids the problem of low heat transfer efficiency caused by the inability of the heat dissipation bracket and the heat dissipation fins to fully fit together. At the same time, the use of the heat dissipation fins increases the heat dissipation area and improves the heat dissipation efficiency. The use of the fan accelerates the air circulation in the heat dissipation fins, so that the heat of the heat dissipation fins can be quickly discharged, further improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings that constitute a part of this application are used to provide further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute improper limitations on this application.

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0025] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the various elements are drawn only for illustrative purposes and are not necessarily drawn to true scale.

[0026] Figure 1 Schematic diagram of the structure of an endoscope host according to an embodiment.

[0027] Figure 2 for Figure 1 The structural explosion diagram of the endoscope host is shown in .

[0028] Figure 3 for Figure 1 The diagram shows the structure of the endoscope main unit from another perspective after the upper shell is hidden.

[0029] Description of Reference Numerals

[0030] 10. Heat dissipation bracket; 11. Groove; 20. Heat conductor; 30. Fan; 31. Air cover; 311. Second air inlet; 312. Second air outlet; 40. Heat dissipation fins; 42. Air duct; 421. Air inlet; 422. Air outlet; 50. Shielding cover; 51. Upper shell; 52. Lower shell; 53. First air inlet; 54. First air outlet; 60. Mainboard; 61. Heat-generating device. DETAILED DESCRIPTION

[0031] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0033] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0034] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0035] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0036] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0037] As mentioned above, at present, the heat dissipation efficiency of the heat dissipation system for the chip of the endoscope host is poor, and it is unable to discharge the heat in the endoscope host in time, affecting the working stability of the chip itself and the surrounding electronic components. Specifically, in a traditional endoscope host, the heat dissipation system usually includes a stacked heat dissipation bracket, a heat sink and a heat dissipation fan. The heat dissipation bracket is set on the chip, and the heat sink is installed on the heat dissipation bracket by screws, etc. However, considering the structure of the heat sink itself and the spatial layout inside the endoscope host, the heat sink cannot be completely attached to the heat dissipation bracket, resulting in low heat conduction efficiency between the heat sink and the heat dissipation bracket. At the same time, since the shielding cover of the endoscope host is relatively closed, the hot air convection in the shielding cover is not smooth, and the heat is not easily discharged, resulting in the heat dissipation effect not meeting the requirements.

[0038] Based on this, an embodiment of the present application provides an endoscope host, specifically, see Figures 1 to 3 The endoscope main unit of one embodiment includes a mainboard 60, a heat dissipation bracket 10, a heat conductive member 20, heat dissipation fins 40, and a fan 30. The mainboard 60 is provided with a heating element 61. For example, the heating element 61 can be a chip or other electronic device that generates heat during operation. The heat dissipation bracket 10 is provided on the mainboard 60 and fits in with the heating element 61. The heat conductive member 20 is provided on the heat dissipation bracket 10. The heat dissipation fins 40 are provided on the heat dissipation bracket 10 and fit in with the heat conductive member 20. The fan 30 is provided on the heat dissipation bracket 10, and the air outlet side of the fan 30 faces the heat dissipation fins 40.

[0039] In the above-mentioned endoscope host, a heat dissipation bracket 10 is provided on the mainboard 60 and the heat dissipation bracket 10 is made to fit closely with the heating element 61. A heat conductor 20, heat dissipation fins 40, and a fan 30 are further provided on the heat dissipation bracket 10. At the same time, the heat dissipation fins 40 are made to fit closely with the heat dissipation bracket 20, and the air outlet side of the fan 30 faces the heat dissipation fins 40. In this way, during operation, the heat generated by the heating element 61 can be transferred to the heat conductor 20 through the heat dissipation bracket 10, and then transferred to the heat dissipation fins 40 by the heat conductor 20. Then, the air outlet side of the fan 30 blows air toward the heat dissipation fins 40, and the air is used to carry the heat out of the endoscope host to achieve heat dissipation. Among them, the provision of the heat conductor 20 greatly accelerates the heat transfer efficiency between the heat dissipation bracket 10 and the heat dissipation fins 40, avoiding the problem of low heat transfer efficiency caused by the inability of the heat dissipation bracket 10 and the heat dissipation fins 40 to fit completely. At the same time, the setting of the heat dissipation fins 40 greatly increases the heat dissipation area and improves the heat dissipation efficiency, and the setting of the fan 30 accelerates the air circulation in the heat dissipation fins 40, so that the heat of the heat dissipation fins 40 can be quickly discharged, further improving the heat dissipation efficiency.

[0040] See also Figure 1 Optionally, in one embodiment, the endoscope main unit further includes a shielding cover 50, which can provide waterproof and dustproof protection for the electronic components in the endoscope main unit and also play an electromagnetic shielding role. Specifically, the shielding cover 50 is provided with a first air inlet 53 and a first air outlet 54, and the first air inlet 53 and the first air outlet 54 are respectively located on different surfaces of the shielding cover 50. The mainboard 60, the heat dissipation bracket 10, the heat conductor 20 and the fan 30 are all located in the shielding cover 50, and the air inlet side of the fan 30 faces the first air inlet 53, and the air outlet side of the fan 30 faces the first air outlet 54. In this way, when working, the cold air from the outside can enter the shielding cover 50 from the first air inlet 53 under the drive of the fan 30, and after flowing through the heat dissipation fins 40, it takes away the heat in the heat dissipation fins 40 and is finally discharged from the first air outlet 54, ensuring the smooth flow of air inside and outside the shielding cover 50, thereby improving the heat dissipation efficiency. At the same time, since the first air inlet 53 and the first air outlet 54 are respectively located on different surfaces of the shielding cover 50, the first air inlet 53 and the first air outlet 54 can be separated, preventing the mixing of cold and hot air, and further improving the heat dissipation efficiency.

[0041] Combine Figure 2Optionally, in one embodiment, the shielding cover 50 includes an upper shell 51 and a lower shell 52 disposed opposite each other along the height direction of the endoscope main body, the mainboard 60 is disposed in the lower shell 52, the first air inlet 53 is disposed in the upper shell 51, and the first air outlet 54 is located between the upper shell 51 and the lower shell 52. That is, the first air inlet 53 is disposed on the top surface of the shielding cover 50, and the first air outlet 54 is disposed on the side of the shielding cover 50. This ensures that the air inlet and air outlet directions of the shielding cover 50 are different and separated by a certain distance, further preventing the mixing of cold and hot air, thereby improving heat dissipation efficiency.

[0042] See also Figure 3 In one embodiment, the fan 30 includes a shroud 31 and a centrifugal impeller (not shown) disposed within the shroud 31. A second air inlet 311 is defined on the shroud 31's axial side, corresponding to the impeller's axis, to form an air inlet side. A second air outlet 312 is defined on the shroud 31's circumferential side, corresponding to the impeller's axis, to form an air outlet side. The second air inlet 311 of the shroud 31 faces the first air inlet 53 of the shielding cover 50, while the second air outlet 312 of the shroud 31 faces the heat sink 40 and the first air outlet 54 of the shielding cover 50. That is, the fan 30 of this embodiment is a centrifugal fan 30 with axial air intake and radial air outlet. Compared to the axial flow fans with axial air intake and axial air outlet used in traditional heat dissipation systems, the fan 30 of this application can ensure that the air intake direction is perpendicular to the air outlet direction, thereby being more suitable for the shielding cover 50 with the first air inlet 53 on the top surface and the first air outlet 54 on the side. This ensures that the cold air entering the air is separated from the hot air leaving the air, preventing the mixing of the cold and hot air, thereby improving the heat dissipation efficiency. At the same time, when using the centrifugal fan 30, the heat dissipation fins 40 can be arranged on the outer peripheral side of the fan 30, thereby eliminating the need for the fan 30 and the heat dissipation fins 40 to be stacked, reducing the space occupied by the combination of the fan 30 and the heat dissipation fins 40 in the height direction, and thus reducing the overall height of the endoscope mainframe.

[0043] See also Figure 3Optionally, in one embodiment, the heat sink fin 40 has an air inlet end 421 and an air outlet end 422, and an air duct 42 is formed in the heat sink fin 40, and the air duct 42 runs through the air inlet end 421 and the air outlet end 422. Exemplarily, the heat sink fin 40 includes an outer cover with openings at both ends, and a plurality of fins are arranged at intervals in the outer cover, and an air duct 42 is formed between two adjacent fins. Furthermore, the air inlet end 421 is connected to the air outlet side of the fan 30, and the air outlet end 422 extends from the first air outlet 54 to the shielding cover 50. Exemplarily, the opening of the air inlet end 421 of the heat sink fin 40 is connected to the second air outlet 312 of the fan 30, and the opening of the air outlet end 422 of the heat sink fin 40 is located outside the shielding cover 50. In this way, after the fan 30 sends the cold air into the air duct 42 of the heat dissipation fin 40 through the opening of the air inlet end 421 of the heat dissipation fin 40, the cold air exchanges heat with the fins in the air duct 42 to form hot air, and the hot air is then directly discharged to the outside of the shielding cover 50 through the opening of the air outlet end 422 of the heat fin, preventing the hot air from flowing back into the shielding cover 50, thereby further improving the heat dissipation effect.

[0044] See also Figure 3 Optionally, in one embodiment, the heat dissipation bracket 10 includes a heat absorption zone attached to the heating element 61 and a heat dissipation zone extending from the heating element 61. The heat conductor 20 extends from the heat absorption zone to the heat dissipation zone. The fan 30 is disposed in the heat absorption zone, and the heat dissipation fins 40 are disposed in the heat dissipation zone. In this way, the heat conductor 20 can exchange heat with the heating element 61 in the heat absorption zone, and then transfer the heat to the heat dissipation zone for heat exchange with the heat dissipation fins 40. Furthermore, the fan 30 disposed in the heat absorption zone not only dissipates heat from the heat dissipation fins 40 in the adjacent heat dissipation zone, but also provides a certain heat dissipation effect on the heat conductor 20 in the heat absorption zone, thereby further improving heat dissipation efficiency.

[0045] Continue to see Figure 3 The number of the heat conducting members 20 is multiple, and the multiple heat conducting members 20 are arranged at intervals on the heat dissipation bracket 10. For example, the number of the heat conducting members 20 can be two, three, four or more, etc., which is not limited here.

[0046] Furthermore, the arrangement spacing of the heat conductive members 20 in the heat dissipation zone is greater than the arrangement spacing of the heat conductive members 20 in the heat absorption zone. For example, the portions of the heat conductive members 20 in the heat dissipation zone are close to each other and arranged in parallel, so that the heat conductive members 20 in the heat dissipation zone are arranged more densely, while the portions of the heat conductive members 20 in the heat dissipation zone are bent in different directions, so that the heat conductive members 20 in the heat dissipation zone are arranged more sparsely. In this way, in the heat dissipation zone, the heat conductive members 20 are arranged densely, so that the heating device 61 below can exchange heat with more heat conductive members 20, thereby improving the heat absorption efficiency. In the heat dissipation zone, the heat conductive members 20 are arranged sparsely, so that the heat of the heat conductive members 20 is more easily dissipated and transferred to the heat sink fins 40, thereby improving the heat dissipation efficiency.

[0047] See also Figure 3A groove 11 is formed on the side of the heat dissipation bracket 10 facing away from the heating element 61. The heat conductive member 20 is disposed in the groove 11, and the surface of the heat conductive member 20 facing away from the heating element 61 is flush with the surface of the heat dissipation bracket 10 facing away from the heating element 61. This ensures that the surface of the heat dissipation bracket 10 facing away from the heating element 61 is flat, making it easier to install the heat dissipation fins 40 and the fan 30 there. In addition, the surface of the heat conductive member 20 is flush with the surface of the heat dissipation bracket 10, so that the heat dissipation fins 40 can fit together with the heat conductive member 20 and the heat dissipation bracket 10 at the same time, so that the heat dissipation bracket 10 can also directly transfer heat to the heat dissipation fins 40, further improving the heat dissipation efficiency.

[0048] Optionally, in one embodiment, the heat conductor 20 is a heat pipe. A heat pipe is a heat transfer element that transfers heat through the phase transition of its internal working fluid. Heat transfer within a heat pipe primarily occurs through the vapor-liquid phase transition of the working fluid, resulting in very low thermal resistance and, therefore, high thermal conductivity. Compared to metals such as silver, copper, and aluminum, a heat pipe can transfer several orders of magnitude more heat per unit weight, thereby significantly enhancing the heat transfer efficiency between the heat sink bracket 10 and the heat sink fins 40, thereby improving heat dissipation efficiency.

[0049] Another embodiment of the present application further provides an endoscope system. Specifically, the endoscope system of one embodiment includes the endoscope host described above. Furthermore, the endoscope system also includes an endoscope body, which is electrically connected to the endoscope host.

[0050] In the above-mentioned endoscope system, a heat dissipation bracket 10 is provided on the mainboard 60 of the endoscope host, and the heat dissipation bracket 10 is made to fit closely with the heating element 61. A heat conductor 20, a heat dissipation fin 40, and a fan 30 are further provided on the heat dissipation bracket 10. At the same time, the heat dissipation fin 40 is made to fit closely with the heat dissipation bracket 20, and the air outlet side of the fan 30 faces the heat dissipation fin 40. In this way, during operation, the heat generated by the heating element 61 can be transferred to the heat conductor 20 through the heat dissipation bracket 10, and then transferred to the heat dissipation fin 40 by the heat conductor 20. Then, the air outlet side of the fan 30 blows air toward the heat dissipation fin 40, and the air is used to carry the heat out of the endoscope host to achieve heat dissipation. Among them, the provision of the heat conductor 20 greatly accelerates the heat transfer efficiency between the heat dissipation bracket 10 and the heat dissipation fin 40, and avoids the problem of low heat transfer efficiency caused by the inability of the heat dissipation bracket 10 and the heat dissipation fin 40 to fit completely. At the same time, the setting of the heat dissipation fins 40 greatly increases the heat dissipation area and improves the heat dissipation efficiency, and the setting of the fan 30 accelerates the air circulation in the heat dissipation fins 40, so that the heat of the heat dissipation fins 40 can be quickly discharged, further improving the heat dissipation efficiency.

[0051] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An endoscope host, characterized in that: include: A mainboard, wherein the mainboard is provided with a heating device; A heat dissipation bracket, which is arranged on the mainboard and fits in with the heating element; A heat conducting member, the heat conducting member being arranged on the heat dissipation bracket; heat dissipation fins, which are arranged on the heat dissipation bracket and fit closely with the heat conducting member; and A fan is arranged on the heat dissipation bracket and an air outlet side of the fan faces the heat dissipation fins.

2. The endoscope main unit according to claim 1, characterized in that: The endoscope host also includes a shielding cover, which is provided with a first air inlet and a first air outlet, and the first air inlet and the first air outlet are respectively located on different surfaces of the shielding cover, the mainboard, the heat dissipation bracket, the heat conductor and the fan are all located in the shielding cover, and the air inlet side of the fan faces the first air inlet, and the air outlet side of the fan faces the first air outlet.

3. The endoscope main unit according to claim 2, characterized in that: The shielding cover includes an upper shell and a lower shell arranged relatively to each other along the height direction of the endoscope host, the mainboard is arranged in the lower shell, the first air inlet is arranged in the upper shell, and the first air outlet is located between the upper shell and the lower shell.

4. The endoscope main unit according to claim 2, characterized in that: The fan includes a hood and a centrifugal impeller arranged in the hood, the hood is provided with a second air inlet on the side corresponding to the axial side of the centrifugal impeller to form the air inlet side, and the hood is provided with a second air outlet on the side corresponding to the circumferential side of the centrifugal impeller to form the air outlet side, wherein the second air inlet faces the first air inlet, and the second air outlet faces the heat dissipation fins and the first air outlet.

5. The endoscope main unit according to claim 2, characterized in that: The heat dissipation fin has an air inlet end and an air outlet end. An air duct is formed in the heat dissipation fin. The air duct runs through the air inlet end and the air outlet end. The air inlet end is connected to the air outlet side of the fan. The air outlet end extends from the first air outlet to the shielding cover.

6. The endoscope main unit according to claim 1, characterized in that: The heat dissipation bracket includes a heat absorption area attached to the heating device and a heat dissipation area extending from the heating device, the heat conduction member extends from the heat absorption area to the heat dissipation area, the fan is arranged in the heat absorption area, and the heat dissipation fins are arranged in the heat dissipation area.

7. The endoscope main unit according to claim 6, characterized in that: There are multiple heat conducting members, and the multiple heat conducting members are arranged at intervals on the heat dissipation bracket.

8. The endoscope main unit according to claim 7, characterized in that: The arrangement interval of the heat conducting members in the heat dissipation area is greater than the arrangement interval of the heat conducting members in the heat absorption area.

9. The endoscope main unit according to claim 6, characterized in that: A groove is formed on the side of the heat dissipation bracket away from the heating device. The heat conductive element is arranged in the groove, and the surface of the heat conductive element away from the heating device is flush with the surface of the heat dissipation bracket away from the heating device.

10. The endoscope main unit according to any one of claims 1 to 9, characterized in that: The heat conducting member is a heat pipe.

11. An endoscope system, characterized in that: The endoscope host comprises the endoscope host according to any one of claims 1-10.

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