Rapid heat dissipation type reflow soldering furnace device

Abstract

The utility model relates to the technical field of reflow soldering furnaces, in particular to a quick heat dissipation type reflow soldering furnace device. The rapid heat dissipation type reflow soldering furnace device comprises a reflow soldering furnace body, a drawer is inserted into the reflow soldering furnace body, and a shielding assembly and a heat dissipation assembly are arranged on the outer side of the drawer in the reflow soldering furnace body; the shielding assembly comprises a horizontal heat insulation plate and a vertical heat insulation plate. According to the rapid heat dissipation type reflow soldering furnace device, through the arrangement of the shielding assembly, when the reflow soldering furnace body works, the horizontal heat insulation plate and the vertical heat insulation plate can block heat in the device, heating of the heat to the horizontal condensation pipe and the vertical condensation pipe of the heat dissipation assembly can be reduced, and the heat dissipation efficiency of the reflow soldering furnace device is improved. Therefore, the influence of over-high temperature of the horizontal condenser pipe and the vertical condenser pipe at the initial stage of heat dissipation on the heat dissipation effect can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of reflow soldering furnaces, in particular to a fast heat dissipation type reflow soldering furnace device. Background Art

[0002] A reflow oven is also called a reflow machine. It provides a heating environment to melt the solder paste so that surface mount components and PCB pads are reliably bonded together through the solder paste alloy.

[0003] After soldering a PCB in a reflow oven, the temperature of the PCB is relatively high, requiring cooling. A drawer-type reflow oven, due to its integrated structure, heats the heat dissipation pipes during operation. Consequently, when the heat dissipation components are operating, the cold source must pre-cool the pipes before dissipating heat to the PCB, which in turn affects the heat dissipation performance of the components to a certain extent.

[0004] Therefore, it is necessary to provide a new fast heat dissipation reflow oven device to solve the above technical problems. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a fast heat dissipation type reflow soldering furnace device.

[0006] The utility model provides a fast heat dissipation reflow soldering furnace device comprising: a reflow soldering furnace body, a drawer is inserted into the interior of the reflow soldering furnace body, and a shielding component and a heat dissipation component are provided on the outside of the drawer in the reflow soldering furnace body;

[0007] The shielding assembly includes a horizontal heat insulation board and a vertical heat insulation board. The horizontal heat insulation board is slidably inserted into the reflow soldering furnace body. The top of the horizontal heat insulation board is against the top of the drawer and is slidably connected. The vertical heat insulation board is provided with two and symmetrically distributed on the two side walls of the drawer. The two vertical heat insulation boards are both slidably set in the reflow soldering furnace body, and the opposite surfaces of the two vertical heat insulation boards are against the outer wall of the drawer and are slidably connected to avoid light.

[0008] The heat dissipation assembly includes a horizontal bottom frame and a vertical frame. The horizontal bottom frame is arranged below the horizontal heat insulation board inside the reflow oven body, and a horizontal condenser is arranged inside the horizontal bottom frame.

[0009] The vertical frames are provided with two and are symmetrically distributed on one side of the vertical insulation board away from the center of the reflow oven body, and vertical condensation pipes are provided inside the vertical frames. Fans are provided inside the horizontal bottom frame and the vertical frames.

[0010] Preferably, the heat dissipation assembly also includes a condensation box, which is arranged on the outer wall of the reflow oven body, a refrigerator is provided at the bottom of the condensation box, pump bodies are provided on both side walls of the condensation box, and the input ends of the pump bodies are connected to the interior of the condensation box.

[0011] Preferably, the output end of the pump body on one side is provided with a connecting transfer tube, the interior of the transfer tube is respectively connected to the interior of the corresponding vertical condenser and the horizontal condenser, and the side of the interior of the horizontal condenser away from the transfer tube is connected to the interior of the condensation tank.

[0012] Preferably, the output end of the pump body on the other side is connected to the interior of the corresponding vertical condenser tube, and the sides of the interiors of the two vertical condenser tubes away from the pump body are both connected to the interior of the condensation tank.

[0013] Preferably, a hollow plate is provided at the bottom of the drawer, and a through groove is provided at a position opposite to the vertical insulation plate.

[0014] Preferably, the shielding assembly also includes a horizontal cylinder, which is mounted between the horizontal insulation board and the reflow oven body, one end of the horizontal cylinder is connected to the outer wall of the reflow oven body, and the other end of the horizontal cylinder is connected to the end of the horizontal insulation board.

[0015] Preferably, the shielding assembly also includes a connecting rod, which is provided in number and symmetrically installed on the top of the vertical insulation plates on both sides. The top of the connecting rod passes through the top of the reflow oven body, and the outer wall of the connecting rod is slidably connected to the inner top of the reflow oven body.

[0016] Preferably, the tops of several of the connecting rods are provided with the same fixedly connected top frame, a vertical cylinder is provided between the top frame and the reflow oven body, the top end of the vertical cylinder is fixedly connected to the bottom of the top frame, and the bottom end of the vertical cylinder is fixedly connected to the top of the reflow oven body.

[0017] Compared with the related art, the rapid heat dissipation reflow oven device provided by the present invention has the following advantages:

[0018] Beneficial effects:

[0019] 1. The utility model sets a shielding component. When the reflow soldering furnace body is working, the horizontal heat insulation board and the vertical heat insulation board can block the heat inside the device, thereby reducing the heat on the horizontal condenser tube and the vertical condenser tube of the heat dissipation component, thereby reducing the influence of the horizontal condenser tube and the vertical condenser tube on the heat dissipation effect due to excessive temperature in the initial stage of heat dissipation.

[0020] 2. The utility model can wrap the PCB board with cold air in all directions by blowing cold air in multiple directions, thereby improving the heat dissipation effect of the device in the later stage and achieving rapid cooling of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic structural diagram of a preferred embodiment of a rapid heat dissipation reflow oven device is provided for the utility model;

[0022] Figure 2 for Figure 1 A schematic diagram of the orientation structure of the shielding component and the heat dissipation component shown;

[0023] Figure 3 for Figure 2 A schematic structural diagram of the shielding component shown;

[0024] Figure 4 for Figure 2 A schematic structural diagram of the heat dissipation assembly shown;

[0025] Figure 5 for Figure 1 Schematic diagram of the structure of the drawer shown.

[0026] Numbers in the figure: 1. Reflow oven body; 2. Drawer; 21. Through slot; 22. Hollow plate; 3. Shielding assembly; 31. Horizontal heat insulation board; 311. Horizontal cylinder; 32. Vertical heat insulation board; 321. Connecting rod; 322. Top frame; 323. Vertical cylinder; 4. Heat dissipation assembly; 41. Horizontal bottom frame; 411. Horizontal condenser; 42. Vertical frame; 421. Vertical condenser; 43. Condensation box; 431. Pump body; 44. Fan; 45. Adapter tube. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0028] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0029] See also Figures 1 to 5 The embodiment of the present invention provides a fast heat dissipation reflow soldering furnace device, which includes: a reflow soldering furnace body 1, a drawer 2 is inserted into the reflow soldering furnace body 1, and a shielding component 3 and a heat dissipation component 4 are provided on the outside of the drawer 2 in the reflow soldering furnace body 1.

[0030] In the embodiments of the present invention, please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 5 The shielding component 3 includes a horizontal heat insulation board 31 and a vertical heat insulation board 32. The horizontal heat insulation board 31 is slidably inserted into the reflow soldering furnace body 1. The top of the horizontal heat insulation board 31 is abutted against and slidably connected to the top of the drawer 2. Two vertical heat insulation boards 32 are provided and symmetrically distributed on the two side walls of the drawer 2. The two vertical heat insulation boards 32 are both slidably set in the reflow soldering furnace body 1, and the opposite surfaces of the two vertical heat insulation boards 32 are abutted against and slidably connected to the outer wall of the drawer 2 to avoid light.

[0031] It should be noted that: during the process of soldering the PCB board by the reflow oven body 1, the vertical insulation plates 32 and the horizontal insulation plates 31 located on both sides and the bottom of the drawer 2 in the shielding component 3 can block the hot air when the reflow oven body 1 is working, so that the hot air can circulate inside the drawer 2, thereby reducing the hot air flowing into the outside of the horizontal condenser 411 and the vertical condenser 421 in the heat dissipation component 4, causing the condenser to heat up. Therefore, the influence of the horizontal condenser 411 and the vertical condenser 421 on the overall heat dissipation effect due to excessive temperature in the initial stage of heat dissipation can be reduced.

[0032] In the embodiments of the present invention, please refer to Figure 1 、 Figure 2 、 Figure 4 and Figure 5 The heat dissipation component 4 includes a horizontal bottom frame 41 and a vertical frame 42. The horizontal bottom frame 41 is mounted below the horizontal heat insulation board 31 inside the reflow soldering furnace body 1, and a horizontal condensation pipe 411 is provided inside the horizontal bottom frame 41; the vertical frame 42 is provided with two and symmetrically distributed on the side of the vertical heat insulation board 32 away from the center of the reflow soldering furnace body 1, and a vertical condensation pipe 421 is provided inside the vertical frame 42. Fans 44 are provided inside the horizontal bottom frame 41 and the vertical frame 42. The heat dissipation component 4 also includes a condensation box 43. The condensation box 43 is arranged on the outer wall of the reflow soldering furnace body 1, and the bottom of the condensation box 43 is provided with a The cooler has pump bodies 431 on both side walls of the condensing tank 43, and the input ends of the pump bodies 431 are connected to the interior of the condensing tank 43. The output ends of the pump bodies 431 on one side are provided with connecting transfer pipes 45. The interiors of the transfer pipes 45 are respectively connected to the interiors of the corresponding vertical condensing tubes 421 and the horizontal condensing tubes 411, and the side of the horizontal condensing tube 411 away from the transfer pipe 45 is connected to the interior of the condensing tank 43. The output end of the pump body 431 on the other side is connected to the interior of the corresponding vertical condensing tube 421, and the sides of the two vertical condensing tubes 421 away from the pump body 431 are connected to the interior of the condensing tank 43.

[0033] It should be noted that: through the setting of the refrigerator, the refrigerator working during use can continue to cool the coolant in the condensation box 43, and then when the condensate circulates inside the horizontal condenser tube 411 and the vertical condenser tube 421, the condenser tube can always be cooled. Therefore, when the air generated by the fan 44 passes through the corresponding horizontal condenser tube 411 and the vertical condenser tube 421, heat exchange of the air can be achieved, so that the air becomes a lower temperature, and then when the air is blown to the outside of the PCB board, the PCB board can be quickly cooled. Since the air is fully circulated at the bottom and top of the PCB board, the PCB board can be fully cooled during the heat dissipation process of the PCB board, thereby improving the heat dissipation effect of the PCB board.

[0034] In the embodiments of the present invention, please refer to Figure 1 and Figure 5 A hollow plate 22 is provided at the bottom of the drawer 2 , and a through slot 21 is provided at a portion of the drawer 2 facing the vertical heat insulation plate 32 .

[0035] It should be noted that: through the arrangement of the hollow plate 22 and the through groove 21, after the welding of the PCB board is completed, when heat dissipation is required, the hollow plate 22 and the through groove 21 can allow the cold air generated by the heat dissipation component 4 to smoothly pass through the drawer 2 and circulate outside the PCB board to achieve heat dissipation of the PCB board.

[0036] In the embodiments of the present invention, please refer to Figure 1 、 Figure 2 and Figure 3 The shielding assembly 3 also includes a horizontal cylinder 311, which is mounted between the horizontal heat insulation plate 31 and the reflow soldering furnace body 1, one end of the horizontal cylinder 311 is connected to the outer wall of the reflow soldering furnace body 1, and the other end of the horizontal cylinder 311 is connected to the end of the horizontal heat insulation plate 31, the shielding assembly 3 also includes a connecting rod 321, and the connecting rod 321 is provided with several and symmetrically installed on the top of the vertical heat insulation plates 32 on both sides, the top of the connecting rod 321 passes through the top of the reflow soldering furnace body 1, and the outer wall of the connecting rod 321 is slidably connected to the inner top of the reflow soldering furnace body 1, the tops of the several connecting rods 321 are mounted with the same fixedly connected top frame 322, a vertical cylinder 323 is mounted between the top frame 322 and the reflow soldering furnace body 1, the top of the vertical cylinder 323 is fixedly connected to the bottom of the top frame 322, and the bottom end of the vertical cylinder 323 is fixedly connected to the top of the reflow soldering furnace body 1.

[0037] It should be noted that: through the setting of the horizontal cylinder 311 and the vertical cylinder 323, during use, the corresponding horizontal insulation board 31 and the vertical insulation board 32 can be driven to move by operating the horizontal cylinder 311 and the vertical cylinder 323, so that the horizontal insulation board 31 and the vertical insulation board 32 can be flexibly slid on the outside of the drawer 2 as needed, thereby flexibly controlling the shielding state of the outside of the drawer 2.

[0038] The working principle of the fast heat dissipation reflow oven device provided by the utility model is as follows:

[0039] When using the reflow oven, first place the PCB board to be processed in the drawer 2, then insert the drawer 2 into the reflow oven body 1, and control the reflow oven body 1 to work;

[0040] During the process of soldering the PCB board by the reflow oven body 1, the vertical heat insulation plates 32 and the horizontal heat insulation plates 31 located on both sides and the bottom of the drawer 2 in the shielding assembly 3 can block the hot air when the reflow oven body 1 is working, so that the hot air can circulate inside the drawer 2, thereby reducing the hot air from flowing into the outside of the horizontal condensing pipe 411 and the vertical condensing pipe 421 in the heat dissipation assembly 4, thereby heating the condensing pipe;

[0041] When the reflow oven body 1 completes soldering of the PCB board, the horizontal cylinder 311 and the vertical cylinder 323 in the shielding assembly 3 can be controlled to extend, thereby driving the corresponding horizontal insulation board 31 and the vertical insulation board 32 to move out of the drawer 2;

[0042] During this process, the working body can guide the condensate in the condensation box 43 into the vertical condensation tube 421 and the horizontal condensation tube 411 so that it passes through the corresponding condensation tube and flows back into the condensation box 43. At the same time, the fan can be controlled to work, and the wind force generated by the working fan can blow toward the corresponding horizontal condensation tube 411 and the vertical condensation tube 421. When the air passes through the horizontal condensation tube 411 and the vertical condensation tube 421, the cold air flowing through the condensate in the horizontal condensation tube 411 and the vertical condensation tube 421 can be taken away and blown toward the PCB board in the drawer 2. At this time, the rapid heat dissipation and cooling of the PCB board can be achieved through the comprehensive circulation of cold air to the bottom and top of the PCB board.

[0043] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0044] The above are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A rapid heat dissipation reflow oven device, characterized in that: include: A reflow oven body (1), wherein a drawer (2) is inserted into the interior of the reflow oven body (1), and a shielding component (3) and a heat dissipation component (4) are provided on the outside of the drawer (2) in the reflow oven body (1); The shielding assembly (3) includes a horizontal heat insulation board (31) and a vertical heat insulation board (32), wherein the horizontal heat insulation board (31) is slidably inserted into the interior of the reflow soldering furnace body (1), the top of the horizontal heat insulation board (31) is abutted against and slidably connected to the top of the drawer (2), and two vertical heat insulation boards (32) are provided and symmetrically distributed on both side walls of the drawer (2), and both of the two vertical heat insulation boards (32) are slidably arranged in the reflow soldering furnace body (1), and the opposite surfaces of the two vertical heat insulation boards (32) are abutted against and slidably connected to the outer wall of the drawer (2) in a light-proof manner; The heat dissipation assembly (4) comprises a horizontal bottom frame (41) and a vertical frame (42); the horizontal bottom frame (41) is mounted below a horizontal heat insulation board (31) inside the reflow oven body (1); and a horizontal condenser pipe (411) is provided inside the horizontal bottom frame (41); The vertical frames (42) are provided with two and are symmetrically distributed on one side of the vertical heat insulation board (32) away from the center of the reflow oven body (1), and a vertical condenser (421) is provided inside the vertical frame (42), and fans (44) are provided inside the horizontal bottom frame (41) and the vertical frame (42).

2. The rapid heat dissipation reflow oven device according to claim 1, characterized in that: The heat dissipation assembly (4) further includes a condensation box (43), which is arranged on the outer wall of the reflow oven body (1), a refrigerator is provided at the bottom of the condensation box (43), and pump bodies (431) are provided on both side walls of the condensation box (43), and the input ends of the pump bodies (431) are communicated with the interior of the condensation box (43).

3. The rapid heat dissipation reflow oven device according to claim 2, characterized in that: The output end of the pump body (431) on one side is provided with a connecting transfer tube (45), the interior of the transfer tube (45) is respectively connected to the interior of the corresponding vertical condenser tube (421) and the horizontal condenser tube (411), and the side of the interior of the horizontal condenser tube (411) away from the transfer tube (45) is connected to the interior of the condensation tank (43).

4. The rapid heat dissipation reflow oven device according to claim 3, characterized in that: The output end of the pump body (431) on the other side is connected to the interior of the corresponding vertical condenser tube (421), and the sides of the interiors of the two vertical condenser tubes (421) away from the pump body (431) are both connected to the interior of the condensation tank (43).

5. The rapid heat dissipation reflow oven device according to claim 1, characterized in that: A hollow plate (22) is provided at the bottom of the drawer (2), and a through groove (21) is provided at a position opposite to the vertical heat insulation plate (32) of the drawer (2).

6. The rapid heat dissipation reflow oven device according to claim 1, characterized in that: The shielding assembly (3) further comprises a horizontal cylinder (311), which is mounted between the horizontal heat insulation board (31) and the reflow oven body (1), one end of the horizontal cylinder (311) being connected to the outer wall of the reflow oven body (1), and the other end of the horizontal cylinder (311) being connected to the end of the horizontal heat insulation board (31).

7. The rapid heat dissipation reflow oven device according to claim 1, characterized in that: The shielding assembly (3) further includes a connecting rod (321), wherein a plurality of the connecting rods (321) are symmetrically mounted on the tops of the vertical heat insulation plates (32) on both sides, the tops of the connecting rods (321) pass through the top of the reflow oven body (1), and the outer walls of the connecting rods (321) are slidably connected to the inner top of the reflow oven body (1).

8. The rapid heat dissipation reflow oven device according to claim 7, characterized in that: The tops of the plurality of connecting rods (321) are provided with a top frame (322) that is fixedly connected thereto, a vertical cylinder (323) is provided between the top frame (322) and the reflow oven body (1), the top end of the vertical cylinder (323) is fixedly connected to the bottom of the top frame (322), and the bottom end of the vertical cylinder (323) is fixedly connected to the top of the reflow oven body (1).

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