Double-shaft grinding and polishing disc assembling structure and equipment comprising same

Abstract

The utility model discloses a double-shaft grinding and polishing disc assembling structure and equipment comprising the same, the double-shaft grinding and polishing disc assembling structure comprises a polishing upper disc, the polishing upper disc comprises a first connecting block, an upper disc bottom plate and an upper metal disc, and the upper disc bottom plate and the upper metal disc are coaxially arranged; the number of the first connecting blocks is at least two, and the first connecting blocks are used for connecting the upper disc bottom plate and the upper metal disc; the lower polishing disc comprises at least two second connecting blocks, a lower disc bottom plate and a lower metal disc, the lower disc bottom plate and the lower metal disc are coaxially arranged, and the second connecting blocks are used for connecting the lower disc bottom plate and the lower metal disc; the rotating shaft of the upper polishing disc and the rotating shaft of the lower polishing disc are parallel and do not coincide. The upper polishing disc and the lower polishing disc eccentrically grind the ceramic part, the grinding precision can be improved through the double-shaft eccentric grinding mode, the connecting strength of the metal disc and the bottom plate is improved by arranging the two or more connecting blocks, and the problem that the metal disc falls off due to aging of glue or the grinding precision of the metal disc is reduced due to loss is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of ceramic processing, in particular to a double-axis grinding and polishing disc assembly structure and equipment comprising the same. Background Art

[0002] For precision ceramic parts such as ceramic ferrules, ceramic sleeves, and ceramic splitters, after the green body is prepared and sintered to obtain ceramic structural parts, it is often necessary to perform local grinding or polishing processes on the ceramic structural parts with a certain hardness and shape to meet the accuracy or special size requirements.

[0003] Existing polishing equipment includes single-sided polishing machines and double-sided polishing machines, which contain polishing discs composed of a metal disc and a base support disc. There are two ways to combine them: using glue to form an intermediate glue layer combination, or punching holes in the metal disc and using bolts to increase the combination strength to overcome the centrifugal force of rotation.

[0004] However, both of these connection methods have their drawbacks: when glue is used as the adhesive connecting the metal disc and the base support disc, the addition of grinding fluid during the grinding process will cause the glue layer to absorb water and swell, which, on the one hand, affects the polishing accuracy, and on the other hand, will also cause the glue layer to absorb water and age, causing the metal disc to become unstable and fall off. When bolted connection is used, as the thickness of the metal disc decreases during the grinding process, the screw holes of the metal disc may be exposed, destroying the consistency of the polishing surface, affecting the polishing accuracy and the finishing of the metal disc. Therefore, it is necessary to design a connection method that ensures a stable connection between the metal disc and the base support disc, while at the same time reducing the impact on the grinding accuracy. Utility Model Content

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a dual-axis grinding and polishing disc assembly structure that can stably mount metal discs to prevent them from falling off during grinding or polishing, and can also improve the overall grinding accuracy of precision ceramic parts.

[0006] The utility model also provides a device with the above-mentioned dual-axis grinding and polishing disc assembly structure.

[0007] The dual-axis grinding and polishing disc assembly structure according to the first embodiment of the present invention includes:

[0008] A polishing upper plate, the polishing upper plate comprising a first connecting block and an upper plate bottom plate and an upper metal plate arranged coaxially with each other, wherein the first connecting block is at least two and is arranged in a circumferential array around the rotation axis of the upper plate bottom plate, and the first connecting block is arranged between the upper plate bottom plate and the upper metal plate to connect the two;

[0009] A polishing lower plate, the polishing lower plate comprising a second connecting block and a lower plate bottom plate and a lower metal plate arranged coaxially with the rotation axis, wherein the second connecting block is at least two and is arranged in a circular array around the rotation axis of the lower plate bottom plate, and the second connecting block is arranged between the lower plate bottom plate and the lower metal plate to connect the two;

[0010] Wherein, the rotation axis of the polishing upper plate and the rotation axis of the polishing lower plate are parallel to each other but do not overlap.

[0011] According to the dual-axis grinding and polishing disc assembly structure of the embodiment of the present invention, it has at least the following beneficial effects: the polishing upper disc and the polishing lower disc eccentrically grind the ceramic parts, the dual-axis eccentric grinding method can improve the grinding accuracy, and by setting two or more connecting blocks to improve the connection strength between the metal disc and the base plate, it avoids the problem of falling off due to aging of the glue or the problem of reduced grinding accuracy of the metal disc due to wear.

[0012] According to some embodiments of the present invention, the diameter of the polishing upper plate is a, and the diameter of the polishing lower plate is b, wherein a:b=(3-4):(5-6).

[0013] According to some embodiments of the present invention, the shortest distance between the rotation axis of the polishing upper plate and the rotation axis of the polishing lower plate is x, where the value range of x is: 0.125a <x<0.167a。

[0014] According to some embodiments of the present invention, the upper metal plate includes an upper grinding area and an upper mounting area, the upper mounting area is located in the center of the upper metal plate, the upper grinding area is annular and is arranged on the periphery of the upper mounting area, the first connecting block is installed in the upper mounting area, and the installation area of ​​the first connecting block accounts for 0.25% to 0.4% of the area of ​​the upper metal plate.

[0015] According to some embodiments of the present invention, the lower metal plate includes a lower grinding area, a first lower mounting area and a second lower mounting area, the first lower mounting area is located in the center of the lower metal plate, the lower grinding area is annular and is arranged on the periphery of the first lower mounting area, the second lower mounting area is annular and is arranged on the periphery of the lower grinding area, the second connecting block is installed in the first lower mounting area and / or the second lower mounting area, and the installation area of ​​the second connecting block accounts for 0.33% to 0.66% of the area of ​​the lower metal plate.

[0016] According to some embodiments of the present invention, the second connecting block is installed in the first lower installation area or the second lower installation area.

[0017] According to some embodiments of the present invention, the second connecting blocks are installed in the first lower mounting area and the second lower mounting area, wherein the number of the second connecting blocks in the first lower mounting area is odd and the number in the second lower mounting area is even; or the number of the second connecting blocks in the first lower mounting area is even and the number in the second lower mounting area is odd; or the number of the second connecting blocks in the first lower mounting area and the second lower mounting area are both odd; or the number of the second connecting blocks in the first lower mounting area and the second lower mounting area are both even.

[0018] According to some embodiments of the present invention, the shapes of the first connecting block and the second connecting block include but are not limited to one of a circle, a rectangle, a triangle, an L shape, an X shape, a hexagon and a crescent shape.

[0019] According to some embodiments of the present invention, the dual-axis grinding and polishing disc assembly structure further includes a pad, which is arranged between the polishing upper disc and the polishing lower disc.

[0020] The device according to the second embodiment of the present invention includes the above-mentioned dual-axis grinding and polishing disc assembly structure.

[0021] The equipment according to the embodiment of the present invention has at least the following beneficial effects: by utilizing the dual-axis grinding and polishing disc assembly structure, the grinding equipment can improve grinding accuracy, extend the service life of the metal disc and improve grinding efficiency.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0024] Figure 1 This is a front view of the assembly structure of the dual-axis grinding and polishing disc according to the first embodiment of the present utility model;

[0025] Figure 2 This is a top view of the upper metal disc in the dual-axis grinding and polishing disc assembly structure according to the first embodiment of the present invention;

[0026] Figure 3 This is a top view of the lower metal disc in the dual-axis grinding and polishing disc assembly structure according to the first embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the installation position of the first connecting block on the upper metal plate in the dual-axis grinding and polishing plate assembly structure according to the first embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the installation position of the second connecting block on the lower metal plate in the dual-axis grinding and polishing plate assembly structure of the first embodiment of the present invention.

[0029] Figure markings: 100-polishing upper plate, 110-upper plate base, 120-upper metal plate, 121-upper grinding area, 122-upper mounting area, 200-polishing lower plate, 210-lower plate base, 220-lower metal plate, 221-lower grinding area, 222-first lower mounting area, 223-second lower mounting area, 310-first connecting block, 320-second connecting block, 400-pad. DETAILED DESCRIPTION

[0030] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0031] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0032] In the description of this utility model, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of the terms "first" and "second" is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0033] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0034] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0035] For precision ceramic parts such as ceramic ferrules, ceramic sleeves, and ceramic splitters, after the green body is prepared and sintered to obtain ceramic structural parts, it is often necessary to perform local grinding or polishing processes on the ceramic structural parts with a certain hardness and shape to meet the accuracy or special size requirements.

[0036] Existing polishing equipment includes single-sided polishing machines and double-sided polishing machines, which contain polishing discs composed of a metal disc and a base support disc. There are two ways to combine them: using glue to form an intermediate glue layer combination, or punching holes in the metal disc and using bolts to increase the combination strength to overcome the centrifugal force of rotation.

[0037] However, both of these connection methods have their drawbacks: when glue is used as the adhesive connecting the metal disc and the base support disc, the addition of grinding fluid during the grinding process will cause the glue layer to absorb water and swell, which, on the one hand, affects the polishing accuracy, and on the other hand, will also cause the glue layer to absorb water and age, causing the metal disc to become unstable and fall off. When bolted connection is used, as the thickness of the metal disc decreases during the grinding process, the screw holes of the metal disc may be exposed, destroying the consistency of the polishing surface, affecting the polishing accuracy and the finishing of the metal disc. Therefore, it is necessary to design a connection method that ensures a stable connection between the metal disc and the base support disc, while at the same time reducing the impact on the grinding accuracy.

[0038] In this regard, the present application proposes a dual-axis grinding and polishing disc assembly structure, in which the polishing upper disc 100 and the polishing lower disc 200 eccentrically grind the ceramic parts. The dual-axis eccentric grinding method can improve the grinding accuracy, and by setting two or more connecting blocks to improve the connection strength between the metal disc and the base plate, it avoids the problem of falling off due to aging of the glue or the problem of reduced grinding accuracy of the metal disc due to wear.

[0039] In addition, the present application also proposes a device including the above-mentioned dual-axis grinding and polishing disc assembly structure. By utilizing this dual-axis grinding and polishing disc assembly structure, the grinding equipment can improve the grinding accuracy of the metal disc, extend the service life of the metal disc and improve the grinding efficiency.

[0040] Reference Figure 1, the dual-axis grinding and polishing disc assembly structure in the first aspect embodiment of the present application includes a polishing upper disc 100 and a polishing lower disc 200, which are respectively connected to an external motor. Place the ceramic parts to be ground and polished between the polishing upper disc 100 and the polishing lower disc 200. After starting the motor, the polishing upper disc 100 and the polishing lower disc 200 can rotate respectively, and use the speed difference and different grinding directions between the two to continuously rub the ceramic parts, so as to complete the double-sided grinding of the ceramic parts and improve the grinding accuracy.

[0041] Specifically, the polishing upper disc 100 includes a first connecting block 310, an upper disc bottom plate 110 and an upper metal disc 120 arranged coaxially with the rotation axis l1. The number of the first connecting blocks 310 is at least two and they are all arranged in a circumferential array around the rotation axis of the upper disc bottom plate 110. The first connecting block 310 is arranged between the upper disc bottom plate 110 and the upper metal disc 120 and connects the two, so as to connect and fix the upper metal disc 120 and the upper disc bottom plate 110 through each first connecting block 310.

[0042] The polishing lower disc 200 includes a second connecting block 320, a lower disc bottom plate 210 and a lower metal disc 220 arranged coaxially with the rotation axis l2. The number of the second connecting blocks 320 is at least two and they are all arranged in a circumferential array around the rotation axis of the lower disc bottom plate 210. The second connecting block 320 is arranged between the lower disc bottom plate 210 and the lower metal disc 220 and connects the two, so as to connect and fix the lower metal disc 220 and the lower disc bottom plate 210 through each second connecting block 320.

[0043] Among them, the rotation axis l1 of the polishing upper disc 100 and the rotation axis l2 of the polishing lower disc 200 are parallel to each other but do not coincide, so that the rotation axes of the polishing upper disc 100 and the polishing lower disc 200 are not coaxial, achieving the effect of eccentric grinding.

[0044] Furthermore, the dual-axis grinding and polishing disc assembly structure further includes a backing plate 400. The backing plate 400 is arranged between the polishing upper disc 100 and the polishing lower disc 200. Different thicknesses of ceramic parts can be adapted by using backing plates 400 with different installation heights, so as to complete the grinding work of different types of ceramic parts.

[0045] Furthermore, the diameter of the polishing upper disc 100 is smaller than the diameter of the polishing lower disc 200, so that the polishing upper disc 100 has a smaller volume and lighter weight, and thus is less likely to fall. Specifically, the diameter of the polishing upper disc 100 is a, and the diameter of the polishing lower disc 200 is b, where a:b = (3 - 4):(5 - 6).

[0046] Furthermore, the shortest distance between the rotation axis of the polishing upper disc 100 and the rotation axis of the polishing lower disc 200 is x, and the value range of x is: 0.125a < x < 0.167a. The value of x changes based on the change of the diameter a of the polishing upper disc 100.

[0047] Specifically, refer to Figure 2 The upper metal plate 120 includes an upper grinding area 121 and an upper mounting area 122. The upper mounting area 122 is located in the center of the upper metal plate 120, and the upper grinding area 121 is annular and disposed on the periphery of the upper mounting area 122. The upper grinding area 121 is used to actually contact the ceramic part and grind its surface, while the upper mounting area 122 is used to connect to the upper plate bottom plate 110. Each first connecting block 310 is mounted on the upper mounting area 122.

[0048] Furthermore, the installation area of ​​the first connecting block 310 accounts for 0.25% to 0.4% of the area of ​​the upper metal plate 120, wherein the installation area of ​​the first connecting block 310 refers to the projection area of ​​the connection between the first connecting block 310 and the upper metal plate 120 projected onto the surface of the upper metal plate 120.

[0049] Specifically, refer to Figure 3 The lower metal plate 220 includes a lower grinding area 221, a first lower mounting area 222, and a second lower mounting area 223. The first lower mounting area 222 is located in the center of the lower metal plate 220. The lower grinding area 221 is annular and disposed around the first lower mounting area 222. The second lower mounting area 223 is annular and disposed around the lower grinding area 221. The lower grinding area 221 is used to actually contact the ceramic part and grind its surface. The first lower mounting area 222 and the second lower mounting area 223 are both used to connect to the lower plate bottom plate 210. Each second connecting block 320 is mounted on the first lower mounting area 222 and / or the second lower mounting area 223.

[0050] Furthermore, the installation area of ​​the second connecting block 320 accounts for 0.33% to 0.66% of the area of ​​the lower metal plate 220, wherein the installation area of ​​the second connecting block 320 refers to the projection area of ​​the connection between the second connecting block 320 and the lower metal plate 220 projected onto the surface of the lower metal plate 220.

[0051] It is worth noting that the shapes of the first connecting block 310 and the second connecting block 320 include but are not limited to one of a circle, a rectangle, a triangle, an L-shape, an X-shape, a hexagon, and a crescent shape.

[0052] Regarding the arrangement of the first connecting block 310 and the second connecting block 320, this application proposes some possible embodiments thereof. However, it should be noted that this application is not limited to the specific embodiments described, and the first connecting block 310 and the second connecting block 320 can also adopt other similar installation methods.

[0053] Reference Figure 4 In the polishing upper plate 100, the setting method of the first connecting block 310 can be divided into the following cases:

[0054] (1) The number of the first connecting blocks 310 can be two and they can be symmetrically arranged in the upper mounting area 122 (see Figure 4 A in

[0055] (2) The number of the first connecting blocks 310 can be three and they are distributed in a circular array in the upper mounting area 122 (see Figure 4 B in the);

[0056] (3) The number of the first connecting blocks 310 can be four and they are distributed in a circular array in the upper mounting area 122 (see Figure 4 C).

[0057] Reference Figure 5 In the polishing lower plate 200, the setting method of the second connecting block 320 can be divided into the following cases:

[0058] The second connecting blocks are installed in the first lower mounting area and the second lower mounting area, wherein the number of the second connecting blocks in the first lower mounting area is odd and the number in the second lower mounting area is even; or the number of the second connecting blocks in the first lower mounting area is even and the number in the second lower mounting area is odd; or the number of the second connecting blocks in the first lower mounting area and the second lower mounting area are both odd; or the number of the second connecting blocks in the first lower mounting area and the second lower mounting area are both even.

[0059] (1) The second connecting blocks 320 are arranged in a circular array in the first lower mounting area 222 (refer to Figure 5 D in

[0060] (2) The second connecting blocks 320 are arranged in a circular array in the second lower mounting area 223 (refer to Figure 5 E in);

[0061] (3) The second connecting blocks 320 are installed in the first lower mounting area 222 and the second lower mounting area 223. The number of the second connecting blocks 320 in the second lower mounting area 223 is an odd number and the number of the second connecting blocks 320 in the first lower mounting area 222 is an odd number. The second connecting blocks 320 are distributed in a circular array around the lower metal plate 220 (refer to Figure 5 F in

[0062] (4) The second connecting blocks 320 are installed in the first lower mounting area 222 and the second lower mounting area 223. The number of the second connecting blocks 320 in the second lower mounting area 223 is an odd number and the number of the second connecting blocks 320 in the first lower mounting area 222 is an even number. The second connecting blocks 320 are distributed in a circular array around the lower metal plate 220 (refer to Figure 5 G in );

[0063] (5) The second connecting blocks 320 are installed in the first lower mounting area 222 and the second lower mounting area 223. The number of the second connecting blocks 320 in the second lower mounting area 223 is an even number and the number of the second connecting blocks 320 in the first lower mounting area 222 is an odd number. The second connecting blocks 320 are arranged in a circular array around the lower metal plate 220 (refer to Figure 5 H in

[0064] (6) The second connecting blocks 320 are installed in the first lower mounting area 222 and the second lower mounting area 223. The number of the second connecting blocks 320 in the second lower mounting area 223 is an even number and the number of the second connecting blocks 320 in the first lower mounting area 222 is an even number. The second connecting blocks 320 are distributed in a circular array around the lower metal plate 220 (refer to Figure 5 I in ).

[0065] Next, by combining various configurations of the first connecting block 310 and the second connecting block 320 and comparing them with the comparative example, the stability of the metal plate connection of the dual-axis grinding and polishing plate assembly structure can be understood:

[0066] (1) Performance data testing method

[0067]

[0068] (2) Configuration of the first connecting block and the second connecting block in each embodiment

[0069]

[0070]

[0071] In the table, "upper" refers to the polishing of the upper plate 100, and "lower" refers to the polishing of the lower plate 200. For example, "upper A and lower D" refers to the polishing of the upper plate 100 using Figure 4 The first connecting block 310 of the middle A is set up, and the polishing bottom plate 200 adopts Figure 5 The configuration of the second connecting block 320 in FIG. The configuration of other embodiments in the table is similar and will not be described in detail.

[0072] (3) Test data

[0073] Load-bearing value / Kg Adhesion test Example 1 60 qualified Example 2 80 qualified Example 3 90 qualified Example 4 100 qualified Example 5 90 qualified Example 6 120 qualified Example 7 100 qualified Example 8 90 qualified Example 9 90 qualified Example 10 60 qualified Example 11 80 qualified Comparative Example 1 80 Unqualified Comparative Example 2 40 Unqualified Comparative Example 3 60 Unqualified

[0074] It can be seen that after using the dual-axis grinding and polishing disc assembly structure, the load-bearing value is improved, and the bonding force also meets the requirements, so that the metal disc is not easy to fall off after long-term use, which has a good effect on improving the utilization rate and service life of the metal disc, and further promotes the optimization of grinding efficiency and grinding accuracy.

[0075] A device in an embodiment of the second aspect of the present application includes the above-mentioned dual-axis grinding and polishing disc assembly structure.

[0076] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. In addition, the embodiments of the present invention and the features of the embodiments can be combined with each other unless there is a conflict.

Claims

1. A dual-axis grinding and polishing disc assembly structure, characterized in that: include: A polishing upper plate, the polishing upper plate comprising a first connecting block and an upper plate bottom plate and an upper metal plate arranged coaxially with each other, wherein the first connecting block is at least two and is arranged in a circumferential array around the rotation axis of the upper plate bottom plate, and the first connecting block is arranged between the upper plate bottom plate and the upper metal plate to connect the two; A polishing lower plate, the polishing lower plate comprising a second connecting block and a lower plate bottom plate and a lower metal plate arranged coaxially with the rotation axis, wherein the second connecting block is at least two and is arranged in a circular array around the rotation axis of the lower plate bottom plate, and the second connecting block is arranged between the lower plate bottom plate and the lower metal plate to connect the two; Wherein, the rotation axis of the polishing upper plate and the rotation axis of the polishing lower plate are parallel to each other but do not overlap.

2. The dual-axis grinding and polishing disc assembly structure according to claim 1, characterized in that: The diameter of the polishing upper plate is a, and the diameter of the polishing lower plate is b, wherein a:b=(3-4):(5-6).

3. The dual-axis grinding and polishing disc assembly structure according to claim 2, characterized in that: The shortest distance between the rotation axis of the polishing upper plate and the rotation axis of the polishing lower plate is x, where the value range of x is: 0.125a <x<0.167a。 4. The dual-axis grinding and polishing disc assembly structure according to claim 1, characterized in that: The upper metal plate includes an upper grinding area and an upper mounting area. The upper mounting area is located in the center of the upper metal plate. The upper grinding area is annular and is arranged on the periphery of the upper mounting area. The first connecting block is installed in the upper mounting area. The installation area of ​​the first connecting block accounts for 0.25% to 0.4% of the area of ​​the upper metal plate.

5. The dual-axis grinding and polishing disc assembly structure according to claim 1, characterized in that: The lower metal plate includes a lower grinding area, a first lower mounting area and a second lower mounting area, the first lower mounting area is located in the center of the lower metal plate, the lower grinding area is annular and is arranged on the periphery of the first lower mounting area, the second lower mounting area is annular and is arranged on the periphery of the lower grinding area, the second connecting block is installed in the first lower mounting area and / or the second lower mounting area, and the installation area of ​​the second connecting block accounts for 0.33% to 0.66% of the area of ​​the lower metal plate.

6. The dual-axis grinding and polishing disc assembly structure according to claim 5, characterized in that: The second connection block is installed in the first lower installation area or the second lower installation area.

7. The dual-axis grinding and polishing disc assembly structure according to claim 5, characterized in that: The second connecting blocks are installed in the first lower mounting area and the second lower mounting area, wherein the number of the second connecting blocks in the first lower mounting area is odd and the number in the second lower mounting area is even; or the number of the second connecting blocks in the first lower mounting area is even and the number in the second lower mounting area is odd; or the number of the second connecting blocks in the first lower mounting area and the second lower mounting area are both odd; or the number of the second connecting blocks in the first lower mounting area and the second lower mounting area are both even.

8. The dual-axis grinding and polishing disc assembly structure according to claim 1, characterized in that: The shapes of the first connecting block and the second connecting block include, but are not limited to, at least one of a circle, a rectangle, a triangle, an L-shape, an X-shape, a hexagon, and a crescent shape.

9. The dual-axis grinding and polishing disc assembly structure according to any one of claims 1 to 8, characterized in that: The dual-axis grinding and polishing disc assembly structure further includes a pad, which is arranged between the polishing upper disc and the polishing lower disc.

10. A device, characterized in that The invention comprises the dual-axis grinding and polishing disc assembly structure described in any one of claims 1 to 9.

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