Liquid leakage detection device for semiconductor electroplating equipment
By using a combination of an inclined leak tray and an electric telescopic rod in semiconductor electroplating equipment, rapid detection and drainage of leaks are achieved, solving the problems of detection delay and drainage inconvenience in existing devices and ensuring environmental safety.
Patent Information
- Application Number
- CN202423070615.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-12-12
AI Technical Summary
Existing leakage detection devices for semiconductor electroplating equipment have problems with detection delay and inconvenient drainage, which causes the electroplating liquid to overflow for a long time, affecting environmental safety.
An inclined leakage receiving plate and a leakage sensor are combined with an electric telescopic rod. The leakage position and degree are detected by the leakage sensor, and the electric telescopic rod is activated to pull the connecting plate to deflect and pull out the piston to discharge the leaked liquid.
The accuracy and speed of leakage detection are improved, large-scale overflow of electroplating solution is avoided, and environmental safety is guaranteed.
Smart Images
Figure CN223426176U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor plating, specifically to a liquid leakage detection device for semiconductor plating equipment. BACKGROUND
[0002] In the semiconductor production process, various liquid chemicals and water such as pure water, tap water, ice water, acid and alkali liquid, organic solution, etc. are used. These liquids play a key role in the process steps such as plating, cleaning, etching, etc. However, due to equipment aging, pipe damage, improper operation, etc., liquid leakage incidents occur from time to time. These leaks not only cause equipment damage, production line downtime, but also may cause environmental pollution and employee injury.
[0003] However, the liquid leakage detection device for semiconductor plating equipment in the prior art still has some shortcomings: the original liquid leakage detection is detected and alarmed only when the liquid reaches a certain amount on the receiving tray or in the area of the leakage sensor. At the same time, the original detection device is not convenient to drain the liquid, resulting in a long time of plating liquid overflow, causing large-scale liquid leakage and affecting environmental safety. SUMMARY
[0004] The utility model aims at solving the shortcomings in the prior art and provides a liquid leakage detection device for semiconductor plating equipment.
[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a liquid leakage detection device for semiconductor plating equipment, comprising a detection assembly and a drainage assembly, the detection assembly comprises a receiving tray, a liquid leakage sensor is arranged in the receiving tray, and an electroplating machine is arranged above the receiving tray, the drainage assembly is arranged below the detection assembly, the drainage assembly comprises an electric telescopic rod, one end of the electric telescopic rod is connected with a first connecting block, the first connecting block is connected with a second connecting block, one end of the second connecting block is connected with a connecting plate, the other side of the connecting plate away from the second connecting block is connected with a piston, one end of the electric telescopic rod away from the first connecting block is connected with a third connecting block, and the drainage assembly further comprises a fixed shell.
[0006] As a further description of the above technical scheme:
[0007] The liquid leakage sensor is arranged at the middle position of the inner side lower end of the receiving tray, the electroplating machine is arranged directly above the receiving tray, and the lower end of the electroplating machine is fixedly connected to the upper end of the fixed shell.
[0008] As a further description of the above technical scheme:
[0009] The first connecting block is rotatably connected to one end of the second connecting block away from the connecting plate, and the third connecting block is rotatably connected to the outer side of the receiving tray.
[0010] As a further description of the above technical solution:
[0011] The side of the connecting plate close to the electric telescopic rod is hinged on the leakage receiving plate, and the piston penetrates and slides on the leakage receiving plate.
[0012] As a further description of the above technical solution:
[0013] The piston is arranged on one side of the liquid leakage sensor, and the outer side of the upper end of the leakage receiving plate is fixedly connected to the inner side of the fixed shell.
[0014] As a further description of the above technical solution:
[0015] The fixed shell is provided with a liquid outlet groove, and the liquid outlet groove is arranged below the electric telescopic rod and the connecting plate.
[0016] As a further description of the above technical solution:
[0017] One end of the second connecting block away from the first connecting block is fixedly connected to the connecting plate, and the upper end of the fixing plate is fixedly connected to the lower end of the fixing shell.
[0018] The utility model has the following beneficial effects:
[0019] 1. When the electroplating machine leaks, the edge of the leakage tray is tilted to concentrate the leakage, and the leakage sensor is used to detect the position and extent of the leakage. The improved chassis slope is used to concentrate the leakage area to improve the sensor detection rate.
[0020] 2. By starting the electric telescopic rod to pull the first connecting block and the second connecting block, the connecting plate is driven to deflect on the leakage plate, and the piston is pulled out from the leakage plate to allow the leaked liquid in the leakage plate to flow out. This can effectively prevent the electroplating liquid from overflowing for too long, causing large-scale leakage and affecting environmental safety. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of a liquid leakage detection device for semiconductor electroplating equipment proposed in this utility model. Figure 1 ;
[0022] Figure 2 This is a partial structural diagram of a leakage detection device for semiconductor electroplating equipment proposed in this utility model. Figure 1 ;
[0023] Figure 3 This is a schematic structural diagram of a liquid leakage detection device for semiconductor electroplating equipment proposed by the present invention;
[0024] Figure 4This is a partial structural diagram of a leakage detection device for semiconductor electroplating equipment proposed in this utility model. Figure 2 ;
[0025] Figure 5 for Figure 4 Enlarged view of point C.
[0026] Legend:
[0027] 1. Detection assembly; 11. Leakage tray; 12. Liquid leakage sensor; 13. Electroplating machine; 2. Drainage assembly; 21. Electric telescopic rod; 22. First connecting block; 23. Second connecting block; 24. Connecting plate; 25. Third connecting block; 26. Piston; 27. Fixed shell; 28. Fixed plate; 29. Liquid outlet tank. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0029] Reference Figure 1-Figure 5 The utility model provides a liquid leakage detection device for semiconductor electroplating equipment, comprising: a detection component 1 and a drainage component 2.
[0030] Specifically, it includes a detection component 1 and a drainage component 2. The detection component 1 includes a leakage tray 11, and a leakage sensor 12 is provided in the leakage tray 11, and an electroplating machine 13 is provided at the upper end of the leakage tray 11. The drainage component 2 is arranged below the detection component 1, and the drainage component 2 includes an electric telescopic rod 21, and one end of the electric telescopic rod 21 is connected to a first connecting block 22, and the first connecting block 22 is connected to a second connecting block 23, and one end of the second connecting block 23 is connected to a connecting plate 24, and the side of the connecting plate 24 away from the second connecting block 23 is connected to a piston 26, and the end of the electric telescopic rod 21 away from the first connecting block 22 is connected to a third connecting block 25, and the drainage component 2 also includes a fixed shell 27.
[0031] In this embodiment, the detection component 1 and the drainage component 2 constitute a liquid leakage detection device for semiconductor electroplating equipment involved in this application, which realizes accurate detection of liquid leakage and facilitates the operation of discharging the leaked liquid after detection.
[0032] In this embodiment, the liquid leakage sensor 12 involved is the existing technology. When liquid leaks into the detection area of the sensor, the liquid will cause light scattering or absorption, changing the light intensity received by the photodiode. This light signal will be captured by the sensor circuit and converted into an electrical signal, thereby determining the location and extent of the leakage.
[0033] Specifically, the leakage sensor 12 is arranged in the middle position of the inner lower end of the leakage tray 11, and the electroplating machine 13 is arranged directly above the leakage tray 11, and the lower end of the electroplating machine 13 is fixedly connected to the upper end of the fixed shell 27, the first connecting block 22 is rotatably connected to the end of the second connecting block 23 away from the connecting plate 24, and the third connecting block 25 is rotatably connected to the outer side of the leakage tray 11, the side of the connecting plate 24 close to the electric telescopic rod 21 is hinged to the leakage tray 11, and the piston 26 slides through the leakage tray 11, the piston 26 is provided on one side of the leakage sensor 12, and the outer side of the upper end of the leakage tray 11 is fixedly connected to the inner side of the fixed shell 27, the fixed shell 27 is provided with a liquid outlet 29, and the liquid outlet trough 29 is provided below the electric telescopic rod 21 and the connecting plate 24, the end of the second connecting block 23 away from the first connecting block 22 is fixedly connected to the connecting plate 24, and the upper end of the fixed plate 28 is fixedly connected to the lower end of the fixed shell 27.
[0034] As a preferred embodiment, the edge of the leakage tray 11 is tilted to concentrate the leaked liquid and facilitate the detection of the leaked liquid.
[0035] As a preferred embodiment, when the leakage sensor 12 detects leakage and the leakage reaches a certain amount, a signal is transmitted to a controller (not shown) to start the electric telescopic rod 21.
[0036] As a preferred embodiment, the first connecting block 22 and the second connecting block 23 are pulled by the electric telescopic rod 21, driving the connecting plate 24 to deflect on the leakage plate 11 and pulling the piston 26 out of the leakage plate 11.
[0037] It should be noted that when the electric telescopic rod 21 pulls the second connecting block 23 , the third connecting block 25 at one end of the electric telescopic rod 21 away from the first connecting block 22 performs a deflection motion on the leakage receiving plate 11 .
[0038] During use, when the electroplating machine 13 leaks liquid, the edge of the leakage tray 11 is tilted to concentrate the leaked liquid, and the position and degree of the leakage are detected by the leakage sensor 12. When a certain amount is reached, the alarm is activated by the controller, and the controller controls the start of the electric telescopic rod 21 to pull the first connecting block 22 and the second connecting block 23, driving the connecting plate 24 to deflect on the leakage tray 11, and pulling the piston 26 out of the leakage tray 11, so that the leaked liquid in the leakage tray 11 can flow out and flow out through the liquid outlet trough 29, and be collected by the collection bucket (not shown) at the lower end of the fixed plate 28.
[0039] The utility model discloses a leakage detection device for semiconductor electroplating equipment, which uses an improved chassis slope to concentrate leakage in a certain area to improve the sensor detection rate. This can effectively prevent the electroplating liquid from overflowing for too long, causing large-scale leakage and affecting environmental safety.
[0040] It should be noted that the electrical components appearing in this article are all connected to an external main controller and 220V AC power, and the main controller can be a conventional known device controlled by a computer, etc. The specific implementation method of this disclosure omits the detailed description of known functions and known components. In order to ensure the compatibility of the equipment, the operating methods used are consistent with the parameters of marketed equipment.
[0041] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A liquid leakage detection device for semiconductor electroplating equipment, characterized in that: The invention comprises a detection component (1) and a drainage component (2), wherein the detection component (1) comprises a leakage tray (11), a liquid leakage sensor (12) is arranged in the leakage tray (11), and an electroplating machine (13) is arranged at the upper end of the leakage tray (11), and the drainage component (2) is arranged below the detection component (1), and the drainage component (2) comprises an electric telescopic rod (21), and one end of the electric telescopic rod (21) is connected to a first connecting block (22), and the first connecting block (22) is connected to a second connecting block (23), and one end of the second connecting block (23) is connected to a connecting plate (24), and a piston (26) is connected to the side of the connecting plate (24) away from the second connecting block (23), and the end of the electric telescopic rod (21) away from the first connecting block (22) is connected to a third connecting block (25), and the drainage component (2) further comprises a fixed shell (27).
2. The liquid leakage detection device for semiconductor electroplating equipment according to claim 1, characterized in that: The liquid leakage sensor (12) is arranged at the middle position of the inner lower end of the leakage tray (11), and the electroplating machine (13) is arranged directly above the leakage tray (11), and the lower end of the electroplating machine (13) is fixedly connected to the upper end of the fixed shell (27).
3. The liquid leakage detection device for semiconductor electroplating equipment according to claim 2, characterized in that: The first connecting block (22) is rotatably connected to an end of the second connecting block (23) away from the connecting plate (24), and the third connecting block (25) is rotatably connected to the outer side of the leakage receiving plate (11).
4. The liquid leakage detection device for semiconductor electroplating equipment according to claim 3, characterized in that: The connecting plate (24) is hinged to the leakage receiving plate (11) on one side close to the electric telescopic rod (21), and the piston (26) penetrates and slides on the leakage receiving plate (11).
5. The liquid leakage detection device for semiconductor electroplating equipment according to claim 4, characterized in that: The piston (26) is arranged on one side of the liquid leakage sensor (12), and the outer side of the upper end of the leakage receiving plate (11) is fixedly connected to the inner side of the fixed shell (27).
6. The liquid leakage detection device for semiconductor electroplating equipment according to claim 5, characterized in that: The fixed shell (27) is provided with a liquid outlet groove (29), and the liquid outlet groove (29) is arranged below the electric telescopic rod (21) and the connecting plate (24).
7. The liquid leakage detection device for semiconductor electroplating equipment according to claim 6, characterized in that: One end of the second connecting block (23) away from the first connecting block (22) is fixedly connected to the connecting plate (24), and the upper end of the fixing plate (28) is fixedly connected to the lower end of the fixing shell (27).