Packaging structure
By designing a mold sealing layer with angled and inclined edges in the semiconductor packaging structure, the warping problem of the sub-substrate is solved, ensuring that the electrical connectors are fully exposed, improving product quality and reducing production costs.
Patent Information
- Application Number
- CN202422375130.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-09-27
AI Technical Summary
In existing semiconductor products, warping of the sub-substrate results in insufficient exposure of electrical connectors, which affects product quality and increases production costs.
The design of the first and second mold sealing layers forms an angle and tilts the edges to reduce substrate warping and ensure that the electrical connectors are fully exposed.
Reduce substrate warping, improve product yield and reduce production costs.
Smart Images
Figure CN223427488U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor packaging, and in particular, to a packaging structure. Background Art
[0002] In existing semiconductor product manufacturing processes, the sub-substrates in products with a stacked mother-substrate structure often have warping, which results in electrical connectors on the sub-substrate not being fully exposed, affecting product quality.
[0003] Figure 1 FIG. 1 shows a schematic diagram of a packaging structure of the prior art. Figure 1 As shown, the packaging structure of the prior art includes a first substrate 901, a second substrate 902, an electrical connector 903, a molding layer 904 and an electronic component 905. The first substrate 901 is located above the second substrate 902, the electronic component 905 connects the first substrate 901 and the second substrate 902, the electronic connector 903 is arranged above the first substrate 901 and is electrically connected to the first substrate 901, the molding layer 904 covers the upper surfaces of the first substrate 901, the electronic component 905 and the second substrate 902, and the electrical connector 903 is exposed from the upper surface of the molding layer 904.
[0004] Figure 2 Shown as Figure 1 The figure shows a schematic diagram of the production process of a packaging structure in the prior art.
[0005] like Figure 2 As shown, the production process of the packaging structure in the prior art includes multiple steps:
[0006] Step 9001: providing a first substrate 901 and placing electronic components 905 on the first substrate 901;
[0007] Step 9002: Flip the product obtained in step 9001 and place it on a second substrate 902; wherein the electronic component 905 is electrically connected to the first substrate 901 and the second substrate 902;
[0008] Step 9003: Dispose an electronic connector 903 on the upward side of the first substrate 901;
[0009] Step 9004: using a molding layer 904 to cover the first substrate 901, the electrical connector 903 and the electronic component 905; and
[0010] Step 9005 : Grinding the side where the electrical connector 903 is provided, so that the electrical connector 903 is exposed from the molding layer 904 .
[0011] Figure 3 Shown as Figure 1 A schematic diagram of a prior art packaging structure warping is shown.Figure 3 As shown, in the conventional packaging structure, both ends of the first substrate 901 may warp during the production process. When the warping is severe, some electronic components 905 may not be fully exposed from the top surface of the product. This can affect product performance, reduce product yield, and increase production costs.
[0012] In summary, the art needs to provide a packaging structure that can overcome the defects of the prior art. Utility Model Content
[0013] The present application provides a packaging structure that can solve the problems of the prior art. The purpose of the present application is achieved through the following technical solutions.
[0014] One embodiment of the present application provides a packaging structure, which includes: a first substrate; a first molding layer, the first molding layer covers the upper surface of the first substrate; a second substrate, the second substrate is arranged below the first substrate; a second molding layer, the second molding layer covers the upper surface of the second substrate, and the second molding layer covers the lower surface and side surfaces of the first substrate and the side surfaces of the first molding layer; wherein, in the side viewing direction, an angle is formed between the upper surface of the first molding layer and the upper surface of the second molding layer.
[0015] In some optional embodiments, according to the package structure provided by one of the above embodiments of the present application, the second molding layer is inclined downward from an edge adjacent to the first molding layer to an edge of the second molding layer.
[0016] In some optional embodiments, according to the package structure provided by one of the above embodiments of the present application, the roughness of the upper surface of the first molding layer and the upper surface of the second molding layer are different.
[0017] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the upper surface of the second molding layer has a serrated texture.
[0018] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein the first molding layer includes a first filler, a cross-section of the first filler is exposed from the upper surface of the first molding layer and the cross-section of the exposed first filler is flush with the upper surface of the first molding layer.
[0019] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the second molding layer includes a second filler, and the second filler is in a complete state.
[0020] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the size of the first substrate is smaller than the size of the second substrate.
[0021] In some alternative embodiments, the packaging structure according to one of the above embodiments of the present application, wherein the packaging structure further comprises an electronic component, the electronic component is disposed between the first substrate and the second substrate, a top end of the electronic component is electrically connected to the first substrate, and a bottom end of the electronic component is electrically connected to the second substrate.
[0022] In some alternative embodiments, the packaging structure according to one of the above embodiments of the present application, wherein the electronic component is a passive component.
[0023] In some alternative embodiments, the packaging structure according to one of the above embodiments of the present application, wherein the first substrate comprises a first electrical connector, a first circuit, and a first board, the first electrical connector is disposed above the first board, and the electronic component is electrically connected to the first electrical connector through the first circuit.
[0024] In some alternative embodiments, the packaging structure according to one of the above embodiments of the present application, wherein the second substrate comprises a second electrical connector, a second circuit, and a second board, the second electrical connector is disposed below the second board, and the electronic component is electrically connected to the second electrical connector through the second circuit.
[0025] The packaging structure according to the embodiments of the present application has the advantages of reducing the warpage of the first substrate, avoiding the insufficient exposure of the electrical connector above the first substrate, improving the yield of the product, and reducing the production cost. BRIEF DESCRIPTION OF DRAWINGS
[0026] Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments thereof as provided in conjunction with the accompanying drawings.
[0027] Figure 1 A schematic diagram of a packaging structure of one prior art is shown;
[0028] Figure 2 A schematic diagram of a production process of a packaging structure of one prior art is shown; Figure 1
[0029] A schematic diagram of the warpage of a packaging structure of one prior art is shown; Figure 3 Figure 1 A schematic diagram of a packaging structure according to one embodiment of the present application is shown;
[0030] Figure 4 A schematic diagram of the part marked as A in the packaging structure according to one embodiment of the present application is shown;
[0031] Figure 5 Figure 4 A schematic diagram of the part marked as A in the packaging structure according to one embodiment of the present application is shown;
[0032] Figure 6 Shown as Figure 4 A schematic diagram of a first filler in a first molding layer and a second filler in a second molding layer of a package structure according to an embodiment of the present application is shown;
[0033] Figure 7 Shown as Figure 4 FIG. 1 is a schematic diagram of a cross section of a first filler in a first molding layer of a package structure according to an embodiment of the present application;
[0034] Figure 8 Shown as Figure 4 The figure shows a schematic diagram of the production process of a packaging structure according to an embodiment of the present application.
[0035] Numbers and component names: 1-first substrate, 2-first molding layer, 3-second substrate, 4-second molding layer, 5-electronic component, 11-first electrical connector, 12-first circuit, 13-first board, 21-first filler, 31-second electrical connector, 32-second circuit, 33-second board, 41-second filler, 101-first substrate, 102-first molding layer, 103-first electrical connector, 104-first circuit, 105-electronic component, 106-second substrate, 107-second molding layer, 108-release film, 109-second electrical connector, 110-third electrical connector, 901-first substrate, 902-second substrate, 903-electrical connector, 904-molding layer, 905-electronic component. DETAILED DESCRIPTION
[0036] The following describes the specific implementation methods of the present application in conjunction with the accompanying drawings and examples. Through the contents of this specification, those skilled in the art can clearly and completely understand the technical solutions, technical problems solved, and technical effects produced by the present application. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. In addition, for ease of description, only the parts relevant to the present application are shown in the accompanying drawings.
[0037] It should be readily understood that the meanings of “on,” “over,” and “over…” in this application should be interpreted in the broadest sense, such that “on” not only means “directly on something,” but also means “on something” including intermediate components or layers therebetween.
[0038] Furthermore, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90° or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.
[0039] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.
[0040] As used herein, the term "layer" refers to a portion of a material comprising an area having a certain thickness. A layer may extend over the entire underlying or superstructure, or may have an extent that is less than the extent of the underlying or superstructure. In addition, a layer may be an area of a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers thereon, above and / or below. A layer may include multiple layers. For example, a semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.
[0041] The term "electrical connector" as used herein may refer to a pad or a bump. Examples of the bump include a gold bump (usually rectangular, made of gold), a solder bump (usually round, made of copper and tin), and a pillar bump (usually octagonal or polygonal, made of copper and tin or lead and tin).
[0042] The term "molding layer" or "molding compound" used in this article includes, but is not limited to, epoxy resin, filler, catalyst, pigment, release agent, flame retardant, coupling agent, hardener, low stress absorber, adhesion promoter, ion trapping agent, etc.
[0043] In addition, the embodiments and features of the embodiments in this application can be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0044] Figure 4 A schematic diagram of a packaging structure according to an embodiment of the present application is shown. Figure 5 Shown as Figure 4 FIG. 1 is an enlarged schematic diagram of a portion marked A in a packaging structure according to an embodiment of the present application. Figure 4 to Figure 5 As shown, the packaging structure includes: a first substrate 1; a first sealing layer 2, the first sealing layer 2 covers the upper surface of the first substrate 1; a second substrate 3, the second substrate 3 is arranged below the first substrate 1; a second sealing layer 4, the second sealing layer 4 covers the upper surface of the second substrate 3, and the second sealing layer 4 covers the lower surface and side surface of the first substrate 1 and the side surface of the first sealing layer 2; wherein, in the side viewing direction, an angle a is formed between the upper surface of the first sealing layer 2 and the upper surface of the second sealing layer 4.
[0045] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein the angle a ranges from 5° to 15°; the height difference b between the upper surface of the first encapsulation layer 2 and the edge of the second encapsulation layer 4 is between 10 microns and 30 microns, preferably, the height difference is 15 microns.
[0046] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the second encapsulation layer 4 is inclined downward from the edge adjacent to the first encapsulation layer 2 to the edge of the second encapsulation layer 4 .
[0047] In some optional embodiments, according to the package structure provided by one of the above embodiments of the present application, the upper surface of the first encapsulation layer 2 and the upper surface of the second encapsulation layer 4 have different roughness.
[0048] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the upper surface of the second molding layer 4 has serrated lines.
[0049] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein the first molding layer 2 includes a first filler 21, a cross-section of the first filler 21 is exposed from the upper surface of the first molding layer 2 and the cross-section of the exposed first filler 21 is flush with the upper surface of the first molding layer 2.
[0050] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the second molding layer 4 includes a second filler 41 , and the second filler 41 is in a complete state.
[0051] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the size of the first substrate 1 is smaller than the size of the second substrate 3 .
[0052] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein the packaging structure further includes an electronic component 5, the electronic component 5 is arranged between the first substrate 1 and the second substrate 3, the top end of the electronic component 5 is electrically connected to the first substrate 1, and the bottom end of the electronic component 5 is electrically connected to the second substrate 3.
[0053] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the electronic component 5 is a passive component.
[0054] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein the first substrate 1 includes a first electrical connector 11, a first circuit 12 and a first board 13, the first electrical connector 11 is arranged above the first board 13, and the electronic component 5 is electrically connected to the first electrical connector 11 through the first circuit 12.
[0055] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein the second substrate 3 includes a second electrical connector 31, a second circuit 32 and a second board 33, the second electrical connector 31 is arranged below the second board 33, and the electronic component 5 is electrically connected to the second electrical connector 31 through the second circuit 32.
[0056] Figure 6 Shown as Figure 4 The figure shows a schematic diagram of a first filler in a first molding layer and a second filler in a second molding layer of a package structure according to an embodiment of the present application. Figure 7 Shown as Figure 4FIG. 1 is a schematic diagram of a cross section of a first filler in a first mold sealing layer of a package structure according to an embodiment of the present application. Figure 6 and Figure 7 As shown, the first molding layer 2 includes a first filler 21 , a cross section of the first filler 21 is exposed from the upper surface of the first molding layer 2 and the cross section of the exposed first filler 21 is flush with the upper surface of the first molding layer 2 .
[0057] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the second molding layer 4 includes a second filler 41 , and the second filler 41 is in a complete state.
[0058] Figure 8 Shown as Figure 4 The schematic diagram of the production process of the packaging structure according to one embodiment of the present application is shown in FIG. Figure 8 As shown, the production process of the package structure includes multiple steps:
[0059] Step 1001: Disposing a first electrical connector 103 on the lower surface of a first substrate 101 , and using a first molding layer 102 to cover the lower surface of the first substrate 101 and the first electrical connector 103 ;
[0060] Step 1002 : Grinding the side where the first electrical connector 103 is provided, so that the first electrical connector 103 is exposed from the first molding layer 102 ;
[0061] Step 1003: Disposing an electronic component 105 on the upper surface of the first substrate 101 , wherein the electronic component 105 is electrically connected to the first circuit 104 on the first substrate 101 ;
[0062] Step 1004: Flipping the product obtained in step 1003 and placing it on the second substrate 106; wherein the first substrate 101 and the second substrate 106 are electrically connected via the electronic component 105. It should be noted that the product obtained in step 1003 has already been polished before being placed on the second substrate 106, and does not need to be polished again after stacking, thereby reducing the possibility of product warping;
[0063] Step 1005: Use the second molding layer 108 to cover the upper surface of the second substrate 106, the electronic component 105, and the side surfaces of the first substrate 101 and the first molding layer 102, and set a release film 108 on the upper surfaces of the first molding layer 102 and the second molding layer 108; and
[0064] Step 1006 : removing the release film 108 and processing the exposed first electrical connector 103 into a protruding third electrical connector 110 . Since the first substrate 101 is less likely to warp, the first electrical connector 103 can be fully exposed.
[0065] The advantages of the packaging structure according to the embodiment of the present application are that it can reduce the warping of the first substrate, avoid the electrical connectors above the first substrate from being insufficiently exposed, improve the product yield, and reduce production costs.
[0066] Although the present application has been described and illustrated with reference to specific embodiments of the present application, these descriptions and illustrations are not intended to limit the present application. It will be clearly understood by those skilled in the art that various changes may be made and that equivalent elements may be substituted within the embodiments without departing from the scope of protection of the present application as defined by the claims. Due to variables in the manufacturing process, etc., there may be differences between the technical reproduction in the present application and the actual device. There may be other embodiments of the present application that are not specifically described. The description and illustrations should be regarded as illustrative, not restrictive, and modifications may be made according to the purpose and spirit of the present application, all of which are within the scope of protection of the claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations may be recombined, subdivided, or arranged to form equivalent methods without departing from the teachings of the present application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the present application.
Claims
1. A packaging structure, characterized in that: include: a first substrate; a first mold sealing layer, wherein the first mold sealing layer covers an upper surface of the first substrate; a second substrate, the second substrate being disposed below the first substrate; a second mold sealing layer, wherein the second mold sealing layer covers the upper surface of the second substrate, and the second mold sealing layer covers the lower surface and side surfaces of the first substrate and side surfaces of the first mold sealing layer; Wherein, an angle is formed between the upper surface of the first sealing layer and the upper surface of the second sealing layer in a side view direction.
2. The packaging structure according to claim 1, wherein: The second molding layer is inclined downward from an edge adjacent to the first molding layer to an edge of the second molding layer.
3. The packaging structure according to claim 1, wherein: The roughness of an upper surface of the first molding layer and an upper surface of the second molding layer are different.
4. The packaging structure according to claim 1, wherein: The upper surface of the second mold sealing layer has serrated lines.
5. The packaging structure according to claim 1, wherein: The first molding layer includes a first filler, a cross section of the first filler is exposed from an upper surface of the first molding layer, and the exposed cross section of the first filler is flush with the upper surface of the first molding layer.
6. The packaging structure according to claim 1, wherein: The second molding layer includes a second filler, and the second filler is in a complete state.
7. The packaging structure according to claim 1, wherein: The size of the first substrate is smaller than that of the second substrate.
8. The packaging structure according to claim 1, wherein: The packaging structure further includes an electronic component, which is disposed between the first substrate and the second substrate. A top end of the electronic component is electrically connected to the first substrate, and a bottom end of the electronic component is electrically connected to the second substrate.
9. The packaging structure according to claim 8, wherein: The first substrate includes a first electrical connector, a first circuit, and a first plate. The first electrical connector is disposed above the first plate. The electronic component is electrically connected to the first electrical connector via the first circuit.
10. The packaging structure according to claim 8, wherein: The second substrate includes a second electrical connection member, a second circuit, and a second plate member. The second electrical connection member is disposed below the second plate member. The electronic component is electrically connected to the second electrical connection member through the second circuit.