Buckle type radiator and circuit assembly

Abstract

The utility model relates to a buckle type radiator and a circuit assembly, and belongs to the technical field of electronics. A buckle type radiator comprises a radiator assembly, the radiator assembly is provided with a first heat dissipation through groove, a second heat dissipation through groove and a clamping groove, and the first heat dissipation through groove and the second heat dissipation through groove intersect and communicate with each other; the fixing assembly is arranged on the radiator assembly and located at the clamping groove; the fixing assembly comprises a first fixing strip, two second fixing strips and two third fixing strips, the first fixing strip is arranged on the radiator assembly and located at the clamping groove, the two second fixing strips are arranged at the two ends of the first fixing strip, and the two third fixing strips are arranged at the two ends of the first fixing strip. The two third fixing strips are arranged on the two second fixing strips respectively. The utility model discloses a buckle-type radiator, and the radiator is stably fixed on a chip through a fixing structure, thereby effectively preventing a radiator assembly from loosening or displacing.

Description

Technical Field

[0001] The utility model relates to the technical field of electronics, in particular to a clip-on radiator and a circuit assembly. Background Art

[0002] In the prior art, the heat sink on the circuit board may be separated from the chip due to external forces such as impact or vibration during the operation of the electronic device. As a result, the chip cannot continuously dissipate heat during operation, eventually causing the chip to overheat and malfunction, shortening the service life of the electronic device. Utility Model Content

[0003] Based on this, it is necessary to provide a clip-on heat sink and circuit assembly to address the problem of unstable fixation of the heat sink on the circuit board.

[0004] A clip-on radiator, the clip-on radiator comprising: a radiator assembly, the radiator assembly being provided with a first heat dissipation slot, a second heat dissipation slot and a clip slot, the first heat dissipation slot and the second heat dissipation slot intersecting and connected; a fixing assembly, the fixing assembly being arranged on the radiator assembly and located at the clip slot; the fixing assembly comprising a first fixing bar, a second fixing bar and a third fixing bar, the first fixing bar being arranged on the radiator assembly and located at the clip slot, the number of the second fixing bars being two, two of the second fixing bars being arranged at both ends of the first fixing bar, the number of the third fixing bars being two, two of the third fixing bars being arranged on the two second fixing bars respectively.

[0005] The above-disclosed clip-on heat sink comprises a first heat dissipation slot and a second heat dissipation slot on the heat sink assembly, which help distribute heat more evenly throughout the heat sink assembly. Without the slots, heat tends to accumulate in a localized area near the heat source, causing the temperature in that area to be too high while other areas remain cooler. The slots direct heat from high-temperature areas to low-temperature areas, smoothing the temperature gradient across the entire heat sink. Uneven temperature distribution can damage certain parts of the heat sink due to prolonged exposure to excessively high temperatures, or lead to material fatigue due to excessive local thermal stress. Providing different heat dissipation slots can avoid these problems and extend the lifespan of the heat sink. Furthermore, when the first and second heat dissipation slots are connected, the air flow path is expanded and optimized. After being heated and rising in one slot, hot air can flow smoothly into the other slot through the connecting portion. This continuous channel allows for a more complete convection circulation of air within the heat sink assembly. The mounting assembly is positioned on the heat sink assembly, located within the slot, allowing it to be accurately installed in the desired position within the heat sink assembly, ensuring the stability of the overall structure of the clip-on heat sink. At the same time, the cooperation between the fixing assembly and the slot can effectively prevent the heat sink from shifting during use, avoiding the heat sink assembly's heat dissipation function for the chip from failing or being poor. The fixing assembly reduces the complexity of the operation when installing the heat sink assembly, making the entire installation process simpler and faster. By setting the first fixing bar on the slot of the heat sink assembly, the slot provides a specific installation position for the first fixing bar, allowing the first fixing bar to fit tightly against the heat sink assembly, preventing the heat sink assembly from shifting or shaking during operation of the device. At the same time, the slot provides a clear installation position for the first fixing bar, making the installation process simpler and more accurate. Setting multiple second fixing bars on the first fixing bar, on the one hand, constructs a multi-layer fixing structure, supplementing the fixing function of the first fixing bar on the heat sink assembly. This multi-layer setting can make the fixing structure more stable. When the heat sink assembly is subjected to external forces, such as vibration, collision, or stress caused by thermal expansion and contraction of the equipment, this multi-layer reinforcement system can better withstand these forces and prevent the heat sink assembly from loosening or shifting. The third fixing bar is set on the second fixing bar. The third fixing bar is used to fix the entire fixing structure on the circuit board. At the same time, it also fixes the radiator assembly at a preset position to dissipate heat for the chip, thereby achieving the ultimate heat dissipation purpose.

[0006] In one embodiment, the number of the fixing components is one or more. By setting the fixing components to one or more, the radiator assembly can be flexibly configured according to the actual situation to ensure a close fit with the mounting surface or other components. When there are multiple fixing components, the fixing force on the radiator assembly can be evenly distributed on these components. During the operation of the radiator, it may be subjected to vibrations from the equipment itself, external impacts, or stress caused by thermal expansion and contraction. Multiple fixing components are like multiple support points, dispersing these forces to prevent the radiator from being subjected to excessive force at a certain point and causing deformation, loosening, or damage.

[0007] In one embodiment, the fixing directions of the fixing components are the same or different. By setting the fixing directions of the fixing components to be the same or different, the same fixing direction helps to form a unified force pattern during the fixing process of the radiator assembly, so that the forces applied by each fixing component to the radiator are consistent in direction. Setting different fixing directions can achieve all-round fixation of the radiator assembly. The radiator may be subjected to forces from various directions during operation, such as vibrations in different directions, stresses caused by thermal expansion and contraction, etc. By making the fixing directions of the fixing components different, the radiator assembly can be fixed from multiple angles, effectively limiting the displacement and deformation of the radiator assembly in various directions.

[0008] In one embodiment, the number of the first heat dissipation grooves is multiple. By providing a plurality of first heat dissipation grooves, the surface area of ​​the radiator in contact with the air can be greatly increased. The larger the heat dissipation area, the more heat is conducted per unit time, thus avoiding the phenomenon of thermal stress concentration. When there are multiple grooves, the air can fully contact these numerous surfaces, so that heat can be transferred from the radiator to the air more efficiently. At the same time, multiple first heat dissipation grooves can optimize the air flow path, forming a more complex and efficient heat convection system. The hot air rises in the grooves, and the surrounding cold air will be continuously replenished. As the number of grooves increases, the air flow channels increase, the speed and efficiency of heat convection will increase, and the efficiency of heat dissipation will be improved.

[0009] In one embodiment, the number of the second heat dissipation grooves is multiple. By providing multiple second heat dissipation grooves, the surface area of ​​the heat sink in contact with the air can be greatly increased. The larger the heat dissipation area, the more heat is conducted per unit time, avoiding the phenomenon of thermal stress concentration. When there are multiple grooves, the air can fully contact these numerous surfaces, so that heat can be transferred from the heat sink to the air more efficiently. At the same time, multiple second heat dissipation grooves can optimize the air flow path, forming a more complex and efficient heat convection system. The hot air rises in the grooves, and the surrounding cold air will be continuously replenished. As the number of grooves increases, the air flow channels increase, the speed and efficiency of heat convection will increase, and the efficiency of heat dissipation will be improved.

[0010] In one embodiment, the heat sink assembly includes a heat sink base, heat sink fins, a clamping assembly, and a reinforcement block. The heat sink base is provided with a plurality of heat sink fins, which are spaced apart along the length and width of the heat sink base, respectively. A first heat dissipation channel is formed between adjacent heat sink fins along the length direction, and a second heat dissipation channel is formed between adjacent heat sink fins along the width direction. The clamping assembly is provided on the heat sink base, and the clamping assembly is arranged opposite to the plurality of heat sink fins. The reinforcement block is provided with a plurality of reinforcement blocks, which are arranged between the plurality of heat sink fins and located at the plurality of first heat dissipation channels. By arranging the plurality of heat sink fins along the length and width of the heat sink base, and forming the first heat dissipation channel and the second heat dissipation channel between adjacent heat sink fins, this structural arrangement can effectively expand the heat dissipation area. When the heat source transfers heat to the heat sink base, the heat sink fins can quickly transfer the heat away from the base because the distribution of the heat sink fins allows heat to be transferred simultaneously in the length and width directions, which greatly increases the heat transfer rate compared to a single-direction transfer path. Secondly, the first and second heat dissipation slots formed between adjacent heat sinks create excellent conditions for air flow. After the heat sink is heated, the hot air will rise due to its reduced density, and cold air will be replenished from the bottom of the slots, forming natural convection. Because the heat sink is arranged in two directions at intervals, the distribution of the slots is also more uniform and regular, which allows the air to form a stable and efficient convection cycle inside the heat sink. This convection cycle allows the air to fully contact the surface of the heat sink, removing more heat. Moreover, the slots in different positions can guide the air to flow in a complex manner inside the heat sink, further enhancing the effect of thermal convection, allowing heat to be transferred from the heat sink to the surrounding air more quickly. The clamping assembly is set on the heat sink base and combined with the fixing assembly to firmly fix the heat sink assembly to the circuit board. Multiple reinforcement blocks are set at multiple first heat dissipation slots to provide additional support for the heat sink, allowing it to withstand greater external forces without changing shape, ensuring the structural integrity of the heat sink and maintaining its normal heat dissipation function.

[0011] In one of the embodiments, the clamping assembly comprises clamping side blocks and a clamping base, the number of the clamping side blocks is multiple, the multiple clamping side blocks are arranged on the radiator base, the clamping base is arranged on the multiple clamping side blocks, the multiple clamping side blocks and the clamping base cooperate to form the clamping groove, and the fixing assembly is arranged on the clamping base. By arranging multiple clamping side blocks on the radiator base and arranging the clamping base on the multiple clamping side blocks, the multiple clamping side blocks are distributed on the radiator base to apply fixing force from multiple sides. When the clamping base is installed on the clamping side blocks, the fixing assembly can firmly fix the radiator assembly at the installation position. Since the multiple clamping side blocks and the clamping base cooperate to form the clamping groove, the clamping groove provides a storage position for the fixing assembly. When the fixing assembly is placed in the clamping groove, its position is accurately positioned, avoiding the situation that the position of the fixing assembly deviates or the installation angle is inaccurate during installation, ensuring the stability of the overall structure of the radiator assembly and the normal play of the heat dissipation function. Because the inaccurate position of the fixing assembly may cause poor contact or insecure fixation of the radiator and the heat source.

[0012] In one of the embodiments, the first fixing strip comprises a pressing strip and a connecting strip, the pressing strip is arranged on the radiator assembly and located at the clamping groove, the number of the connecting strip is two, the two connecting strips are arranged at two ends of the pressing strip, and the two second fixing strips are arranged on the two connecting strips correspondingly. By arranging the pressing strip on the clamping groove of the radiator assembly, the pressing strip can directly press the radiator assembly. When the radiator assembly is installed, the pressing strip can tightly fix the radiator on the chip of the circuit board by applying pressure. This tight fixation can prevent the displacement of the radiator assembly due to factors such as vibration and shaking during equipment operation. The multiple connecting strips are arranged at the two ends of the pressing strip to form a more stable frame structure with the pressing strip. This frame structure can better withstand external pressure, vibration and other forces. During equipment operation, when the radiator assembly is subjected to vibration from the inside of the equipment or impact from the outside, the connecting strips can enhance the anti-deformation ability of the entire fixing structure to ensure that the fixing effect of the pressing strip on the radiator assembly will not be invalid due to these external forces. The multiple second fixing strips arranged on the multiple connecting strips play a role of connecting the fixing assembly to ensure the stable operation of the fixing assembly.

[0013] In one embodiment, the second fixing bar includes an extension bar and a turning bar. The extension bar is disposed on the first fixing bar and located at the first heat dissipation channel. The turning bar is disposed on the extension bar, and the third fixing bar is disposed on the turning bar. By disposing the extension bar on the first fixing bar and the first heat dissipation channel of the heat sink assembly, additional support is provided for the fixation of the heat sink assembly, sharing some of the force originally borne solely by the first fixing bar. When the device is subjected to vibration or external impact during operation, the extension bar can effectively resist these forces, reducing the shaking and displacement of the heat sink assembly, and making the heat sink assembly more securely mounted on the device. At the same time, the presence of the extension bar strengthens the connection between the first fixing bar and the heat sink assembly, forming a tighter whole. This integrity prevents local connection points from loosening or being damaged due to excessive force. By connecting the extension bar to the first fixing bar, force can be more evenly distributed between the two, avoiding stress concentration at a single connection point, thereby improving the reliability and durability of the entire fixing structure. Setting the turning bar on the extension bar and then setting the third fixing bar on the turning bar can firstly change the direction of the fixed structure to better adapt to the spatial environment inside the equipment and avoid interference with other components. Secondly, it also plays the role of connecting the third fixing bar to ensure the integrity of the fixed structure.

[0014] In one embodiment, the third fixing bar includes a transition bar and a hook bar, the transition bar is arranged on the second fixing bar, the hook bar is arranged on the transition bar, and the hook bar is used to position the heat sink assembly. By arranging the transition bar on the second fixing bar, it plays a role of connection and reinforcement. It can connect adjacent second fixing bars more tightly together to form a more stable overall structure. Arranging the hook bar on the transition bar provides a fixed point for the entire fixed structure, which is an important structure to ensure that the heat sink assembly can be close to the chip, prevent the heat sink assembly from detaching from the fixed position when subjected to external force, ensure that the heat sink assembly always remains in the correct position, and ensure the heat dissipation effect.

[0015] The second aspect of the present application discloses a circuit assembly, which includes: the above-mentioned clip-on heat sink; a circuit board assembly, on which the clip-on heat sink is arranged; a chip, which is clamped between the clip-on heat sink and the circuit board assembly; and an electronic component, which is arranged on the circuit board assembly.

[0016] The second aspect discloses a circuit assembly. By arranging a plurality of buckle type heat sinks on the circuit board assembly and clamping the chip between the circuit board assembly and the buckle type heat sink, direct contact between the chip and the heat sink is achieved. This close contact can greatly reduce the thermal resistance, so that heat can be more efficiently transferred from the chip to the buckle type heat sink, thereby effectively reducing the temperature of the chip and improving the efficiency of the entire heat dissipation system. At the same time, the buckle type heat sink clamps the chip, which provides physical protection for the chip. When the device is slightly shaken, the heat sink assembly can absorb and disperse these vibrations to prevent the chip from loosening its pins and damaging its internal structure due to the vibrations. By arranging a plurality of electronic components on the circuit board assembly, the buckle type heat sink can also provide some heat dissipation effect to ensure the normal operation of the entire circuit assembly and prolong the service life of the electronic device.

[0017] In one embodiment, the circuit board assembly includes a circuit board and a plurality of fixing rings arranged on the circuit board, and the buckle type heat sink is clamped on the fixing ring. By arranging a plurality of fixing rings on the circuit board and then arranging the buckle type heat sink on the fixing ring, the fixing ring first provides an accurate mounting position for the buckle type heat sink on the circuit board, avoiding the problem of poor contact with the chip due to inaccurate mounting position and ensuring the stability of the heat dissipation effect. At the same time, the plurality of fixing rings can restrict the movement of the buckle type heat sink from multiple directions. When the device is shaken, collided or jolted during transportation, the fixing ring can tightly fix the heat sink assembly to prevent it from moving, which is crucial to ensure good contact between the heat sink assembly and the chip. If the heat sink assembly moves, it may cause the heat conduction efficiency between the chip to decrease, thereby affecting the heat dissipation effect, and even possibly damaging the chip due to local overheating. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a perspective view of the buckle type heat sink;

[0019] Figure 2 is a first perspective view of the heat sink assembly;

[0020] Figure 3 is a second perspective view of the heat sink assembly;

[0021] Figure 4 is a first perspective view of the fixing assembly;

[0022] Figure 5 is a second perspective view of the fixing assembly;

[0023] Figure 6 is a third perspective view of the fixing assembly;

[0024] Figure 7 A perspective view of a circuit component.

[0025] The corresponding relationship between the reference numerals and component names is as follows:

[0026] 1 radiator assembly, 11 radiator base, 12 heat sink, 13 clamping assembly, 131 clamping side block, 132 clamping base, 14 reinforcement block, 101 first heat dissipation slot, 102 second heat dissipation slot, 103 card slot;

[0027] 2 fixing assembly, 21 first fixing bar, 211 pressing bar, 212 connecting bar, 22 second fixing bar, 221 extension bar, 222 turning bar, 23 third fixing bar, 231 transition bar, 232 hook bar;

[0028] 3 circuit board assembly, 31 circuit board, 32 fixing ring;

[0029] 4 chips;

[0030] 5. Electronic components. DETAILED DESCRIPTION

[0031] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0032] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0033] The following describes the clip-on heat sink and circuit assembly according to some embodiments of the present invention with reference to the accompanying drawings.

[0034] Example 1

[0035] like Figures 1 to 6As shown, this embodiment discloses a clip-on heat sink, including: a heat sink assembly 1, the heat sink assembly 1 is provided with a first heat dissipation groove 101, a second heat dissipation groove 102 and a card slot 103, the first heat dissipation groove 101 and the second heat dissipation groove 102 intersect and are connected; a fixing assembly 2, the fixing assembly 2 is arranged on the heat sink assembly 1 and is located at the card slot 103; the fixing assembly 2 includes a first fixing bar 21, a second fixing bar 22 and a third fixing bar 23, the first fixing bar 21 is arranged on the heat sink assembly 1 and is located at the card slot 103, the number of the second fixing bars 22 is two, the two second fixing bars 22 are arranged at both ends of the first fixing bar 21, the number of the third fixing bars 23 is two, and the two third fixing bars 23 are respectively arranged on the two second fixing bars 22.

[0036] The present application discloses a snap-on heat sink. A first heat dissipation slot 101 and a second heat dissipation slot 102 are provided on the heat sink assembly 1, which help to dissipate heat more evenly throughout the heat sink assembly. In the absence of slots, heat tends to accumulate in a local area near the heat source, causing the temperature in that area to be too high while the temperature in other parts is lower. The slots can guide heat from high-temperature areas to low-temperature areas, making the temperature gradient of the entire heat sink more gentle. If the temperature distribution is uneven, some parts of the heat sink may be damaged due to prolonged exposure to excessively high temperatures, or material fatigue may occur due to excessive local thermal stress. By providing different heat dissipation slots, these problems can be avoided and the service life of the heat sink can be extended. Moreover, when the first heat dissipation slot 101 and the second heat dissipation slot 102 are connected, the air flow path is expanded and optimized. After the hot air rises in one slot due to heating, it can smoothly enter the other slot through the connecting portion. This continuous channel allows the air to form a more complete convection cycle within the heat sink assembly. The fixing component 2 is arranged on the radiator assembly 1 and is located at the card slot 103, so that the fixing component can be accurately installed at the required position of the radiator assembly 1, ensuring the stability of the overall structure of the clip-on radiator. At the same time, the cooperation between the fixing component 2 and the card slot 103 can effectively prevent the radiator from being displaced during use, and avoid the failure or poor heat dissipation function of the radiator assembly 1 for the chip. The fixing component 2 reduces the complexity of the operation when installing the radiator assembly 1, making the entire installation process simpler and faster. By arranging the first fixing bar 21 on the card slot 103 of the radiator assembly 1, the card slot provides a specific installation position for the first fixing bar, so that the first fixing bar can fit tightly against the radiator assembly 1, preventing the radiator assembly 1 from being displaced or shaking during the operation of the device. At the same time, the card slot 103 provides a clear installation position for the first fixing bar 21, making the installation process simpler and more accurate. Arranging multiple second fixing bars 22 on the first fixing bar 21 creates a multi-layered fixing structure, supplementing the first fixing bar 21's ability to secure the heat sink assembly 1. This multi-layered arrangement further stabilizes the fixing structure. When the heat sink assembly 1 is subjected to external forces, such as vibration, collision, or stress caused by thermal expansion and contraction, this multi-layered reinforcement system can better withstand these forces, preventing loosening or displacement of the heat sink assembly 1. Arranging a third fixing bar 23 on the second fixing bar 22 secures the entire fixing structure 2 to the circuit board, while also securing the heat sink assembly 1 in a predetermined position to dissipate heat from the chip, ultimately achieving the desired heat dissipation goal.

[0037] like Figure 1As shown, in addition to the features of the above-mentioned embodiment, this embodiment further defines that: the number of fixing components 2 is one or more. By setting the fixing components 2 to one or more, it can be flexibly configured according to the actual situation of the radiator assembly 1 to ensure a close fit with the installation surface or other components. When there are multiple fixing components 2, the fixing force on the radiator assembly 1 can be evenly distributed on these components. During the operation of the radiator, it may be subject to vibrations from the equipment itself, external impacts, or stresses caused by thermal expansion and contraction. Multiple fixing components 2 are like multiple support points, dispersing these forces to prevent the radiator from being subjected to excessive force at a certain point and causing deformation, loosening, or damage.

[0038] like Figure 1 As shown, in addition to the features of the above-mentioned embodiment, this embodiment further defines that: the fixing directions of the fixing components 2 are the same or different. By setting the fixing directions of the fixing components 2 to be the same or different, the same fixing directions help to form a unified force pattern during the fixing process of the radiator assembly 1, so that the forces applied by each fixing component 2 to the radiator are consistent in direction. Setting different fixing directions can achieve all-round fixation of the radiator assembly 1. The radiator may be subjected to forces from various directions during operation, such as vibrations in different directions, stresses caused by thermal expansion and contraction, etc. By making the fixing directions of the fixing components 2 different, the radiator assembly 1 can be fixed from multiple angles, effectively limiting the displacement and deformation of the radiator assembly 1 in various directions.

[0039] like Figure 1 and Figure 2 As shown, in addition to the features of the above-mentioned embodiment, this embodiment further defines that: the number of the first heat dissipation grooves 101 is multiple. By providing multiple first heat dissipation grooves 101, the surface area of ​​the heat sink in contact with the air can be greatly increased. The larger the heat dissipation area, the more heat is conducted per unit time, thus avoiding the phenomenon of thermal stress concentration. When there are multiple grooves, the air can fully contact these numerous surfaces, so that heat can be transferred from the heat sink to the air more efficiently. At the same time, multiple first heat dissipation grooves 101 can optimize the air flow path, forming a more complex and efficient heat convection system. The hot air rises in the grooves, and the surrounding cold air will be continuously replenished. As the number of grooves increases, the air flow channels increase, the speed and efficiency of heat convection will increase, and the efficiency of heat dissipation will be improved.

[0040] like Figure 1 and Figure 2As shown, in addition to the features of the above-mentioned embodiment, this embodiment further defines that: the number of the second heat dissipation grooves 102 is multiple. By providing multiple second heat dissipation grooves 102, the surface area of ​​the heat sink in contact with the air can be greatly increased. The larger the heat dissipation area, the more heat is conducted per unit time, thus avoiding the phenomenon of thermal stress concentration. When there are multiple grooves, the air can fully contact these numerous surfaces, so that heat can be transferred from the heat sink to the air more efficiently. At the same time, multiple second heat dissipation grooves 102 can optimize the air flow path, forming a more complex and efficient heat convection system. The hot air rises in the grooves, and the surrounding cold air will be continuously replenished. As the number of grooves increases, the air flow channels increase, the speed and efficiency of heat convection will increase, and the efficiency of heat dissipation will be improved.

[0041] like Figure 1 and Figure 2As shown, in addition to the features of the above embodiments, this embodiment further defines: the radiator assembly 1 includes a radiator base 11, heat sinks 12, a clamping assembly 13 and a reinforcement block 14, the number of heat sinks 12 is multiple, and the multiple heat sinks 12 are respectively arranged at intervals along the length direction and the width direction of the radiator base 11, a first heat dissipation groove 101 is formed between the heat sinks 12 adjacent to each other along the length direction, and a second heat dissipation groove 102 is formed between the heat sinks 12 adjacent to each other along the width direction, the clamping assembly 13 is arranged on the radiator base 11, and the clamping assembly 13 is arranged opposite to the multiple heat sinks 12, the number of reinforcement blocks 14 is multiple, and the multiple reinforcement blocks 14 are arranged between the multiple heat sinks 12 and located at the multiple first heat dissipation grooves 101. By arranging multiple heat sinks 12 at intervals along the length and width of the heat sink base 11, and forming first heat dissipation slots 101 and second heat dissipation slots 102 between adjacent heat sinks 12, this structural arrangement can effectively expand the heat dissipation area. When the heat source conducts heat to the radiator base 11, the heat sink 12 can quickly conduct the heat away from the base. This is because the distribution of the heat sink 12 allows heat to be conducted simultaneously in the length and width directions, greatly increasing the heat conduction rate compared to a single-direction conduction path. Secondly, the first heat dissipation slots 101 and second heat dissipation slots 102 formed between adjacent heat sinks 12 create good conditions for air flow. After the hot air is heated by the heat sink 12, it will rise due to its reduced density, and cold air will be replenished from the bottom of the slots, forming natural convection. Since the heat sink 12 is arranged at intervals in two directions, the distribution of the slots is also more uniform and regular, which allows the air to form a stable and efficient convection cycle inside the radiator. This convection circulation allows air to fully contact the surface of the heat sink 12, removing more heat. Furthermore, the slots at different locations can guide the air to flow in a complex manner within the heat sink 12, further enhancing the effect of thermal convection and allowing heat to be transferred from the heat sink to the surrounding air more quickly. The clamping assembly 13 is disposed on the heat sink base 11, and combined with the fixing assembly 2, the heat sink assembly 1 can be securely fixed to the circuit board. Multiple reinforcement blocks 14 are disposed at multiple first heat dissipation slots 101 to provide additional support for the heat sink 12, enabling it to withstand greater external forces without changing shape, thereby ensuring the structural integrity of the heat sink 12 and maintaining its normal heat dissipation function.

[0042] like Figure 2 and Figure 3As shown, in addition to the features of the above embodiment, this embodiment further defines that: the clamping assembly 13 includes a clamping side block 131 and a clamping base 132, the number of the clamping side blocks 131 is multiple, the multiple clamping side blocks 131 are arranged on the radiator base 11, the clamping base 132 is arranged on the multiple clamping side blocks 131, the multiple clamping side blocks 131 and the clamping base 132 cooperate to form a clamping groove 103, and the fixing assembly 2 is arranged on the clamping base 132. By arranging the multiple clamping side blocks 131 on the radiator base 11 and then arranging the clamping base 132 on the multiple clamping side blocks 131, the multiple clamping side blocks 131 are distributed on the radiator base 11, and fixing forces are applied from multiple sides. When the clamping base 132 is installed on these clamping side blocks 131, combined with the fixing assembly 2, the radiator assembly 1 can be firmly fixed in the installation position. Since multiple clamping side blocks 131 and clamping base 132 cooperate to form a card slot 103, the card slot 103 provides a storage location for the fixed component 2. When the fixed component 2 is placed in the card slot 103, its position is precisely positioned, avoiding the position offset or inaccurate installation angle of the fixed component 2 during the installation process, ensuring the stability of the overall structure of the radiator assembly 1 and the normal performance of the heat dissipation function, because inaccurate position of the fixed component 2 may cause poor contact between the radiator and the heat source or loose fixation.

[0043] like Figure 1 and Figure 4 As shown, in addition to the features of the above-mentioned embodiment, this embodiment further defines that: the first fixing bar 21 includes a clamping bar 211 and a connecting bar 212, the clamping bar 211 is arranged on the radiator assembly 1 and is located at the card slot 103, the number of the connecting bars 212 is two, the two connecting bars 212 are respectively arranged at both ends of the clamping bar 211, and the two second fixing bars 22 are correspondingly arranged on the two connecting bars 212. By setting the clamping bar 211 on the card slot 103 on the radiator assembly 1, the radiator assembly 1 can be directly clamped. When the radiator assembly 1 is installed, the clamping bar 211 can tightly fix the radiator to the chip of the circuit board by applying pressure. This tight fixation can prevent the radiator assembly 1 from being displaced due to vibration, shaking and other factors during the operation of the equipment. Multiple connecting bars 212 are arranged at both ends of the compression bar 211, and together with the compression bar 211, they form a more stable frame structure. This frame structure can better withstand external pressure, vibration and other forces. During the operation of the device, when the radiator assembly 1 is subjected to vibration from within the device or external impact, the connecting bars 212 can enhance the deformation resistance of the entire fixed structure 2, ensuring that the fixing effect of the compression bar 211 on the radiator assembly 1 will not fail due to these external forces. The multiple second fixing bars 22 are arranged on the multiple connecting bars 212, which plays a connecting role for the fixed assembly 2 and ensures the stable operation of the fixed assembly 2.

[0044] like Figure 1 and Figure 5 As shown, in addition to the features of the above-mentioned embodiment, this embodiment further defines that the second fixing bar 22 includes an extension bar 221 and a turning bar 222. The extension bar 221 is disposed on the first fixing bar 21 and located at the first heat dissipation groove 101. The turning bar 222 is disposed on the extension bar 221. The third fixing bar 23 is disposed on the turning bar 222. By disposing the extension bar 221 on the first fixing bar 21 and the first heat dissipation groove 101 of the heat sink assembly 1, additional support is provided for the fixation of the heat sink assembly 1, sharing some of the force originally borne solely by the first fixing bar 21. When the device vibrates during operation or is subjected to external impact, the extension bar 221 can effectively resist these forces, reducing the shaking and displacement of the heat sink assembly 1, and making the heat sink assembly 1 more firmly mounted on the device. At the same time, the presence of the extension bar 221 strengthens the connection between the first fixing bar 21 and the heat sink assembly 1, forming a more compact whole. This integrity prevents local connection points from loosening or being damaged due to excessive force. By connecting the extension bar 221 to the first fixing bar 21, force is more evenly distributed between the two, avoiding stress concentration at a single connection point, thereby improving the reliability and durability of the entire fixing structure 2. Positioning the transition bar 222 on the extension bar 221 and the third fixing bar 23 on the transition bar 222 not only changes the orientation of the fixing structure 2, better adapting to the spatial environment within the device and avoiding interference with other components, but also serves to connect the third fixing bar 23, ensuring the integrity of the fixing structure 2.

[0045] like Figure 1 and Figure 6 As shown, in addition to the features of the above-mentioned embodiment, this embodiment further defines that: the third fixing bar 23 includes a transition bar 231 and a hook bar 232, the transition bar 231 is arranged on the second fixing bar 22, the hook bar 232 is arranged on the transition bar 231, and the hook bar 232 is used to position the heat sink assembly 1. By arranging the transition bar 231 on the second fixing bar 22, it plays a role of connection and reinforcement. It can connect the adjacent second fixing bars 22 more tightly together to form a more stable overall structure. Arranging the hook bar 232 on the transition bar 231 provides a fixed point for the entire fixed structure 2, which is an important structure to ensure that the heat sink assembly 1 can be close to the chip, prevent the heat sink assembly 1 from detaching from the fixed position when subjected to external force, ensure that the heat sink assembly 1 always remains in the correct position, and ensure the heat dissipation effect.

[0046] Example 2

[0047] like Figures 1 to 7As shown, this embodiment discloses a circuit assembly, including: the above-mentioned clip-on heat sink; a circuit board assembly 3, the clip-on heat sink is arranged on the circuit board assembly 3; a chip 4, the chip 4 is clamped between the clip-on heat sink and the circuit board assembly 3; and an electronic component 5, the electronic component 5 is arranged on the circuit board assembly 3.

[0048] The second aspect of the present application discloses a circuit assembly. By setting a plurality of clip-on heat sinks on the circuit board assembly 3 and clamping the chip 4 between the circuit board assembly 3 and the clip-on heat sink, direct contact between the chip and the heat sink is achieved. This close contact method can greatly reduce thermal resistance, so that heat can be transferred from the chip to the clip-on heat sink more efficiently, thereby effectively reducing the temperature of the chip and improving the efficiency of the entire heat dissipation system. At the same time, the clip-on heat sink clamps the chip 4, which plays a certain physical protection role for the chip 4. When the device is subjected to slight vibration, the heat sink assembly 1 can absorb and disperse these vibrations, preventing the chip 4 from having loose pins or damage to the internal structure of the chip 4 due to vibration. When multiple electronic components 5 are set on the circuit board assembly 3, the clip-on heat sink can also play a certain heat dissipation role for them, ensuring the normal operation of the entire circuit assembly and extending the service life of the electronic device.

[0049] like Figure 1 and Figure 7 As shown, in addition to the features of the above-described embodiment, this embodiment further defines that the circuit board assembly 3 includes a circuit board 31 and a fixing ring 32. There are multiple fixing rings 32, each of which is disposed on the circuit board 31, and the clip-on heat sink is clipped onto the fixing rings 32. By disposing multiple fixing rings 32 on the circuit board 31 and then placing the clip-on heat sink on the fixing rings 32, the fixing rings 32 provide a precise mounting position for the clip-on heat sink on the circuit board 31, avoiding poor contact with the chip 4 due to inaccurate mounting positions and ensuring stable heat dissipation. Furthermore, the multiple fixing rings 32 can restrict the movement of the clip-on heat sink in multiple directions. When the device is subjected to vibration, collision, or bumps during transportation, the fixing rings 32 can firmly secure the heat sink assembly 1 and prevent it from displacement, which is crucial for ensuring good contact between the heat sink assembly 1 and the chip 4. Displacement of the heat sink assembly 1 can reduce the heat conduction efficiency between the heat sink assembly 1 and the chip 4, thereby affecting the heat dissipation effect and even potentially damaging the chip due to local overheating.

[0050] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A snap-on heat sink, characterized in that: The snap-on heat sink comprises: A radiator assembly (1), the radiator assembly (1) being provided with a first heat dissipation slot (101), a second heat dissipation slot (102) and a clamping slot (103), wherein the first heat dissipation slot (101) and the second heat dissipation slot (102) intersect and communicate with each other; A fixing assembly (2), the fixing assembly (2) being arranged on the radiator assembly (1) and located at the card slot (103); The fixing assembly (2) comprises a first fixing bar (21), a second fixing bar (22) and a third fixing bar (23); the first fixing bar (21) is arranged on the radiator assembly (1) and located at the card slot (103); the number of the second fixing bars (22) is two, and the two second fixing bars (22) are arranged at both ends of the first fixing bar (21); the number of the third fixing bars (23) is two, and the two third fixing bars (23) are respectively arranged on the two second fixing bars (22).

2. The clip-on heat sink according to claim 1, characterized in that: The number of the fixing components (2) is one or more; And / or the fixing directions of the fixing components (2) are the same or different.

3. The clip-on heat sink according to claim 1, characterized in that: The number of the first heat dissipation slots (101) is multiple; And / or the number of the second heat dissipation slots (102) is plural.

4. The clip-on heat sink according to claim 1, characterized in that: The radiator assembly (1) comprises a radiator base (11), a heat sink (12), a clamping assembly (13) and a reinforcement block (14); the number of the heat sink (12) is multiple, and the multiple heat sinks (12) are spaced apart along the length direction and the width direction of the radiator base (11); the first heat dissipation slots (101) are formed between the adjacent heat sinks (12) along the length direction, and the second heat dissipation slots (102) are formed between the adjacent heat sinks (12) along the width direction; the clamping assembly (13) is arranged on the radiator base (11), and the clamping assembly (13) is arranged opposite to the multiple heat sinks (12); the number of the reinforcement blocks (14) is multiple, and the multiple reinforcement blocks (14) are arranged between the multiple heat sinks (12) and located at the multiple first heat dissipation slots (101).

5. The clip-on heat sink according to claim 4, characterized in that: The clamping assembly (13) includes a clamping side block (131) and a clamping base (132). The number of the clamping side blocks (131) is multiple, and the multiple clamping side blocks (131) are arranged on the radiator base (11). The clamping base (132) is arranged on the multiple clamping side blocks (131). The multiple clamping side blocks (131) and the clamping base (132) cooperate to form the clamping slot (103), and the fixing assembly (2) is arranged on the clamping base (132).

6. The clip-on heat sink according to claim 5, characterized in that: The first fixing strip (21) comprises a pressing strip (211) and a connecting strip (212); the pressing strip (211) is arranged on the radiator assembly (1) and located at the slot (103); there are two connecting strips (212); the two connecting strips (212) are respectively arranged at both ends of the pressing strip (211); and the two second fixing strips (22) are correspondingly arranged on the two connecting strips (212).

7. The clip-on heat sink according to claim 5, characterized in that: The second fixing bar (22) comprises an extension bar (221) and a turning bar (222); the extension bar (221) is arranged on the first fixing bar (21) and located at the first heat dissipation groove (101); the turning bar (222) is arranged on the extension bar (221); and the third fixing bar (23) is arranged on the turning bar (222).

8. The clip-on heat sink according to claim 5, characterized in that: The third fixing bar (23) comprises a transition bar (231) and a hook bar (232), wherein the transition bar (231) is arranged on the second fixing bar (22), and the hook bar (232) is arranged on the transition bar (231), and the hook bar (232) is used to position the radiator assembly (1).

9. A circuit assembly, characterized in that: The circuit assembly includes: The clip-on heat sink according to any one of claims 1 to 8; A circuit board assembly (3), wherein the clip-on heat sink is arranged on the circuit board assembly (3); A chip (4), the chip (4) being clamped between the clip-on heat sink and the circuit board assembly (3); An electronic component (5), wherein the electronic component (5) is arranged on the circuit board assembly (3).

10. The circuit assembly according to claim 9, wherein: The circuit board assembly (3) comprises a circuit board (31) and a fixing ring (32). The fixing rings (32) are multiple in number and are arranged on the circuit board (31). The clip-on heat sink is clipped onto the fixing rings (32).

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