High-speed high-frequency copper-clad plate

Abstract

The utility model relates to the technical field of copper-clad plates, in particular to a high-speed high-frequency copper-clad plate, which comprises a base material layer, a copper foil layer is coated on the surface of the top end of the base material layer, a plurality of groups of ceramic radiating strips attached to the copper foil layer are adhered on the surface of the top end of the base material layer, and ceramic radiating fins are assembled on the surface of the bottom end of the base material layer. Graphite heat conduction strips used for conducting heat are assembled between the ceramic cooling fins and the ceramic cooling strips, and a plurality of groups of graphite heat conduction strips are arranged; when the high-speed and high-frequency copper-clad plate is used, the plurality of groups of ceramic radiating fins between the base material layer and the copper foil layer can conduct heat generated during operation of the copper foil layer, and the heat can be conducted to the ceramic radiating fins at the bottom of the base material layer through the graphite heat conduction strips, so that the heat is volatilized by utilizing the ceramic radiating fins, and the service life of the high-speed and high-frequency copper-clad plate is prolonged. Therefore, the copper-clad plate can be used more stably subsequently.

Description

Technical Field

[0001] The utility model relates to the technical field of copper clad laminates, in particular to a high-speed and high-frequency copper clad laminate. Background Art

[0002] Compared with 1G-4G communication technology, 5G communication equipment has a higher frequency and faster transmission speed, which puts forward higher and more stringent requirements on the technical indicators such as dielectric constant and dielectric loss factor of the electronic materials used in the equipment. Traditional epoxy-based copper clad laminates and polyimide-based copper clad laminates cannot meet the electrical performance requirements necessary for 5G high-frequency communication. Liquid crystal polymer (LCP) polymer materials have extremely low dielectric constant and dielectric loss factor, and have the characteristics of low moisture absorption, good chemical resistance, and high gas barrier properties, making them the most suitable materials for production in the 5G era. The most important basic material of copper clad laminates; Patent No. CN202222895858.1 discloses a high-frequency, high-speed LCP copper clad laminate. The protrusion begins to melt when heated. When it melts to the top of the recessed part, the protrusion is completely melted. At this time, hot pressing is continued until the plane of the LCP substrate layer begins to melt when heated, which ensures that the melted protrusion is completely filled into the recessed part. However, when using high-frequency copper clad laminates, the copper foil generates a certain amount of heat during the conduction process, and this heat will be transferred to the plastic substrate layer. The plastic substrate layer has poor heat dissipation effect, which causes heat to easily accumulate around the copper clad laminate. To this end, we propose a high-speed, high-frequency copper clad laminate. Utility Model Content

[0003] In view of the problems in the prior art, the utility model provides a high-speed and high-frequency copper clad laminate.

[0004] The technical solution adopted by the utility model to solve its technical problems is a high-speed and high-frequency copper-clad laminate, comprising a substrate layer, the top surface of the substrate layer being coated with a copper foil layer, and the top surface of the substrate layer being bonded with a ceramic heat dissipation strip in contact with the copper foil layer, and the ceramic heat dissipation strips are in multiple groups, the bottom surface of the substrate layer is equipped with a ceramic heat sink, and the ceramic heat sinks are in multiple groups, and graphite heat conduction strips for heat conduction are arranged between the ceramic heat sink and the ceramic heat dissipation strips, and the graphite heat conduction strips are in multiple groups;

[0005] The outer surface of the ceramic heat dissipation strip is provided with square holes, and there are multiple groups of square holes. Aluminum bars for improving strength are installed between the multiple groups of square holes.

[0006] By adopting the above technical solution, when using high-speed and high-frequency copper-clad laminates, the multiple sets of ceramic heat sinks between the substrate layer and the copper foil layer can conduct the heat generated by the operation of the copper foil layer itself, and can conduct it to the ceramic heat sink at the bottom of the substrate layer through the graphite heat conducting strips, thereby using the ceramic heat sink to evaporate the heat, thereby making the copper-clad laminate more stable in subsequent use;

[0007] When the ceramic heat dissipation strips are in operation, the aluminum bars between the multiple groups of ceramic heat dissipation strips can be conveniently plugged into the square holes and can span between the multiple groups of ceramic heat dissipation strips, thereby facilitating the heat conduction between the ceramic heat dissipation strips, and can improve the strength of the substrate layer and the strength of the copper clad laminate, so that the copper clad laminate can be used more stably.

[0008] Specifically, the top surface of the ceramic heat dissipation strip is provided with a plurality of clamping holes, and rubber blocks for preventing slipping are clamped in the clamping holes.

[0009] By adopting the above technical solution, the rubber block can be easily connected with the card hole on the top of the ceramic heat dissipation strip, so as to provide support and protection when the copper foil layer is wrapped on the surface of the substrate layer and provide certain anti-slip performance, so that the copper foil layer can be more stably wrapped on the surface of the substrate layer, making it convenient to use.

[0010] Specifically, straight holes are opened on the periphery of the ceramic heat dissipation strip.

[0011] By adopting the above technical solution, the straight holes on the periphery of the ceramic heat dissipation strip facilitate improving the stability of the connection between the substrate layer and the ceramic heat dissipation strip, so that the ceramic heat dissipation strip can conduct heat more stably.

[0012] Specifically, the top surface of the copper foil layer is coated with a ceramic wear-resistant layer for protection, and the top surface of the ceramic wear-resistant layer is bonded with a protective film layer.

[0013] By adopting the above technical solution, the ceramic wear-resistant layer has good wear resistance, which enables the copper foil layer to operate more stably and reduces the scratches and damage caused by friction when the copper foil layer is coated. At the same time, the protective film layer is easy to disassemble, which facilitates further improving the stability of the copper foil layer when it is coated on the surface of the substrate layer.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. The technical solution of this application adopts the design of copper foil layer, ceramic heat sink, graphite thermal conductive strip and ceramic heat sink. When high-speed and high-frequency copper clad laminate is used, multiple groups of ceramic heat sinks between the substrate layer and the copper foil layer can conduct the heat of the copper foil layer itself during operation, and can conduct it to the ceramic heat sink at the bottom of the substrate layer through the graphite thermal conductive strip, so that the ceramic heat sink can evaporate the heat, so that the copper clad laminate can be used more stably in the future.

[0016] 2. The technical solution of the present application is designed with square holes and aluminum bars. When the ceramic heat dissipation strips are in operation, the aluminum bars between multiple groups of ceramic heat dissipation strips can be conveniently plugged into the square holes and can span between multiple groups of ceramic heat dissipation strips, thereby facilitating the conduction of heat between the ceramic heat dissipation strips, and can improve the strength of the substrate layer and the strength of the copper clad laminate, so that the copper clad laminate can be used more stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is an axonometric drawing of the present utility model;

[0019] Figure 2 It is a schematic plan view of the overall structure of the utility model;

[0020] Figure 3 This is an exploded view of the connection structure between the substrate layer and the copper foil layer of the present invention;

[0021] In the figure: 1. Base material layer; 2. Copper foil layer; 3. Ceramic heat dissipation strip; 4. Graphite heat conductive strip; 5. Ceramic heat sink; 6. Straight hole; 7. Square hole; 8. Aluminum bar; 9. Clamp hole; 10. Rubber block; 11. Ceramic wear-resistant layer; 12. Protective film layer. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0023] See also Figure 1-3 The embodiment of the utility model provides a technical solution: a high-speed and high-frequency copper clad laminate, comprising a substrate layer 1, the top surface of the substrate layer 1 is covered with a copper foil layer 2, and the top surface of the substrate layer 1 is bonded with a ceramic heat dissipation bar 3 in contact with the copper foil layer 2, and there are multiple groups of ceramic heat dissipation bars 3, the bottom surface of the substrate layer 1 is equipped with a ceramic heat sink 5, and there are multiple groups of ceramic heat sinks 5, and graphite heat conduction bars 4 for heat conduction are equipped between the ceramic heat sink 5 and the ceramic heat dissipation bars 3, and there are multiple groups of graphite heat conduction bars 4; the outer peripheral surface of the ceramic heat dissipation bar 3 is opened with square holes 7, and there are multiple groups of square holes 7, and aluminum bars 8 for improving strength are equipped between the multiple groups of square holes 7.

[0024] During use, when the high-speed and high-frequency copper clad laminate is used, the multiple groups of ceramic heat sinks 5 between the substrate layer 1 and the copper foil layer 2 can conduct the heat of the copper foil layer 2 itself during operation, and can conduct it to the ceramic heat sink 5 at the bottom of the substrate layer 1 through the graphite thermal conductive strips 4, so that the ceramic heat sink 5 can evaporate the heat, so that the copper clad laminate can be used more stably in the future; when the ceramic heat sink 3 is in operation, the aluminum bars 8 between the multiple groups of ceramic heat sinks 3 are conveniently plugged into the square holes 7, and can span between the multiple groups of ceramic heat sinks 3, which is convenient for conducting heat between the ceramic heat sinks 3, and can improve the strength of the substrate layer 1, and the strength of the copper clad laminate is improved, so that the copper clad laminate can be used more stably.

[0025] like Figure 2 and Figure 3 As shown, the top surface of the ceramic heat dissipation strip 3 is provided with a clamping hole 9 , and there are multiple groups of clamping holes 9 , and rubber blocks 10 for anti-slip are clamped in the clamping holes 9 .

[0026] When in use, the rubber block 10 is easily engaged with the card hole 9 on the top of the ceramic heat dissipation strip 3, so as to provide support and protection when the copper foil layer 2 is wrapped on the surface of the substrate layer 1 and provide certain anti-slip performance, so that the copper foil layer 2 can be more stably wrapped on the surface of the substrate layer 1, making it convenient to use.

[0027] like Figure 1 、 Figure 2 and Figure 3 As shown, a straight hole 6 is opened on the outer periphery of the ceramic heat dissipation strip 3 .

[0028] When in use, the straight holes 6 on the periphery of the ceramic heat dissipation bar 3 facilitate improving the stability of the connection between the substrate layer 1 and the ceramic heat dissipation bar 3, so that the ceramic heat dissipation bar 3 can conduct heat more stably.

[0029] like Figure 1 、 Figure 2 and Figure 3 As shown, the top surface of the copper foil layer 2 is coated with a ceramic wear-resistant layer 11 for protection, and the top surface of the ceramic wear-resistant layer 11 is bonded with a protective film layer 12.

[0030] During use, the ceramic wear-resistant layer 11 has good wear resistance, which enables the copper foil layer 2 to operate more stably and reduces the possibility of scratches and damage caused by friction when the copper foil layer 2 is coated. At the same time, the protective film layer 12 is easy to disassemble, which facilitates further improving the stability of the copper foil layer 2 when it is coated on the surface of the substrate layer 1.

[0031] The working principle and usage process of the present invention are as follows: when in use, first install the corresponding structural components in the appropriate position. When using the high-speed and high-frequency copper clad laminate, the multiple groups of ceramic heat sinks 5 between the substrate layer 1 and the copper foil layer 2 can conduct the heat of the copper foil layer 2 itself during operation, and can conduct it to the ceramic heat sink 5 at the bottom of the substrate layer 1 through the graphite thermal conductive strips 4, so that the ceramic heat sink 5 is used to evaporate the heat, so that the copper clad laminate can be used more stably in the future. When the ceramic heat sink 3 is in operation, the aluminum bars 8 between the multiple groups of ceramic heat sinks 3 are conveniently plugged into the square holes 7, and can span between the multiple groups of ceramic heat sinks 3, which is convenient for conducting heat between the ceramic heat sinks 3, and can improve the strength of the substrate layer 1, and the strength of the copper clad laminate is improved, so that the copper clad laminate can be used more stably.

[0032] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-speed and high-frequency copper-clad laminate, characterized in that: The invention comprises a substrate layer (1), wherein the top surface of the substrate layer (1) is coated with a copper foil layer (2), and the top surface of the substrate layer (1) is bonded with a ceramic heat dissipation strip (3) in contact with the copper foil layer (2), and the ceramic heat dissipation strip (3) is provided in multiple groups, and the bottom surface of the substrate layer (1) is provided with a ceramic heat dissipation fin (5), and the ceramic heat dissipation fin (5) is provided in multiple groups, and a graphite heat conduction strip (4) for heat conduction is provided between the ceramic heat dissipation fin (5) and the ceramic heat dissipation strip (3), and the graphite heat conduction strip (4) is provided in multiple groups; The outer peripheral surface of the ceramic heat dissipation strip (3) is provided with square holes (7), and there are multiple groups of square holes (7). Aluminum bars (8) for increasing strength are installed between the multiple groups of square holes (7).

2. The high-speed and high-frequency copper-clad laminate according to claim 1, characterized in that: The top surface of the ceramic heat dissipation strip (3) is provided with a clamping hole (9), and there are multiple groups of clamping holes (9). A rubber block (10) for anti-slip is clamped in the clamping hole (9).

3. The high-speed and high-frequency copper-clad laminate according to claim 1, characterized in that: The outer periphery of the ceramic heat dissipation strip (3) is provided with a straight hole (6).

4. The high-speed and high-frequency copper-clad laminate according to claim 1, characterized in that: The top surface of the copper foil layer (2) is coated with a ceramic wear-resistant layer (11) for protection, and the top surface of the ceramic wear-resistant layer (11) is bonded with a protective film layer (12).

Images