Etching equipment and transparent electrode
By adjusting the height of the adjustment bracket of the etching equipment and using sensing components on the transparent electrode, the problem of uneven line width caused by the etching equipment is solved, and the uniformity and performance of the conductive line are improved.
Patent Information
- Application Number
- CN202422582067.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-10-24
AI Technical Summary
Existing etching equipment is prone to uneven line width when etching on transparent electrodes, resulting in reduced overall material aesthetics and decreased performance stability.
An etching device was designed. By adjusting the height of the adjustment bracket at different positions of the transparent electrode, the actual height between the etching component and the transparent electrode reached the target height. Precise adjustment was performed through the sensing component to reduce the influence of the pool effect on line width unevenness.
It effectively improves the line width uniformity of the conductive lines on the transparent electrode, and enhances the aesthetics and performance stability of the material.
Smart Images
Figure CN223428645U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of etching equipment, in particular to an etching device and a transparent electrode. Background Art
[0002] In the fields of PCB (Printed Circuit Board), FPC (Flexible Printed Circuit), touch screen (eg, transparent electrode), semiconductor, etc., etching equipment is required to print circuits.
[0003] When developing / etching circuits in a yellow light process / wet process, conventional etching equipment is prone to produce a pool effect, resulting in the circuit etched at the edge of the material (e.g., the edge of the transparent electrode) having a thinner line width than the circuit etched in the center of the material (e.g., the center of the transparent electrode). This causes the circuit on the entire material (e.g., the transparent electrode) to have an uneven line width defect.
[0004] In other words, areas where the lines are thicker appear darker, while areas where the lines are thinner appear lighter. As a result, uneven line widths can cause color differences and shadows in the overall material (e.g., a transparent electrode), thereby reducing the aesthetics of the overall material (e.g., a transparent electrode).
[0005] The above situation is particularly prominent when making transparent electrodes; in addition, uneven line width will also lead to different resistance values in different areas, which can easily reduce the performance stability of devices made with transparent electrodes. Utility Model Content
[0006] The etching equipment and transparent electrode provided by the utility model aim to solve the defect of uneven line width of the circuits etched on the transparent electrode by the existing etching equipment.
[0007] In a first aspect, the present invention provides an etching device. The etching device is used to etch N conductive lines to a transparent electrode; the etching device comprises:
[0008] Equipment body;
[0009] N adjustment brackets extending along a first direction; the N adjustment brackets are assembled on at least a portion of the device body and arranged at a preset target spacing along a second direction;
[0010] N groups of etching components; each group of etching components is disposed on one of the adjustment brackets, and each group of etching components has a target height with the transparent electrode;
[0011] N groups of sensing components; each group of the sensing components is disposed on one of the adjustment brackets, and each group of the sensing components can detect an actual height between each group of the etching components and the transparent electrode;
[0012] A portion of the device body can independently control each of the adjustment brackets to move along the third direction so that each of the actual heights can reach the corresponding target height;
[0013] Wherein, N is greater than 1 and is a positive integer; the first direction, the second direction and the third direction are orthogonal to each other, and the third direction is perpendicular to the surface of the transparent electrode on which the N conductive lines are etched.
[0014] In some embodiments, each adjustment bracket is in a straight line shape, and each set of the sensing components consists of at least one distance sensor;
[0015] Each group of etching components is composed of at least two nozzles, and the axis direction of each nozzle is parallel to the third direction.
[0016] In some embodiments, the device body includes:
[0017] Rack; N of the adjustment brackets are assembled on the rack;
[0018] The loading platform is provided on the frame and is located below the N adjustment brackets;
[0019] Control module; the control module is fixedly mounted on the frame and is respectively connected to the stage and N groups of sensing components.
[0020] In some embodiments, the control module is connected to the stage and can control the stage to move along the first direction;
[0021] The transparent electrode is placed on the stage to move along the first direction following the stage.
[0022] In some embodiments, N groups of the sensing components are all connected to the control module, and can transmit N actual heights to the control module.
[0023] In some embodiments, when the control module receives N actual heights, each actual height may be compared with the corresponding target height one by one, so that the control module generates N corresponding control signals;
[0024] The control module may independently control the corresponding adjustment bracket to move along the third direction according to each control signal.
[0025] In a second aspect, the utility model provides a kind of transparent electrode.The transparent electrode includes:
[0026] Transparent substrate and conductive substrate;The conductive substrate is laid on the transparent substrate;
[0027] The nozzle of the etching equipment described above can spray etching liquid to the conductive substrate, to form N conductive lines on the conductive substrate;
[0028] N The conductive lines all extend along the first direction, and are arranged along the second direction;
[0029] Wherein, N is greater than 1, and N is positive integer;The first direction is the arrangement direction of the adjusting support of the etching equipment;The second direction is orthogonal to the first direction, and parallel to the surface of the conductive substrate etched with N The conductive lines.
[0030] In some embodiments, the conductive substrate has opposite first edge and second edge in the second direction, and the first edge and the second edge are symmetric about center line;
[0031] Wherein, the center line is located at the middle position of the conductive substrate, and parallel to the first direction.
[0032] In some embodiments, each etching component of the etching equipment has a target height between the transparent electrode;
[0033] From the first edge or the second edge to the target height at the center line, gradually reduce.
[0034] In some embodiments, the target height at least includes:
[0035] First height;The first height is located at the first edge;
[0036] Second height;The second height is located at the second edge;
[0037] Third height;The third height is located at the center line;
[0038] Wherein, the first height and the second height are all greater than the third height, and first height is equal to second height.
[0039] At least one beneficial effect of the etching equipment and transparent electrode provided by the embodiments of the present invention is: a new type of etching equipment for etching circuits on a transparent electrode is proposed, by adjusting the height of the adjustment bracket at different positions of the transparent electrode so that the actual height between the etching component and the transparent electrode can reach the corresponding target height, thereby adjusting the etching ability of the transparent electrode at different positions, effectively reducing the influence of the pool effect on the uneven line width of the conductive circuit, and further improving the line width uniformity of the conductive circuit; and, by adding a sensing component, the etching equipment can also accurately adjust the etching ability of the transparent electrode at different positions. BRIEF DESCRIPTION OF THE DRAWINGS
[0040] One or more embodiments are exemplarily illustrated by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as the same elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.
[0041] Figure 1 A schematic diagram of the partial structure of the adjusting bracket, etching component and sensing component of the etching equipment provided by an embodiment of the present invention;
[0042] Figure 2 This is a functional block diagram of the etching equipment provided in an embodiment of the present invention for etching a conductive circuit on a transparent electrode.
[0043] Reference numerals:
[0044] 100. Etching equipment; 1001. First direction; 1002. Second direction; 1003. Third direction; 1. Equipment body; 11. Frame; 12. Stage; 13. Control module; 2. Adjustment bracket; 3. Etching component; 31. Nozzle; 4. Sensing component; 41. Distance sensor;
[0045] 200, transparent electrode; 2001, transparent substrate; 2002, conductive substrate; 2003, conductive circuit. DETAILED DESCRIPTION
[0046] The present invention is described in detail below with reference to specific embodiments. It should be emphasized that the following description is merely illustrative and is not intended to limit the scope and application of the present invention.
[0047] It should be noted that, unless otherwise clearly specified and limited, the terms "relative", "first direction", "second direction", "third direction", etc. used in this specification to indicate the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as a limitation on the present invention. Terms such as "installation", "fitting", "connection" and "fixation" should be understood in a broad sense. For example, "connection" can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; "fixation" can be bolt fixation, snap fixation or glue fixation; the terms "first", "second" and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated; thus, the features specified as "first", "second" and "third" may explicitly or implicitly include one or more of the features; "multiple" or "several" means two or more; in addition, "and / or" includes any and all combinations of one or more related listed items; for ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to the specific circumstances.
[0048] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.
[0049] In this embodiment, the specific implementation of the "etching device and the transparent electrode" is not limited, and those skilled in the art can selectively use any appropriate implementation method according to actual needs.
[0050] Figure 1 A schematic diagram of the partial structure of the etching equipment provided in an embodiment of the present invention, including the adjustment bracket, etching component and sensing component. Figure 2 This is a functional block diagram of the etching device provided in an embodiment of the present invention for etching a conductive circuit on a transparent electrode.
[0051] See also Figure 1 and Figure 2 The etching device 100 is used to etch N conductive lines 2003 to the transparent electrode 200.
[0052] The etching equipment 100 mentioned above includes: an equipment body 1 , N adjustment brackets 2 , N groups of etching components 3 and N groups of sensor components 4 .
[0053] The N adjustment brackets 2 all extend along the first direction 1001 ; and the N adjustment brackets 2 are all assembled on at least a portion of the device body 1 and arranged at a preset target spacing along the second direction 1002 .
[0054] In addition, each set of etching components 3 is disposed on an adjustment bracket 2 , and each set of etching components 3 has a target height with the transparent electrode 200 .
[0055] In addition, each set of sensing components 4 is disposed on an adjustment bracket 2 , and each set of sensing components 4 can detect an actual height between each set of etching components 3 and the transparent electrode 200 .
[0056] It can be understood that a portion of the device body 1 can independently control each adjustment bracket 2 to move along the third direction 1003 so that each actual height can reach the corresponding target height.
[0057] It should be noted that N is greater than 1 and is a positive integer; the first direction 1001 , the second direction 1002 and the third direction 1003 are orthogonal to each other, and the third direction 1003 is perpendicular to the surface of the transparent electrode 200 on which N conductive lines 2003 are etched.
[0058] Combine Figure 1 and Figure 2 It can be seen that the etching equipment 100 adjusts the height of the adjustment bracket 2 at different positions (or in different areas) of the transparent electrode 200 so that the actual height between the etching component 3 and the transparent electrode can reach the corresponding target height, thereby adjusting the etching ability (or etching rate) of the transparent electrode at different positions, effectively reducing the influence of the pool effect on the uneven line width of the conductive circuit 2003, and further improving the line width uniformity of the conductive circuit 2003; and, by adding the sensing component 4, the etching equipment 100 can also accurately adjust the etching ability of the transparent electrode 200 at different positions.
[0059] Specifically, a transparent electrode is an element that has both high conductivity and high visible light transmittance, and is usually composed of two parts: a transparent substrate and a conductive substrate (or called a transparent conductive film); in other words, a transparent electrode is a thin film structure with high transparency and excellent conductivity in the visible light band (400nm~800nm); generally speaking, transparent electrodes are widely used in liquid crystal displays, touch screens, flexible displays and other fields.
[0060] Further, in the yellow light process / wet process, the line development / etching stage is prone to the pool effect. The pool effect refers to that, when the etching liquid is sprayed onto the surface of the conductive substrate, the etching liquid is accumulated on the surface of the conductive substrate due to the residual liquid on the surface of the conductive substrate, which hinders the direct contact between the etching liquid and the conductive substrate, so that the related chemical reaction is difficult to occur between them. At this time, the etching liquid is accumulated on the surface of the conductive substrate to form a "pool", which causes the etching liquid to be difficult to reach the surface of the conductive substrate where the conductive line needs to be etched, that is, the so-called pool effect.
[0061] In the process of etching the conductive substrate, the etching liquid flows to the edge of the conductive substrate, so that the etching rate (or etching ability) at the edge of the conductive substrate is generally faster than that at the center of the conductive substrate, which causes the etching quality of the entire conductive substrate to be uneven.
[0062] In addition, the greater the etching rate is, the higher the etching intensity is, and the thinner the line width of the conductive line is. Generally, the etching rate at the edge of the conductive substrate is the largest, so the line width at the edge of the conductive substrate is the thinnest. The etching rate at the center of the conductive substrate is the smallest, so the line width at the center of the conductive substrate is the thickest.
[0063] In addition, the height of the etching component 3 (or the nozzle 31) to the conductive substrate 2002 should be increased in the area with a thin line width, and the height of the etching component 3 (or the nozzle 31) to the conductive substrate 2002 should be reduced in the area with a thick line width.
[0064] In summary, the target height corresponding to the edge of the conductive substrate 2002 is greater than the target height corresponding to the center of the conductive substrate 2002.
[0065] In some embodiments, as shown in Figure 1 and Figure 2 each adjusting support 2 is in a straight line shape, and each group of sensing components 4 is composed of at least one distance sensor 41.
[0066] Specifically, each group of etching components 3 is composed of at least two nozzles 31, and the axis direction of each nozzle 31 is parallel to the third direction 1003.
[0067] In some embodiments, in combination with Figure 1 and Figure 2 it can be seen that the equipment body 1 comprises a rack 11, a worktable 12 and a control module 13.
[0068] In the embodiments of the present application, N adjusting supports 2 are assembled on the rack 11; the worktable 12 is arranged on the rack 11 and located below the N adjusting supports 2; and the control module 13 is fixedly installed on the rack 11 and connected to the worktable 12 and the N groups of sensing components 4, respectively.
[0069] In some embodiments, according to Figure 1 and Figure 2 It can be seen that the control module 13 is connected to the stage 12 and can control the stage 12 to move along the first direction 1001 .
[0070] Generally speaking, the stage 12 includes at least a driving mechanism and a loading platform. The control module 13 mainly controls the driving mechanism to force the loading platform to move. Furthermore, the transparent substrate 2001 of the transparent electrode 200 is away from the surface of the conductive substrate 2002 and abuts against the surface of the loading platform.
[0071] To further illustrate, the transparent electrode 200 is placed on the stage 12 to move along the first direction 1001 along with the stage 12 .
[0072] In some embodiments, Figure 1 and Figure 2 It can be seen that N groups of sensor components 4 are all connected to the control module 13 and can transmit N actual heights to the control module 13 .
[0073] In some embodiments, reference Figure 1 and Figure 2 It can be seen that when the control module 13 receives N actual heights, each actual height can be compared with the corresponding target height one by one, so that the control module 13 generates N corresponding control signals.
[0074] It should be noted that the control module 13 can independently control the corresponding adjustment bracket 2 to move along the third direction 1003 according to each control signal (during the movement of the adjustment bracket 2, the gear can be driven by the motor, and then the adjustment bracket 2 can be driven to move in the third direction 1003).
[0075] Please continue reading Figure 1 and Figure 2 The transparent electrode 200 includes: a transparent substrate 2001 and a conductive substrate 2002.
[0076] The conductive substrate 2002 is laid on the transparent substrate 2001 ; the nozzle 31 of the etching device 100 can spray etching liquid onto the conductive substrate 2002 to form N conductive circuits 2003 on the conductive substrate 2002 .
[0077] In addition, the N conductive lines 2003 all extend along the first direction 1001 and are arranged along the second direction 1002 .
[0078] In addition, N is greater than 1 and is a positive integer; the first direction 1001 is the arrangement direction of the adjustment bracket 2 of the etching equipment 100; the second direction 1002 is orthogonal to the first direction 1001 and parallel to the surface of the conductive substrate 2002 on which N conductive lines 2003 are etched.
[0079] In some embodiments, as Figure 1 and Figure 2 As shown, the conductive substrate 2002 has a first edge and a second edge opposite to each other in the second direction 1002 , and the first edge and the second edge are symmetrical about the center line.
[0080] It can be understood that the center line is located in the middle of the conductive substrate 2002 and is parallel to the first direction 1001 .
[0081] In some embodiments, combined Figure 1 and Figure 2 It can be seen that there is a target height between each etching component 3 of the etching equipment 100 and the transparent electrode 200 .
[0082] In the embodiment of the present application, the target height gradually decreases from the first edge or the second edge toward the center line.
[0083] In some embodiments, according to Figure 1 and Figure 2 It can be seen that the above target heights include at least: a first height, a second height and a third height
[0084] The first height is located at the first edge; the second height is located at the second edge; and the third height is located at the center line.
[0085] In addition, the first height and the second height are both greater than the third height, and the first height is equal to the second height.
[0086] It should be noted that the etching equipment 100 can improve the line width uniformity of the conductive circuit 2003 by adjusting the height of the adjustment bracket 2, and can also improve the line width uniformity of the conductive circuit 2003 by controlling the intensity of the etching liquid sprayed by the nozzle 31 to impact the conductive substrate 2002.
[0087] In summary, the etching equipment and transparent electrode provided by the embodiments of the present invention can adjust the height of the adjustment bracket at different positions of the transparent electrode so that the actual height between the etching component and the transparent electrode can reach the corresponding target height, thereby adjusting the etching ability of the transparent electrode at different positions. This can effectively reduce the impact of the pool effect on the uneven line width of the conductive circuit, further improving the line width uniformity of the conductive circuit. In addition, by adding a sensing component, the etching equipment can also accurately adjust the etching ability of the transparent electrode at different positions. Therefore, the etching equipment for etching circuits on transparent electrodes provided by the embodiments of the present invention has certain novelties compared to traditional etching equipment for etching circuits on transparent electrodes.
[0088] The above content is a further detailed description of the present invention in conjunction with specific / preferred embodiments, and the specific implementation of the present invention cannot be limited to these descriptions. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the concept of the present invention, and all of these modifications and improvements fall within the scope of protection of the present invention.
Claims
1. An etching device for etching N conductive lines to a transparent electrode; characterized in that: include: Equipment body; N adjustment brackets extending along a first direction; N of the adjustment brackets are mounted on at least a portion of the device body and are arranged at a preset target interval along the second direction; N groups of etching components; each group of etching components is disposed on one of the adjustment brackets, and each group of etching components has a target height with the transparent electrode; N groups of sensing components; each group of the sensing components is disposed on one of the adjustment brackets, and each group of the sensing components can detect an actual height between each group of the etching components and the transparent electrode; A portion of the device body can independently control each of the adjustment brackets to move along the third direction so that each of the actual heights can reach the corresponding target height; Wherein, N is greater than 1 and is a positive integer; the first direction, the second direction and the third direction are orthogonal to each other, and the third direction is perpendicular to the surface of the transparent electrode on which the N conductive lines are etched.
2. The etching equipment according to claim 1, characterized in that Each adjustment bracket is in a straight line shape, and each set of the sensing components is composed of at least one distance sensor; Each group of etching components is composed of at least two nozzles, and the axis direction of each nozzle is parallel to the third direction.
3. The etching equipment according to claim 1, characterized in that The device body includes: Rack; N of the adjustment brackets are assembled on the rack; The loading platform is provided on the frame and is located below the N adjustment brackets; Control module; the control module is fixedly mounted on the frame and is respectively connected to the stage and N groups of sensing components.
4. The etching equipment according to claim 3, characterized in that The control module is connected to the loading platform and can control the loading platform to move along the first direction; The transparent electrode is placed on the stage to move along the first direction following the stage.
5. The etching equipment according to claim 3, characterized in that The N groups of sensing components are all connected to the control module and can transmit the N actual heights to the control module.
6. The etching equipment according to claim 5, characterized in that When the control module receives the N actual heights, each actual height may be compared with the corresponding target height one by one, so that the control module generates N corresponding control signals; The control module may independently control the corresponding adjustment bracket to move along the third direction according to each control signal.
7. A transparent electrode, characterized in that: include: Transparent substrates and conductive substrates; The conductive substrate is laid on the transparent substrate; The nozzle of the etching device according to any one of claims 1 to 6 is capable of spraying etching liquid onto the conductive substrate to form N conductive lines on the conductive substrate; The N conductive lines all extend along the first direction and are arranged along the second direction; Wherein, N is greater than 1 and is a positive integer; the first direction is the arrangement direction of the adjustment bracket of the etching equipment; the second direction is orthogonal to the first direction and parallel to the surface of the conductive substrate on which N conductive lines are etched.
8. The transparent electrode according to claim 7, characterized in that The conductive substrate has a first edge and a second edge opposite to each other in the second direction, and the first edge and the second edge are symmetrical about a center line; The center line is located in the middle of the conductive substrate and is parallel to the first direction.
9. The transparent electrode according to claim 8, characterized in that There is a target height between each etching component of the etching device and the transparent electrode; The target height gradually decreases from the first edge or the second edge toward the center line.
10. The transparent electrode according to claim 9, characterized in that The target height includes at least: a first height; the first height being located at the first edge; a second height; the second height being located at the second edge; A third height; the third height is located at the center line; The first height and the second height are both greater than the third height, and the first height is equal to the second height.