Radiator and electronic equipment
By designing a radiator in a low-power complete machine, combining active heat conduction and passive heat radiation, and using heat-conducting parts made of high thermal conductivity materials in contact with the PCB board and the casing, the problem of poor heat dissipation effect of the small-power complete machine is solved, and efficient and stable heat dissipation effect and miniaturized design are achieved.
Patent Information
- Application Number
- CN202422461649.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-10-11
AI Technical Summary
The existing low-power complete machine has poor heat dissipation effect, mainly relying on the casing for heat dissipation, and cannot effectively dissipate the heat of the PCB board.
The heat sink design includes a heat sink and a heat conductor. The heat sink is placed on the PCB and has a through-hole. The heat conductor is passed through the hole and contacts the PCB and the chassis respectively. Active heat conduction and passive heat radiation are combined to dissipate heat. The heat conductor is made of high thermal conductivity materials such as copper columns.
It achieves efficient and stable heat dissipation, saves space, has a small integrated size, and improves heat dissipation efficiency.
Smart Images
Figure CN223428730U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of radiators, in particular to a radiator and an electronic device. Background Art
[0002] Low-power complete devices generally refer to electronic devices or systems with relatively low power consumption. Their design and application emphasize features such as small size, light weight, and low energy consumption. They are widely used in household appliances, office equipment, small machinery, and intelligent control systems. The design of low-power complete devices often prioritizes heat dissipation to ensure stable and reliable operation.
[0003] Existing low-power complete machines usually rely solely on the casing for heat dissipation. A heat-conducting block is set between the PCB board and the structural casing to dissipate excess heat through the casing, resulting in poor heat dissipation effect. Utility Model Content
[0004] The main purpose of the utility model is to provide a radiator and an electronic device, aiming to achieve efficient and stable heat dissipation effect.
[0005] To achieve the above-mentioned objectives, the present invention proposes a radiator for dissipating heat from an electronic device. The electronic device includes a housing and a PCB board arranged in the housing. The radiator includes a heat sink and a heat conductor. The heat sink is arranged on the PCB board and has a through-hole. The heat conductor is inserted into the through-hole, and one end surface of the heat conductor is used to abut against the PCB board, and the other end surface of the heat conductor is used to abut against the housing.
[0006] In one embodiment, the heat sink includes a main body and two fin parts, the two fin parts are connected to opposite sides of the main body, one fin part includes a plurality of fins, the plurality of fins are arranged parallel to each other, and the avoidance is opened in the main body.
[0007] In one embodiment, the center of the escape opening coincides with the center of the main body.
[0008] In one embodiment, both end surfaces of the heat conducting element are respectively flush with two surfaces of the heat dissipating element.
[0009] In one embodiment, the heat sink further includes two thermal pads, one of which is sandwiched between one end surface of the thermal conductive element and the PCB board, and the other of which is sandwiched between the other end surface of the thermal conductive element and the housing.
[0010] In one embodiment, the heat sink further includes a plurality of spring screws, a plurality of threaded holes are provided on the surface of the heat sink facing the PCB board, the plurality of threaded holes are evenly distributed along the circumference of the heat sink, a plurality of connection holes are opened at corresponding positions of the PCB board, and one of the spring screws passes through one of the connection holes and one of the threaded holes to threadably connect the PCB board and the heat sink.
[0011] In one embodiment, the heat sink is an aluminum extruded heat sink, and the heat conductor is a copper column.
[0012] In one embodiment, the heat conducting element is connected to the heat dissipating element by welding, hot-mounting, or cold-mounting.
[0013] In one embodiment, both end surfaces of the heat conducting member and both surfaces of the heat dissipating member are provided with an anti-oxidation layer.
[0014] The present utility model also proposes an electronic device, comprising a casing, a PCB board and a radiator, wherein the casing has a accommodating cavity; the PCB board is arranged in the accommodating cavity; the radiator is the radiator described above, and the radiator comprises a heat dissipation member and a heat conducting member, the heat dissipation member is arranged on the PCB board, the heat dissipation member is provided with a through avoidance opening, the heat conducting member is passed through the avoidance opening, one end face of the heat conducting member abuts against the PCB board, and the other end face of the heat conducting member abuts against the casing.
[0015] The heat sink proposed in the technical solution of the present invention includes a heat sink and a heat conductor. The heat sink is disposed on a PCB board and has a through-hole formed therethrough. The heat conductor is disposed within the through-hole. One end face of the heat conductor abuts the PCB board, while the other end face abuts the housing. The heat sink itself can absorb some heat and radiate it into the air for heat dissipation. The heat conductor can achieve rapid heat transfer, conducting some heat to the housing for heat dissipation. The heat sink proposed in the present invention combines active abutment heat conduction with passive heat radiation to achieve efficient and stable heat dissipation. The heat conductor is disposed in the middle of the heat sink, which can save space occupied by the heat sink and has the advantage of a small integrated size. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.
[0017] Figure 1A schematic structural diagram of an embodiment of a radiator provided by the present utility model;
[0018] Figure 2 This is a structural schematic diagram of an embodiment of a heat dissipation element in a radiator provided by the utility model.
[0019] Description of Figure Numbers:
[0020] 10. Radiator; 1. Heat sink; 11. Main body; 111. Avoidance; 12. Fin; 2. Heat conductor; 3. Thermal pad; 4. Spring screw; 30. PCB board; 20. Casing.
[0021] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.
[0023] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.
[0025] Existing low-power complete machines usually rely solely on the casing for heat dissipation. A heat-conducting block is set between the PCB board and the structural casing to dissipate excess heat through the casing, resulting in poor heat dissipation effect.
[0026] The utility model provides a radiator and an electronic device, aiming to achieve an efficient and stable heat dissipation effect.
[0027] See also Figure 1 and Figure 2 In one embodiment of the present invention, the heat sink 10 is used to dissipate heat from an electronic device. The electronic device includes a housing 20 and a PCB board 30 arranged in the housing 20. The heat sink 10 includes a heat sink 1 and a heat conductor 2. The heat sink 1 is arranged on the PCB board 30 and has a through avoidance opening 111. The heat conductor 2 is inserted into the avoidance opening 111. One end surface of the heat conductor 2 is used to abut against the PCB board 30, and the other end surface of the heat conductor 2 is used to abut against the housing 20.
[0028] In this embodiment, the heat sink 1 can be a heat sink made of metal, or a heat pipe radiator 10 with a phase change material inside. As long as it is a heat dissipation component that can absorb the heat of the PCB board 30 and diffuse it out, no further limitation is made here. The heat conductor 2 mainly conducts the heat of the PCB board 30 to the housing 20 through direct contact between its two end faces and the PCB board 30 and the housing 20, and then dissipates the heat through the housing 20. The heat conductor 2 is made of a metal material with a high thermal conductivity coefficient, such as a copper column or an aluminum column, to improve the heat dissipation efficiency and effect of the heat sink 10. The heat conductor 2 is provided through the avoidance opening 111 opened on the heat sink 1, which can make the volume of the heat sink 10 smaller, and has the advantages of integration and miniaturization.
[0029] The heat sink 10 proposed in the technical solution of the present invention includes a heat sink 1 and a heat conductor 2. The heat sink 1 is arranged on a PCB board 30 and has a through-hole 111 formed therethrough. The heat conductor 2 is inserted into the through-hole 111. One end face of the heat conductor 2 abuts the PCB board 30, and the other end face abuts the housing 20. The heat sink 1 itself can absorb some heat and radiate it into the air for heat dissipation. The heat conductor 2 can achieve rapid heat transfer and conduct some heat to the housing 20 for heat dissipation. The heat sink 10 proposed in the present invention can combine active abutment heat conduction heat dissipation with passive heat radiation heat dissipation to achieve efficient and stable heat dissipation. In addition, the heat conductor 2 is inserted into the middle of the heat sink 1, which can save space occupied by the heat sink 10 and has the advantage of a small integrated size.
[0030] In an embodiment of the present invention, the heat sink 1 includes a main body 11 and two fin parts 12, the two fin parts 12 are connected to opposite sides of the main body 11, one fin part 12 includes a plurality of fins, the plurality of fins are arranged parallel to each other, and the avoidance opening 111 is opened in the main body 11.
[0031] In this embodiment, the heat sink 1 includes a main body 11 and two fins 12 disposed on opposite sides of the main body 11. The main body 11 is used to connect to the PCB 30 and has a relief opening 111 for passing the thermal conductive member 2, serving as a base. The fins 12 include a plurality of parallel fins that increase the surface area of the heat sink 1 and thereby improve heat dissipation efficiency. It is understood that in other embodiments, the heat sink 1 may also utilize other types of heat sinks 10, such as a heat pipe heat sink 10.
[0032] In the embodiment of the present invention, the center of the avoidance opening 111 coincides with the center of the main body 11 .
[0033] In this embodiment, an avoidance opening 111 is opened at the center of the main body 11, so that the heat conductor 2 is located in the center of the heat sink 1, and the two sides of the radiator 10 are symmetrically arranged, ultimately making the heat dissipation of the radiator 10 more uniform and improving the heat dissipation efficiency and effect.
[0034] In the embodiment of the present invention, both end surfaces of the heat conducting member 2 are respectively flush with the two surfaces of the heat dissipating member 1 .
[0035] In this embodiment, the two end surfaces of the heat conductor 2 are respectively arranged flush with the two surfaces of the heat sink 1, that is, the two ends of the heat conductor are not exposed on the two surfaces of the heat sink 1. The advantage of such an arrangement is that when the two end surfaces of the heat conductor 2 are attached to the PCB board 30 and the housing 20, the corresponding surfaces of the heat sink 1 are also attached to the PCB board 30 and the housing 20, and the heat sink 1 can also participate in heat conduction and heat dissipation, thereby improving the heat dissipation effect of the radiator 10.
[0036] In the embodiment of the present invention, the heat sink 10 further includes two thermal pads 3 , one thermal pad 3 is sandwiched between one end surface of the thermal conductive element 2 and the PCB board 30 , and the other thermal pad 3 is sandwiched between the other end surface of the thermal conductive element 2 and the housing 20 .
[0037] In this embodiment, the thermal pad 3 is a flexible material used to fill the gaps between the thermal conductor 2 and the PCB 30, and between the thermal conductor 2 and the housing 20, thereby improving heat conduction efficiency. Of course, in other embodiments, thermal grease or thermal gel may also be used to fill the gaps between the thermal conductor 2 and the PCB 30 or the housing 20, thereby improving heat conduction efficiency.
[0038] In the embodiment of the utility model, the radiator 10 further includes a plurality of spring screws 4, the surface of the heat dissipation piece 1 towards the PCB 30 is provided with a plurality of threaded holes, the plurality of threaded holes are evenly distributed along the circumference of the heat dissipation piece 1, the corresponding position of the PCB 30 is provided with a plurality of connecting holes, a spring screw 4 passes through a connecting hole and a threaded hole to threadedly connect the PCB 30 and the heat dissipation piece 1.
[0039] In the embodiment, the spring screw 4 is used to connect the radiator 10 and the PCB 30, the connection strength is guaranteed, and a gap is left between the components on the radiator 10 and the PCB 30, so that the components are prevented from being damaged and the PCB 30 is prevented from being invalid.
[0040] In the embodiment of the utility model, the heat dissipation piece 1 is an aluminum extruded fin, and the heat conduction piece 2 is a copper column.
[0041] In the embodiment, the aluminum extruded fin is used as the heat dissipation piece 1, and the copper column is used as the heat conduction piece 2. The specific heat capacity of aluminum is high, the aluminum extruded fin can absorb more heat, and the cost of aluminum is relatively low, so that the cost can be saved when the aluminum extruded fin is manufactured. The thermal conductivity of copper is high, so that the heat can be quickly conducted away, and the heat dissipation efficiency is improved. It can be understood that in other embodiments, the aluminum cast fin, the aluminum cutting fin or the like can be used as the heat dissipation piece 1, and other heat dissipation fins made of other materials, such as a copper heat dissipation fin, can be used. The heat conduction piece 2 can also be made of other metal materials with good heat conduction effect, such as aluminum.
[0042] In the embodiment of the utility model, the heat conduction piece 2 is connected with the heat dissipation piece 1 by welding, hot-pressing or cold-pressing.
[0043] In the embodiment, the heat conduction piece 2 can be fixed in the heat dissipation piece 1 in the following ways. The heat conduction piece 2 is in interference fit with the heat dissipation piece 1, the heat dissipation piece 1 is heated to expand the avoiding opening 111, the heat conduction piece 2 passes through the avoiding opening 111, the temperature returns to normal, the avoiding opening 111 shrinks to cover the heat conduction piece 2, or the temperature of the heat conduction piece 2 is lowered to reduce the size of the heat conduction piece 2, the heat conduction piece 2 passes through the avoiding opening 111, the temperature returns to normal, and the heat conduction piece 2 expands against the avoiding opening 111. In addition, the size of the heat conduction piece 2 is slightly smaller than the size of the avoiding opening 111, the heat conduction piece 2 is first inserted into the avoiding opening 111, and then the two end faces of the heat conduction piece 2 are welded with the edges of the avoiding opening 111, so that the heat conduction piece 2 and the heat dissipation piece 1 are connected as a whole.
[0044] In the embodiment of the utility model, the two end faces of the heat conduction piece 2 and the two surfaces of the heat dissipation piece 1 are provided with an anti-oxidation layer.
[0045] In this embodiment, an anti-oxidation layer is provided on both end surfaces of the thermal conductor 2 and both surfaces of the heat sink 1. This effectively prevents oxidation of the metal material at high temperatures, thereby extending the service life of the heat sink 10 while maintaining its good appearance and performance. The anti-oxidation layer may be an electroplated layer, a chemically plated layer, or an anodized layer, without further limitation herein.
[0046] The present invention also proposes an electronic device, including a housing 20, a PCB board 30 and a radiator 10, the housing 20 has a accommodating cavity; the PCB board 30 is arranged in the accommodating cavity; the radiator 10 is the radiator 10 as described above, the radiator 10 includes a heat sink 1 and a heat conductor 2, the heat sink 1 is arranged on the PCB board 30, the heat sink 1 is provided with a through avoidance opening 111, the heat conductor 2 is passed through the avoidance opening 111, one end surface of the heat conductor 2 abuts against the PCB board 30, and the other end surface of the heat conductor 2 abuts against the housing 20.
[0047] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A radiator for dissipating heat from an electronic device, wherein the electronic device comprises a housing and a PCB board disposed in the housing, wherein: include: A heat sink, the heat sink being arranged on the PCB board and having a through-hole; and A heat conducting member is provided in the avoidance opening, one end surface of the heat conducting member is used to abut against the PCB board, and the other end surface of the heat conducting member is used to abut against the casing.
2. The radiator according to claim 1, wherein The heat sink includes a main body and two fin parts, the two fin parts are connected to opposite sides of the main body, one fin part includes a plurality of fins, and the plurality of fins are arranged parallel to each other. The avoidance port is opened in the main body.
3. The radiator according to claim 2, wherein: The center of the escape opening coincides with the center of the main body.
4. The radiator according to claim 2, wherein: The two end surfaces of the heat conducting member are respectively arranged flush with the two surfaces of the heat dissipating member.
5. The radiator according to any one of claims 1 to 4, characterized in that The heat sink further includes two thermal pads, one of which is clamped between one end surface of the thermal conductive element and the PCB board, and the other of which is clamped between the other end surface of the thermal conductive element and the housing.
6. The radiator according to any one of claims 1 to 4, characterized in that The heat sink also includes a plurality of spring screws. The surface of the heat sink facing the PCB board is provided with a plurality of threaded holes, and the plurality of threaded holes are evenly spaced along the circumference of the heat sink. The corresponding positions of the PCB board are provided with a plurality of connecting holes. One of the spring screws passes through one of the connecting holes and one of the threaded holes to threadably connect the PCB board and the heat sink.
7. The radiator according to any one of claims 1 to 4, characterized in that The heat sink is an aluminum extruded heat sink, and the heat conductor is a copper column.
8. The heat sink according to claim 7, wherein: The heat conducting element is connected to the heat dissipating element by welding, hot-inserting or cold-inserting.
9. The heat sink according to claim 7, wherein: Both end surfaces of the heat conducting member and both surfaces of the heat dissipating member are provided with an anti-oxidation layer.
10. An electronic device, characterized in that: include: a housing, the housing having a receiving cavity; A PCB board, the PCB board being arranged in the accommodating cavity; as well as The radiator is the radiator according to any one of claims 1 to 9, the radiator comprising a heat sink and a heat conductor, the heat sink being arranged on the PCB board, the heat sink being provided with a through avoidance opening, the heat conductor being passed through the avoidance opening, one end surface of the heat conductor abutting the PCB board, and the other end surface of the heat conductor abutting the casing.