Inverter

Abstract

The utility model provides an inverter, which relates to the technical field of heat radiation and comprises a shell, a cavity and an out-cavity flow channel which are communicated with each other are arranged in the shell, a radiator is arranged in the out-cavity flow channel and used for radiating heat of a power module in the cavity, a heat pipe heat exchanger is arranged in the shell and comprises at least one heat pipe, and the heat pipe is communicated with the cavity. The evaporation end of the heat pipe is arranged in the cavity, the condensation end of the heat pipe is arranged in the out-cavity flow channel, the heat pipe heat exchanger is used for transferring heat in the cavity to the out-cavity flow channel, and the out-cavity flow channel is communicated with the outside. The heat dissipation system not only directly dissipates heat of the power module through the radiator, but also effectively transmits heat in the cavity to the flow channel outside the cavity through the heat pipe heat exchanger via the heat pipe, thereby improving the temperature in the cavity, indirectly cooling the heating components of the inverter in the cavity, and improving the heat dissipation efficiency of the power module. Therefore, the risk of overheating damage of components in the cavity is greatly reduced, the overall service life of the inverter is prolonged, and the reliability of the system is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, and in particular to an inverter. Background Art

[0002] As a core component in power conversion systems, the performance and reliability of the inverter are directly related to the efficiency and stability of the entire system. As the power of inverter systems continues to increase, the heat generated within them also increases significantly, placing higher demands on the inverter's heat dissipation efficiency. Traditional heat dissipation methods, which rely on natural heat dissipation from the housing and forced air cooling with turbulent fans, face problems such as low heat dissipation efficiency and excessive internal component temperatures. This not only shortens component lifespan but also reduces overall system reliability.

[0003] While there are some solutions currently on the market to address inverter heat dissipation, these solutions generally suffer from complex structures, suboptimal heat dissipation, and high maintenance costs. For example, while using a cross-flow heat exchanger for heat dissipation can improve heat dissipation to a certain extent, the heat exchanger is bulky, resulting in a less compact overall structure and increasing manufacturing costs and maintenance burdens. Utility Model Content

[0004] The problem solved by the utility model is: how to manage heat efficiently and reasonably while maintaining a compact inverter structure, so as to reduce the risk of overheating and damage of components inside the inverter, and improve the life of the entire inverter and system reliability.

[0005] To solve the above problems, the present invention provides an inverter, comprising a shell, wherein a chamber and an external flow channel are connected to each other in the shell, a radiator is provided in the external flow channel, and the radiator is used to dissipate heat from the power module in the chamber, and a heat pipe heat exchanger is provided in the shell, and the heat pipe heat exchanger includes at least one heat pipe, the evaporation end of the heat pipe is arranged in the chamber, and the condensation end of the heat pipe is arranged in the external flow channel, and the heat pipe heat exchanger is used to transfer the heat in the chamber to the external flow channel, and the external flow channel is connected to the outside.

[0006] Optionally, the heat sink includes a heat dissipation substrate and a heat dissipation fin group, the heat dissipation substrate is connected to the power module on a side facing the cavity, and the heat dissipation fin group is connected to a side of the heat dissipation substrate facing the extracavity flow channel.

[0007] Optionally, a heat-conducting medium is provided at the contact surface between the heat-dissipating substrate and the power module, and the heat-conducting medium is used to reduce the contact thermal resistance between the heat-dissipating substrate and the power module.

[0008] Optionally, a heat pipe is embedded in the heat dissipation substrate, and an evaporation end of the heat pipe is in contact with the power module.

[0009] Optionally, the heat pipe heat exchanger further includes an inner fin group and an outer fin group, the inner fin group includes a plurality of inner fins arranged at intervals, and the evaporation end of the heat pipe is sequentially penetrated by the plurality of inner fins, the outer fin group includes a plurality of outer fins arranged at intervals, and the condensation end of the heat pipe is sequentially penetrated by the plurality of outer fins.

[0010] Optionally, the heat pipe heat exchanger further includes a heat pipe inner fan, which is arranged on a side of the inner fin group facing the power module, and is used to draw air from the inner fin group and blow air toward one side of the power module.

[0011] Optionally, a turbulence fan is provided in the chamber, and the turbulence fan and the fan in the heat pipe are respectively arranged at different ends on opposite sides of the chamber, and the air duct of the turbulence fan is parallel to the air duct of the fan in the heat pipe.

[0012] Optionally, a plurality of inductance boxes are provided in the extracavity flow channel, and the inductance boxes are used to place inductance components and to dissipate heat generated by the inductance components.

[0013] Optionally, a plurality of external fans are provided in the extracavity flow channel, and the plurality of external fans are arranged at intervals on a side of the radiator away from the inductor box, and the external fans are used to provide air volume for heat dissipation of the radiator, the inductor box and the heat pipe exchanger.

[0014] Optionally, the heat pipe heat exchanger further includes a heat pipe external fan, which is used to blow air toward the external fin group, thereby cooling the condensing end of the heat pipe;

[0015] Or the plurality of external fans are linearly spaced apart and arranged on a side of the radiator away from the inductor box, the external fin group is arranged on one side of the heat dissipation fin group, and the arrangement direction of the external fin group and the heat dissipation fin group is consistent with the arrangement direction of the plurality of external fans;

[0016] Or the plurality of external fans are linearly spaced apart and arranged on a side of the radiator away from the inductor box, the external fin group is arranged on one side of the plurality of inductor boxes, and the arrangement direction of the external fin group and the plurality of inductor boxes is consistent with the arrangement direction of the plurality of external fans.

[0017] The inverter of the present invention has the following beneficial effects: the inverter is primarily composed of a housing, a chamber, an external flow channel, a radiator, and a heat pipe heat exchanger. The housing is provided with a connected chamber and external flow channel, which communicates with the outside world and forms the primary path for heat transfer. The chamber houses the inverter's power module, which generates a large amount of heat during operation. The radiator, located within the external flow channel, removes heat from the external flow channel through convection or radiation, thereby dissipating heat from the power module. The heat pipe heat exchanger is the core component of the heat dissipation system and includes at least one heat pipe. The operating principle of a heat pipe is based on a cyclic process in which a working fluid (such as liquid metal, water, or other working fluid) within the heat pipe evaporates at an evaporation end and then condenses and releases heat at a condensation end. In this system, the evaporation end of the heat pipe is located within the chamber, adjacent to the power module, thereby directly absorbing the heat generated by the power module. As heat is absorbed, the working fluid within the heat pipe evaporates and rises to the condensation end, which is located within the external flow channel adjacent to the radiator. At the condensation end, the evaporated working fluid releases heat and condenses back into liquid. This heat is transferred from the chamber to the flow channel outside the chamber, thereby reducing the temperature inside the chamber.

[0018] This utility model not only directly dissipates heat from the power module through the radiator, but also effectively transfers heat from the chamber to the flow channel outside the chamber through the heat pipe through the heat pipe, improving the internal temperature of the chamber and indirectly cooling the heat-generating components of the inverter located within the chamber. This significantly reduces the risk of overheating and damage to the components inside the chamber, thereby extending the life of the inverter, increasing system reliability, and making the entire thermal management more efficient and reasonable. Moreover, compared with traditional cooling solutions such as cross-flow heat exchangers, heat pipe heat exchangers are smaller and more compact, making the entire inverter structure more compact, which helps save space and reduce manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the structure inside the inverter housing of the first embodiment of the present utility model;

[0020] Figure 2 This is a schematic diagram of the extracavitary flow channel structure of Example 1 of the present utility model;

[0021] Figure 3 This is a partial structural diagram of a heat pipe heat exchanger according to the first embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the extracavitary flow channel structure of the second embodiment of the present utility model;

[0023] Figure 5 This is a schematic diagram of the extracavity flow channel structure of Example 3 of the present utility model.

[0024] Description of reference numerals:

[0025] 1. Housing; 11. Chamber; 12. Outer cavity flow channel; 2. Radiator; 21. Heat dissipation substrate; 22. Heat dissipation fin group; 3. Heat pipe heat exchanger; 31. Heat pipe; 32. Inner fin group; 33. Outer fin group; 34. Inner fan of heat pipe; 35. Outer fan of heat pipe; 36. Mounting plate; 37. Bracket plate; 4. Turbine fan; 5. Inductor box; 6. External fan; 7. Power module; 8. Electronic components. DETAILED DESCRIPTION

[0026] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0027] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to"; the term "based on" means "at least partially based on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "optional embodiments". The relevant definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc. mentioned in this utility model are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0028] It should be noted that the modifications of "one" and "multiple" mentioned in the present invention are illustrative rather than restrictive. Those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0029] In related technologies, the PCB (Printed Circuit Board) and inductor assembly in the inverter are two crucial components within the inverter. PCBA technology is the process of assembling electronic components onto a PCB (printed circuit board) through methods such as SMT (surface mount technology) or DIP (dual in-line package). In photovoltaic inverters, PCBA technology ensures that the electronic components within the inverter can be accurately and stably connected together, thereby ensuring the efficiency and stability of power conversion. The inductor assembly includes an inductor, which is a component that can convert electrical energy into magnetic energy and store it. In photovoltaic inverters, the inductor assembly mainly performs functions such as energy storage, voltage boosting, filtering, and EMI (electromagnetic interference) elimination, making it one of the most critical components in the inverter.

[0030] like Figure 1 As shown, the photovoltaic inverter utilizes PCBA technology to mount electronic components 8 and power modules 7 on a printed circuit board (PCB). During inverter operation, the conversion of electrical energy and the flow of current generate a significant amount of heat. If this heat cannot be dissipated promptly, it will cause the internal temperature of the inverter to rise, further impacting the performance and lifespan of the electronic components 8, power modules 7, and inductor components mounted on the PCB.

[0031] In response to the problems existing in the above-mentioned related technologies, this embodiment provides an inverter that efficiently dissipates heat for electronic components 8 and power modules 7, as well as inductor components, disposed on a PCB within the inverter.

[0032] like Figure 1 As shown, an inverter provided by an embodiment of the present invention includes: a shell 1, a chamber 11 and an extra-cavity flow channel 12 are provided in the shell 1, a radiator 2 is provided in the extra-cavity flow channel 12, and the radiator 2 is used to dissipate heat for the power module 7 in the chamber 11; a heat pipe heat exchanger 3 is provided in the shell 1, and the heat pipe heat exchanger 3 includes at least one heat pipe 31, the evaporation end of the heat pipe 31 is arranged in the chamber 11, and the condensation end of the heat pipe 31 is arranged in the extra-cavity flow channel 12, and the heat pipe heat exchanger 3 is used to transfer the heat in the chamber 11 to the extra-cavity flow channel 12, and the extra-cavity flow channel 12 is connected to the outside.

[0033] Specifically, the housing 1 serves as the carrier of the entire heat dissipation system. The interior of the housing 1 is divided into two main parts: a chamber 11 and an external channel 12. The two are interconnected but functionally distinct. Chamber 11 primarily houses heat-generating components such as the inverter's PCB (printed circuit board). The electronic components 8 and power module 7 mounted on the PCB are located within chamber 11, while the external channel 12 provides a channel for external heat dissipation. The radiator 2 is located within the external channel 12, and its primary function is to dissipate heat from the power module 7 through contact heat dissipation. The heat pipe heat exchanger 3 consists of at least one heat pipe 31, a highly efficient heat-conducting element filled with a volatile working fluid. When one end (the evaporating end) of the heat pipe 31 is heated, the working fluid evaporates and absorbs heat. Driven by the pressure differential within the pipe, it flows to the other end (the condensing end). After releasing heat at the condensing end, the fluid condenses back into a liquid state and then flows back to the evaporating end through a capillary structure, completing a single cycle. The evaporation end of the heat pipe 31 is arranged in the chamber 11, close to the power module 7 and other heating elements, and is used to absorb the heat generated inside the inverter; the condensation end of the heat pipe 31 is arranged in the extracavity flow channel 12, connected to or adjacent to the radiator 2, and is used to transfer the absorbed heat to the extracavity flow channel 12, and then dissipate it to the outside.

[0034] In this embodiment, not only does the heat sink 2 directly dissipate heat from the power module 7, but the heat pipe heat exchanger 3 also effectively transfers heat from the chamber 11 to the external flow channel 12 via the heat pipe 31, improving the internal temperature of the chamber 11 and indirectly cooling the heat-generating components of the inverter located within the chamber. This significantly reduces the risk of overheating and damage to the components within the chamber 11, thereby extending the life of the inverter, increasing system reliability, and making the overall thermal management more efficient and reasonable. Furthermore, compared to traditional heat dissipation solutions, such as cross-flow heat exchangers, the heat pipe heat exchanger 3 is smaller and more compact, making the entire inverter structure more compact, which helps save space and reduce manufacturing costs.

[0035] Alternatively, as Figure 1 As shown, the heat sink 2 includes a heat dissipation substrate 21 and a heat dissipation fin group 22 . The heat dissipation substrate 21 is connected to the power module 7 on the side facing the cavity 11 , and the heat dissipation fin group 22 is connected to the side of the heat dissipation substrate 21 facing the extracavity flow channel 12 .

[0036] Specifically, the heat dissipation substrate 21 serves as the base part of the radiator 2, and the heat dissipation substrate 21 is responsible for transferring the heat generated by the power module 7 to the heat dissipation fin group 22. The heat dissipation substrate 21 has good thermal conductivity to ensure that heat can be quickly transferred from the power module 7 to the heat dissipation fin group 22. The heat dissipation substrate 21 is connected to the power module 7 on the side facing the cavity 11, and thermal connection is achieved through thermal adhesive, thermal pads or direct contact to ensure the efficiency and stability of heat transfer. The heat dissipation fin group 22 is connected to the side of the heat dissipation substrate 21 facing the extracavity flow channel 12, and is composed of a series of parallel or staggered fins. The thickness of the heat dissipation fins is preferably in the range of 1-2 mm. The setting of the fins increases the surface area of ​​the radiator 2, thereby improving the heat dissipation efficiency. When the hot air or coolant in the radiator 2 flows through the fin group, the heat on the fins will be quickly transferred to the fluid and dissipated to the external environment through natural convection or forced air cooling.

[0037] In this optional embodiment, the heat generated by the power module 7 is first transferred to the fin assembly 22 via the heat sink substrate 21. Simultaneously, the evaporation end of the heat pipe heat exchanger 3 absorbs heat within the chamber 11 and transfers it to the condensation end. The heat at the condensation end is then dissipated into the fluid in the extracavity flow channel 12 via the fin assembly 22. When the fluid (e.g., air) flows through the fin assembly 22, it removes heat and discharges it into the external environment. The fin assembly 22 increases the surface area of ​​the radiator 2, allowing heat to be transferred to the fluid more quickly and dissipated into the external environment through natural convection or forced air cooling. This further improves the heat dissipation efficiency of the entire heat dissipation system and helps reduce the operating temperature of the power module 7. Furthermore, the direct connection between the heat sink substrate 21 and the power module 7 and the secure mounting of the fin assembly 22 on the heat sink substrate 21 enhance the structural stability of the heat dissipation system, ensuring the continuity and stability of heat transfer, thereby improving the overall reliability of the inverter. Furthermore, by arranging the fin assembly 22 on the side of the heat sink substrate 21 facing the extracavity flow channel 12, the layout of the heat dissipation system is optimized. This ensures that heat can be smoothly transferred from the power module 7 to the heat sink fin assembly 22 and then dissipated into the external environment through the fluid, reducing heat loss and accumulation during the transfer process. Furthermore, the relatively simple configuration of the heat sink substrate 21 and the heat sink fin assembly 22 makes them easy to manufacture, helping to reduce the manufacturing cost of the heat dissipation system. Furthermore, the improved heat dissipation efficiency reduces reliance on auxiliary heat dissipation equipment such as cooling fans or pumps, further reducing the overall cost of the system.

[0038] Optionally, a heat-conducting medium is provided at the contact surface between the heat-dissipating substrate 21 and the power module 7 , and the heat-conducting medium is used to reduce the contact thermal resistance between the heat-dissipating substrate 21 and the power module 7 .

[0039] Specifically, the thermal conductive medium is a material with a high thermal conductivity, which is used to fill the tiny gap between the two contact surfaces to reduce the contact thermal resistance and improve the heat transfer efficiency. The thermal conductive medium can be a thermal adhesive, a thermal pad, a thermal grease, etc., which has good thermal conductivity and adhesion, and can ensure that heat is effectively transferred from the power module 7 to the heat dissipation substrate 21. Contact thermal resistance refers to the heat transfer barrier caused by incomplete contact between the two contact surfaces. In the inverter, there are often tiny gaps and unevenness in the contact surface between the power module 7 and the heat dissipation substrate 21, which will increase the contact thermal resistance and reduce the heat transfer efficiency.

[0040] In this optional embodiment, the heat generated by the power module 7 is first transferred through its surface to the heat-conducting medium in contact with it. The heat-conducting medium, utilizing its high thermal conductivity, rapidly transfers the heat to the heat sink substrate 21. The heat sink substrate 21 then transfers the heat to the heat sink fin assembly 22, which dissipates the heat to the external environment through natural convection or forced air cooling. The provision of the heat-conducting medium significantly reduces the contact thermal resistance between the heat sink substrate 21 and the power module 7, enabling heat to be transferred more quickly and efficiently from the power module 7 to the heat sink substrate 21, and then further to the heat sink fin assembly 22 and the external environment, thereby improving the heat transfer efficiency of the entire heat dissipation system and lowering the operating temperature of the power module 7. Furthermore, due to the presence of the heat-conducting medium, the heat sink substrate 21 can more effectively absorb the heat generated by the power module 7 and transfer it to the heat sink fin assembly 22, enhancing the heat dissipation effect, improving the heat dissipation performance of the inverter, and ensuring stable operation of the inverter at high power density. Furthermore, by reducing the contact thermal resistance, the heat-conducting medium helps lower the operating temperature of the power module 7 and extend its service life. At the same time, due to the improved heat dissipation efficiency, the overall heat load of the inverter is reduced, thereby improving the reliability and stability of the system. In addition, the thermal conductive medium can simplify the heat dissipation design to a certain extent, making the connection between the heat dissipation substrate 21 and the power module 7 more compact and reliable, and achieving efficient heat transfer without the need for additional heat dissipation structures or materials.

[0041] Optionally, a heat pipe is embedded in the heat dissipation substrate 21 , and an evaporation end of the heat pipe is in contact with the power module 7 .

[0042] Specifically, the heat pipe is a highly efficient heat conduction element, consisting of a working fluid (such as water, alcohol or other low-boiling-point liquid) and a capillary structure enclosed in a vacuum tube. At one end of the heat pipe (the evaporation end), the working fluid evaporates due to heat to form steam, which flows to the other end (the condensation end) under the pressure inside the tube. After releasing heat at the condensation end, it condenses back into liquid, and then returns to the evaporation end through the capillary structure, forming a closed-loop heat transfer process. When the evaporation end is heated, the working fluid evaporates and fills the steam cavity, then diffuses toward the condensation end, condenses after releasing heat, and then flows back to the evaporation end through the capillary structure. In this embodiment, the evaporation end of the heat pipe is in contact with the power module 7, and the heat generated by the power module 7 can be directly and efficiently transferred to the heat pipe, and then quickly transferred to other parts of the radiator 2 through them, and finally carried away by the external environment.

[0043] In this optional embodiment, the heat generated by the power module 7 is directly transferred to the evaporation end of the heat pipe attached to it. The working fluid in the heat pipe is heated and evaporated, forming steam, which flows toward the condensation end under the pressure inside the pipe. The steam releases heat at the condensation end, condenses into liquid, and then flows back to the evaporation end through the capillary structure, completing a heat transfer cycle. The heat released at the condensation end is dissipated to the external environment through the heat dissipation fin group 22 of the radiator 2. As an efficient heat conduction element, the heat pipe can significantly reduce the thermal resistance during the transfer of heat from the power module 7 to the radiator 2, thereby improving the heat transfer efficiency. Because the heat pipe can quickly transfer the heat generated by the power module 7 to other parts of the radiator 2 and dissipate it to the external environment through the heat dissipation fin group 22, the heat dissipation performance of the entire heat dissipation system is significantly enhanced. In addition, by arranging the heat pipe on the heat dissipation substrate 21, a structure similar to a temperature plate can be formed, which can provide a more uniform temperature distribution, ensuring that the power module 7 does not generate local overheating during operation, thereby improving the reliability and stability of the inverter. In addition, due to the high thermal conductivity of the heat pipe, the volume and weight of the radiator 2 can be reduced while maintaining the same heat dissipation effect, which is conducive to the lightweight and miniaturization of the inverter.

[0044] Alternatively, as Figure 3 As shown, the heat pipe heat exchanger 3 also includes an inner fin group 32 and an outer fin group 33. The inner fin group 32 includes a plurality of inner fins arranged at intervals, and the evaporation end of the heat pipe 31 is sequentially penetrated by the plurality of inner fins. The outer fin group 33 includes a plurality of outer fins arranged at intervals, and the condensation end of the heat pipe is sequentially penetrated by the plurality of outer fins.

[0045] Specifically, the inner fin group 32 comprises a plurality of spaced inner fins, and the evaporation end of the heat pipe 31 is sequentially arranged through the inner fins. The presence of the inner fins increases the heat exchange area, so that the heat in the chamber 11 can be transferred to the evaporation end of the heat pipe 31 more quickly. The outer fin group 33 comprises a plurality of spaced outer fins, and the condensation end of the heat pipe 31 is sequentially arranged through the outer fins. Similar to the inner fins, the outer fins also increase the heat exchange area between the condensation end and the heat dissipation fin group 22 or the external environment. When the working medium in the heat pipe 31 releases heat and condenses at the condensation end, the outer fins can more effectively dissipate heat to the external environment through natural convection or forced air cooling. The heat pipe 31 is filled with working medium, when the evaporation end is heated, the working medium evaporates to form steam, the steam flows to the condensation end under the pressure in the pipe, and condenses into liquid after releasing heat at the condensation end. The liquid returns to the evaporation end by capillary structure or gravity, completing a heat transfer cycle. The presence of the inner fin group 32 and the outer fin group 33 respectively enhances the heat transfer efficiency of the evaporation end and the condensation end, so that the performance of the entire heat pipe heat exchanger 3 is improved.

[0046] In this optional embodiment, multiple heat pipes 31 are arranged in an equidistant array, and the number and specifications of the heat pipes 31 should match the total heat exchange capacity of the heat pipe heat exchanger 3. The inner fin group 32 and the outer fin group 33 of the heat pipe heat exchanger 3 are both made using the fin buckle process. The heat pipe 31 passes through each inner fin and each outer fin respectively using the fin through process, and each inner fin and each outer fin is connected to the heat pipe 31 using the reflow soldering process to ensure good thermal contact of the welding surface and avoid defects such as cold soldering. The interior of the heat pipe 31 is hollow and filled with phase change material. The optimal thickness range of the inner fin and outer fin of the heat pipe heat exchanger 3 is 0.3mm-0.5mm. A mounting plate 36 is connected to the middle of the heat pipe heat exchanger 3. Several sealing grooves are machined into the mounting plate 36. The number of sealing grooves matches the number of heat pipes 31. When installing the heat pipe heat exchanger 3, the heat pipes 31 are passed through the sealing grooves, sealing rings are installed in the sealing grooves, and the mounting plate 36 is then attached to the inverter housing 1 and tightened with bolts. Bracket plates 37 are connected to both sides of the inner fin group 32 and outer fin group 33 of the heat pipe heat exchanger 3. Bracket plates 37 provide support for the heat pipe heat exchanger 3 and are provided with screw holes for fixing to the inverter housing 1 or other structural support members. The arrangement of the inner fin group 32 and outer fin group 33 of the heat pipe heat exchanger 3 significantly increases the heat exchange area, allowing heat to be transferred more quickly to the evaporation end of the heat pipe 31 and released more efficiently at the condensation end, thereby improving the heat transfer efficiency of the entire heat pipe heat exchanger 3 and reducing the operating temperature of the power module 7. Due to the improvement in heat transfer efficiency, the heat pipe heat exchanger 3 can more effectively dissipate the heat generated by the power module 7 to the external environment, which helps to reduce the overall heat load of the inverter and improve the reliability and stability of the system. The shape and arrangement of the inner fins can optimize fluid flow, improve the heat convection effect, and help further enhance the heat transfer efficiency and improve the heat dissipation performance. In addition, by increasing the fin group to increase the heat exchange area, compared with simply increasing the number of heat pipes 31 or increasing the size of the heat pipe 31, it can more effectively utilize materials and reduce costs. In addition, according to the specific application scenario and needs, the number, shape and arrangement of the inner fin group 32 and the outer fin group 33 can be flexibly adjusted to adapt to different heat dissipation needs.

[0047] Alternatively, as Figure 1 As described above, the heat pipe heat exchanger 3 also includes a heat pipe inner fan 34, which is arranged on the side of the inner fin group 32 facing the power module 7. The heat pipe inner fan 34 is used to draw air from the inner fin group 32 and blow air toward one side of the power module 7.

[0048] Specifically, the heat pipe fan 34 is a small fan device installed on the side of the inner fin assembly 32 of the heat pipe heat exchanger 3 facing the power module 7. The heat pipe fan 34 draws air from the inner fin assembly 32 and blows the extracted, heat-exchanged, cool air toward the side of the power module 7. By actively moving air, the heat pipe fan 34 accelerates the heat exchange process between the inner fin assembly 32 and the air in the chamber 11. When the heat pipe fan 34 is operating, it draws air near the inner fin assembly 32 and, through the heat exchange action of the inner fins, transfers heat from the evaporation end of the heat pipe 31 to the air. The cooled air is then blown into the chamber 11 by the heat pipe fan 34, completing the heat transfer. The interior of the heat pipe 31 is filled with a working fluid. When the evaporation end is heated, the working fluid evaporates to form vapor. The vapor flows toward the condensation end under the pressure within the pipe, where it releases heat and condenses into liquid. The liquid then flows back to the evaporation end through capillary structure or gravity, completing a heat transfer cycle. In this process, the inner fin group 32 enhances the heat exchange efficiency between the evaporation end and the air, while the fan 34 in the heat pipe further improves the efficiency of this process through active air flow.

[0049] In this optional embodiment, the introduction of the fan 34 within the heat pipe significantly improves the heat exchange efficiency between the inner fin group 32 and the air in the chamber 11 through active air flow, helping to accelerate heat transfer, reduce the operating temperature of the power module 7, and improve the performance of the entire heat dissipation system. Due to the improved heat exchange efficiency, the heat pipe heat exchanger 3 can more effectively dissipate the heat generated by the power module 7 into the air in the chamber 11. At the same time, the blowing action of the fan 34 within the heat pipe can also reduce the temperature within the chamber 11 to a certain extent, further enhancing the heat dissipation performance. The fan 34 within the heat pipe can be adjusted according to specific application scenarios and needs to achieve the best air flow effect. For example, the heat exchange process between the inner fin group 32 and the air in the chamber 11 can be optimized by adjusting parameters such as the fan speed, wind direction, and position. The fan wind direction directly blows towards the fin gap of the inner fin group 32, which can more effectively utilize the heat dissipation area of ​​the fins. The air flowing in the fin gap can more fully contact the fins, thereby improving the efficiency of heat transfer. By improving heat exchange efficiency and heat dissipation performance, the introduction of fans 34 within the heat pipe helps reduce the overall thermal load of the inverter, reducing the risk of failure due to overheating, helping to improve system reliability and stability, and extending the lifespan of the inverter. Furthermore, this feature can be flexibly adjusted to suit different application scenarios and requirements. For example, in scenarios requiring higher heat dissipation performance, the number of fans 34 within the heat pipe can be increased or the fan speed can be increased; in environments requiring quieter operation, low-noise fans can be selected.

[0050] Alternatively, as Figure 1As shown, the chamber 11 is provided with a turbulence fan 4, which is arranged at a different end of the chamber 11 opposite to the heat pipe inner fan 34, and the air duct of the turbulence fan 4 is parallel to the air duct of the heat pipe inner fan 34.

[0051] Specifically, the turbulence fan 4 is a fan specially used for changing or optimizing air flow, which is placed in the chamber 11 opposite to the heat pipe inner fan 34, and the air duct of the turbulence fan 4 is parallel to the air duct of the heat pipe inner fan 34. The turbulence fan 4 functions to interfere with and redistribute the air flow in the chamber 11 by generating a specific air flow pattern, thereby improving the heat exchange efficiency of the air. As mentioned before, the heat pipe inner fan 34 is responsible for drawing air from the inner fin group 32 and blowing the heat-exchanged air into the chamber 11, which enhances the heat exchange efficiency between the inner fin group 32 and the air in the chamber 11, and is an important component in the heat dissipation system. When the turbulence fan 4 and the heat pipe inner fan 34 work simultaneously, they jointly act on the air flow in the chamber 11, the air flow generated by the heat pipe inner fan 34 is first heat-exchanged by the inner fin group 32 and then blown into the chamber 11. The turbulence fan 4 further interferes with and redistributes the air blown into the chamber 11 by the air flow generated by the turbulence fan 4, which helps to break the laminar state of the air flow and increase the turbulence degree, thereby improving the heat exchange efficiency of the air. Moreover, the air ducts of the turbulence fan 4 and the heat pipe inner fan 34 remain parallel, which helps to ensure that the air flows generated by the two fans form a consistent and stable air flow field in the chamber 11, simplifying the control and management of the air flow and improving the overall efficiency and reliability of the heat dissipation system. In addition, the heat pipe inner fan 34 and the turbulence fan 4 form relatively staggered air ducts in the chamber 11, which makes the air circulate in the chamber 11, thereby cooling the heat-generating components in the chamber 11 to the greatest extent.

[0052] In this optional embodiment, the turbulence fan 4 changes the air flow pattern and distribution within the chamber 11, increasing the contact area and contact time between the air and the heat dissipation element, thereby improving heat exchange efficiency, helping to reduce the operating temperature of the power module 7, and enhancing the performance of the entire heat dissipation system. Furthermore, by optimizing air flow, the turbulence fan 4 and the fan 34 within the heat pipe work together to improve the heat dissipation process within the chamber 11, not only improving heat dissipation efficiency but also enhancing the stability and reliability of the heat dissipation system. The introduction of the turbulence fan 4 helps disrupt the laminar flow of the air, increasing turbulence and creating a more uniform and efficient air flow pattern around the heat dissipation element, further improving the performance of the heat dissipation system. Furthermore, by optimizing air flow and heat dissipation, the introduction of the turbulence fan 4 helps reduce the overall thermal load of the inverter, reducing the risk of failure due to overheating, improving system reliability and stability, and extending the inverter's service life. Furthermore, the turbulence fan 4 can be flexibly adjusted to suit different application scenarios and requirements. For example, in scenarios requiring higher heat dissipation performance, the number of turbulence fans 4 can be increased or their position adjusted; in environments requiring quieter operation, a low-noise fan device can be selected.

[0053] Alternatively, as Figure 2 As shown, a plurality of inductance boxes 5 are provided in the extracavity flow channel 12 . The inductance boxes 5 are used to place inductance components and to dissipate heat generated by the inductance components.

[0054] Specifically, the inductor box 5 is a container or box for placing the inductor component. Within the extracavity flow channel 12, the inductor box 5 is spaced apart on one side of the radiator 2. The inductor box 5 is made of a material with good thermal conductivity so as to effectively transfer the heat generated by the inductor component to the radiator 2. The inductor component is a common component in power electronic equipment and generates a certain amount of heat during operation. Traditional heat dissipation methods may not be able to effectively dissipate the heat generated by the inductor component, resulting in excessively high temperatures of the inductor component, affecting the performance and reliability of the equipment. The inductor box 5, on the other hand, achieves effective heat dissipation by placing the inductor component in a box with good thermal conductivity and transferring the heat to the radiator 2. The radiator 2 is an important component of the heat dissipation system, which generally dissipates heat to the environment through heat conduction, convection, and radiation. The extracavity flow channel 12 is a channel between the radiator 2 and the external environment, which allows air or other cooling media to flow through the radiator 2, thereby removing heat. The inductor box 5 is positioned on one side of the heat sink 2. Heat generated by the inductor assembly is transferred through the inductor box 5 to the heat sink 2 and ultimately dissipated into the environment through the extracavity flow channel 12. By placing the inductor assembly in the inductor box 5 and integrating it with the heat sink 2, effective heat management is achieved. Heat generated by the inductor assembly is quickly transferred to the heat sink 2 and dissipated into the environment through the extracavity flow channel 12, thereby reducing the operating temperature of the inductor assembly and improving the performance and reliability of the device.

[0055] In this optional embodiment, the inductor box 5 allows the heat generated by the inductor assembly to be more efficiently transferred to the heat sink 2 and dissipated into the environment through the extracavity flow channel 12, thereby improving heat dissipation efficiency and reducing the operating temperature of the inductor assembly. Furthermore, by placing the inductor assembly in the inductor box 5 and combining it with the heat sink 2, the heat dissipation structure is optimized, making the heat dissipation system more compact, efficient, and easy to maintain and manage. Furthermore, the operating temperature of the inductor assembly is one of the key factors affecting the reliability and lifespan of the device. By reducing the operating temperature of the inductor assembly, the reliability of the device is improved and the service life of the device is extended. Furthermore, the design can be flexibly adjusted according to different application scenarios and requirements. For example, in scenarios requiring higher heat dissipation performance, the number of inductor boxes 5 can be increased or their position adjusted; in scenarios requiring a more compact design, the structure of the inductor box 5 and the heat sink 2 can be optimized. Therefore, by integrating the heat dissipation of the inductor assembly with the overall heat dissipation system, heat dissipation management is simplified. This makes the heat dissipation system simpler and more convenient, reducing system complexity and cost.

[0056] Alternatively, as Figure 2 As shown, a plurality of external fans 6 are further provided in the extracavity flow channel 12 . The plurality of external fans 6 are spaced apart on the side of the radiator 2 away from the inductor box 5 . The external fans 6 are used to provide air volume for heat dissipation of the radiator 2 , the inductor box 5 and the heat pipe heat exchanger 3 .

[0057] Specifically, the external fan 6 is a device for generating air flow in the heat dissipation system. The external fan 6 is installed on the side of the radiator 2 away from the inductor box 5 and outside the cavity flow channel 12. When the external fan 6 is working, the wind force generated by it will push the air to flow in the cavity flow channel 12. This air will pass through the radiator 2, the inductor box 5 and the heat pipe heat exchanger 3, remove the heat on their surfaces, and finally be discharged into the environment through the cavity flow channel 12. The air flow not only helps to reduce the temperature of the heat dissipation components, but also improves the efficiency of the heat dissipation system. The radiator 2 transfers heat from the heat source (such as the power module 7) to the environment through its large-area heat sink and heat pipe. The inductor box 5 is used to place the inductor component and transfers heat to the cavity flow channel 12 through its heat conductive structure. The heat pipe heat exchanger 3 uses the thermal conductivity of the heat pipe 31 to transfer heat from the heat source to the cavity flow channel 12, and then dissipates heat through air flow. The number and speed of the external fans 6 can be adjusted according to the heat dissipation requirement. When the heat dissipation requirement is high, the number of external fans 6 can be increased or their speed can be increased to increase air flow and heat dissipation efficiency. Conversely, when the heat dissipation requirement is low, the number of external fans 6 can be reduced or their speed can be lowered to reduce energy consumption and noise.

[0058] In this optional embodiment, the introduction of the external fan 6 enhances the air flow in the extracavity flow channel 12, allowing the radiator 2, the inductor box 5, and the heat pipe heat exchanger 3 to dissipate heat more effectively, reducing the temperature of the heat dissipation elements and improving the efficiency of the entire heat dissipation system. By adjusting the number and speed of the external fans 6, the heat dissipation performance can be optimized according to the heat dissipation requirements, so that the heat dissipation system can adapt to different working environments and load conditions, ensuring the stable operation of the equipment. The introduction of the external fan 6 helps to reduce the temperature of the heat dissipation elements, reduce the risk of failure due to overheating, improve the reliability of the system, and extend the service life of the equipment. When the heat dissipation requirements are low, energy consumption and noise can be reduced by reducing the number of external fans 6 or lowering their speed, which not only meets the heat dissipation requirements but also takes into account environmental protection and comfort requirements. In addition, the external fans 6 are usually installed on the outside of the radiator 2, making maintenance and replacement more convenient. In addition, since the external fans 6 are independent heat dissipation elements, their failure will not have a serious impact on the entire heat dissipation system, reducing maintenance costs.

[0059] Optionally, in order to cool the outer fin group 33 of the heat pipe heat exchanger 3, the present invention provides three different embodiments:

[0060] Example 1:

[0061] like Figure 2As shown, the heat pipe heat exchanger 3 further includes a heat pipe external fan 35 , which is used to blow air toward the external fin group 33 , thereby cooling the condensation end of the heat pipe 31 .

[0062] In the heat pipe heat exchanger 3, a heat pipe external fan 35 is specifically arranged on the side of the outer fin group 33 facing the radiator 2. The main function of the heat pipe external fan 35 is to blow air toward the outer fin group 33, increasing the air flow rate on the surface of the outer fin group 33, thereby enhancing the thermal convection effect and accelerating the heat loss from the condensation end of the heat pipe 31. After the evaporation end of the heat pipe 31 absorbs heat from the heat source (such as the power module 7), the heat is transferred to the condensation end through the working medium inside the heat pipe 31. The condensation end then releases the heat to the outer fin group 33. The blowing effect of the heat pipe external fan 35 allows the heat on the outer fin group 33 to be transferred to the environment more quickly through air convection, thereby achieving efficient heat dissipation.

[0063] The external fan 35 significantly enhances the heat dissipation efficiency at the condensing end of the heat pipe 31, enabling the heat pipe 31 to respond more quickly and remove heat generated by the heat source. Furthermore, by precisely controlling the speed and direction of the external fan 35, the heat dissipation process can be finely tuned to meet the cooling requirements under varying load conditions. This efficient heat dissipation reduces the overall system temperature, extends the equipment's lifespan, and improves system stability and reliability.

[0064] Example 2:

[0065] like Figure 4 As shown, a plurality of external fans 6 are linearly spaced apart and arranged on a side of the radiator 2 away from the inductor box 5, and an external fin group 33 is arranged on one side of the heat dissipation fin group 22. The arrangement direction of the external fin group 33 and the heat dissipation fin group 22 is consistent with the arrangement direction of the plurality of external fans 6.

[0066] An external fan 6 is spaced apart on the side of the radiator 2 away from the inductor box 5. The airflow generated by the external fan 6 acts simultaneously on the external fin assembly 33 and the heat dissipation fin assembly 22, providing sufficient cooling airflow for both. The external fin assembly 33 dissipates heat from the condensing end of the heat pipe 31, while the heat dissipation fin assembly 22 may be directly connected to the radiator 2 or other heat source for heat dissipation. The blowing action of the external fan 6 ensures that both heat dissipation areas are adequately cooled.

[0067] The external fan 6 simultaneously acts on the external fin assembly 33 and the heat dissipation fin assembly 22, achieving overall optimization of the heat dissipation system and improving heat dissipation efficiency. By juxtaposing the external fin assembly 33 and the heat dissipation fin assembly 22, and integrating heat dissipation by the external fan 6, the heat dissipation system structure is simplified, manufacturing costs are reduced, and the heat dissipation system can be flexibly adjusted to meet different heat dissipation requirements, such as by increasing or decreasing the number of external fans 6 to change the heat dissipation air volume.

[0068] Example 3:

[0069] like Figure 5 As shown, several external fans 6 are linearly spaced apart on one side of the radiator 2 away from the inductor box 5 , and the external fin group 33 is arranged on one side of the inductor boxes 5 . The arrangement direction of the external fin group 33 and the inductor boxes 5 is consistent with the arrangement direction of the external fans 6 .

[0070] The external fin assembly 33 is arranged in parallel with the inductor box 5 and spaced apart on the side of the fin assembly 22 away from the external fan 6. Heat generated by the inductor assembly within the inductor box 5 is transferred to the fin assembly 22 through its heat dissipation structure, while the external fin assembly 33 dissipates heat at the condensing end of the heat pipe 31. The external fan 6 is positioned on the side of the fin assembly 22 away from the chamber 11, providing airflow across the entire heat dissipation area. This fully utilizes the heat dissipation area of ​​the fin assembly 22 and simultaneously dissipates heat from the inductor assembly and the condensing end of the heat pipe 31.

[0071] The parallel arrangement of the external fin assembly 33 and the inductor box 5 fully utilizes the limited heat dissipation space, improving the compactness and integration of the heat dissipation system. The inductor assembly and the condenser end of the heat pipe 31 share the heat dissipation fin assembly 22, improving heat dissipation efficiency and reducing heat dissipation costs. The heat dissipation system can simultaneously handle heat generated by multiple heat sources, enhancing the system's thermal management capabilities and stability.

[0072] Although the present invention is disclosed as above, the protection scope of the present invention is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications will fall within the protection scope of the present invention.

Claims

1. An inverter, characterized in that: include: A shell (1) is provided with a chamber (11) and an external flow channel (12) in communication with each other in the shell (1), a radiator (2) is provided in the external flow channel (12), and the radiator (2) is used to dissipate heat from a power module (7) in the chamber (11); a heat pipe heat exchanger (3) is provided in the shell (1), and the heat pipe heat exchanger (3) includes at least one heat pipe (31), an evaporation end of the heat pipe (31) is provided in the chamber (11), and a condensation end of the heat pipe (31) is provided in the external flow channel (12); the heat pipe heat exchanger (3) is used to transfer heat in the chamber (11) to the external flow channel (12), and the external flow channel (12) is communicated with the outside.

2. The inverter according to claim 1, characterized in that The heat sink (2) comprises a heat dissipation substrate (21) and a heat dissipation fin group (22); the heat dissipation substrate (21) is connected to the power module (7) on a side facing the chamber (11); and the heat dissipation fin group (22) is connected to the heat dissipation substrate (21) on a side facing the extracavity flow channel (12).

3. The inverter according to claim 2, characterized in that: A heat-conducting medium is provided at the contact surface between the heat-dissipating substrate (21) and the power module (7), and the heat-conducting medium is used to reduce the contact thermal resistance between the heat-dissipating substrate (21) and the power module (7).

4. The inverter according to claim 2, characterized in that: A heat pipe is embedded in the heat dissipation substrate (21), and an evaporation end of the heat pipe is in contact with the power module (7).

5. The inverter according to claim 2, characterized in that: The heat pipe heat exchanger (3) further comprises an inner fin group (32) and an outer fin group (33), wherein the inner fin group (32) comprises a plurality of inner fins arranged at intervals, and the evaporation end of the heat pipe (31) is sequentially penetrated by the plurality of inner fins, and the outer fin group (33) comprises a plurality of outer fins arranged at intervals, and the condensation end of the heat pipe (31) is sequentially penetrated by the plurality of outer fins.

6. The inverter according to claim 5, characterized in that The heat pipe heat exchanger (3) further comprises a heat pipe inner fan (34), which is arranged on a side of the inner fin group (32) facing the power module (7), and is used to draw air from the inner fin group (32) and blow air toward one side of the power module (7).

7. The inverter according to claim 6, characterized in that: A turbulence fan (4) is provided in the chamber (11), and the turbulence fan (4) and the fan (34) in the heat pipe are respectively arranged at different ends on opposite sides of the chamber (11), and the air duct of the turbulence fan (4) is parallel to the air duct of the fan (34) in the heat pipe.

8. The inverter according to claim 7, characterized in that: A plurality of inductance boxes (5) are provided in the extracavity flow channel (12), and the inductance boxes (5) are used for placing inductance components and for dissipating heat generated by the inductance components.

9. The inverter according to claim 8, characterized in that: A plurality of external fans (6) are further provided in the extracavity flow channel (12). The plurality of external fans (6) are arranged at intervals on a side of the radiator (2) away from the inductor box (5). The external fans (6) are used to provide air volume for heat dissipation of the radiator (2), the inductor box (5) and the heat pipe heat exchanger (3).

10. The inverter according to claim 9, characterized in that: The heat pipe heat exchanger (3) further comprises a heat pipe external fan (35), wherein the heat pipe external fan (35) is used to blow air toward the external fin group (33), thereby cooling the condensation end of the heat pipe (31); or a plurality of the external fans (6) are linearly spaced apart and arranged on a side of the radiator (2) away from the inductor box (5), the external fin group (33) is arranged on one side of the heat dissipation fin group (22), and the arrangement direction of the external fin group (33) and the heat dissipation fin group (22) is consistent with the arrangement direction of the plurality of the external fans (6); Or the plurality of external fans (6) are arranged linearly and spaced apart on a side of the radiator (2) away from the inductor box (5), the external fin group (33) is arranged on one side of the plurality of inductor boxes (5), and the arrangement direction of the external fin group (33) and the plurality of inductor boxes (5) is consistent with the arrangement direction of the plurality of external fans (6).

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