Printed circuit structure

Abstract

A printed circuit structure is matched with a light-emitting diode and comprises a printed circuit board, a bonding pad and the light-emitting diode. The printed circuit board has a certain thickness, and a through hole is formed in the printed circuit board; the bonding pad is of a small plate-shaped structure, and the bonding pad is arranged at the bottom of the printed circuit board; the light emitting diode is arranged at the bottom of the printed circuit board and is arranged at the bottom of the through hole; through the arrangement, state display can be realized, and the problem that the bonding pad is exposed and unstable is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to element technical field especially relates to a printed circuit structure. BACKGROUND

[0002] The printed circuit module refers to the direct combination of the printed circuit board and the base, and can realize the specific function of the electrical instrument module, the printed circuit board serves as an appearance surface of the module, plays the double role of arranging components and the shell, saves the material and reduces the resource consumption, therefore, most of the modules are installed in the control cabinet, and the applicability is good. The printed circuit board on the module generally adopts single / double-sided copper according to the complexity of the function, and the power supply or the signal state display is usually configured and arranged on the front surface of the printed circuit board, and the wiring terminal with the height higher than the indicator light is configured, which can better replace most simple function electrical instruments.

[0003] Most of the components are arranged on the bottom surface of the printed circuit board, if the components are arranged on the front surface, the straight insertion package should be reasonably used, in the normal process without additional surface treatment, the soldering pad on the front surface of the printed circuit board is exposed, for the terminal type soldering pad, the terminal seat is welded and covers the soldering pad, which is stable and has no problem, but for the display state light emitting diode, the following problems exist: the light emitting diode is fixed on the printed circuit board by the soldering pin, and is not in a stable fixed state, and is easy to be damaged due to accidental external force. CONTENT

[0004] Therefore, the application provides a printed circuit structure, which is a light emitting diode welded on the bottom of a printed circuit board and can display real-time state.

[0005] According to an aspect of the application, a printed circuit structure is provided, which cooperates with a light emitting diode and comprises a printed circuit board, a soldering pad and a light emitting diode; the printed circuit board has a certain thickness, and a through hole is formed in the printed circuit board; the soldering pad is a small plate-shaped structure, and is arranged at the bottom of the printed circuit board; and the light emitting diode is arranged at the bottom of the printed circuit board and at the bottom of the through hole.

[0006] In a possible implementation, the two soldering pads are a group and are arranged on the two sides of the light emitting diode respectively.

[0007] In a possible implementation, the two soldering pads are a group and are arranged on the two sides of the light emitting diode respectively.

[0008] In a possible implementation, the two soldering pads are a group and are arranged on the two sides of the light emitting diode respectively.

[0009] In a possible implementation, the diameter of the light-emitting diode is the same as the diameter of the through hole.

[0010] In a possible implementation, the thickness of the printed circuit board is not less than the height of the display head of the light-emitting diode.

[0011] In a possible implementation, one of the through holes, one of the light-emitting diodes and two of the pads form a display group.

[0012] In a possible implementation, a plurality of display groups can be arranged on the printed circuit board.

[0013] In a possible implementation, the material of the printed circuit board is aluminum, copper or tungsten.

[0014] The utility model discloses the beneficial effect that: through setting printed circuit board, pad and light-emitting diode, pad and light-emitting diode are all arranged at the bottom of printed circuit board, in order to be the display head of light-emitting diode has the place to place, and the through hole is seted to printed circuit board, and light-emitting diode is arranged below the through hole, and after welding, the display head of light-emitting diode is in the inside of through hole, can realize state display, and the utility model discloses through the above setting, pad and light-emitting diode are all arranged at the bottom of printed circuit board, and state display can also be realized.

[0015] Other features and aspects of the present application will become apparent from the following detailed description of example embodiments, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate example embodiments, features, and aspects of the present application and serve to explain the principles of the present application.

[0017] Figure 1 A schematic diagram showing the printed circuit structure of the embodiment of the present application;

[0018] Figure 2 A printed circuit board structure schematic diagram showing the printed circuit structure of the embodiment of the present application. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be apparently and completely described below with reference to the drawings in the embodiments of the present application, and obviously, the described embodiments are only part of the embodiments of the present application, but not all the embodiments.

[0020] Examples of the embodiments are illustrated in the accompanying drawings, wherein identical or similar symbols represent identical or similar elements or elements having identical or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0021] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application or simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0022] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0023] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing", "connection", "hinge" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0024] As Figures 1 to 2 As shown in the figure, the printed circuit structure cooperates with the light emitting diode and comprises a printed circuit board 100, a solder pad 200 and a light emitting diode 300; the printed circuit board 100 has a certain thickness, and the printed circuit board 100 is provided with a through hole 110; the solder pad 200 is a small plate-shaped structure, and the solder pad 200 is arranged at the bottom of the printed circuit board 100; the light emitting diode 300 is arranged at the bottom of the printed circuit board 100 and at the bottom of the through hole 110.

[0025] Specifically, as Figure 1As shown, the printed circuit structure specifically includes a printed circuit board 100, a pad 200 and a light-emitting diode 300. In order to ensure that the pad 200 is not exposed, the pad 200 is set at the bottom of the printed circuit board 100. However, in order to facilitate the connection between the light-emitting diode 300 and the pad 200, the light-emitting diode 300 is also set at the bottom of the printed circuit board 100. In order to ensure that the light-emitting diode 300 is soldered to the bottom of the printed circuit board 100, there is a place to place the display head, such as Figure 2 As shown, a through hole 110 is opened on the printed circuit board 100 . In order to facilitate the placement of the display head, the light emitting diode 300 is arranged below the through hole 110 .

[0026] In a possible implementation, two pads 200 form a group and are respectively arranged on both sides of the light-emitting diode 300; there is a preset distance between the two pads 200 and the light-emitting diode 300; and the pads 200 and the light-emitting diode 300 are electrically connected.

[0027] Specifically, such as Figure 1 As shown, because the light-emitting diode 300 has a positive and negative pole, the soldering pads 200 are arranged in a group of two, respectively arranged on both sides of the light-emitting diode 300, and connected to the positive and negative poles of the light-emitting diode 300, so the two soldering pads 200 are electrically connected to the light-emitting diode 300. In order to facilitate the connection between the soldering pads 200 and the light-emitting diode 300, there is a certain preset distance between the soldering pads 200 and the light-emitting diode 300 to facilitate the connection.

[0028] In a possible implementation, the diameter of the light emitting diode 300 is the same as the diameter of the through hole 110 .

[0029] Specifically, such as Figure 1 As shown, in order to ensure that the display head can be accurately placed in the through hole 110 after the LED 300 is soldered to the printed circuit board 100 , the diameter of the LED 300 is the same as the diameter of the through hole 110 .

[0030] In a possible implementation, the thickness of the printed circuit board 100 is not less than the height of the display head of the light emitting diode 200 .

[0031] Specifically, such as Figure 1 As shown, in order to prevent the display head of the light emitting diode 200 from being exposed, the thickness of the printed circuit board 100 is not less than the height of the display head of the light emitting diode 200 .

[0032] In a possible implementation, one through hole 110 , one light-emitting diode 300 , and two pads 200 constitute a display group.

[0033] In a possible implementation, a plurality of display groups can be arranged on the printed circuit board 100.

[0034] Specifically, as shown in the figure, one through hole 110, one light emitting diode 300 and two pads 200 form a display group, and a plurality of display groups can be arranged on the printed circuit board 100 according to actual conditions, which is convenient for use. Figure 1

[0035] In a possible implementation, the material of the printed circuit board 100 is aluminum, copper or tungsten.

[0036] Specifically, aluminum, copper or tungsten is selected because it has good heat dissipation performance and mechanical strength, excellent electrical conductivity, can effectively improve the conduction performance of the printed circuit board 100, has good electromagnetic shielding effect and can reduce electromagnetic interference; the material of the printed circuit board 100 can also be glass fiber reinforced epoxy resin based material, because the glass fiber reinforced epoxy resin based material has good mechanical strength, heat resistance and chemical corrosion resistance, excellent electrical performance and processing performance, moderate dielectric constant, is suitable for general circuit board design, has good flame retardant performance and can prevent fire spread to a certain extent.

[0037] The printed circuit board 100, the pad 200 and the light emitting diode 300 are arranged, the pad 200 and the light emitting diode 300 are arranged on the bottom of the printed circuit board 100, the through hole 110 is arranged on the printed circuit board 100 to place the display head of the light emitting diode 300, the light emitting diode is arranged below the through hole 110, the diameter of the light emitting diode 300 is the same as the diameter of the through hole 110, the display head of the light emitting diode 300 is arranged inside the through hole after welding, the state display can be realized, and the problems of pad exposure and instability are solved.

[0038] The above describes only a preferred embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can make equivalent replacement or change according to the technical scheme and concept of the present application within the scope disclosed by the present application, which should be covered in the protection scope of the present application.​

Claims

1. A printed circuit structure, matched with a light emitting diode, characterized in that: including printed circuit boards, solder pads and light-emitting diodes; The printed circuit board has a certain thickness and is provided with a through hole; The pad is a small plate-shaped structure, and the pad is arranged at the bottom of the printed circuit board; The light emitting diode is arranged at the bottom of the printed circuit board and at the bottom of the through hole.

2. The printed circuit structure according to claim 1, characterized in that: The two solder pads form a group and are respectively arranged on both sides of the light emitting diode.

3. The printed circuit structure according to claim 2, characterized in that: There is a preset distance between the two solder pads and the light emitting diode.

4. The printed circuit structure according to any one of claims 1 to 3, characterized in that: The soldering pad is electrically connected to the light emitting diode.

5. The printed circuit structure according to any one of claims 1 to 3, characterized in that: The diameter of the light emitting diode is the same as the diameter of the through hole.

6. The printed circuit structure according to claim 5, characterized in that: The thickness of the printed circuit board is not less than the height of the display head of the light emitting diode.

7. The printed circuit structure according to claim 6, characterized in that: One through hole, one light emitting diode and two pads form a display group.

8. The printed circuit structure according to claim 7, characterized in that: A plurality of display groups may be arranged on the printed circuit board.

9. The printed circuit structure according to claim 8, characterized in that: The printed circuit board is made of aluminum, copper or tungsten.

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