Quartz wafer processing device

Abstract

A quartz wafer processing device relates to the technical field of quartz wafer processing and comprises a water tank, a first driving motor is mounted at the bottom end of the inner side of the water tank, a connecting block is mounted at the top end of the first driving motor, a sleeve column is fixedly connected to the top end of the connecting block, and a movable column sleeves the top end of the sleeve column. By adopting the structure, a proper amount of water source is injected into the water tank through the circulating water pump, and then the first driving motor is started to drive the clamping mechanism to rotate, so that a good water source cleaning effect can be achieved under the condition of water flow stamping; the electric push rod is started to push the clamping mechanism to move upwards, under the mutual cooperation of the movable column and the sleeve column, the situation that the clamping mechanism cannot be pushed can be avoided, and the cleaning efficiency of the quartz crystal wafer body is effectively improved while subsequent grinding machining of the quartz crystal wafer body is not hindered.

Description

TECHNICAL FIELD

[0001] The utility model belongs to quartz wafer processing technical field, in particular to a quartz wafer processing device. BACKGROUND

[0002] Quartz wafer is a kind of special industrial technology material made of silicon dioxide, also called quartz sheet or quartz plate, it has high temperature resistance, strong pressure resistance, corrosion resistance and wear resistance, and excellent optical performance, quartz wafer is widely used in electronic field, such as electronic clock, timer, radio equipment, computer etc., as core device provides high-precision, high-stability clock signal, in addition, it is also used to manufacture optical elements, semiconductor devices and other various fields.

[0003] The Chinese patent with publication number "CN211966997U" discloses a quartz wafer processing device, relating to processing device technical field, to solve the problem of low processing efficiency of existing quartz wafer processing device. One side of the water tank is provided with a water inlet pipe, the lower part of the water inlet pipe is provided with a water outlet pipe, the inside of the water tank is provided with a cleaning frame, the cleaning frame is provided with through holes, and the through holes are provided with a plurality of through holes, the upper part of both sides of the water tank is provided with a gas cylinder, the rear end of the water tank is provided with a vertical column, and the front end face of the vertical column is provided with a horizontal plate.

[0004] However, this device still has some shortcomings, when cleaning the quartz wafer body, because the quartz wafer body is in static state, the water source filled in it can only clean the surface of the quartz wafer body in the way of soaking, if you want to achieve good cleaning effect, you also need to complete it in the way of long time soaking, at the same time, under the condition of long time soaking, the cleaning effect is still not good, which reduces the cleaning efficiency and increases the time consumption problem. UTILITY MODEL CONTENTS

[0005] The utility model solves the technical problem to provide a quartz wafer processing device.

[0006] The technical scheme adopted by the utility model to solve the technical problem is:

[0007] The utility model provides a quartz wafer processing device, including water tank, the inside bottom of water tank is installed with first drive motor, the top of first drive motor is installed with connecting block, the top of connecting block is fixedly connected with sleeve column, the top of sleeve column is sleeved with movable column, the top of movable column is fixedly connected with clamping mechanism, the inside bottom of water tank is installed with electric push rod, the top of electric push rod is symmetrical with the bottom of clamping mechanism, the inside bottom of water tank is fixedly connected with support plate, the top of support plate is installed with second drive motor, the bottom of second drive motor is installed with rotating rod, the bottom of rotating rod is installed with polishing mechanism, the outer wall of water tank is fixedly connected with mounting plate, the top of mounting plate is installed with circulating water pump, the top of circulating water pump is installed with water suction pipe, water suction pipe is open with the inside of water tank, the front side of water tank is provided with strip groove, the inside bottom of strip groove is provided with collection groove, one side of circulating water pump is installed with water outlet pipe, water outlet pipe is open with the inside of collection groove, the inside of strip groove is inserted with sealing plate, sealing plate covers the inside of strip groove.

[0008] In one embodiment, the rear side of the sealing plate is fixedly connected with a sealing gasket, the thickness of the sealing gasket is one centimeter, the sealing gasket covers the rear side of the sealing plate, the rear side of the sealing gasket is attached to the inner wall of the strip groove, the inner wall of the collection groove is installed with a filter plate, the position of the filter plate is symmetrical with the position of the water outlet pipe.

[0009] In one embodiment, the front side of the sealing plate is fixedly connected with a baffle, the rear side of the baffle is fixedly connected with a clamping block, the front side of the water tank is provided with a clamping groove matched with the clamping block, the clamping block is clamped in the inside of the clamping groove, the front side of the baffle is fixedly connected with a handle, the shape of the handle is concave, the shape of the corner of the handle is arc-shaped.

[0010] In one embodiment, the clamping mechanism includes a limiting plate, the top of the movable column is fixedly connected with the limiting plate, the inner wall of the limiting plate is slidingly connected with a clamping plate, one side of the clamping plate is rotatably connected with a rotating shaft, one side of the rotating shaft is fixedly connected with a screw rod, one side of the limiting plate is provided with a screw hole matched with the screw rod, the screw rod is threadedly connected to the inside of the screw hole.

[0011] In one embodiment, the inside of the clamping plate is clamped and fixed with a quartz wafer body, the position of the quartz wafer body is symmetrical with the position of the polishing mechanism, the top of the limiting plate is provided with a water inlet, the water inlet is open with the inside of the water tank.

[0012] In one embodiment, the inner wall of the limiting plate is provided with a sliding groove matched with the clamping plate, the clamping plate is slidingly connected to the inner wall of the limiting plate through the sliding groove, the inner wall of the limiting plate is fixedly connected with an extension rod, one side of the extension rod is fixedly connected to the other side of the clamping plate, the screw rod is located on the inside close to the extension rod.

[0013] In one embodiment, one side of the clamping plate is fixedly connected with a rubber pad, the thickness of the rubber pad is one centimeter, the rubber pad covers one side of the clamping plate, and one side of the rubber pad is attached to the other side of the quartz wafer body.

[0014] In one embodiment, the top end of the support plate is provided with a power supply module, and the front side of the water tank is provided with a control module.

[0015] In one embodiment, the power supply module is connected with the control module, the first driving motor, the second driving motor and the electric push rod circuit.

[0016] In one embodiment, the control module is connected with the first driving motor, the second driving motor and the electric push rod circuit.

[0017] In summary, the utility model mainly has the following beneficial effects:

[0018] First, during use, the circulating water pump injects an appropriate amount of water source in the water tank, in order to improve the cleaning effect of the quartz wafer body, the user can start the first driving motor, and then the clamping mechanism can be driven to rotate in the water source inside the water tank, under the condition of water flow stamping, the good water source cleaning effect can be achieved, when the quartz wafer body needs to be pushed out of the water source area in the later period, the electric push rod is started to push the clamping mechanism to move upward, under the mutual cooperation of the movable column and the sleeve column, the clamping mechanism cannot be pushed, the subsequent polishing of the quartz wafer body is not affected, the cleaning efficiency of the quartz wafer body is effectively improved, and the time consumption of the quartz wafer body cleaning is reduced.

[0019] Second, due to the existence of the clamping plate, the mutual clamping of the clamping plate can effectively limit the position of the quartz wafer body, so that the position deviation of the quartz wafer body can be avoided, when the screw rod is twisted, the shaft can make the end of the screw rod rotate in place, and the clamping plate can move along the sliding groove, so that the position of the clamping plate can be adjusted to facilitate clamping and limiting the quartz wafer body of different sizes, the rubber pad has good antiskid and shock absorption capacity, the clamping stability of the quartz wafer body is improved, and the edge of the quartz wafer body can be prevented from being bumped, compared with the previous spring clamping and limiting mode, this mode is more stable, and the quartz wafer body is not easy to shake or separate during polishing. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a structural schematic diagram of the utility model;

[0021] Figure 2 is a structural schematic diagram of the inside of the water tank of the utility model;

[0022] Figure 3 is a structural schematic diagram of the sealing plate of the utility model;

[0023] Figure 4 is a clamping mechanism structural schematic view of the utility model;

[0024] Figure 5 is a water tank sectional view structural schematic view of the utility model.

[0025] Reference signs: 1, water tank; 2, first drive motor; 3, connecting block; 4, sleeve column; 5, movable column; 6, clamping mechanism; 61, limit plate; 62, clamping plate; 63, sliding slot; 64, rotating shaft; 65, screw hole; 66, screw rod; 67, rubber pad; 68, water passage; 69, telescopic rod; 610, quartz crystal chip body; 7, electric push rod; 8, support plate; 9, second drive motor; 10, rotating rod; 11, polishing mechanism; 12, strip-shaped groove; 13, collecting groove; 14, clamping groove; 15, sealing plate; 16, sealing pad; 17, baffle; 18, clamping block; 19, handle; 20, mounting plate; 21, circulating water pump; 22, water suction pipe; 23, water outlet pipe; 24, power supply module; 25, control module; 26, filter plate. DETAILED DESCRIPTION

[0026] The utility model will be further described below in connection with the drawings and examples.

[0027] Example

[0028] Reference Figures 1 to 5The embodiment includes a water tank 1, the inner side bottom end of the water tank 1 is provided with a first driving motor 2, the top end of the first driving motor 2 is provided with a connecting block 3, the top end of the connecting block 3 is fixedly connected with a sleeve column 4, the top end of the sleeve column 4 is sleeved with a movable column 5, the top end of the movable column 5 is fixedly connected with a clamping mechanism 6, the inner side bottom end of the water tank 1 is provided with an electric push rod 7, the top end of the electric push rod 7 is symmetrical with the bottom end of the clamping mechanism 6, the inner side bottom end of the water tank 1 is fixedly connected with a supporting plate 8, the top end of the supporting plate 8 is provided with a second driving motor 9, the bottom end of the second driving motor 9 is provided with a rotating rod 10, the bottom end of the rotating rod 10 is provided with a polishing mechanism 11, the outer wall of the water tank 1 is fixedly connected with a mounting plate 20, the top end of the mounting plate 20 is provided with a circulating water pump 21, the top end of the circulating water pump 21 is provided with a water suction pipe 22, the water suction pipe 22 is communicated with the inner side of the water tank 1, the front side of the water tank 1 is provided with a strip-shaped groove 12, the inner side bottom end of the strip-shaped groove 12 is provided with a collecting groove 13, one side of the circulating water pump 21 is provided with a water outlet pipe 23, the water outlet pipe 23 is communicated with the inner side of the collecting groove 13, the inner side of the strip-shaped groove 12 is inserted with a sealing plate 15, the sealing plate 15 covers the inner side of the strip-shaped groove 12, the circulating water pump 21 on the outer side of the water tank 1 is two, the positions of the water suction pipe 22 and the water outlet pipe 23 on the two circulating water pumps 21 are opposite, so that the water source can be discharged and the water source can be sucked, the water source can be effectively reduced, when the quartz wafer body 610 is cleaned, the water source is injected into the water tank 1 through the circulating water pump 21, the quartz wafer body 610 is in a soaking state, then the user starts the first driving motor 2 to drive the clamping mechanism 6 to rotate in the water tank 1, so that the water source in the water tank 1 has water flow and water pressure, under the condition of water flow stamping, the cleaning effect of the quartz wafer body 610 can be effectively improved, when the quartz wafer body 610 needs to be pushed out of the water source area in the later period, the electric push rod 7 is started to push the clamping mechanism 6 to move upward, under the cooperation of the movable column 5 and the sleeve column 4, the clamping mechanism 6 cannot be pushed, the polishing process of the quartz wafer body 610 is not affected, and the cleaning efficiency of the quartz wafer body 610 is effectively improved.

[0029] Reference Figures 1 to 3The rear side of the sealing plate 15 is fixedly connected with a sealing gasket 16, the thickness of the sealing gasket 16 is one centimeter, the sealing gasket 16 covers the rear side of the sealing plate 15, the rear side of the sealing gasket 16 is attached to the inner wall of the strip-shaped groove 12, the inner wall of the collecting groove 13 is installed with a filter plate 26, the position of the filter plate 26 is symmetrical to the position of the water outlet pipe 23, when it is needed to process the water source in the water tank 1, the sealing plate 15 is pulled out, the used water source in the water tank 1 can flow into the collecting groove 13 through the strip-shaped groove 12, the filter plate 26 on the inner side of the collecting groove 13 can effectively filter and purify the water source, the purified water source can be sucked into the water tank 1 through the circulating water pump 21 for use, when it is not needed to replace the water source, the strip-shaped groove 12 is sealed by using the sealing plate 15, the sealing gasket 16 can effectively seal the connecting point between the two to achieve the effect of preventing water leakage.

[0030] With reference to Figures 1 to 3 The front side of the sealing plate 15 is fixedly connected with a baffle 17, the rear side of the baffle 17 is fixedly connected with a clamping block 18, the front side of the water tank 1 is provided with a clamping groove 14 matched with the clamping block 18, the clamping block 18 is clamped on the inner side of the clamping groove 14, the front side of the baffle 17 is fixedly connected with a handle 19, the shape of the handle 19 is concave, the shape of the edge of the handle 19 is arc-shaped, due to the existence of the clamping block 18, the clamping of the clamping block 18 can effectively clamp the position of the sealing plate 15, thereby avoiding the displacement of the sealing plate 15, the handle 19 is convenient for the user to grab, and the sealing plate 15 is more convenient and fast to pull out through the handle 19.

[0031] With reference to Figure 1 With reference to Figure 4The clamping mechanism 6 comprises a limiting plate 61, the top end of the movable column 5 is fixedly connected with the limiting plate 61, the inner wall of the limiting plate 61 is slidably connected with a clamping plate 62, one side of the clamping plate 62 is rotatably connected with a rotating shaft 64, one side of the rotating shaft 64 is fixedly connected with a screw rod 66, one side of the limiting plate 61 is provided with a screw hole 65 matched with the screw rod 66, the screw rod 66 is threadedly connected to the inner side of the screw hole 65, the inner side of the clamping plate 62 is clampingly fixed with a quartz crystal wafer body 610, the position of the quartz crystal wafer body 610 is symmetrical to the position of the polishing mechanism 11, the top end of the limiting plate 61 is provided with a water inlet 68 communicated with the inner side of the water tank 1, the inner wall of the limiting plate 61 is provided with a sliding groove 63 matched with the clamping plate 62, the clamping plate 62 is slidably connected to the inner wall of the limiting plate 61 through the sliding groove 63, the inner wall of the limiting plate 61 is fixedly connected with an extension rod 69, one side of the extension rod 69 is fixedly connected to the other side of the clamping plate 62, the screw rod 66 is located close to the inner side of the extension rod 69, one side of the clamping plate 62 is fixedly connected with a rubber pad 67, the thickness of the rubber pad 67 is one centimeter, the rubber pad 67 covers one side of the clamping plate 62, one side of the rubber pad 67 is attached to the other side of the quartz crystal wafer body 610, and the extension rod 69 comprises a movable rod and a sleeve rod, the movable rod is sleeved on the inner side of the sleeve rod. Due to the existence of the clamping plate 62, the mutual clamping of the clamping plate 62 can effectively limit the position of the quartz crystal wafer body 610, thereby avoiding the position offset of the quartz crystal wafer body 610, when the screw rod 66 is twisted, the rotating shaft 64 can rotate the end of the screw rod 66 in place, and the clamping plate 62 will move along the sliding groove 63, so that the position of the clamping plate 62 can be adjusted to facilitate clamping and limiting the quartz crystal wafer body 610 of different sizes, the rubber pad 67 has good anti-skid and shock absorption capacity, which can improve the clamping stability of the quartz crystal wafer body 610, and also can avoid the edge of the quartz crystal wafer body 610 from being bumped. Compared with the previous spring clamping and limiting mode, this mode is more stable, and it is not easy to shake or separate when the polishing mechanism 11 is used to polish.

[0032] Reference Figure 1 The top end of the supporting plate 8 is provided with a power supply module 24, the front side of the water tank 1 is provided with a control module 25, the power supply module 24 is electrically connected with the control module 25, the first driving motor 2, the second driving motor 9 and the electric push rod 7, and the control module 25 is electrically connected with the first driving motor 2, the second driving motor 9 and the electric push rod 7. Due to the existence of the power supply module 24, the electrical equipment on the device can be effectively powered on, and the control module 25 can effectively control the electrical equipment on the device. It is more convenient and fast to control the operation of the device through the control module 25.

[0033] Principle and advantages: when cleaning the quartz wafer body 610, the water source is injected into the water tank 1 through the circulating water pump 21, so that the quartz wafer body 610 is in a soaking state, and then the user starts the first driving motor 2 to drive the clamping mechanism 6 to rotate in the water tank 1, so that the water source in the water tank 1 has water flow and water pressure, and under the condition of water flow pressure, the cleaning effect of the quartz wafer body 610 can be effectively improved. When the quartz wafer body 610 needs to be pushed out of the water source area, the electric push rod 7 is started to push the clamping mechanism 6 to move upwards, and under the cooperation of the movable column 5 and the sleeve column 4, the clamping mechanism 6 cannot be pushed, which does not hinder the subsequent polishing of the quartz wafer body 610, and also effectively improves the cleaning efficiency of the quartz wafer body 610. When the water source in the water tank 1 needs to be treated, the sealing plate 15 is pulled out, and the used water source in the water tank 1 can flow into the collecting groove 13 through the strip-shaped groove 12. The filter plate 26 on the inner side of the collecting groove 13 can effectively filter and purify the water source. The purified water source can be sucked into the water tank 1 again through the circulating water pump 21 for use. When the water source does not need to be replaced, the strip-shaped groove 12 is sealed by using the sealing plate 15, and the sealing gasket 16 can effectively seal the connecting point between the two to achieve the effect of preventing water leakage. Because of the existence of the clamping block 18, the clamping block 18 can effectively clamp the position of the sealing plate 15, so that the displacement of the sealing plate 15 can be avoided, and the handle 19 can be easily grabbed by the user. By pulling the sealing plate 15 through the handle 19, it is more convenient and fast. Because of the existence of the clamping plate 62, the mutual clamping of the clamping plate 62 can effectively limit the position of the quartz wafer body 610, so that the position deviation of the quartz wafer body 610 can be avoided. When the screw rod 66 is twisted, the shaft 64 can rotate the end of the screw rod 66 in place, and the clamping plate 62 will move along the sliding groove 63. Adjusting the position of the clamping plate 62 can facilitate clamping and limiting the quartz wafer body 610 of different sizes. The rubber pad 67 has good anti-skid and shock-absorbing capacity, which can improve the clamping stability of the quartz wafer body 610 and avoid the edge of the quartz wafer body 610 from being bumped.

[0034] Finally, it should be pointed out that: the above examples are only used to illustrate the technical solutions of the present application, but not to limit them; although the technical solutions of the present application have been described in detail with reference to the foregoing examples, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or replace some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A quartz wafer processing device, comprising a water tank (1), characterized in that: A first drive motor (2) is installed at the inner bottom end of the water tank (1), a connecting block (3) is installed at the top end of the first drive motor (2), a sleeve column (4) is fixedly connected to the top end of the connecting block (3), a movable column (5) is sleeved on the top end of the sleeve column (4), a clamping mechanism (6) is fixedly connected to the top end of the movable column (5), an electric push rod (7) is installed at the inner bottom end of the water tank (1), the top end of the electric push rod (7) is symmetrical to the bottom end of the clamping mechanism (6), a support plate (8) is fixedly connected to the inner bottom end of the water tank (1), a second drive motor (9) is installed at the top end of the support plate (8), a rotating rod (10) is installed at the bottom end of the second drive motor (9), and the rotating rod (10) A grinding mechanism (11) is installed at the bottom end of the water tank (1), a mounting plate (20) is fixedly connected to the outer wall of the water tank (1), a circulating water pump (21) is installed at the top end of the mounting plate (20), a water suction pipe (22) is installed at the top end of the circulating water pump (21), and the water suction pipe (22) is communicated with the inner side of the water tank (1), a strip groove (12) is provided on the front side of the water tank (1), a collecting groove (13) is provided at the bottom end of the inner side of the strip groove (12), a water outlet pipe (23) is installed on one side of the circulating water pump (21), and the water outlet pipe (23) is communicated with the inner side of the collecting groove (13), a sealing plate (15) is inserted into the inner side of the strip groove (12), and the sealing plate (15) covers the inner side of the strip groove (12).

2. A quartz wafer processing device according to claim 1, characterized in that: The rear side of the sealing plate (15) is fixedly connected with a sealing gasket (16), the thickness of the sealing gasket (16) is one centimeter, the sealing gasket (16) covers the rear side of the sealing plate (15), the rear side of the sealing gasket (16) is in contact with the inner wall of the strip groove (12), and a filter plate (26) is installed on the inner wall of the collecting tank (13), and the position of the filter plate (26) is symmetrical with the position of the water outlet pipe (23).

3. The quartz wafer processing device according to claim 1, wherein: The front side of the sealing plate (15) is fixedly connected to a baffle (17), the rear side of the baffle (17) is fixedly connected to a clamping block (18), the front side of the water tank (1) is provided with a clamping groove (14) matching the clamping block (18), the clamping block (18) is clamped to the inner side of the clamping groove (14), the front side of the baffle (17) is fixedly connected to a handle (19), the shape of the handle (19) is concave, and the shape of the corner of the handle (19) is arc-shaped.

4. The quartz wafer processing device according to claim 1, wherein: The clamping mechanism (6) includes a limit plate (61), the top end of the movable column (5) is fixedly connected to the limit plate (61), a clamping plate (62) is slidably connected to the inner wall of the limit plate (61), one side of the clamping plate (62) is rotatably connected to a rotating shaft (64), one side of the rotating shaft (64) is fixedly connected to a screw rod (66), one side of the limit plate (61) is provided with a screw hole (65) matching the screw rod (66), and the screw rod (66) is threadedly connected to the inner side of the screw hole (65).

5. A quartz wafer processing device according to claim 4, characterized in that: A quartz wafer body (610) is clamped and fixed on the inner side of the clamping plate (62), and the position of the quartz wafer body (610) is symmetrical with the position of the polishing mechanism (11). A water outlet (68) is provided at the top of the limiting plate (61), and the water outlet (68) is communicated with the inner side of the water tank (1).

6. A quartz wafer processing device according to claim 5, characterized in that: The inner wall of the limiting plate (61) is provided with a sliding groove (63) that matches the splint (62), and the splint (62) is slidably connected to the inner wall of the limiting plate (61) through the sliding groove (63). A telescopic rod (69) is fixedly connected to the inner wall of the limiting plate (61), one side of the telescopic rod (69) is fixedly connected to the other side of the splint (62), and the screw (66) is located close to the inner side of the telescopic rod (69).

7. The quartz wafer processing device according to claim 5, characterized in that: A rubber pad (67) is fixedly connected to one side of the clamping plate (62). The thickness of the rubber pad (67) is one centimeter. The rubber pad (67) covers one side of the clamping plate (62). One side of the rubber pad (67) is in contact with the other side of the quartz wafer body (610).

8. The quartz wafer processing device according to claim 1, characterized in that: A power supply module (24) is installed on the top of the support plate (8), and a control module (25) is installed on the front side of the water tank (1).

9. The quartz wafer processing device according to claim 8, characterized in that: The power supply module (24) is connected to the control module (25), the first drive motor (2), the second drive motor (9) and the electric push rod (7) in an electrical circuit.

10. The quartz wafer processing device according to claim 9, characterized in that: The control modules (25) are electrically connected to the first drive motor (2), the second drive motor (9) and the electric push rod (7).

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