Ceramic substrate of piezoresistor

Abstract

The utility model discloses a ceramic base body of a piezoresistor, which belongs to the field of piezoresistors and comprises a ceramic base body and a pin arranged on one side of the ceramic base body, and heat dissipation groups with the same shape as the ceramic base body are respectively arranged on the front side and the rear side of the ceramic base body. One sides of the two heat dissipation sets are connected through a supporting arc plate, and a buffer plate is installed in the supporting arc plate. According to the utility model, the heat dissipation group consisting of the upper heat dissipation plate, the lower heat dissipation plate and the heat insulation plate is arranged, so that heat dissipation can be carried out on the ceramic base body more quickly when the piezoresistor works, thermal decomposition and oxidation reactions of internal materials of the ceramic base body when the piezoresistor works in a high-temperature environment for a long time are avoided, and the aging phenomenon is reduced; and by arranging the supporting arc plates and the buffer plates, force can be absorbed when the ceramic base body is subjected to mechanical vibration or impact, the buffer effect is achieved, and therefore the influence generated by mechanical vibration is reduced, and damage to the ceramic base body is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a pressure sensitive resistance technical field especially relates to a pressure sensitive resistance's ceramic base body. BACKGROUND

[0002] The pressure sensitive resistance is a kind of special resistor, with nonlinear volt-ampere characteristic, mainly used in the overvoltage protection in circuit, and its working principle is based on the piezoelectric effect and variable resistance effect of material.The ceramic base body of pressure sensitive resistance is its core component part, it decides the main performance and characteristics of pressure sensitive resistance.

[0003] But the existing pressure sensitive resistance works long-term in high temperature environment, ceramic base body is prone to internal material thermal decomposition and oxidation reaction, these are prone to cause the performance of pressure sensitive resistance to gradually decline, thereby appears aging phenomenon;In addition to high temperature environment, the trigger voltage of pressure sensitive resistance can also drop under the influence of mechanical vibration, leading to the overvoltage protection effect to be poor, aggravate the damage of internal element, thereby affect overall use. UTILITY MODEL CONTENT

[0004] The utility model discloses a pressure sensitive resistance's ceramic base body, which solves the problems of long-term work of the existing pressure sensitive resistance in high temperature environment, thermal decomposition and oxidation reaction of internal material of ceramic base body, gradual decline of performance of pressure sensitive resistance, aging phenomenon, drop of trigger voltage of pressure sensitive resistance under the influence of mechanical vibration, poor overvoltage protection effect, aggravation of damage of internal element and overall use.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] A kind of ceramic base body of pressure sensitive resistance, including ceramic base body and pin installed in one side of the ceramic base body, the front and back sides of the ceramic base body are respectively installed with the same shape of the ceramic base body Heat dissipation group, the heat dissipation group is composed of upper heat dissipation plate, lower heat dissipation plate and heat insulation plate and is used to heat dissipation to the ceramic base body;Two heat dissipation groups are connected by support arc plate on the side away from the pin, the support arc plate is installed with buffer plate in;The ceramic base body is installed with soft sealing gasket for improving sealing effect periphery, and the soft sealing gasket is located on the inner side of the support arc plate.

[0007] Preferably, the heat insulation plate is equidistantly installed between the upper heat dissipation plate and the lower heat dissipation plate, and the heat insulation plate and the upper heat dissipation plate are equidistantly provided with heat dissipation holes.

[0008] Preferably, the material of the upper heat dissipation plate, the lower heat dissipation plate and the heat insulation plate is good heat conductivity material.

[0009] Preferably, the supporting arc plate is made of a soft material such as rubber.

[0010] Preferably, the buffer plate is a folding plate with a buffer effect.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] 1. By providing a heat dissipation group consisting of an upper heat dissipation plate, a lower heat dissipation plate and a heat insulation plate, the ceramic substrate can be cooled faster when the varistor is working, avoiding thermal decomposition and oxidation of the internal material of the ceramic substrate when working in a high-temperature environment for a long time, and reducing the aging phenomenon.

[0013] 2. By providing a support arc plate and a buffer plate, the ceramic substrate can absorb force when subjected to mechanical vibration or impact, and has a buffering effect, thereby reducing the impact of mechanical vibration and reducing damage to the ceramic substrate, thereby increasing the service life of the ceramic substrate. The soft sealing gasket on the periphery of the ceramic substrate can improve the sealing effect and prevent moisture from entering and causing damage to the ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a three-dimensional schematic diagram of the overall structure of the ceramic substrate of a varistor proposed in the utility model;

[0015] Figure 2 This is a schematic diagram of the overall structural installation of a ceramic substrate of a varistor proposed in the utility model;

[0016] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0017] Figure 4 This is a schematic diagram of the installation structure of a buffer plate in a ceramic substrate of a varistor proposed by the utility model.

[0018] In the figure: 1. Ceramic substrate; 11. Pin; 2. Heat dissipation group; 21. Upper heat dissipation plate; 22. Lower heat dissipation plate; 23. Heat insulation plate; 201. Heat dissipation hole; 3. Support arc plate; 4. Soft sealing pad; 5. Buffer plate. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0020] Embodiment one

[0021] With reference to Figures 1-4 A ceramic base of a pressure sensitive resistor, comprising a ceramic base 1 and a pin 11 mounted on one side of the ceramic base 1, and a heat dissipation group 2 mounted on the front and back sides of the ceramic base 1, the heat dissipation group 2 is composed of an upper heat dissipation plate 21, a lower heat dissipation plate 22 and a heat insulation plate 23, and is used for heat dissipation of the ceramic base 1;

[0022] Further, the heat insulation plate 23 is equidistantly mounted between the upper heat dissipation plate 21 and the lower heat dissipation plate 22, and the heat insulation plate 23 and the upper heat dissipation plate 21 are equidistantly provided with heat dissipation holes 201; further, the materials of the upper heat dissipation plate 21, the lower heat dissipation plate 22 and the heat insulation plate 23 are all good heat conductive materials;

[0023] It should be noted that: by providing the heat dissipation group 2 composed of the upper heat dissipation plate 21, the lower heat dissipation plate 22 and the heat insulation plate 23 on the front and back sides of the ceramic base 1, the ceramic base 1 can be more quickly heat dissipated, the heat insulation plate 23 equidistantly mounted between the upper heat dissipation plate 21 and the lower heat dissipation plate 22 and the heat dissipation holes 201 can accelerate the circulation of air, improve the heat dissipation effect, and at the same time reduce the thickness to avoid the poor heat dissipation effect caused by the over-thickness of the material;

[0024] The two heat dissipation groups 2 away from the pin 11 are connected by a support arc plate 3, and the support arc plate 3 is provided with a buffer plate 5; the ceramic base 1 is provided with a soft sealing gasket 4 for improving the sealing effect, and the soft sealing gasket 4 is located on the inner side of the support arc plate 3; it should be noted that: the soft sealing gasket 4 can improve the sealing between the ceramic base 1 and the heat dissipation group 2;

[0025] Further, the support arc plate 3 is a soft material of rubber material, which can help to buffer the impact force generated during mechanical vibration, and at the same time can reduce the conductivity of current, so as to avoid the leakage of the pressure sensitive resistor; further, the buffer plate 5 is a folding plate with buffering effect, which can absorb force during mechanical vibration and collision, so as to reduce the influence caused by mechanical vibration, and the folding plate with buffering effect can reset under the condition of stopping force, so as to protect next time.

[0026] When the present invention is in use, the varistor is installed in a suitable position by inserting the pin 11. When the varistor generates heat during operation, the heat on the ceramic substrate 1 is absorbed by the lower heat dissipation plate 22 that is in direct contact with the ceramic substrate 1. The heat is circulated in the space formed by the upper heat dissipation plate 21, the lower heat dissipation plate 22 and the heat insulation plate 23. The heat dissipation holes 201 can accelerate the circulation of air and thus accelerate the heat dissipation. When the ceramic substrate 1 is subjected to mechanical vibration, the surface of the upper heat dissipation plate 21 is displaced by the pressure. At this time, the support arc plate 3 at the bottom of the upper heat dissipation plate 21 can absorb the external force. The buffer plate 5 installed in the support arc plate 3 can play a buffering role to prevent the ceramic substrate 1 from being affected by excessive external force and causing damage to internal components. The soft sealing gasket 4 on the periphery of the ceramic substrate 1 can improve the sealing effect to prevent moisture from entering and causing damage to the ceramic substrate 1.

[0027] The above are only preferred specific implementation methods of the present invention, but the protection scope of the present invention is not limited to them. Any technician familiar with the technical field can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention within the technical scope disclosed by the present invention, and they should be covered by the protection scope of the present invention.

Claims

1. A ceramic substrate for a varistor, comprising a ceramic substrate (1) and a pin (11) mounted on one side of the ceramic substrate (1), characterized in that: Heat dissipation groups (2) having the same shape as the ceramic base (1) are respectively installed on the front and rear sides of the ceramic base (1), and the heat dissipation group (2) is composed of an upper heat dissipation plate (21), a lower heat dissipation plate (22) and a heat insulation plate (23) and is used to dissipate heat from the ceramic base (1); The two heat dissipation groups (2) are connected laterally on a side away from the pins (11) via a supporting arc plate (3), wherein a buffer plate (5) is installed inside the supporting arc plate (3); a soft sealing gasket (4) for improving the sealing effect is installed on the periphery of the ceramic substrate (1), and the soft sealing gasket (4) is located on the inner side of the supporting arc plate (3).

2. The ceramic substrate of a varistor according to claim 1, characterized in that: The heat insulation plate (23) is equidistantly installed between the upper heat dissipation plate (21) and the lower heat dissipation plate (22), and heat dissipation holes (201) are equidistantly provided on the heat insulation plate (23) and the upper heat dissipation plate (21).

3. The ceramic substrate of a varistor according to claim 1, characterized in that: The upper heat dissipation plate (21), the lower heat dissipation plate (22) and the heat insulation plate (23) are all made of thermally conductive materials.

4. The ceramic substrate of a varistor according to claim 1, characterized in that: The supporting arc plate (3) is made of a soft rubber material.

5. The ceramic substrate of a varistor according to claim 1, characterized in that: The buffer plate (5) is a folding plate with a buffering effect.

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