Flatness adjusting mechanism for ToolHead

Abstract

The utility model discloses a flatness adjusting mechanism for ToolHead, and relates to the technical field of integrated circuits. The device comprises a bearing table, an integrated circuit is in lap joint with the top of the bearing table, a pressurizing block is arranged above the integrated circuit, a heating block is fixedly connected to the bottom of the pressurizing block, a plurality of heating rods are arranged in the heating block at equal intervals, and clamping mechanisms are symmetrically arranged at the top of the bearing table. The handle is pulled to drive the abutting block to abut against the two sides of the integrated circuit, so that the risk of displacement or falling of the integrated circuit in follow-up operation is reduced, and the yield of products is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a flatness adjustment mechanism for a ToolHead. Background Art

[0002] An integrated circuit is a miniature electronic device that uses a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit. It is manufactured on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function.

[0003] In the inner pin bonding process, the integrated circuit is placed on the receiving table and bonded to the flexible film through heating and pressurization. Whether there is any difference in the overall bonding height of the product is mainly determined by the degree of flatness of the heating block. When producing different products, the temperature of different heating rods can be adjusted to achieve control of the overall flatness of the heating block. Finally, the quality of the bonded product is inspected to check whether the bonding height meets the requirements and whether the circuit function is normal, thereby completing the inspection.

[0004] In the existing method of inner pin bonding, most of the integrated circuits are directly placed on the receiving table, and then the integrated circuits are heated and pressurized by a heating block. Although simple and easy, directly placing the integrated circuit on the receiving table may cause displacement during the heating and pressurizing process, thereby affecting the accuracy of the inner pin bonding and thus affecting the product yield. Utility Model Content

[0005] The purpose of the present invention is to solve the problem that displacement may occur during the heating and pressurizing process, thereby affecting the accuracy of the inner pin connection. The present invention provides a flatness adjustment mechanism for the ToolHead.

[0006] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0007] A flatness adjustment mechanism for a ToolHead comprises a receiving platform, an integrated circuit is overlapped on the top of the receiving platform, a pressure block is arranged above the integrated circuit, a heating block is fixedly connected to the bottom of the pressure block, a plurality of heating rods are arranged at equal intervals inside the heating block, and a clamping mechanism is symmetrically provided on the top of the receiving platform.

[0008] By adopting the above technical scheme, the integrated circuit is received on the receiving table, then the air heating block is placed above the integrated circuit, and then the heating rod is started to heat the integrated circuit. By adjusting the temperature of different heating rods, the flatness control is realized, so that the flatness can be controlled by adjusting the temperature of different heating rods, thereby completing the inner pin combination. The clamping mechanism can reduce the risk of displacement of the integrated circuit.

[0009] Further, the clamping mechanism includes a fixed groove symmetrically opened at the top of the receiving table, a driving rod slidably arranged on the inner side of the fixed groove, a moving plate fixedly connected to one end of the driving rod, a contact plate fixedly connected to the top of the moving plate, a buffer pad fixedly connected to the side of the contact plate close to the integrated circuit, and a handle fixedly connected to the end of the driving rod away from the moving plate.

[0010] By adopting the above technical scheme, pulling the handle makes the contact block away from the integrated circuit. After moving a certain distance, the integrated circuit is placed on the receiving table, and then the two sides of the integrated circuit are contacted by the contact block to reduce the risk of falling of the integrated circuit.

[0011] Further, the side of the contact plate away from the buffer pad is fixedly connected with a spring, and the end of the spring away from the contact plate is fixedly connected with the inner side of the fixed groove.

[0012] By adopting the above technical scheme, the elastic potential energy of the spring is released to automatically reset the contact plate to contact the integrated circuit.

[0013] Further, the inner side of the fixed groove is symmetrically provided with a sliding groove, and the two sides of the moving plate are fixedly connected with sliding blocks, and the sliding blocks are slidably connected with the sliding groove.

[0014] By adopting the above technical scheme, the sliding groove provides a guiding effect for the moving plate, so that the moving plate can maintain the correct motion trajectory when moving.

[0015] Further, the outer side of the contact plate is symmetrically provided with a moving hole, the inner side of the moving hole is slidably connected with a driving block, one end of the driving block is fixedly connected with a limiting block, and the side of the limiting block close to the integrated circuit is fixedly connected with a metal plate.

[0016] By adopting the above technical scheme, the limiting block drives the metal plate to limit and contact the other two sides of the integrated circuit.

[0017] Further, the end of the driving block away from the limiting block is fixedly connected with a connecting block, the outer side of the connecting block is slidably connected with a latch, and the outer side of the contact plate is symmetrically provided with a plurality of limiting holes, and the latch is slidably arranged in the limiting hole.

[0018] By adopting the above technical scheme, the limiting block is fixed, thereby improving the stability during limiting.

[0019] In summary, the utility model includes following at least one beneficial effect:

[0020] 1、The utility model discloses, need to clamp integrated circuit, first pull handle and drive the abutment block to the both sides of integrated circuit and abut, thereby reduce the risk that integrated circuit displaces or falls in subsequent operation, guarantee the yield of product, can flexibly control the position of abutment block simultaneously, thereby adapt to integrated circuit of different size, improve the versatility of clamping device.

[0021] 2、The utility model discloses, when the other two sides of integrated circuit are protected, through the staff drive drive block and drive limit block to move, make limit block and drive metal plate to the other two sides of integrated circuit and limit abut, thereby further improve the stability of integrated circuit when processing. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is integrated circuit three-dimensional structure schematic diagram in the utility model;

[0023] Figure 2 It is the section structure schematic diagram of the utility model

[0024] Figure 3 It is the utility model Figure 2 A place enlarged structure schematic diagram in the utility model;

[0025] Figure 4 It is abutment plate three-dimensional structure schematic diagram in the utility model;

[0026] Figure 5 It is the utility model Figure 4 B place enlarged structure schematic diagram.

[0027] Mark explanation:

[0028] 1, receiving table, 2, integrated circuit, 3, pressurizing block, 4, heating block, 5, heating rod, 6, fixed groove, 7, drive rod, 8, moving plate, 9, abutment plate, 10, handle, 11, buffer pad, 12, spring, 13, moving hole, 14, drive block, 15, limit block, 16, metal plate, 17, connecting block, 18, bolt, 19, limit hole, 20, sliding slot. DETAILED DESCRIPTION

[0029] The utility model will be further explained in detail below in conjunction with the drawings. Figures 1-5 The utility model will be further explained in detail below in conjunction with the drawings.

[0030] The utility model discloses a kind of flatness adjustment mechanism for ToolHead.

[0031] Refer to Figure 1 andFigure 2 The utility model provides a flatness adjusting mechanism for ToolHead, including the top of receiving table 1 is overlapped with integrated circuit 2, the top of receiving table 1 is opened the clamping mechanism symmetrically.

[0032] When the inner pin bonding process is carried out, the integrated circuit 2 is received on the receiving table 1, then the air heating block 4 is placed above the integrated circuit 2, then the heating rod 5 is started to heat the integrated circuit 2, the flatness is controlled by adjusting the temperature of different heating rods 5, so that the flatness can be controlled by adjusting the temperature of different heating rods 5, thereby completing the inner pin bonding, and the integrated circuit 2 can be clamped by the clamping mechanism, reducing the risk of displacement of the integrated circuit 2.

[0033] Referring to Figure 1 And Figure 2 The clamping mechanism includes the fixed groove 6 that is opened symmetrically on the top of receiving table 1, the inner side of fixed groove 6 is slidably provided with the drive rod 7, one end of drive rod 7 is fixedly connected with the moving plate 8, the top of moving plate 8 is fixedly connected with the abutting plate 9, one side of abutting plate 9 close to integrated circuit 2 is fixedly connected with the buffer pad 11, one end of drive rod 7 away from moving plate 8 penetrates receiving table 1 and is fixedly connected with the handle 10.

[0034] Wherein, one side of abutting plate 9 away from buffer pad 11 is fixedly connected with the spring 12, one end of spring 12 away from abutting plate 9 is fixedly connected with the inner side of fixed groove 6.

[0035] In addition, the inner side of fixed groove 6 is symmetrically provided with the sliding slot 20, and the two sides of the moving plate 8 are fixedly connected with the sliding block, and the sliding block is slidably connected with the sliding slot 20.

[0036] When the integrated circuit 2 needs to be clamped, first pull the handle 10 to drive the drive rod 7 to move, the drive rod 7 moves to drive the moving plate 8 to move, and the moving plate 8 moves to drive the abutting block to move away from the integrated circuit 2, when moving a certain distance, the integrated circuit 2 is placed on the receiving table 1, and then the two sides of the integrated circuit 2 are abutted by the abutting block, thereby reducing the risk of displacement or falling of the integrated circuit 2 in subsequent operation, ensuring the yield of products, and the position of the abutting block can be flexibly controlled by moving the moving plate 8, so that different sizes of integrated circuits 2 are adapted, and the versatility of the clamping device is improved.

[0037] When the handle 10 is pulled, the handle 10 will drive the moving plate 8 to extrude the spring 12, so that the spring 12 is compressed to generate elastic potential energy, and when the integrated circuit 2 is placed, the elastic potential energy of the spring 12 is released, so that the abutting plate 9 is automatically reset to abut the integrated circuit 2.

[0038] When the moving plate 8 moves, the sliding block and the sliding groove 20 provide a guide for the moving plate 8, so that the moving plate 8 can maintain the correct trajectory when moving.

[0039] With reference to Figure 3 And Figure 4 The outer side of the abutting plate 9 is symmetrically provided with a moving hole 13, and the inner side of the moving hole 13 is slidably connected with a driving block 14. One end of the driving block 14 is fixedly connected with a limiting block 15, and the side of the limiting block 15 close to the integrated circuit 2 is fixedly connected with a metal plate 16.

[0040] Among them, the end of the driving block 14 away from the limiting block 15 is fixedly connected with a connecting block 17, the outer side of the connecting block 17 is slidably connected with a latch 18, and the outer side of the abutting plate 9 is equidistantly provided with a plurality of limiting holes 19, and the latch 18 is slidably arranged with the limiting hole 19.

[0041] When protecting the other two sides of the integrated circuit 2, the staff drives the driving block 14 to move, so that the driving block 14 moves in the moving hole 13, and the driving block 14 moves to drive the limiting block 15 to move, so that the limiting block 15 drives the metal plate 16 to limit and abut the other two sides of the integrated circuit 2, thereby further improving the stability of the integrated circuit 2 during processing.

[0042] When the driving block 14 moves to the appropriate position, the staff can insert the latch 18 into the connecting block 17, and then the outer side of the abutting plate 9 is equidistantly provided with a plurality of limiting holes 19, so that the latch 18 is inserted into the limiting hole 19, thereby fixing the position of the connecting block 17, and the connecting block 17 is fixed, so that the limiting block 15 is fixed, thereby improving the stability during limiting.

[0043] Working principle: the integrated circuit 2 is supported on the supporting table 1, and then the air heating block 4 is placed above the integrated circuit 2, and then the heating rod 5 is started to heat the integrated circuit 2. By adjusting the temperature of different heating rods 5, the flatness control is realized, so that the flatness can be controlled by adjusting the temperature of different heating rods 5, thereby completing the inner pin combination, pulling the handle 10 to drive the driving rod 7 to move, the driving rod 7 moves to drive the moving plate 8 to move, the moving plate 8 moves to drive the abutting block away from the integrated circuit 2, and when moving a certain distance, the integrated circuit 2 is placed on the supporting table 1, and then the abutting block is used to abut the two sides of the integrated circuit 2, thereby reducing the risk of falling of the integrated circuit 2.

Claims

1. A flatness adjustment mechanism for a ToolHead, comprising a receiving platform (1), characterized in that: An integrated circuit (2) is overlapped on the top of the receiving platform (1), a pressure block (3) is arranged above the integrated circuit (2), a heating block (4) is fixedly connected to the bottom of the pressure block (3), a plurality of heating rods (5) are arranged at equal intervals inside the heating block (4), and a clamping mechanism is symmetrically provided on the top of the receiving platform (1).

2. The flatness adjustment mechanism for a ToolHead according to claim 1, characterized in that: The clamping mechanism comprises a fixing groove (6) symmetrically arranged on the top of the receiving platform (1); a driving rod (7) is slidably provided on the inner side of the fixing groove (6); one end of the driving rod (7) is fixedly connected to a moving plate (8); the top of the moving plate (8) is fixedly connected to a contact plate (9); a side of the contact plate (9) close to the integrated circuit (2) is fixedly connected to a buffer pad (11); and the end of the driving rod (7) away from the moving plate (8) passes through the receiving platform (1) and is fixedly connected to a handle (10).

3. The flatness adjustment mechanism for a ToolHead according to claim 2, characterized in that: A spring (12) is fixedly connected to a side of the contact plate (9) away from the buffer pad (11), and an end of the spring (12) away from the contact plate (9) is fixedly connected to the inner side of the fixing groove (6).

4. The flatness adjustment mechanism for a ToolHead according to claim 2, characterized in that: The inner side of the fixed groove (6) is symmetrically provided with a sliding groove (20), and both sides of the movable plate (8) are fixedly connected with a sliding block, and the sliding block is slidably connected to the sliding groove (20).

5. The flatness adjustment mechanism for a ToolHead according to claim 2, characterized in that: The outer side of the contact plate (9) is symmetrically provided with a moving hole (13), the inner side of the moving hole (13) is slidably connected to a driving block (14), one end of the driving block (14) is fixedly connected to a limiting block (15), and a metal plate (16) is fixedly connected to a side of the limiting block (15) close to the integrated circuit (2).

6. The flatness adjustment mechanism for a ToolHead according to claim 5, characterized in that: One end of the driving block (14) away from the limiting block (15) is fixedly connected to a connecting block (17), and the outer side of the connecting block (17) is slidably connected to a latch (18). The outer side of the contact plate (9) is provided with a plurality of limiting holes (19) at equal intervals, and the latch (18) and the limiting holes (19) are slidably arranged.

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