Radiator and switching power supply with same

Abstract

The utility model discloses a radiator and a switching power supply with the radiator, and belongs to the technical field of heat radiation, the switching power supply comprises a radiator, a first housing, a first circuit board, a second housing and a second circuit board; the sides, provided with the cavities, of the first shell and the second shell are fixed to the surface sides of a first substrate and a second substrate of the radiator respectively, so that two closed cavities isolated from the external environment are formed. And the first circuit board and the second circuit board are respectively arranged in the closed cavities of the first shell and the second shell. The switching power supply isolates the invasion of water vapor, dust and salt mist in an external environment, provides a stable working environment for the power supply, prolongs the service life of the power supply, enables the heat of a heating element of the switching power supply to pass through the radiator substrate and the heat pipe through the combination of the novel radiator, enables the conducted heat to be uniformly distributed, and improves the heat dissipation efficiency. And finally, the heat is taken out by the heat dissipation fins through the independent air ducts, so that more efficient heat dissipation is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to heat dissipation technical field, and especially relates to a radiator and switching power supply with the radiator. BACKGROUND

[0002] With the development of electronic technology, electric vehicle charging piles and charging stations are more and more popular, and the requirement for the charging power of the charging pile is continuously improved, and the electronic components in the charging pile have the development trend of integration, miniaturization, thinness, and portability, therefore, higher requirements are put forward for the heat dissipation system of the power device such as the charging pile.

[0003] At present, the common radiator generally includes a heat conduction plate and a heat dissipation fin, the front surface of the heat conduction plate is in contact with the heating element, the heat dissipation fin is arranged on the back surface of the heat conduction plate, the heat dissipated by the heat dissipation fin is first spread into the internal space of the electronic product, and then is sucked out by the fan to realize heat dissipation. If multiple heating elements are arranged in the electronic product, multiple radiators need to be arranged, or the multiple heating elements are arranged on the same radiator, which will cause the increase of the product volume and weight, or the problem of local heat accumulation, and reduces the heat dissipation effect.

[0004] At the same time, since the switching power supply of such a charging pile needs to be installed in an outdoor or basement area, it will be eroded by water vapor, dust and salt mist in the long-term use process, causing the switching power supply to fail. The existing anti-erosion method is usually to coat the charging pile module PCB with a three-proofing paint, and the paint film thickness is 50-150 microns, which plays a role in isolating the external environment, preventing moisture, salt mist and mold. The effect of three-proofing paint is obvious in indoor environment, but in outdoor and coastal areas, three-proofing paint will be affected by the external environment in the long-term use process, and will appear brittle and warped, and will fall off, which cannot play a protective role. The electronic devices on the PCB in the switching power supply are exposed to the external environment for a long time, and the conventional three-proofing treatment can only ensure effectiveness for a short time, and cannot guarantee long-term stable protection. Therefore, it is necessary to develop a more efficient and stable radiator. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a switching power supply capable of isolating external environment, and a radiator matched with the switching power supply.

[0006] To achieve the above-mentioned purpose, the technical scheme of the utility model is as follows:

[0007] A heat sink, comprising, a first heat dissipation unit and a second heat dissipation unit; the first heat dissipation unit comprises, a first base plate, a first heat dissipation fin group, and a first side plate, the first heat dissipation fin group is arranged on the bottom surface side of the first base plate, two first side plates are arranged on both sides of the first heat dissipation fin group and are fixedly connected with the first base plate; the second heat dissipation unit comprises, a second base plate, a second heat dissipation fin group, and a second side plate, the second heat dissipation fin group is arranged on the bottom surface side of the second base plate, two second side plates are arranged on both sides of the second heat dissipation fin group and are fixedly connected with the second base plate; one side of the first heat dissipation unit with the first heat dissipation fin group is buckled with one side of the second heat dissipation unit with the second heat dissipation fin group, and the first side plate and the second side plate are fixedly connected.

[0008] In a preferred embodiment of the utility model, the first heat dissipation fin group and the second heat dissipation fin group are composed of multiple heat dissipation fins arranged in parallel and at intervals, and heat dissipation channels are formed between adjacent heat dissipation fins.

[0009] In a preferred embodiment of the utility model, the heat dissipation fins in the first heat dissipation fin group and the second heat dissipation fin group are connected with the bottom surface sides of the first base plate and the second base plate respectively in a mode of die forming or brazing.

[0010] In a preferred embodiment of the utility model, the cross-sectional shape of the heat dissipation fin is wavy or sawtooth-shaped.

[0011] In a preferred embodiment of the utility model, the first base plate and the second base plate are heat-conducting plates.

[0012] In a preferred embodiment of the utility model, the heat sink further comprises first heat pipes and second heat pipes, multiple first heat pipes are embedded in the first base plate, and multiple second heat pipes are embedded in the second base plate.

[0013] The utility model also relates to a switching power supply with a heat sink, comprising, the heat sink above, and casing and circuit board;The surface side of the first base plate and / or second base plate of the heat sink is fixed on one side of the cavity of the casing, and a sealed cavity isolated from the external environment is formed;The circuit board is arranged in the sealed cavity of the casing.

[0014] In a preferred embodiment of the utility model, the circuit board is provided with a heating device, and one side of the circuit board provided with the heating device faces the heat sink.

[0015] In a preferred embodiment of the utility model, the heating device is in contact with the heat sink by pouring sealing, setting a heat-conducting pad on the top, coating heat-conducting silicone grease, or coating liquid gold.

[0016] In a preferred embodiment of the utility model, the switching power supply further comprises a fan assembly, and the fan assembly blows or sucks air towards the heat dissipation channel of the radiator.

[0017] In a preferred embodiment of the utility model, the heat dissipation channel of the radiator is filled with cooling liquid, and the cooling liquid comprises pure water, ethylene glycol-based cooling liquid, carbon hydrogen and organic silicon-based cooling liquid, carbon fluoride-based cooling liquid, alcohol-based cooling liquid, glycerol-based cooling liquid, or propylene glycol-based cooling liquid.

[0018] In a preferred embodiment of the utility model, a sealing measure is applied at the connection between the shell and the radiator, and the sealing measure is one or a combination of the following: a sealing ring is arranged at the connection, point sealing is performed at the connection, or glue sealing is performed inside the closed cavity of the shell.

[0019] Beneficial effects, the switching power supply of the utility model, the water vapor, dust and salt fog in the external environment are isolated, and the stable working environment is provided for the power supply, the power supply life is prolonged, and meanwhile, the novel radiator is combined, so that the heat of the heating element of the switching power supply is evenly distributed through the radiator substrate and the heat pipe, and finally, the heat is taken out by the independent air duct through the heat dissipation fins, so that more efficient heat dissipation is realized.

[0020] In order to make the above features and advantages of the utility model more obvious and easy to understand, the following embodiments are specifically described, and the accompanying drawings are described in detail as follows. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a structural schematic view of the radiator of the utility model.

[0022] Figure 2 It is a side schematic view of the switching power supply of the utility model.

[0023] Figure 3 It is an explosion view of the switching power supply of the utility model.

[0024] Figure 4 It is an internal sectional view of the switching power supply of the utility model. DETAILED DESCRIPTION

[0025] In order to make the purpose and technical solution of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front, back, bottom, top, etc., are only reference to the directions of the attached drawings. Therefore, the directional terms used are for illustration, not for limitation of the present invention.

[0026] Figure 1 This is a schematic diagram of the structure of the radiator of the present invention. Figure 1 As shown, the radiator 10 includes a first heat dissipation unit 11 and a second heat dissipation unit 12 , and the first heat dissipation unit 11 and the second heat dissipation unit 12 are fixedly connected up and down to form the radiator 10 .

[0027] The first heat dissipation unit 11 includes a first substrate 111 and a first heat dissipation fin group 112. The first heat dissipation fin group 112 is arranged on the bottom side of the first substrate 111 and is composed of a plurality of heat dissipation fins arranged in parallel and spaced apart. The first heat dissipation unit 11 also includes a first side plate 113. Two first side plates 113 are arranged on both sides of the first heat dissipation fin group 112, are arranged parallel to the heat dissipation fins, and are fixedly connected to or integrally formed with the first substrate 111.

[0028] The second heat dissipation unit 12 includes a second substrate 121 and a second heat dissipation fin group 122. The second heat dissipation fin group 122 is arranged on the bottom side of the second substrate 121 and is composed of a plurality of heat dissipation fins arranged in parallel and spaced apart. The second heat dissipation unit 12 also includes a second side plate 123. Two second side plates 123 are arranged on both sides of the second heat dissipation fin group 122, are arranged parallel to the heat dissipation fins, and are fixedly connected to or integrally formed with the second substrate 121.

[0029] The first heat dissipation unit 11 has a side with the first heat dissipation fin group 112 and the second heat dissipation unit 12 has a side with the second heat dissipation fin group 122, and is fixedly connected by the first side plate 113 and the second side plate 123 to form the heat sink 10. In the heat sink 10, the surface sides of the first base plate 111 and the second base plate 121 face outward, and a heat dissipation channel 20 is formed between adjacent heat dissipation fins in the first heat dissipation fin group 112 and the second heat dissipation fin group 122.

[0030] The first side plate 113 and the second side plate 123 can be fixed by various ways such as buckling, screwing, welding and gluing.

[0031] Preferably, heat pipes can be used in the heat sink 10 to further improve the heat dissipation performance, the heat pipes can transfer heat more evenly to the heat dissipation fins, effectively reducing the local heat accumulation, and more conducive to heat dissipation. For example, the heat conductive plate can be used as the first base plate 111 and the second base plate 121, the heat conductive plate (Vapor Chamber) is also called the uniform plate, the super heat conductive plate, the function and working principle are consistent with the heat pipe, the closed plate cavity is used as the working fluid to evaporate and condense circulation, so that it has the characteristics of rapid uniformity, so as to have the functions of rapid heat conduction and heat diffusion. Or a traditional heat pipe can also be used, for example, a plurality of first heat pipes 114 are embedded in the first base plate 111, a plurality of second heat pipes 124 are embedded in the second base plate 121, the first heat pipe 114 and the second heat pipe 124 also adopt the squashed heat pipe, the arrangement position is adjusted to correspond to the mounting position of the heat generating element, and better heat dissipation is realized.

[0032] Preferably, the heat dissipation fins in the first heat dissipation fin group 112 and the second heat dissipation fin group 122 are connected to the bottom side of the first base plate 111 and the second base plate 121 respectively by die forming or brazing, and the cross-sectional shape of the heat dissipation fins is wave-shaped or zigzag-shaped.

[0033] Preferably, the first base plate 111, the first heat dissipation fin group 112, the first side plate 113, the second base plate 121, the second heat dissipation fin group 122 and the second side plate 123 in the heat sink 10 are made of metal materials such as aluminum or copper which have excellent heat conduction performance.

[0034] The utility model also relates to a switching power supply. Figure 2 It is the side view schematic diagram of switching power supply of the utility model, Figure 3 It is the explosion drawing of switching power supply of the utility model. As Figure 2 And Figure 3 As shown in the drawing, the switching power supply 1 comprises the heat sink 10.

[0035] The switch power supply 1 further comprises a first housing 30 and a second housing 50, one side of the first housing 30 and the second housing 50 with cavities is fixed on the surface side of the first substrate 111 and the second substrate 121 respectively, forming two independent sealed cavities isolated from the external environment, which can meet the IP65 (Ingress Protection 65) protection level, protecting the electronic devices inside the cavity from external environment erosion. The connection between the first housing 30 and the second housing 50 and the heat sink 10 can be further improved by applying additional sealing measures. The sealing measures include but are not limited to setting a sealing ring at the connection between the first housing 30 and the second housing 50 and the heat sink 10, point sealing at the connection, or pouring glue sealing inside the cavities of the first housing 30 and the second housing 50. The combination of the above sealing methods can also be used to achieve better sealing effect.

[0036] As shown in Figure 3 The first housing 30 and the second housing 50 can be formed by combining side plates and top plates.

[0037] The switch power supply 1 further comprises a first circuit board 40 and a second circuit board 60, which are respectively arranged in the sealed cavities of the first housing 30 and the second housing 50, and are fixed with the first housing 30 and the second housing 50 respectively. The first circuit board 40 and the second circuit board 60 are used to realize the circuit function of the switch power supply 1.

[0038] For the case of only one circuit board, a housing can also be added to one side of the first substrate 111 or the second substrate 121 of the heat sink 10, and the circuit board can be sealed in the housing.

[0039] Figure 4 The internal cross-sectional view of the switch power supply of the present application is shown in Figure 3 and Figure 4 The first circuit board 40 and the second circuit board 60 with one side of the heat generating devices are arranged adjacent to the heat sink 10. The heat generating devices in the switch power supply 1 include transformers, inductors and capacitors, etc. The heat generating devices can be in contact with the heat sink 10 through methods such as potting, setting heat-conducting pads on the top, coating heat-conducting silicone grease or liquid gold (liquid metal), etc., to achieve more efficient heat exchange.

[0040] The heat dissipation channels 20 formed between adjacent heat dissipation fins can be cooled by natural cooling, air cooling, liquid cooling, etc.

[0041] For example, preferably, the switch power supply 1 further comprises a fan assembly 70, as shown in Figure 3 Figure 4As shown, the fan assembly 70 is arranged towards the heat dissipation channel 20. The fan assembly 70 can be arranged at one end of the heat dissipation channel 20, or both ends of the heat dissipation channel 20. The fan in the fan assembly 70 can adopt a blowing or suction mode to take away the air heated by the heat dissipation fins from the heat dissipation channel 20.

[0042] The heat dissipation channel 20 can also be filled with cooling liquid, which contacts the heat dissipation fins in the first heat dissipation fin group 112 and the second heat dissipation fin group 122, and a pump head is additionally arranged to realize circulation of the cooling liquid. The cooling liquid includes but is not limited to pure water, ethylene glycol-based cooling liquid, carbon hydrogen and organic silicon-based cooling liquid, carbon fluoride-based cooling liquid, alcohol-based cooling liquid, glycerol-based cooling liquid, propylene glycol-based cooling liquid, etc.

[0043] In summary, the switch power supply of the utility model, electronic components are arranged in two independent IP65 independent sealed cavities, isolate the moisture, dust and salt spray in the external environment, invade, provide stable working environment for power supply, prolong the service life of power supply. Meanwhile, the novel radiator provided by the utility model is combined, the heat of the heat generating element of the switch power supply is evenly distributed through the radiator substrate and the heat pipe, and finally the heat is taken out by the independent air duct through the heat dissipation fins, so that more efficient heat dissipation is realized.

[0044] Although the utility model has been disclosed as above with embodiments, it is not intended to limit the utility model, and anyone with ordinary knowledge in the art can make some changes and decorations without departing from the spirit and scope of the utility model, so the protection scope of the utility model is defined by the appended patent application scope.

Claims

1. A radiator, characterized in that: comprising a first heat dissipation unit and a second heat dissipation unit, The first heat dissipation unit includes a first base plate, a first heat dissipation fin group, and a first side plate, wherein the first heat dissipation fin group is arranged on the bottom side of the first base plate, and two first side plates are arranged on both sides of the first heat dissipation fin group and are fixedly connected to the first base plate; The second heat dissipation unit includes a second base plate, a second heat dissipation fin group, and a second side plate, wherein the second heat dissipation fin group is arranged on the bottom side of the second base plate, and two second side plates are arranged on both sides of the second heat dissipation fin group and are fixedly connected to the second base plate; The side of the first heat dissipation unit with the first heat dissipation fin group is buckled with the side of the second heat dissipation unit with the second heat dissipation fin group, and the first side plate and the second side plate are fixedly connected.

2. The radiator according to claim 1, wherein The first heat dissipation fin group and the second heat dissipation fin group are composed of a plurality of heat dissipation fins arranged in parallel and at intervals, and heat dissipation channels are formed between adjacent heat dissipation fins.

3. The radiator according to claim 2, wherein: The heat dissipating fins in the first heat dissipating fin group and the second heat dissipating fin group are respectively connected to the bottom surface sides of the first substrate and the second substrate by means of mold forming or brazing.

4. The radiator according to claim 2, wherein: The cross-sectional shape of the heat dissipation fins is wavy or sawtooth.

5. The radiator according to claim 1, wherein The first substrate and the second substrate are heat conducting plates.

6. The heat sink according to claim 1, wherein: The radiator further includes a first heat pipe and a second heat pipe. A plurality of the first heat pipes are buried in the first substrate, and a plurality of the second heat pipes are buried in the second substrate.

7. A switching power supply with a heat sink, characterized in that: The heat sink comprises the heat sink according to any one of claims 1 to 6, a housing and a circuit board; The side of the shell with the cavity is fixed to the surface side of the first substrate and / or the second substrate of the radiator to form a closed cavity isolated from the external environment; the circuit board is arranged in the closed cavity of the shell.

8. The switching power supply with a heat sink according to claim 7, wherein: The circuit board is provided with a heating device, and a side of the circuit board provided with the heating device faces the radiator.

9. The switching power supply with a heat sink according to claim 8, wherein: The heating device is potted, a thermal pad is arranged on the top, thermal grease is applied, or liquid gold is applied, so that the heating device is in contact with the radiator.

10. The switching power supply with a heat sink according to claim 7, wherein: The switching power supply further includes a fan assembly, which blows or draws air toward the heat dissipation channel of the radiator.

11. The switching power supply with a heat sink according to claim 7, wherein: The heat dissipation channel of the radiator is filled with coolant, and the coolant includes pure water, ethylene glycol-based coolant, hydrocarbon and silicone coolant, fluorocarbon coolant, alcohol coolant, glycerin coolant, or propylene glycol coolant.

12. The switching power supply with a heat sink according to claim 7, wherein: Sealing measures are applied at the connection between the shell and the radiator, and the sealing measures are: providing a sealing ring at the connection, performing glue sealing at the connection, or performing glue sealing inside the closed cavity of the shell, or a combination of the above.

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