Wire bonding system and wire bonding tool replacement system

Abstract

The utility model provides a wire welding system. The wire bonding system includes (i) a horn assembly configured to carry a wire bonding tool; and (ii) a wire bonding tool replacement system for replacing the wire bonding tool with another wire bonding tool. The utility model further provides a welding wire tool replacing system which is used for replacing the welding wire tool on the welding wire system, and the welding wire tool replacing system comprises a clamping mechanism which is used for clamping the welding wire tool so as to remove the welding wire tool from the welding head assembly of the welding wire system.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Application No. 63 / 601,286, filed on November 21, 2023, the contents of which are incorporated herein by reference. Technical Field

[0003] The utility model relates to a wire bonding system, and in particular to a wire bonding system comprising a wire replacement system and / or a wire bonding tool replacement system. Background Art

[0004] In the processing and packaging of semiconductor devices, wire bonding continues to be the primary method for providing electrical interconnection between two locations within a package (e.g., between a die pad of a semiconductor die and a wire of a lead frame). More specifically, a wire bonder (also known as a wire bonding system) is used to form a wire arc between the various locations to be electrically interconnected. The primary methods for forming a wire arc are ball bonding and wedge bonding. When forming a weld between (a) the end of the wire arc and (b) the welding location (e.g., a pad, a wire, etc.), different types of welding energy may be used, including, for example, ultrasonic energy, thermoacoustic energy, hot pressing energy, etc., among others. Wire bonding systems (e.g., stud punches) are also used to form conductive bumps from portions of the lead.

[0005] Replacing a portion of a wire bonder and / or replacing a wire bonder tool on a wire bonder often results in significant delays or machine downtime. Therefore, it would be desirable to provide an improved wire bonder system that addresses these issues. Utility Model Content

[0006] According to an exemplary embodiment of the present invention, a wire bonding system is provided. The wire bonding system includes a bonding head assembly configured to carry a wire bonding tool. The wire bonding system also includes a wire bonding tool replacement system for replacing the wire bonding tool with another wire bonding tool.

[0007] According to another exemplary embodiment of the present invention, a wire bonding tool replacement system for replacing a wire bonding tool on a wire bonding system is provided. The wire bonding tool replacement system includes a clamping mechanism for clamping the wire bonding tool to remove the wire bonding tool from a bonding head assembly of the wire bonding system.

[0008] According to other embodiments of the present application, the wire bonding system and / or the wire bonding tool change system described in the preceding two paragraphs can have any one or more of the following features: the wire bonding tool change system includes a clamping mechanism for clamping the wire bonding tool to remove the wire bonding tool from the bond head assembly; the clamping mechanism includes: (i) a threading portion for threading; and (ii) a tool clamping portion for clamping the wire bonding tool; the clamping mechanism includes a spring for providing a clamping force associated with the clamping operation; the clamping mechanism is configured to extract the other wire bonding tool from a wire bonding tool source and to carry the other wire bonding tool to the bond head assembly; the wire bonding tool source is configured to provide a plurality of wire bonding tools; the wire bonding tool change system includes a receiving portion for receiving a used wire bonding tool; the wire bonding tool source defines the receiving portion; the clamping mechanism is carried by a movable arm assembly; the movable arm assembly is further configured to remove a lead wire from the wire bonding tool and to replace the lead wire in connection with replacing the wire bonding tool; the wire bonding tool change system is configured to be removed from the wire bonding system; the wire bonding tool change system is further configured to be installed in connection with another wire bonding system; the wire bonding tool change system is configured to automatically replace the wire bonding tool upon occurrence of a predetermined event; the clamping mechanism includes an image registration feature that provides a reference for determining a position of the clamping mechanism; a vision system configured to determine the position of the clamping mechanism by collecting an image of the image registration feature; an optical path between the vision system and the image registration feature includes a reflective optical element; and an optical path between the vision system and the image registration feature includes a refractive optical element.

[0009] According to another exemplary embodiment of the present application, a method of replacing a wire bonding tool using a wire bonding tool change system on a wire bonder is provided. The method includes the steps of: removing a wire bonding tool from a bond head assembly using the wire bonding tool change system; and providing another wire bonding tool to the bond head assembly using the wire bonding tool change system.

[0010] According to other embodiments of the present application, the method of the preceding paragraph can have any one or more of the following features: the wire bonding tool change system includes a clamping mechanism for clamping the wire bonding tool to remove the wire bonding tool from the bonding head assembly; the clamping mechanism includes a spring for providing a clamping force associated with the clamping operation; the clamping mechanism is configured to extract the other wire bonding tool from a wire bonding tool source and to carry the other wire bonding tool to the bonding head assembly; the wire bonding tool source is configured to provide a plurality of wire bonding tools; the wire bonding tool change system includes a receiving portion for receiving a used wire bonding tool; the wire bonding tool source defines the receiving portion; the clamping mechanism is carried by a movable arm assembly; the movable arm assembly is further configured to remove a portion of a lead from the wire bonding tool and to replace the lead in connection with replacing the wire bonding tool; the wire bonding tool change system is configured to be removed from the wire bonding system; the wire bonding tool change system is further configured to be installed in connection with another wire bonding system; the wire bonding tool change system is configured to automatically replace the wire bonding tool upon occurrence of a predetermined event; further comprising the step of removing a portion of a lead from the wire bonding tool; and / or further comprising the step of providing a portion of a lead through another wire bonding tool. BRIEF DESCRIPTION OF DRAWINGS

[0011] The present application can be better understood with reference to the following detailed description in connection with the attached drawings. It is emphasized that, according to common practice, the various features of the drawings are not to scale. On the contrary, the dimensions of the various features are arbitrarily expanded or reduced for clarity. Included in the drawings are the following figures:

[0012] FIGS. 1A-1F are various perspective views of the wire bonding system according to exemplary embodiments of the present application;

[0013] FIGS. 2A-2B is a perspective view of a wire bonding tool source according to exemplary embodiments of the present application;

[0014] FIGS. 2C-2D is a perspective view of another wire bonding tool source according to exemplary embodiments of the present application;

[0015] FIGS. 3A-3H are various block diagram side views of the wire bonding system of FIGS. 1A-1F

[0016] FIGS. 4A-4D are various perspective views of the components of the wire bonding system according to exemplary embodiments of the present application;

[0017] FIGS. 5A-5H are various block diagram side views of the components of the wire bonding system of FIGS. 3A-3D

[0018] FIGS. 6A-6E ​​are various perspective views illustrating a wire bonding system according to another exemplary embodiment of the present application;

[0019] FIGS. 7A-7F are FIGS. 6A-6E are various block diagram side views of various elements of a wire bonding system;

[0020] FIG. 8A and FIG. 8B are perspective views illustrating another wire bonding system according to an exemplary embodiment of the present application;

[0021] FIG. 9A and FIG. 9B are perspective views illustrating elements of a wire bonding tool change system according to an exemplary embodiment of the present application; and

[0022] FIG. 10 and FIG. 11 are flowcharts illustrating various exemplary embodiments of the present application. DETAILED DESCRIPTION

[0023] Various wire bonding systems (and components thereof) and related methods are provided herein. In particular embodiments, a wire bonding system includes a wire bonding tool change system. In particular embodiments, the wire bonding tool change system can be configured to automatically change a wire bonding tool (e.g., a capillary tube). The wire bonding tool change system can be configured to: precisely position a clamping mechanism (e.g., a "gripper") to clamp a wire bonding tool onto a bonding system (e.g., a bonder, a "bonder head", etc.); loosen a screw (e.g., a "cap screw" or other tightening mechanism) using a robotic wrench; and / or remove a used wire bonding tool from a transducer (e.g., an ultrasonic transducer) of the wire bonding system. In particular embodiments, the wire bonding tool change system can be configured to: pick up a new wire bonding tool from a source of wire bonding tools (e.g., a capillary tube supply); insert the new wire bonding tool into a wire bonding tool hole of the transducer; and / or tighten (e.g., automatically tighten) the screw prior to a subsequent wire bonding operation. In particular embodiments, the wire bonding tool change system can be configured to provide real-time communication with a bonding system (e.g., a computer of the bonding system) regarding: positioning the clamping mechanism with a target wire bonding tool; positioning the wire bonding tool; and / or positioning the wrench (e.g., in association with a servo and / or robotic wrench arm assembly). In particular embodiments, the wire bonding tool change system can be configured to provide feedback control in association with robotic positioning. In particular embodiments, open / short circuit detection can be used in association with wire bonding tool change (e.g., removing a wire bonding tool, picking up a wire bonding tool, inserting a wire bonding tool, tightening / loosening a screw, etc.).

[0024] Particular embodiments of the present application provide particular advantages, such as automatically changing a wire bonding tool, thereby reducing labor (e.g., manual labor).

[0025] Particular embodiments of the present application provide a wire bonding system that includes a wire lead replacement system configured to: (i) remove a wire lead portion engaged with a wire bonding tool; and (ii) replace the wire lead portion (e.g., with the same wire lead portion, with another wire lead portion). Particular embodiments provide automated threading of a wire lead (e.g., during a wire bonding tool change operation in a wire bonding system) using robotic mechanisms. Particular embodiments include: partially cutting (e.g., a "half-cut notch") a wire lead (e.g., at a location between a wire lead clamp and a transducer) using a cutting mechanism (e.g., a blade, a cutting portion of a gripping mechanism, etc.); moving a gripping mechanism (e.g., a gripper) under the wire bonding tool; pulling the wire lead down so that the partially cut portion / notch is at / near a middle portion of a bore in the wire bonding tool; closing the wire lead clamp and the gripping mechanism of the wire bonding head assembly; pulling the wire lead down with the gripping mechanism so that the wire lead breaks at the partially cut portion / notch; completing the wire lead threading process after the wire bonding tool is removed; and / or inserting another (e.g., new) wire bonding tool. Other embodiments include: removing a wire lead portion engaged with a wire bonding tool, and replacing the wire lead portion with the same wire lead portion (e.g., after a wire bonding tool change) without cutting and / or breaking the wire lead portion.

[0026] Particular embodiments of the present application provide particular advantages, such as automated completion of wire lead threading (e.g., in connection with a wire bonding tool change), thereby reducing labor hours (e.g., manual labor hours). Other advantages include consistent breaking of a wire lead to fix a wire lead tail position that is just below a transducer surface within a bore of a wire bonding tool. Particular methods do not require additional mechanisms to fix a wire lead against positioning of the bore of a wire bonding tool, but can provide a high success rate (e.g., in part due to a highly reliable alignment calibration provided by a wire bonding system).

[0027] Reference will now be made to the drawings, FIG. 1AA wire bonding system 100 is illustrated. Wire bonding system 100 includes a bonding head assembly 102 (partially shown) configured to carry a wire bonding tool 110. Bonding head assembly 102 is illustrated as including a wire clamp 104 and a transducer 106. Wire clamp 104 is configured to switch between (i) allowing a wire supply 108 to pass freely through and (ii) grasping wire supply 108 to prevent relative movement between wire supply 108 and bonding head assembly 102. The present invention is not limited to any particular operation of wire clamp 104 (e.g., one portion of wire clamp 104 can be moved relative to another portion to grasp wire supply 108, multiple portions of wire clamp 104 can be moved relative to each other to grasp wire supply 108, etc.). Wire supply 108 is illustrated as being disposed through both wire clamp 104 (e.g., in a closed configuration) and transducer 106. Wire supply 108 can be continuous with a wire source (eg, a wire spool of a wire bonding system). Wire portion 108a of wire supply 108 is shown disposed through wire bonding tool 110.

[0028] The wire bonding system 100 also includes a wire bonding tool replacement system 112a (partially shown). It should be understood that the wire bonding tool replacement system 112a is not identical to that described elsewhere herein (e.g., FIGS. 4A-4D 、 FIGS. 5A-5H 、 FIGS. 6A-6E 、 FIGS. 7A-7F The wire replacement system 112b and / or the wire replacement system 112b′ described in connection with the wire bonding systems 300 and 600 share many of the same elements and aspects. For example, both the wire bonding tool replacement system 112a and the wire replacement system 112b include a clamping mechanism 114.

[0029] The wire bonding tool replacement system 112a is configured to replace the wire bonding tool 110 with another wire bonding tool (e.g., another wire bonding tool 110 or a different type of wire bonding tool). The wire bonding tool replacement system 112a is illustrated as including a clamping mechanism 114 for clamping and / or removing the wire bonding tool 110 from the bonding head assembly 102. The clamping mechanism 114 is illustrated as being carried by a movable arm assembly 128 (partially shown).

[0030] The clamping mechanism 114 can be configured to clamp the wire bonding tool 110 (e.g., to remove the wire bonding tool 110 from the bonding head assembly 102). In certain embodiments, the clamping mechanism 114 can be configured to include a clamping portion (e.g., a first clamping portion 114a and / or a second clamping portion 114b). In certain embodiments, the clamping mechanism 114 includes: (i) a gripping portion for gripping the wire supply 108; (ii) a cutting portion for partially cutting the wire supply 108; (iii) a threading portion for threading the wire supply 108; and / or (iv) a tool gripping portion for gripping the wire bonding tool 110.

[0031] The clamping mechanism 114 is illustrated as including a first clamping portion 114a (e.g., a moving clamping portion) and an adjacent second clamping portion 114b (e.g., a fixed clamping portion). The second clamping portion 114b is illustrated as including a gripping portion 114b1 (e.g., for gripping and / or clamping the wire supply 108 and / or the wire tool 110) and a tool clamping portion 114b2 (e.g., for clamping the wire tool 110). It should be appreciated that each clamping portion 114a / 114b can include one or more gripping portions and tool clamping portions in particular embodiments. The first clamping portion 114a can be configured to move relative to the second clamping portion 114b in at least one direction (e.g., laterally along the x-axis).

[0032] The wire tool change system 112a is configured to provide a clamping force sufficient to support, hold, remove, and / or change the wire tool 110 in a clamping operation and / or a wire tool change operation. In particular embodiments, the clamping mechanism 114 can include a spring 122 (e.g., a leaf spring) for providing the clamping force associated with the clamping operation. The spring 122 can be configured to actuate at least a portion of the first clamping portion 114a (e.g., a moving clamping portion, a gripping portion, a cutting portion, a threading portion, a tool clamping portion) relative to the second clamping portion 114b (e.g., a fixed clamping portion).

[0033] Referring now to FIG. 6, FIG. 1B the wire tool change system 112a and the clamping mechanism 114 are shown moved (i.e., along the y-axis) under the transducer 106 and around the wire tool 110. The wrench 118 (e.g., a cap screw wrench) is shown rotated about the x-axis to loosen the screw 116 (e.g., a cap screw) to loosen the transducer 106 to release the wire tool 110. Prior to (or concurrently with) tightening the transducer 106, the clamping mechanism 114 can clamp the wire tool 110 with the desired clamping force (e.g., move the first clamping portion 114a relative to the second clamping portion 114b). In particular embodiments, the wrench 118 can be included in the wire tool change system 112a (e.g., controlled by a general-purpose computing system associated with the clamping mechanism 114).

[0034] Referring now to FIG. 7, FIG. 1C the wire tool change system 112a and the clamping mechanism 114 are shown moving the wire tool 110 away (i.e., along the z-axis) from the horn assembly 102 and the transducer 106. After removing the wire tool 110 (e.g., a “used” or damaged wire tool), the wire tool change system 112a can discard the wire tool 110.

[0035] Referring now to FIG. 8, FIG. 1D, the figure shows the wire tool replacement system 112a and the clamping mechanism 114 removing the wire tool 110 from the wire tool source 120 (ie, along the z-axis). The wire tool source 120 defines a storage area for waste material (e.g., FIGS. 4A-4D and FIGS. 5A-5H 1. A receiving portion 120a of a wire bonding tool 110 (e.g., a used wire bonding tool 110, a portion of wire bonded after being removed by a wire replacement system) is shown. A gripping mechanism 114 is shown gripping a wire bonding tool 110 (e.g., a "new" or undamaged wire bonding tool) and beginning to move the wire bonding tool 110 away from the wire bonding tool source 120 (i.e., along the z-axis).

[0036] The gripping mechanism 114 is configured to extract the wire bonding tool 110 from the wire bonding tool source 120 and carry the wire bonding tool 110 to the bonding head assembly 102. Such configuration may include specific gripping portions sized to enable the gripping mechanism 114 to extract one of a plurality of wire bonding tools 110. Such configuration may also include mechanically coupling portions of the gripping mechanism 114 to a motion system (e.g., of the wire bonding tool changing system 112a) to move the gripping mechanism 114 across a range of motion (e.g., from the bonding head assembly 102 to the wire bonding tool source 120). Such a motion system may be configured to execute computer-readable instructions; such computer-readable instructions may include information related to the plurality of wire bonding tools 110 (e.g., position or size information of each of the plurality of wire bonding tools 110) and motion profiles, and / or predetermined events (e.g., number of bonding operations, time since installation, other information related to automatically changing a wire bonding tool upon the occurrence of a predetermined event, etc.).

[0037] Although FIG. 1D The wire bonding tool source 120 is shown in a particular configuration, but the present invention is not limited thereto. Other configurations of the wire bonding tool source are contemplated. For example, any number of slots for multiple wire bonding tools 110 are contemplated. The wire bonding tool source can be configured to be on the top side rather than FIG. 1D The bottom side of the wire bonding tool 110 is shown. Such a wire bonding tool source is illustrated and described herein (e.g., see FIGS. 2A-2D ). Wire bonding tools are available individually or as part of a cassette set (see, for example, FIGS. 2C-2D The wire tool source may be included as part of the wire tool replacement system and / or lead replacement system (eg, structurally integrated, electrically integrated), or may be separate from the wire tool replacement system. No receiving portion is required.

[0038] Now refer to FIG. 1E , the figure shows the wire bonding tool replacement system 112a and the clamping mechanism 114 moving the wire bonding tool 110 below the transducer 106 (ie, along the z-axis).

[0039] Now refer toFIG. 1F The wire tool 110 is disposed within the transducer 106. The illustrated wrench 118 (e.g., a cap screw wrench) is rotated about the x-axis to tighten the screw 116 (e.g., a cap screw), thereby tightening the transducer 106 to grip the wire tool 110. After (and / or concurrently with) tightening the transducer 106, the clamping mechanism 114 can be unclamped from the wire tool 110 (e.g., move the first clamping portion 114a relative to the second clamping portion 114b).

[0040] While the wire tool change system 112a / lead change system 112b can be included in a single wire bonding system (e.g., a single wire bonder), the present disclosure is not so limited. In particular embodiments, the wire tool change system 112a / lead change system 112b can be configured to be removed from the wire bonding system 100 and used in association with another wire bonding system. In particular embodiments, the wire tool change system 112a / lead change system 112b can be moved between multiple wire bonding systems automatically (e.g., via a robot).

[0041] Reference is now made to FIGS. 2A-2D Figures are shown illustrating wire tool sources that can be used to replace the wire tool source 120. In particular, FIG. 2A and FIG. 2B Figure illustrates a wire tool source 120', and FIG. 2C and FIG. 2D Figure illustrates a wire tool source 120". The wire tool sources 120' and 120" are configured to simultaneously (i) provide a plurality of wire tools 110 (e.g., each of the plurality of wire tools 110 can be installed in a slot of the wire tool source 120' / 120"), and (ii) provide a receiving portion (such as the receiving portion 120a' defined by the wire tool source 120', or the empty slot 120b' or 120b1") to receive a wire tool from a wire bonding system (e.g., to receive a used wire tool, etc.).

[0042] FIG. 2A Figure illustrates a lead change system 112b' interacting with the wire tool source 120' (the lead change system 112b' will be described in connection with FIGS. 6A-6E Figure). The lead change system 112b' is configured to change the wire tool 110. The lead change system 112b' carries the wire tool 110 with the clamping mechanism 114' (e.g., a used wire tool 110 that has been removed from the transducer 106, as FIG. 1C). The lead replacement system 112b' is aligned with the empty slot 120b' such that the wire bonding tool 110 (e.g., a used wire bonding tool) can be installed into the empty slot 120b'. By receiving the wire bonding tool 110 in this manner, the empty slot 120b' can function as a receptacle (as opposed to the used receptacle 120a') for receiving the wire bonding tool 110 (e.g., a used wire bonding tool) for removal of waste material from the wire bonding system.

[0043] While FIG. 2A The use of the empty slot 120b' to receive the wire bonding tool 110 is illustrated, but the present disclosure is not so limited. It is contemplated that the receptacle 120a' can be used to receive at least one of (i) a wire bonding tool (e.g., a used wire bonding tool) and (ii) a lead (e.g., as described above with respect to the removed lead portion 108a). FIGS. 5E-5F As described herein, the receptacle 120a' can be used to receive at least one of (i) a wire bonding tool (e.g., a used wire bonding tool) and (ii) a lead (e.g., as described above with respect to the removed lead portion 108a).

[0044] In FIG. 2B , the wire bonding tool 110 has been inserted into the empty slot 120b' and the lead replacement system 112b' has removed another wire bonding tool 110 from the wire bonding tool source 120', creating a new empty slot 120b' (e.g., into which another "used" wire bonding tool 110 can be inserted). The lead replacement system 112b' can install the wire bonding tool 110 into a transducer of the wire bonding system (e.g., see FIG. 1E and FIG. 1F ).

[0045] When some or all of the plurality of wire bonding tools 110 have been removed from the wire bonding tool source 120' (and possibly replaced with used wire bonding tools 110), the wire bonding tool source 120' can be removed from the lead replacement system 112b'. Alternatively, the used wire bonding tools 110 can also be removed and / or replaced individually (e.g., manually or via an automated process).

[0046] In FIG. 2C , the wire bonding tool source 120" includes a wire bonding tool cartridge 120b" that houses a plurality of wire bonding tools 110 and an empty slot 120b1". The wire bonding tool cartridge 120b" is an example of a mechanism for holding a plurality of wire bonding tools 110 such that the plurality of wire bonding tools 110 can be efficiently loaded into the wire bonding tool source 120". FIG. 2C The lead replacement system 112b' (including the clamping portion 114) is shown inserting a wire bonding tool 110 into the empty slot 120b1" (e.g., in a similar manner as described above with respect to FIG. 2A and FIG. 2B ).

[0047] In FIG. 2DIn particular, the wire bonding tool cartridge 120b" is being removed from the wire bonding tool source 120", exposing a cartridge base 120c" defined by the wire bonding tool source 120". The cartridge base 120c" is configured to receive another wire bonding tool cartridge 120b". After removal, the wire bonding tool cartridge 120b" can be discarded or reloaded with other / new wire bonding tools (e.g., manually or via an automated process). The wire bonding tool cartridge 120b" can be configured to include a cover to protect the plurality of wire bonding tools 110 from damage during transport and handling.

[0048] While FIGS. 2A-2D While the interaction of the wire lead replacement system 112b' with the wire bonding tool sources 120', 120" is illustrated, the present disclosure is not so limited. That is, any wire bonding tool replacement system or wire lead replacement system (e.g., the wire bonding tool replacement system 112a, the wire lead replacement system 112b, etc.) within the scope of the present disclosure can be used to interact with any wire bonding tool source (e.g., the wire bonding tool sources 120', 120") within the scope of the present disclosure.

[0049] Reference is now made to FIGS. 3A-3H FIGS. 1-3 illustrate various block side views of selected portions of a wire bonding system 100. With particular reference to FIG. 3A The wire bonding system 100 is illustrated as including a bonding head assembly 102 (including a transducer 106). A wire bonding tool 110 is illustrated as being carried by the bonding head assembly 102 and disposed within the transducer 106. The wire bonding system 100 also includes a wire bonding tool replacement system 112a (partially illustrated). The wire bonding tool replacement system 112a is configured to replace the wire bonding tool 110 with another wire bonding tool (e.g., another wire bonding tool 110). The wire bonding tool replacement system 112a is illustrated as including a clamping mechanism 114 for clamping and removing the wire bonding tool 110 from the bonding head assembly 102. The clamping mechanism 114 includes a first clamping portion 114a (e.g., a moving clamping portion) and a second clamping portion 114b (e.g., a fixed clamping portion) adjacent to the first clamping portion 114a. In FIG. 3B In particular, the clamping mechanism 114 is illustrated as gripping the wire bonding tool 110.

[0050] Reference is now made to FIG. 3C A wrench 118 (e.g., a cap screw wrench) is illustrated as being rotated about the x-axis to loosen the screw 116 (e.g., a cap screw), thereby loosening the transducer 106 to release the wire bonding tool 110. Prior to (and / or concurrently with) loosening the transducer 106, the clamping mechanism 114 can clamp the wire bonding tool 110 (e.g., move the first clamping portion 114a relative to the second clamping portion 114b).

[0051] Reference is now made to FIG. 3D, the figure shows that the clamping mechanism 114 moves the wire bonding tool 110 away from (ie, along the z-axis) the bond head assembly 102 and the transducer 106. The wire bonding tool 110 can be discarded before retrieving another wire bonding tool.

[0052] Now refer to FIG. 3E , the wire bonding tool source 120 ′ is shown as including a plurality of wire bonding tools 110 (ie, FIGS. 3E-3F In the block diagram representation of FIG, only four wire bonding tools 110 and corresponding slots are shown.) The second clamping portion 114b is shown adjacent to the wire bonding tool source 120'.

[0053] Now refer to FIG. 3F , the clamping mechanism 114 is shown removing the wire bonding tool 110 from the wire bonding tool source 120 ′ (ie, along the z-axis).

[0054] Now refer to FIG. 3G , the figure shows the clamping mechanism 114 moving the wire bonding tool 110 below the transducer 106 (ie, along the z-axis).

[0055] Now refer to FIG. 3H , a wire bonding tool 110 is shown disposed within transducer 106. Wrench 118 (e.g., a cap screw wrench) is shown rotated about the x-axis to tighten screw 116 (e.g., a cap screw), thereby tightening transducer 106 to grip wire bonding tool 110. After (and / or while) tightening transducer 106, clamping mechanism 114 may unclamp from wire bonding tool 110 (e.g., by moving first clamping portion 114a relative to second clamping portion 114b).

[0056] Although the wire bonding system 100 (combined FIGS. 1A-1F and FIGS. 3A-3H 10 is configured to (e.g., automatically) remove and replace a wire bonding tool, but the present invention is not limited thereto. For example, a similar wire bonding system can be used to (e.g., automatically) remove and replace a lead. The movable arm assembly 128 and / or the clamping mechanism 114 can be configured to remove a lead from the wire bonding tool 110, and to replace a lead in connection with replacing the wire bonding tool 110. In one aspect, the clamping mechanism can include (i) a gripping portion for gripping the lead, (ii) a cutting portion for partially cutting the lead, and (iii) a threading portion for threading the lead (in addition to a tool clamping portion for gripping the wire bonding tool).

[0057] Now refer to FIG. 4A , the figure shows the lead replacement system 112b (partially shown) of the wire bonding system 300. It should be understood that the lead replacement system 112b is different from other parts of this document (e.g. FIGS. 1A-1D 、 FIGS. 3A-3HThe wire tool replacement system 112a described above in relation to the wire bonding system 100 shares many of the same elements and aspects with the wire replacement system 112b described above in relation to the wire bonding system 100. For example, FIG. 4A Various elements of the clamping mechanism 114 are illustrated, including the wire tool 110 being clamped by the clamping mechanism 114.

[0058] The wire replacement system 112b is configured to: (i) remove a portion of the wire that is engaged with the wire tool 110; and (ii) replace the wire portion (e.g., with the same wire portion or another wire portion). The wire replacement system 112b includes the clamping mechanism 114 that is configured to clamp the wire.

[0059] The clamping mechanism 114 is illustrated as including a first clamping portion 114a (e.g., a moving clamping portion) and a second clamping portion 114b (e.g., a fixed clamping portion) disposed adjacent to the first clamping portion 114a. The clamping mechanism 114 is illustrated as including a spring 122 configured to actuate the moving clamping portion (e.g., the first clamping portion 114a) relative to the fixed clamping portion (e.g., the second clamping portion 114b). The clamping mechanism 114 is illustrated as including a gripping portion 114al / 114bl for gripping the wire. The clamping mechanism 114 is illustrated as including a cutting portion 324 for cutting the wire (e.g., cutting the wire completely, cutting the wire in half, cutting the wire partially, creating a cut, etc.). The clamping mechanism 114 is illustrated as including a threading portion 326 for threading the wire. The clamping mechanism 114 is illustrated as including a tool clamping portion 114b2 for clamping the wire tool 110. In particular embodiments, the clamping mechanism 114 can be carried by the movable arm assembly 128.

[0060] The movable arm assembly 128 is configured to move the clamping mechanism 114 independently of the bonding head assembly 102 and / or the X-Y table that carries the bonding head assembly 102. Thus, the clamping mechanism 114 is distinguished from the wire clamp 104 in that the wire clamp 104 is part of the bonding head assembly 102 and thus cannot be moved independently of the bonding head assembly 102. The movable arm assembly 128 can have its own motion system / positioning system, e.g., where the motion system / positioning system is housed within the wire tool replacement system 112a / wire replacement system 112b.

[0061] Reference is now made to FIG. 4B FIG. 3 illustrates a wire bonding system 300. The wire bonding system 300 includes the bonding head assembly 102 (partially illustrated) that is configured to carry the wire tool 110. The bonding head assembly 102 is illustrated as including the wire clamp 104 and the transducer 106. The wire supply 108 is illustrated as being disposed through both the wire clamp 104 and the transducer 106. The wire portion 108a of the wire supply 108 is illustrated as being disposed through the wire tool 110.

[0062] The wire bonding system 300 also includes a wire replacement system 112b (partially illustrated) that is configured to (i) remove a portion of a wire that is engaged with the wire bonding tool and (ii) replace the wire portion (e.g., with the same wire portion or another wire portion). It should be appreciated that while the wire replacement system 112b can primarily replace the wire, the present disclosure is not so limited; in particular embodiments, the wire replacement system 112b can be configured to provide (or remove from) the bond head assembly 102 the wire bonding tool 110. It should be appreciated that the wire bonding tool 110 can be provided to the transducer 106 (of the bond head assembly 102) by the wire replacement system 112b.

[0063] In FIG. 4B In particular embodiments, the wire replacement system 112b is illustrated as cutting the wire supply 108 with a cutting portion 324 (e.g., a“half-cutting blade”) to partially cut (e.g.,“half-cut”) the wire supply 108. The clamping mechanism 114 has been positioned (e.g., along the z-axis in the“open” configuration) and then closed to perform the cutting operation, thereby forming a“half-cut” (or partial severance) on the wire supply 108. It should be appreciated that the cutting portion 324 can be controlled by a spring (e.g., using the spring 122) and can provide a clamping force that is different than the gripping force or the cutting force. During this cutting operation, the wire clamp 104 can be in the“closed” configuration.

[0064] After cutting the wire supply 108, the wire clamp 104 can be opened (i.e., in the“open” configuration) and the clamping mechanism 114 of the wire replacement system 112b can be moved away from the wire clamp 104 (i.e., downward or along the z-axis) so as to feed the wire supply 108 through the wire bonding tool 110.

[0065] In FIG. 4C In particular embodiments, the cutting operation and the first wire feeding operation have been completed. The clamping mechanism 114 of the wire replacement system 112b is illustrated as having been moved below the wire bonding tool 110. The clamping mechanism 114 can grip the wire portion 108a with the gripping portion 114al (and the gripping portion 114bl, not illustrated in the figure) and feed the wire supply 108 in connection with a feeding operation. This feeding operation can be repeated for multiple cycles (e.g., two cycles, three cycles, etc.). This feeding operation includes opening and closing the wire clamp 104 in connection with each cycle. At the end of the feeding operation, the partial cut is approximately aligned with the top of the wire bonding tool 110. The wire clamp 104 is then closed and the clamping mechanism 114 can pull the wire supply 108 (e.g., along the z-axis) so that the wire supply 108 is severed at the partial cut. In particular embodiments, a new wire bonding tool can be provided after the wire supply 108 is severed at the partial cut.

[0066] InFIG. 4D In some embodiments, the lead supply 108 has been severed at the partial cut / kerf, and the clamping mechanism 114 of the lead replacement system 112b is illustrated as having moved over the transducer 106. The clamping mechanism 114 is illustrated as closed around the lead supply 108 using a threading portion 326 (e.g., a threading blade). The clamping mechanism 114 can be moved away from the lead clip 104 in association with a lead threading process. Such a threading process can be repeated for multiple cycles (e.g., two cycles, three cycles, etc.). Such a threading process includes opening and closing the lead clip 104 in association with each cycle. Such a threading process is repeated until the lead portion 108a extends to a desired length (e.g., as shown such that the lead portion 108a extends out of the bonding tool 110). After the threading process is complete, the lead clip 104 is closed. FIG. 4D

[0067] FIGS. 5A-5H Various cross-sectional diagrams of various portions of the bonding system 300 and / or the lead replacement system 112b are illustrated in relation to certain example embodiments of the present application.

[0068] In some embodiments, the clamping mechanism 114 of the lead replacement system 112b is illustrated. The clamping mechanism 114 is illustrated as including a first clamping portion 114a (a moving clamping portion) and a second clamping portion 114b (e.g., a fixed clamping portion) disposed adjacent to the first clamping portion 114a. The first clamping portion 114a is configured to move in at least one direction relative to the second clamping portion 114b. The clamping mechanism 114 is illustrated as including a gripping portion 114a1 for gripping a lead, a cutting portion 324 for cutting (e.g., half-cutting) a lead, and a threading portion 326 for threading. The clamping mechanism 114 is illustrated as including a tool clamping portion 114b2 for clamping a tool (e.g., the bonding tool 110). FIG. 5A

[0069] The clamping mechanism 114 is illustrated as including a spring 122 configured to actuate the first clamping portion 114a relative to the second clamping portion 114b. The spring 122 is illustrated as including multiple springs, including a spring 122a configured to provide a cutting force for the cutting portion 324 and a spring 122b configured to provide a gripping force for the threading portion 326. The cutting portion 324 and the threading portion 326 can be controlled by springs having different mechanical forces (e.g., different spring constants) from one another.

[0070] In some embodiments, the clamping mechanism 114 is illustrated as being disposed over the transducer 106 prior to a cutting operation. The cutting portion 324 is illustrated adjacent to the lead supply 108, and the clamping mechanism 114 is in an “open” position prior to the cutting operation. The lead clip 104 is illustrated in a “closed” position. FIG. 5B In some embodiments, the clamping mechanism 114 is illustrated as being disposed over the transducer 106 prior to a cutting operation. The cutting portion 324 is illustrated adjacent to the lead supply 108, and the clamping mechanism 114 is in an “open” position prior to the cutting operation. The lead clip 104 is illustrated in a “closed” position.​​

[0071] In FIG. 5C , the clamping mechanism 114 has been closed in relation to a cutting operation. The clamping mechanism 114 of the wire replacement system 112b is illustrated as partially cutting the wire supply 108 to create a cut 330. The cut 330 defines the end of the wire portion 108a to be replaced on the bonding wire system 300. The cut 330 has been formed at a location on the bonding wire system 300 between the wire clip 104 and the bonding wire tool 110. The clamping mechanism 114 can then be moved (e.g., down the z-axis) in relation to a first feeding operation.

[0072] In FIG. 5D , the cut 330 has been formed. The clamping mechanism 114 is illustrated as having been moved (e.g., down the z-axis) below the bonding wire tool 110 and disposed adjacent to the wire supply 108. The clamping mechanism 114 has been positioned such that the gripping portions 114al / 114bl contact and clamp the wire supply 108. The clamping mechanism 114 is illustrated as being moved further down (i.e., along the z-axis) in relation to a feeding operation. This feeding operation can be repeated for multiple cycles (e.g., two cycles, three cycles, etc.). This feeding operation includes opening and closing the wire clip 104 in relation to each cycle.

[0073] In FIG. 5E , the feeding operation has been completed and the cut 330 is approximately aligned with the top of the bonding wire tool 110. The wire clip 104 is closed and the clamping mechanism 114 can pull (e.g., along the z-axis) the wire portion 108a such that the wire supply 108 is broken at the cut 330.

[0074] In FIG. 5F , the wire portion 108a has been removed, thereby forming a new wire end portion 108al. The removed wire portion 108a can be discarded in a receptacle (e.g., for waste, such as used bonding wire tools or wire) of the wire replacement system 112b (e.g., the receptacle 120a of FIG. 1D ).

[0075] In FIG. 5G , another bonding wire tool 110 is provided (e.g., using the bonding wire tool 110 of FIGS. 1A-1F and / or FIGS. 3A-3HThe clamping mechanism 114 has moved between the wire clamp 104 and the transducer 106 such that the threading portion 326 is positioned to perform a wire threading process. The wire threading process includes pulling the end portion of the wire supply 108 through the bonding tool 110 with the clamping mechanism 114. For example, the clamping mechanism 114 can grasp the end portion of the wire supply 108. Then, as the wire clamp 104 opens, the clamping mechanism 114 can move such that the end portion of the wire supply 108 moves downward. Then, the clamping mechanism 114 can open, the wire clamp 104 can close, and the clamping mechanism 114 can move upward relative to the wire supply 108 and the wire clamp 104. The threading process can repeat for a number of cycles (e.g., two cycles, three cycles, etc.). Such a threading process includes opening and closing the wire clamp 104 in relation to each cycle. Such a threading process repeats until the wire portion 108a extends to a desired length (e.g., such that the wire portion 108a extends out from the bonding tool 110; such that a proper wire tail of the desired length is formed, etc.). After the threading process is complete, the wire clamp 104 closes.

[0076] In FIG. 5H the threading process has been completed, and a new wire end portion 108al has now been threaded through the bonding tool 110.

[0077] While FIGS. 4A-4D and FIGS. 5A-5H While the process of using a half-cut to facilitate removal of a portion of the wire during a bonding tool change process is illustrated and described, the present disclosure is not limited thereto. FIGS. 6A-6E An exemplary process of removing a portion of the wire from the bonding tool without cutting the wire on the bonding system 600 is illustrated. FIGS. 6A-6E Each of the figures in

[0078] In FIG. 6A the wire change system 112b' is positioned above the bonding head assembly 102. The clamping mechanism 114' of the wire change system 112b' engages against the wire supply 108, preventing the wire supply 108 from moving relative to the clamping mechanism 114' (e.g., moving / actuating the clamping portion to press the wire supply 108 against the stationary clamping portion). The wire clamp 104 is in an open position, allowing the wire supply 108 to pass freely.

[0079] In FIG. 6BIn the middle, the bonding head assembly 102, including the lead clip 104, the transducer 106, and the bonding wire tool 110, moves downward (i.e., away from the clamp mechanism 114'). From the opening of the lead clip 104, the bonding head assembly 102 and the transducer 106 pass over the lead supply 108, allowing the end of the lead supply 108 to move upward relative to the bonding wire tool 110.

[0080] In the middle, the bonding head assembly 102, including the lead clip 104, the transducer 106, and the bonding wire tool 110, moves downward (i.e., away from the clamp mechanism 114'). From the opening of the lead clip 104, the bonding head assembly 102 and the transducer 106 pass over the lead supply 108, allowing the end of the lead supply 108 to move upward relative to the bonding wire tool 110. FIG. 6C In the middle, the bonding head assembly 102, including the lead clip 104, the transducer 106, and the bonding wire tool 110, moves downward (i.e., away from the clamp mechanism 114'). From the opening of the lead clip 104, the bonding head assembly 102 and the transducer 106 pass over the lead supply 108, allowing the end of the lead supply 108 to move upward relative to the bonding wire tool 110.

[0081] FIG. 6D In the middle, the bonding head assembly 102, including the lead clip 104, the transducer 106, and the bonding wire tool 110, moves downward (i.e., away from the clamp mechanism 114'). From the opening of the lead clip 104, the bonding head assembly 102 and the transducer 106 pass over the lead supply 108, allowing the end of the lead supply 108 to move upward relative to the bonding wire tool 110.

[0082] In the middle, the bonding head assembly 102, including the lead clip 104, the transducer 106, and the bonding wire tool 110, moves downward (i.e., away from the clamp mechanism 114'). From the opening of the lead clip 104, the bonding head assembly 102 and the transducer 106 pass over the lead supply 108, allowing the end of the lead supply 108 to move upward relative to the bonding wire tool 110. FIG. 6E FIGS. 1A-1F In the middle, the bonding head assembly 102, including the lead clip 104, the transducer 106, and the bonding wire tool 110, moves downward (i.e., away from the clamp mechanism 114'). From the opening of the lead clip 104, the bonding head assembly 102 and the transducer 106 pass over the lead supply 108, allowing the end of the lead supply 108 to move upward relative to the bonding wire tool 110. FIGS. 2A-2B FIGS. 3A-3H In the middle, the bonding head assembly 102, including the lead clip 104, the transducer 106, and the bonding wire tool 110, moves downward (i.e., away from the clamp mechanism 114'). From the opening of the lead clip 104, the bonding head assembly 102 and the transducer 106 pass over the lead supply 108, allowing the end of the lead supply 108 to move upward relative to the bonding wire tool 110. FIGS. 6A-6D FIG. 4D In the middle, the bonding head assembly 102, including the lead clip 104, the transducer 106, and the bonding wire tool 110, moves downward (i.e., away from the clamp mechanism 114'). From the opening of the lead clip 104, the bonding head assembly 102 and the transducer 106 pass over the lead supply 108, allowing the end of the lead supply 108 to move upward relative to the bonding wire tool 110. FIG. 5G

[0083] FIGS. 1-6 illustrate various cross-sectional diagrams of portions of the lead replacement system 112b' and / or the bonding wire system 600 in relation to certain example embodiments of the present disclosure. FIGS. 7A-7F FIGS. 1-6 illustrate various cross-sectional diagrams of portions of the lead replacement system 112b' and / or the bonding wire system 600 in relation to certain example embodiments of the present disclosure. FIGS. 7A-7F FIGS. 1-6 illustrate various cross-sectional diagrams of portions of the lead replacement system 112b' and / or the bonding wire system 600 in relation to certain example embodiments of the present disclosure. FIGS. 6A-6E FIGS. 1-6 illustrate various cross-sectional diagrams of portions of the lead replacement system 112b' and / or the bonding wire system 600 in relation to certain example embodiments of the present disclosure.

[0084] FIG. 7A FIGS. 1-6 illustrate various cross-sectional diagrams of portions of the lead replacement system 112b' and / or the bonding wire system 600 in relation to certain example embodiments of the present disclosure. ​​​​

[0085] In FIG. 7B , the lead supply 108 is shown engaged by the threading portion 326' of the clamping mechanism 114' at an upper position of the lead clip 104. The lead clip 104 is open. Thus, the lead supply 108 cannot move relative to the clamping mechanism 114', but the bonding head assembly 102 (including the lead clip 104, the transducer 106, and the bonding wire tool 110) can move relative to the lead supply 108. FIG. 7B The bonding head assembly 102 is shown beginning a downward motion. This downward motion will cause the lead supply 108 to move upward relative to the bonding head assembly 102.

[0086] In FIG. 7C , the bonding head assembly 102 has moved downward relative to the lead supply 108 (i.e., the lead supply 108 is no longer threaded completely through the lead bonding wire tool 110 as in FIG. 7B ). The clamping mechanism 114' is now open, and the lead clip 104 is now closed. Thus, the lead supply 108 can move relative to the clamping mechanism 114', and motion of the bonding head assembly 102 will be transmitted to the lead supply 108. FIG. 7C The bonding head assembly 102 is shown beginning an upward motion. This upward motion will cause the bonding head assembly 102 and the lead supply 108 to move upward relative to the clamping mechanism 114'. This upward motion of the lead can be facilitated by air guides (not shown) of the bonding wire system 600.

[0087] FIG. 7D The bonding head assembly 102 is shown having moved upward. The clamping mechanism 114' is again closed, and the lead clip 104 is again open. The bonding head assembly 102 begins a downward motion such that the bonding head assembly 102 will move downward relative to the lead supply 108 and the clamping mechanism 114'. FIG. 7E The bonding head assembly 102 is shown having moved downward, and the lead supply 108 has been further removed from the bonding wire tool 110.

[0088] FIGS. 7B-7E The process shown can be repeated multiple times until the lead supply 108 is completely removed from the bonding wire tool 110. FIG. 7F A position is shown in which the lead supply 108 has been removed from the bonding wire tool 110. After the lead supply 108 is removed from the bonding wire tool 110, the bonding wire tool 110 can be replaced with another bonding wire tool 110 (e.g., as shown in FIGS. 1A-1F , FIGS. 2A-2B and FIGS. 3A-3H ), and the lead replacement system 112b' can replace the lead supply 108 (e.g., as shown in FIG. 4D and FIGS. 5G-5H ).

[0089] Reference is now made toFIG. 8A and FIG. 8B illustrates a wire bonding system 800. As shown, the wire bonding system 800 can include any of the wire tool change system 112a, the lead change system 112b, or the lead change system 112b'. It should be understood that the wire tool change system 112a shares many of the same elements and aspects as the lead change systems 112b and 112b' described elsewhere herein (e.g., Figs. FIGS. 4A-4D , FIGS. 5A-5H etc.).

[0090] In FIG. 8A and FIG. 8B , the wire tool change system 112a (or the lead change system 112b, 112b') is extracting a wire tool 110 from a wire tool source 120, 120', 120" and installing the wire tool 110 into a transducer 106. A support structure 800b is configured to support a workpiece during a wire bonding operation. The support structure 800b and the wire tool change system 112a (or the lead change system 112b, 112b') are supported by a machine base 800a. The wire tool change system 112a (or the lead change system 112b, 112b') is illustrated as including: (i) a clamping mechanism 114 / 114' carried by a movable arm assembly 128; (ii) a wrench 118; and (iii) a wire tool source 120, 120', 120".

[0091] In FIG. 8A , the movable arm assembly 128 is illustrated at the wire tool source 120, 120', 120". In such a position, the clamping mechanism 114 / 114' can pick up a new wire tool 110 (e.g., see FIG. 1D , FIG. 2A , FIG. 2C , FIG. 3E and FIG. 3F ). In FIG. 8B , the movable arm assembly 128 has moved the clamping mechanism 114 / 114' toward the wire tool 110 (e.g., to install the wire tool 110, as in FIGS. 1A-1F and FIGS. 3A-3H , and / or to change a lead, as in FIGS. 4A-4D , FIGS. 5A-5H and FIGS. 6A-6E ). In FIG. 8B , the wire tool 110 has been installed into the transducer 106 (e.g., see FIGS. 1E-1F ).

[0092] It is contemplated that the wire bonding tool change system 112a and / or the lead change system 112b / 112b' can be removable from the machine base 800a. For example, each of the machine base 800a and the wire bonding tool change system 112a can include, for example: (i) an electrical connector for power and / or data communication, and / or (ii) a guide pin / positioning hole for alignment.

[0093] Among the many operations performed by the wire bonding tool change system 112a and / or the lead change system 112b, 112b', high precision is required to prevent damage or error (e.g., failing to grasp the wire bonding tool, mis-threading, misplacing another wire bonding tool, etc.). As such, it is contemplated that the wire bonding tool change system 112a and / or the lead change system 112b / 112b' will include a positioning system for controlling the position of the clamping mechanism, the movable arm assembly, and / or the wrench. An exemplary positioning system can be in communication with the wire bonding system. The wire bonding tool change system can be configured to provide feedback control related to the positioning system. The positioning system can be configured to utilize open / short circuit detection, servo controller feedback, and / or a vision system for positioning.

[0094] It is contemplated that the vision system of the wire bonding system can be used to determine the precise position of the clamping mechanism 114 / 114' (and / or the movable arm assembly and / or the wrench) of the wire bonding tool change system 112a and / or the lead change system 112b / 112b'. This use of the vision system is illustrated and described by reference to FIG. 9A and FIG. 9B are illustrated and described, and can be used with any wire bonding tool change system or lead change system (e.g., the wire bonding tool change system 112a, the lead change system 112b / 112b', etc.) within the scope of the present disclosure.

[0095] FIG. 9A Certain common features of the wire bonding tool change system 112a and the lead change system 112b' are illustrated, including the clamping mechanism 114', the first clamping portion 114a' (e.g., the moving clamping portion), and the second clamping portion 114b' (e.g., the fixed clamping portion). FIG. 9A References related to FIG. 9B are provided. FIG. 9A and FIG. 9B The prism 114b3' is shown in more detail, with reference to FIG. 9B being made.

[0096] FIG. 9BAdditional details of the second clamp portion 114b' are illustrated. An eye point 114b4' is provided on the second clamp portion 114b' and is oriented toward the wire bonding system (i.e., pointing in the negative Y direction as shown). The eye point 114b4' provides a reference feature for determining the position of the clamp mechanism 114'. As shown, the eye point 114b4' has a particular image registration feature, but any image registration feature (e.g., a marker or other feature) can be used. The second clamp portion 114b' includes a prism 114b3'. The prism 114b3' is configured to reflect an image of the eye point 114b4' toward the vision system 140 of the wire bonding system. The prism 114b3' is a reflective optical element configured to reflect the image of the eye point 114b4' at an angle of approximately 90° (e.g., in the range of 70°-110°). The vision system 140 includes a computer (or other processing device, not shown) configured to determine the position of the eye point 114b4' (and thus the clamp mechanism 114') based on images collected by the vision system 140. Since the eye point 114b4' is rigidly attached to the clamp mechanism 114', the precise position of the clamp mechanism 114' can be determined using the images provided by the vision system 140. Such position information can be used to determine the motion of the clamp mechanism 114' during wire tool changeover processes (e.g., as shown and described in FIGS. 1A-1F and FIGS. 3A-3H . FIGS. 4A-4D , FIGS. 5A-5H and FIGS. 6A-6E .

[0097] FIGS. 9A-9B An eye point 114b4' (or other image registration feature) is illustrated as being imaged by the prism 114b3' provided in the optical path. For example, such a prism can be included to extend the working distance of the imaging path to provide a clear eye point image. However, it should be understood that a prism (or other reflective optical element) is not required. For example, a more direct imaging path can be employed without a prism or reflective optical element. In a particular example, a refractive optical element (e.g., glass, plastic, etc.) can be provided in the imaging path to reduce the working distance of the imaging path to provide a clear eye point image (or other image registration feature). Such a refractive optical element can be provided at (or adjacent to) the eye point (or other image registration feature). Of course, other configurations are contemplated.

[0098] FIG. 10 and FIG. 11are flow diagrams illustrating exemplary embodiments and / or aspects of the present application. As those skilled in the art will appreciate, the specific steps illustrated in the flow charts can be performed in other sequences than the illustrated; additional or fewer steps can be performed; and the illustrated steps can be expanded upon in other embodiments of the present application.

[0099] Referring now to FIG. 10 , a method of replacing a wire bonding tool using a wire bonding tool replacement system is illustrated. At optional step 1000, a portion of a lead is removed from the wire bonding tool (e.g., see the process of removing lead portion 108a from wire bonding tool 110 illustrated in FIGS. 5B-5F and FIGS. 7A-7F ). At step 1002, the wire bonding tool is removed from the bond head assembly using the wire bonding tool replacement system (e.g., see the wire bonding tool removal process illustrated in FIGS. 1A-1D and FIGS. 3A-3D ). At step 1004, another wire bonding tool is provided to the bond head assembly using the wire bonding tool replacement system (e.g., see FIGS. 3E-3H ). At optional step 1006, a portion of a lead is provided through the wire bonding tool (e.g., see FIGS. 5F-5H and FIG. 6E ).

[0100] Referring now to FIG. 11 , a method of replacing a lead portion on a wire bonding system is illustrated. At step 1100, a bond head assembly configured to carry a wire bonding tool is provided (e.g., see bond head assembly 102 in FIG. 4B ). A lead portion is engaged with the wire bonding tool. The lead portion is part of a lead supply on the wire bonding system. At step 1102, the lead portion is removed with a lead replacement system (e.g., see the lead removal process of removing lead portion 108a from wire bonding tool 110 illustrated in FIGS. 5B-5F and the lead removal process of FIGS. 7A-7F ). At optional step 1104, the wire bonding tool is removed and another wire bonding tool is provided to the bond head assembly with a wire bonding tool replacement system (e.g., see FIGS. 1A-1F ). At step 1106, the lead portion is replaced (e.g., with the removed lead portion or another lead portion) using the lead replacement system (e.g., see FIGS. 5F-5H and FIG. 6E ).

[0101] While aspects of the present application are illustrated and described herein with respect to creating a partial cut in a lead supply, the present application is not so limited. It is envisioned that the cutting portion / gripping portion of the wire bonding tool replacement system or lead replacement system can be used to completely cut the lead during the lead replacement process.

[0102] While the present application has been illustrated and described with reference to specific embodiments, it is not intended that the present application be limited to the details shown. Rather, various modifications can be made in the details within the scope and range of equivalents of the claims and without departing from the application.

Claims

1. A wire bonding system, characterized by, Comprising: a bonding head assembly configured to carry a bonding wire tool; and a bonding wire tool change system for changing the bonding wire tool with another bonding wire tool, wherein the bonding wire tool change system comprises a clamping mechanism for clamping the bonding wire tool to remove the bonding wire tool from the bonding head assembly; and wherein the clamping mechanism comprises: (i) a threading portion for threading; and (ii) a tool clamping portion for clamping the bonding wire tool. The clamping mechanism comprises a spring for providing a clamping force associated with the clamping operation.

2. The wire bonding system of claim 1, wherein, The clamping mechanism is configured to extract the another bonding wire tool from a bonding wire tool source and carry the another bonding wire tool to the bonding head assembly.

3. The wire bonding system of claim 1, wherein, The bonding wire tool source is configured to provide a plurality of bonding wire tools.

4. The wire bonding system of claim 3, wherein, The bonding wire tool change system comprises a receiving portion for receiving a used bonding wire tool.

5. The wire bonding system of claim 3, wherein, The bonding wire tool source defines the receiving portion.

6. The wire bonding system of claim 5, wherein, The clamping mechanism is carried by a movable arm assembly.

7. The wire bonding system of claim 1, wherein, The movable arm assembly is further configured to remove a lead wire from the bonding wire tool and change the lead wire in association with changing the bonding wire tool.

8. The wire bonding system of claim 7, wherein, The bonding wire tool change system is configured to be removed from the bonding wire system.

9. The wire bonding system of claim 1, wherein, The bonding wire tool change system is further configured to be installed in association with another bonding wire system.

10. The wire bonding system of claim 9, wherein, The bonding wire tool change system is configured to automatically change the bonding wire tool upon occurrence of a predetermined event.

11. The wire bonding system of claim 1, wherein, The clamping mechanism comprises an image registration feature that provides a reference for determining a position of the clamping mechanism.

12. The wire bonding system of claim 1, wherein, Further comprising a vision system configured to determine the position of the clamping mechanism by collecting an image of the image registration feature.

13. The wire bonding system of claim 12, wherein, An optical path between the vision system and the image registration feature comprises a reflective optical element.

14. The wire bonding system of claim 13, wherein, An optical path between the vision system and the image registration feature comprises a refractive optical element.

15. The wire bonding system of claim 13, wherein, The bonding wire tool change system comprises:

16. A wire bonding tool replacement system for replacing a wire bonding tool on a wire bonding system, the system comprising: a clamping mechanism for clamping the bonding wire tool to remove the bonding wire tool from a bonding head assembly of a bonding wire system. The clamping mechanism comprises: (i) a threading portion for threading; and (ii) a tool clamping portion for clamping the bonding wire tool.

17. The wire bonding tool replacement system of claim 16, wherein, The clamping mechanism comprises a spring for providing a clamping force associated with the clamping operation.

18. The wire bonding tool replacement system of claim 16, wherein, The clamping mechanism is configured to extract another bonding wire tool from a bonding wire tool source and carry the another bonding wire tool to the bonding head assembly.

19. The wire bonding tool replacement system of claim 16, wherein, The bonding wire tool source is configured to provide a plurality of bonding wire tools.

20. The wire bonding tool replacement system of claim 19, wherein, Further comprising a receiving portion for receiving a used bonding wire tool.

21. The wire bonding tool replacement system of claim 19, wherein, The bonding wire tool source defines the receiving portion.

22. The wire bonding tool replacement system of claim 21, wherein, The clamping mechanism is carried by a movable arm assembly.

23. The wire bonding tool replacement system of claim 16, wherein, The movable arm assembly is further configured to remove a lead wire from the bonding wire tool and change the lead wire in association with changing the bonding wire tool.

24. The wire bonding tool replacement system of claim 23, wherein, The bonding wire tool change system is configured to be installed in association with a bonding wire system.

25. The wire bonding tool replacement system of claim 16, wherein, The bonding wire tool change system is further configured to be removed from the bonding wire system.

26. The wire bonding tool replacement system of claim 25, wherein, The bonding wire tool change system is configured to automatically change the bonding wire tool upon occurrence of a predetermined event.

27. The wire bonding tool replacement system of claim 16, wherein, ​ 28. The wire bonding tool replacement system of claim 16, wherein, Also included are image registration features that provide a reference for determining the position of the clamping mechanism.

Images