Precise type semiconductor square wafer edge polishing jig

Abstract

The utility model discloses a precise semiconductor square wafer edge polishing jig, which relates to the technical field of processing jigs, and comprises a base, and an accommodating cavity is formed in the base; the clamping mechanism is arranged in the containing cavity, the clamping mechanism comprises a long-edge baffle, two fixing rods and two limiting springs, the long-edge baffle is arranged in the containing cavity, the two limiting springs are arranged in a mirror image mode and installed between the long-edge baffle and the inner wall of the containing cavity, an installation hole is formed between the containing cavity and the outer portion of the base, a bearing is installed in the installation hole, and the bearing is arranged in the bearing. The fixing rods are clamped in the bearings, the ends of the fixing rods are fixedly connected with the long-edge baffles, and the fixing rods are arranged on the inner sides of the limiting springs. According to the utility model, a plurality of wafers can be limited and fixed at the same time through the clamping mechanism, so that the efficiency can be improved, and the wafers are fixed by the long-edge baffle plates through the elastic force of the limiting springs, so that flexible contact is realized, a buffering effect can be achieved, the product is prevented from being damaged by shaking of the product and hard impact of the long-edge baffle plates, and the safety is good.

Description

TECHNICAL FIELD

[0001] The utility model relates to processing jig technical field, concretely relates to a precision type semiconductor square wafer edge polishing jig. BACKGROUND

[0002] With the progress of semiconductor process technology, the size of lithium tantalate, lithium niobate and quartz wafer is getting larger and larger, and the number of chips that can be carried on the wafer is also increasing, which leads to the increase of the number of chips near the edge of the wafer, so the edge quality of the wafer needs to be controlled. If the edge of the wafer is not handled properly, burrs or harmful particles on the edge are easy to be brought to the surface of the wafer, and the damage on the edge of the wafer is also easy to cause the wafer to break or bring defects on the front surface in the later processing, which directly affects the product quality. At present, the edge processing of most wafers can only realize single wafer polishing, which is low in efficiency and cannot meet the demand of mass processing. Moreover, most edge polishing is for circular wafers, and cannot realize edge processing of square wafers. SUMMARY

[0003] The utility model discloses a precision type semiconductor square wafer edge polishing jig, solve the problem that cannot meet the demand of mass processing, and most edge polishing is for circular wafers, and cannot realize edge processing of square wafers.

[0004] The utility model discloses a technical scheme solves above-mentioned technical problem, the utility model discloses a bottom, the bottom is internally provided with accommodating cavity;

[0005] The bottom is internally provided with accommodating cavity;

[0006] The clamping mechanism is arranged in the accommodating cavity, the clamping mechanism includes a long side baffle, two fixed rods and two limit springs, the long side baffle is arranged in the accommodating cavity, the two limit springs are mirror image arranged and installed between the long side baffle and the inner wall of the accommodating cavity, a mounting hole is formed between the accommodating cavity and the outer wall of the bottom, a bearing is installed in the mounting hole, the fixed rod is clamped in the bearing and the end part is fixedly connected with the long side baffle, the fixed rod is arranged on the inner side of the limit spring, a nut is installed at the center position of the rear side of the long side baffle, a control screw is engagedly installed in the nut, a through hole is formed between the accommodating cavity and the outer wall of the bottom, and the control screw is clamped in the through hole.

[0007] The cruise ship is installed at the bottom of the bottom.

[0008] Preferably, a short side baffle is further arranged in the accommodating cavity, an adjusting screw is installed on one side of the short side baffle, a threaded groove is formed between the accommodating cavity and the outer wall of the bottom, and the adjusting screw is engagedly installed in the threaded groove.

[0009] Preferably, an upper pressing plate is arranged at the top of the bottom, and the upper pressing plate is used for fixing the wafer from above.

[0010] Preferably, a counterweight is installed on the top of the upper pressure plate.

[0011] Preferably, positioning rods are installed on the top of both sides of the base, and positioning holes are opened on both sides of the upper pressure plate and the counterweight block, and the positioning rods are clamped in the positioning holes.

[0012] Preferably, a groove is provided at the bottom of the upper pressing plate, and a cover plate is installed in the groove.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] The utility model can limit and fix multiple chips at the same time through the clamping mechanism, thereby improving efficiency, and the long side baffle relies on the elastic force of the limit spring to fix the chips, so it has flexible contact and can play a buffering role, preventing the product from shaking and being hit by the long side baffle, and has good safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Fig. 1 It is a top view of the utility model;

[0016] Fig. 2 It is a bottom view of the utility model;

[0017] Fig. 3 The utility model is a clamping mechanism.

[0018] The numbers in the figure represent:

[0019] 1. Base; 2. Clamping mechanism; 201. Long side baffle; 202. Fixing rod; 203. Limit spring; 3. Bearing; 4. Nut; 5. Control screw; 6. Cruise ship; 7. Short side baffle; 8. Adjusting screw; 9. Upper pressure plate; 10. Counterweight; 11. Positioning rod; 12. Positioning hole; 13. Cover plate. DETAILED DESCRIPTION

[0020] The above and other technical features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.

[0021] This embodiment provides a technical solution: a precision semiconductor square wafer edge polishing fixture, such as Figs. 1-3 As shown, it includes a base 1, a clamping mechanism 2 and a cruise ship 6, and a receiving cavity is opened in the base 1.

[0022] In a specific implementation, the clamping mechanism 2 is arranged in the accommodating cavity, and the clamping mechanism 2 comprises a long-side baffle 201, two fixed rods 202 and two limiting springs 203. The long-side baffle 201 is arranged in the accommodating cavity and can be used to fix the wafers. The two limiting springs 203 are arranged in a mirror image and are installed between the long-side baffle 201 and the inner wall of the accommodating cavity. The limiting springs 203 can be used to install and limit the long-side baffle 201. The accommodating cavity is provided with a mounting hole between the outside of the base 1, and the bearing 3 is installed in the mounting hole. The fixed rods 202 are clamped in the bearing 3 and are fixedly connected with the long-side baffle 201 at the end portions. The fixed rods 202 are arranged on the inner side of the limiting springs 203. The nut 4 is installed at the center position on the rear side of the long-side baffle 201. The control screw 5 is engagedly installed in the nut 4. The accommodating cavity is provided with a through hole between the outer wall of the base 1, and the control screw 5 is clamped in the through hole. The position of the long-side baffle 201 can be conveniently controlled by the control screw 5. When the wafers are fixed, a plurality of wafers can be fixed at the same time. First, the one end of the control screw 5 is screwed into the nut 4, so that the control screw 5 can be pulled to drive the long-side baffle 201 to press the limiting springs 203 and move outward. At this time, the distance between the long-side baffle 201 and the inner wall of the accommodating cavity is increased. The wafers arranged in multiple rows are placed in the long-side baffle 201 and the accommodating cavity. Therefore, the wafers can be clamped and fixed by the long-side baffle 201. Subsequently, the control screw 5 can be unscrewed from the nut 4. At this time, the long-side baffle 201 is fixed to the wafers by the elastic force of the limiting springs 203. Therefore, it is a flexible contact and can play a buffering role. It can prevent the product from shaking and being hard impacted by the long-side baffle 201.

[0023] Further, the cruise ship 6 is installed at the bottom of the base 1.

[0024] Further, the short-side baffle 7 is further arranged in the accommodating cavity. The adjusting screw 8 is installed on one side of the short-side baffle 7. The threaded groove is arranged between the outer wall of the accommodating cavity and the base 1. The adjusting screw 8 is engagedly installed in the threaded groove. The wafers can be fixed from the side by the short-side baffle 7. Therefore, the stability can be further improved. When adjusting, the adjusting screw 8 can be twisted to drive the short-side baffle 7 to move inward. The short-side baffle 7 can be in contact with the side of the wafer to fix it.

[0025] Further, the upper pressing plate 9 is arranged at the top of the base 1. The upper pressing plate 9 is used to fix the wafers from above.

[0026] Further, the counterweight 10 is installed at the top of the upper pressing plate 9. The weight of the upper pressing plate 9 can be increased by the counterweight 10, so as to provide a pressing effect.

[0027] Further, the base 1 is provided with positioning rods 11 on both sides of the top, positioning holes 12 are formed on both sides of the upper pressing plate 9 and the counterweight 10, and the positioning rods 11 are clamped in the positioning holes 12, so that the upper pressing plate 9 can be limited by the positioning rods 11, thereby enhancing the stability.

[0028] Further, the upper pressing plate 9 is provided with a groove at the bottom, and a cover plate 13 is installed in the groove, so that the cover plate 13 can ensure stable extrusion of the wafer when the wafer is contacted.

[0029] The above is only a preferred embodiment of the present application, which is only illustrative but not limiting. It is understood by those skilled in the art that many changes, modifications and even equivalents can be made to the present application within the spirit and scope of the present application, but all will fall within the protection scope of the present application.

Claims

1. A precision semiconductor square wafer edge polishing jig, characterized by, Include: Base (1), the base (1) is provided with a containing cavity; Clamping mechanism (2), which is provided in the containing cavity, the clamping mechanism (2) includes long side baffle (201), two fixed rods (202) and two limit springs (203), the long side baffle (201) is provided in the containing cavity, two limit springs (203) are mirror image and are installed between the long side baffle (201) and the inner wall of the containing cavity, the containing cavity and the outside of the base (1) are provided with mounting holes, the mounting holes are provided with bearings (3), the fixed rods (202) are clamped in the bearings (3) and the end portions are fixedly connected with the long side baffle (201), the fixed rods (202) are provided on the inner side of the limit spring (203), the long side baffle (201) is provided with a nut (4) at the center position of the rear side, the nut (4) is engagedly provided with a control screw (5), the containing cavity and the outer wall of the base (1) are provided with a through hole, the control screw (5) is clamped in the through hole; Cruise ship (6), the cruise ship (6) is installed at the bottom of the base (1).

2. The precision semiconductor square wafer edge polishing jig of claim 1, wherein, The containing cavity is also provided with a short side baffle (7), one side of the short side baffle (7) is provided with an adjusting screw (8), the containing cavity and the outer wall of the base (1) are provided with a threaded groove, and the adjusting screw (8) is engagedly installed in the threaded groove.

3. The precision semiconductor square wafer edge polishing jig of claim 1, wherein, The top of the base (1) is provided with an upper pressing plate (9), and the upper pressing plate (9) is used for fixing the wafer from above.

4. The precision semiconductor square wafer edge polishing jig of claim 3, wherein, The top of the upper pressing plate (9) is provided with a counterweight (10).

5. The precision semiconductor square wafer edge polishing jig of claim 4, wherein, The top of the base (1) is provided with a positioning rod (11), and the top of the base (1) is provided with a positioning hole (12).

6. The precision semiconductor square wafer edge polishing jig of claim 3, wherein, The bottom of the upper pressing plate (9) is provided with a recess, and the recess is provided with a cover plate (13).

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