Double-sided frosted ETFE film for packaging semiconductor memory chip

Abstract

The utility model discloses a double-sided frosted ETFE film for packaging a semiconductor memory chip, which comprises a film main body, a cementing layer fixedly connected to the upper surface of the film main body, a transition layer fixedly connected to the upper surface of the cementing layer, a transverse tensile layer fixedly connected to the upper surface of the transition layer, and a transverse tensile layer fixedly connected to the lower surface of the transverse tensile layer. The upper surface of the transverse tensile layer is fixedly connected with a longitudinal tensile layer, the upper surface of the longitudinal tensile layer is fixedly connected with a fixed layer, the upper surface of the fixed layer is fixedly connected with an elastic column, and the upper end of the elastic column is fixedly connected with an elastic layer. The situation that the ETFE film body is damaged in the pulling process is avoided; the film main body is connected with other functional layers through the cementing layer, and the functional layers above the transition layer can be torn down, so that the antistatic layer and the anti-friction layer can be replaced when damaged, and the whole film does not need to be replaced.

Description

TECHNICAL FIELD

[0001] The utility model relates to ETFE film technical field especially relates to a double-sided frosted ETFE film for semiconductor memory chip package. BACKGROUND

[0002] The semiconductor package technology is mostly developed and evolved on the basis of discrete device package technology, generally, the die of discrete device is sealed in the package body, the semiconductor has both electrical parameters and optical parameters design and technical requirements, needs to use the package film, the ETFE film generally has good light transmission and waterproof performance, since the ETFE film is mostly single polyester film, it is easy to be damaged under external force, thereby affecting the service life of ETFE film. SUMMARY

[0003] The utility model discloses a double-sided frosted ETFE film for semiconductor memory chip package, which has good tensile resistance through the transverse tensile resistance layer and the longitudinal tensile resistance layer, avoiding damage of the ETFE film body during being pulled, the film body is connected with other functional layers through the adhesive layer, the functional layers above the transition layer can be torn off, and the antistatic layer and the friction resistance layer can be replaced without replacing the whole film.

[0004] The utility model discloses a double-sided frosted ETFE film for semiconductor memory chip package, which has good tensile resistance through the transverse tensile resistance layer and the longitudinal tensile resistance layer, avoiding damage of the ETFE film body during being pulled, the film body is connected with other functional layers through the adhesive layer, the functional layers above the transition layer can be torn off, and the antistatic layer and the friction resistance layer can be replaced without replacing the whole film.

[0005] The utility model discloses a double-sided frosted ETFE film for semiconductor memory chip package, which has good tensile resistance through the transverse tensile resistance layer and the longitudinal tensile resistance layer, avoiding damage of the ETFE film body during being pulled, the film body is connected with other functional layers through the adhesive layer, the functional layers above the transition layer can be torn off, and the antistatic layer and the friction resistance layer can be replaced without replacing the whole film.

[0006] The utility model discloses a double-sided frosted ETFE film for semiconductor memory chip packaging, the outer surface of the extension strip is movably connected with the sleeve, the material of the transition layer is polyimide, the polyimide has high heat resistance, can keep stability under high temperature condition, and has excellent electric insulating property, can effectively prevent current leakage, and improves security.

[0007] The utility model discloses a double-sided frosted ETFE film for semiconductor memory chip packaging, the material of the transverse tensile resistance layer and longitudinal tensile resistance layer is polyamide, glass fiber is arranged in the transverse tensile resistance layer and longitudinal tensile resistance layer, and the composite material of polyamide and glass fiber provides very high strength in the tensile resistance layer, can effectively resist external tension, prevent film breakage, and the combination of the transverse tensile resistance layer and longitudinal tensile resistance layer makes the film keep good stability in each direction, and ensures the integrity of packaging.

[0008] The utility model discloses a double-sided frosted ETFE film for semiconductor memory chip packaging, the material of the fixed layer is polypropylene, the material of the elastic column is silicone rubber, and polypropylene has lower production cost and is relatively lighter, and the flexibility of the elastic column can deform to a certain extent when subjected to external force, reducing the risk of breakage.

[0009] The utility model discloses a double-sided frosted ETFE film for semiconductor memory chip packaging, the material of the elastic layer is polyurethane, the material of the protective layer is polytetrafluoroethylene, polyurethane has good resilience as elastic material, can effectively absorb impact when subjected to external pressure, and the polytetrafluoroethylene protective layer provides good surface protection and can resist the erosion of various chemicals.

[0010] The utility model discloses a double-sided frosted ETFE film for semiconductor memory chip packaging, the material of the anti-friction layer is polyethylene, and the material of the antistatic layer is polyaniline, polyethylene as the anti-friction layer can effectively reduce the friction damage that can occur during packaging, and polyaniline as the antistatic layer can effectively prevent static electricity accumulation, protect sensitive semiconductor components and reduce the risk of damage.

[0011] The utility model discloses a double-sided frosted ETFE film for semiconductor memory chip packaging, the elastic column is provided with a plurality of, and is evenly distributed between the elastic layer and the fixed layer, and a plurality of elastic columns are arranged and evenly distributed, can effectively absorb and disperse energy and reduce direct impact on the film.

[0012] Beneficial effects

[0013] 1. Compared with the prior art, the double-sided frosted ETFE film for semiconductor memory chip packaging has good tensile resistance through the transverse tensile-resistant layer and the longitudinal tensile-resistant layer, avoiding damage to the ETFE film body during being pulled.

[0014] 2. Compared with the prior art, the double-sided frosted ETFE film for semiconductor memory chip packaging connects other functional layers through the adhesive layer, can tear off the functional layers above the transition layer, and can replace the antistatic layer and the anti-friction layer without replacing the entire film when the antistatic layer and the anti-friction layer are damaged. BRIEF DESCRIPTION OF DRAWINGS

[0015] The utility model will be further described below in combination with the drawings and embodiments:

[0016] Figure 1 It is the overall structural drawing of the double-sided frosted ETFE film for semiconductor memory chip packaging of the utility model;

[0017] Figure 2 It is the protective layer connection schematic view of the double-sided frosted ETFE film for semiconductor memory chip packaging of the utility model;

[0018] Figure 3 It is the elastic layer connection schematic view of the double-sided frosted ETFE film for semiconductor memory chip packaging of the utility model;

[0019] Figure 4 It is the film body connection schematic view of the double-sided frosted ETFE film for semiconductor memory chip packaging of the utility model.

[0020] LEGEND:

[0021] 1, film body;2, adhesive layer;3, transition layer;4, transverse tensile-resistant layer;5, longitudinal tensile-resistant layer;6, fixed layer;7, elastic column;8, elastic layer;9, protective layer;10, anti-friction layer;11, antistatic layer;12, extension strip;13, shell. DETAILED DESCRIPTION

[0022] This part will describe the specific embodiments of the utility model in detail, and the preferred embodiments of the utility model are shown in the drawings, and the drawings are used to supplement the description of the text part to make people understand each technical feature and the overall technical scheme of the utility model intuitively and visually, but it cannot be understood as the limitation of the protection scope of the utility model.

[0023] REFERENCE Figures 1-4The utility model discloses an embodiment of a kind of double-sided frosted ETFE film for semiconductor memory chip packaging, it includes: film main body 1, provide the support of overall structure, the basis of semiconductor packaging, the upper surface of film main body 1 is fixedly connected with glue layer 2, as the adhesive layer between film main body 1 and other functional layer, provide good adhesion, the upper surface of glue layer 2 is fixedly connected with transition layer 3, connect the layer of different material, buffer the difference between material, the upper surface of transition layer 3 is fixedly connected with horizontal tensile resistance layer 4, provide horizontal tensile resistance ability, enhance the strength and toughness of film, the upper surface of horizontal tensile resistance layer 4 is fixedly connected with longitudinal tensile resistance layer 5, provide tensile resistance support in longitudinal direction, the upper surface of longitudinal tensile resistance layer 5 is fixedly connected with fixed layer 6, for fixing numerous elastic column 7, the upper surface of fixed layer 6 is fixedly connected with elastic column 7, evenly distribute pressure and absorb external force, the upper end of elastic column 7 is fixedly connected with elastic layer 8, with good flexibility and resilience, can effectively absorb and offset external force, the upper surface of elastic layer 8 is fixedly connected with protective layer 9, provide additional physical and chemical protection, the upper surface of protective layer 9 is fixedly connected with anti-friction layer 10, reduce surface friction, the upper surface of anti-friction layer 10 is fixedly connected with antistatic layer 11, prevent the accumulation of static electricity.

[0024] The outer surface of transition layer 3 is fixedly connected with extension strip 12, convenient to replace functional layer when needed, the outer surface of protective layer 9 is fixedly connected with sleeve 13, protect extension strip 12, the outer surface of extension strip 12 is movably connected with sleeve 13, the material of transition layer 3 is polyimide, the material of horizontal tensile resistance layer 4 and longitudinal tensile resistance layer 5 is polyamide, glass fiber is arranged in horizontal tensile resistance layer 4 and longitudinal tensile resistance layer 5, the material of fixed layer 6 is polypropylene, the material of elastic column 7 is silicone rubber, the material of elastic layer 8 is polyurethane, the material of protective layer 9 is polytetrafluoroethylene, the material of anti-friction layer 10 is polyethylene, the material of antistatic layer 11 is polyaniline, elastic column 7 is arranged in plurality, and evenly distributed between elastic layer 8 and fixed layer 6.

[0025] Working principle: film main body 1 is connected with glue layer 2, glue layer 2 is connected with transition layer 3, film main body 1 is connected with other functional layer by glue layer 2, can tear the functional layer above transition layer 3, transition layer 3 is connected with horizontal tensile resistance layer 4, horizontal tensile resistance layer 4 is connected with longitudinal tensile resistance layer 5, by horizontal tensile resistance layer 4 and longitudinal tensile resistance layer 5, have good tensile resistance ability, longitudinal tensile resistance layer 5 is connected with fixed layer 6, fixed layer 6 is connected with elastic column 7, the upper end of elastic column 7 is fixedly connected with elastic layer 8, elastic layer 8 is connected with protective layer 9, protective layer 9 is connected with anti-friction layer 10, anti-friction layer 10 is connected with antistatic layer 11.

[0026] The utility model embodiment makes the detailed explanation in combination with the drawing, but the utility model is not limited to the above -mentioned embodiment, still can make various changes in the knowledge range that the person skilled in the art has possesses without departing from the utility model's tenet under the precondition that the utility model is not limited to the above -mentioned embodiment.

Claims

1. A double-sided matte ETFE film for semiconductor memory chip packaging, characterized by, Include: The upper surface of the film body (1) is fixedly connected with the glue layer (2), the upper surface of the glue layer (2) is fixedly connected with the transition layer (3), the upper surface of the transition layer (3) is fixedly connected with the transverse tensile layer (4), the upper surface of the transverse tensile layer (4) is fixedly connected with the longitudinal tensile layer (5), the upper surface of the longitudinal tensile layer (5) is fixedly connected with the fixed layer (6), the upper surface of the fixed layer (6) is fixedly connected with the elastic column (7), the upper end of the elastic column (7) is fixedly connected with the elastic layer (8), the upper surface of the elastic layer (8) is fixedly connected with the protective layer (9), the upper surface of the protective layer (9) is fixedly connected with the anti-friction layer (10), and the upper surface of the anti-friction layer (10) is fixedly connected with the anti-static layer (11).

2. A double-sided matte ETFE film for packaging of semiconductor memory chips according to claim 1, wherein, The outer surface of the transition layer (3) is fixedly connected with the extension bar (12), and the outer surface of the protective layer (9) is fixedly connected with the sleeve (13).

3. A double-sided matte ETFE film for packaging of semiconductor memory chips according to claim 2, wherein, The outer surface of the extension bar (12) is movably connected with the sleeve (13), and the material of the transition layer (3) is polyimide.

4. The double-sided matte ETFE film for packaging of semiconductor memory chips according to claim 1, wherein, The material of the transverse tensile layer (4) and the longitudinal tensile layer (5) is polyamide, and the transverse tensile layer (4) and the longitudinal tensile layer (5) are provided with glass fibers inside.

5. The double-sided matte ETFE film for packaging of semiconductor memory chips according to claim 1, wherein, The material of the fixed layer (6) is polypropylene, and the material of the elastic column (7) is silicone rubber.

6. The double-sided matte ETFE film for packaging of semiconductor memory chips according to claim 1, wherein, The material of the elastic layer (8) is polyurethane, and the material of the protective layer (9) is polytetrafluoroethylene.

7. The double-sided matte ETFE film for packaging of semiconductor memory chips according to claim 1, wherein, The material of the anti-friction layer (10) is polyethylene, and the material of the anti-static layer (11) is polyaniline.

8. The double-sided matte ETFE film for packaging of semiconductor memory chips according to claim 1, wherein, The elastic column (7) is provided with a plurality of elastic columns, which are uniformly distributed between the elastic layer (8) and the fixed layer (6).

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