Plug-in type installation structure and generator inverter

Abstract

The scheme discloses a plug-in type installation structure and a generator inverter, and the structure comprises a positioning installation seat which is provided with a plurality of installation grooves used for accommodating semiconductor switching devices. The plurality of semiconductor switching devices are respectively accommodated in the mounting grooves and are mutually isolated through the mounting grooves; an installation clamping part is arranged at the bottom of the positioning installation base and used for installing and clamping the positioning installation base to the circuit board. According to the scheme, the positioning mounting seats are used, the semiconductor switching devices in the modules are respectively mounted on the circuit board through the positioning mounting seats, when any semiconductor switching device in a certain module is damaged, only the damaged semiconductor switching device needs to be replaced, and the whole module does not need to be replaced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to circuit structure technical field, concretely relates to a plug -in mounting structure and generator inverter. BACKGROUND

[0002] Rectifier module and IGBT module and so on module composed of multiple semiconductor switching devices are applied to multiple occasions, especially frequency converter, power generation system and so on occasions, need to use rectifier module and inverter module simultaneously.

[0003] The existing rectifier module 2 and inverter module 3, module is a fixed whole, as shown in Figure 1 And Figure 2 As shown in Fig. 2, if a plurality of thyristor single tubes are welded to the aluminum substrate to form a rectifier module, then the two modules are respectively inserted into the corresponding hole positions of the circuit board, the pin is welded to the hole position of the circuit board 1, and the module is locked by the screw hole 8 screw, there is the problem of poor heat dissipation, and the fixed module whole, when one thyristor in the module is damaged, the whole module will be scrapped, needs to be removed, there is the problem of difficult and complex maintenance. In addition, when the module is locked to the aluminum shell radiator, if the aluminum substrate is slightly deformed, the leakage is easy to occur, so the process requirement is higher. UTILITY MODEL CONTENTS

[0004] The utility model aims at the above -mentioned problem, provides a kind of plug -in mounting structure of split type semiconductor single tube and generator control panel;

[0005] Another purpose of the utility model is to provide a kind of generator inverter.

[0006] To achieve the above object, the utility model adopts the following technical scheme:

[0007] A kind of plug -in mounting structure of split type semiconductor single tube and generator control panel, including,

[0008] A plurality of semiconductor switching devices;

[0009] Radiating fin, for being contacted with semiconductor switching device by one side, and the other side is contacted with the inner surface of radiator to transfer the heat of semiconductor switching device to radiator;

[0010] Radiating pressing plate, located at the side of semiconductor switching device away from radiating fin, for being fastened with radiator, under the action of fastening connection, semiconductor switching device is pressed to radiator to make the two sides of radiating fin respectively adhere to semiconductor switching device and radiator.

[0011] In the plug -in mounting structure of split type semiconductor single tube and generator control panel described above, each semiconductor switching device corresponds to a radiating fin;

[0012] The heat dissipation fin is a ceramic heat dissipation fin, and the surface of the heat dissipation fin is coated with a heat-conductive silicone grease.

[0013] In the plug-in mounting structure of the split type semiconductor single tube and the generator control panel, the heat dissipation pressing plate is an elastic metal pressing plate with an arc.

[0014] In the plug-in mounting structure of the split type semiconductor single tube and the generator control panel, the heat dissipation pressing plate is made of manganese steel. This material has high hardness and good elasticity, and can continuously press the tube against the heat sink for a long time, so that the heat generated by the tube is continuously and efficiently transferred to the heat sink through the heat dissipation fin.

[0015] In the plug-in mounting structure of the split type semiconductor single tube and the generator control panel, one heat dissipation pressing plate corresponds to at least two semiconductor switching devices, and the heat dissipation pressing plate is used to press the corresponding at least two semiconductor switching devices against the heat sink so that the corresponding heat dissipation fin tightly contacts the semiconductor switching device and the heat sink.

[0016] In the plug-in mounting structure of the split type semiconductor single tube and the generator control panel, the heat dissipation pressing plate has a first mounting hole for fastening the heat dissipation pressing plate to the heat sink by bolts to press the semiconductor switching device against the heat sink. The first mounting hole is arranged on the heat dissipation pressing plate without contacting the semiconductor switching device.

[0017] In the plug-in mounting structure of the split type semiconductor single tube and the generator control panel, a positioning mounting seat is further included, which has a plurality of mounting grooves for accommodating the semiconductor switching devices, respectively.

[0018] The plurality of semiconductor switching devices accommodated in the mounting grooves are isolated from each other by the mounting grooves, and the plurality of mounting grooves are arranged in two rows in opposition, and the semiconductor switching devices in the mounting grooves in the two rows are arranged in opposition.

[0019] The positioning mounting seat has a mounting clamping component at the bottom for mounting and clamping the positioning mounting seat to the circuit board.

[0020] In the plug-in mounting structure of the split type semiconductor single tube and the generator control panel, the positioning mounting seat has a space between the mounting grooves, and the heat dissipation pressing plate is located at the space and extends from the space to each mounting groove, and the first mounting hole is arranged on the heat dissipation pressing plate at the space to press the semiconductor switching devices in each mounting groove against the heat sink.

[0021] A generator inverter based on the above-mentioned split type semiconductor single tube and the plug-in mounting structure of the generator control panel, comprising a circuit board, a rectifier module and an inverter module mounted on the circuit board, and a radiator provided on the circuit board for heat dissipation of the rectifier module and the inverter module, characterized in that the structure of the rectifier module and the inverter module is as described above.

[0022] In the above-mentioned generator inverter, the circuit board has a clamping hole matched with the mounting clamping part;

[0023] The radiator has a second mounting hole on the same axis as the first mounting hole;

[0024] The heat dissipation pressing plate of the rectifier module corresponds to six semiconductor switching devices, the positioning mounting seat has six mounting grooves, each mounting groove corresponds to a semiconductor switching device, and the six mounting grooves are oppositely arranged in groups of three, and the space is located between the two groups of mounting grooves;

[0025] The heat dissipation pressing plate of the inverter module corresponds to two semiconductor switching devices, and comprises two positioning mounting seats, each positioning mounting seat has two mounting grooves, each mounting groove corresponds to a semiconductor switching device, and each positioning mounting seat corresponds to a heat dissipation pressing plate and has a space, and the space is located between the two mounting grooves of the positioning mounting seat.

[0026] Compared with the prior art, the utility model has the advantages that:

[0027] 1、 this scheme uses heat dissipation fin and heat dissipation pressing plate simultaneously, utilizes heat dissipation pressing plate and tightly adheres semiconductor switching device to heat dissipation fin, thereby improves heat transfer effect, and utilizes the compression force of heat dissipation pressing plate to semiconductor switching device to heat radiator, makes heat dissipation fin tightly adhere to heat radiator when tightly adhering semiconductor switching device, makes the heat of semiconductor switching device can be efficiently transferred to heat radiator through heat dissipation fin, realizes efficient heat dissipation, realizes efficient heat dissipation and good insulation, high voltage resistance;

[0028] 2、 this scheme uses positioning mounting seat, and the semiconductor switching device in module is respectively mounted on circuit board through positioning mounting seat, when any semiconductor switching device in certain module is damaged, only needs to replace the damaged semiconductor switching device, need not replace entire module, and moreover, this scheme uses the independent heat dissipation ceramic piece of dispersion instead of aluminium base plate, can avoid the problem such as electric leakage caused by deformation of aluminium base plate. The structure simplifies the production process of power device heat dissipation structure, greatly improves product insulation performance, can save working hours, reduces cost, and also can improve the utilization rate of power device and PCB board. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1Is the mounting structure diagram of prior art inverter output control circuit;

[0030] Figure 2 Is the mounting structure diagram of rectification module in prior art inverter output control circuit;

[0031] Figure 3 Is the semiconductor switching device installation mode corresponding to six semiconductor switching devices of each heat dissipation pressing plate in the semiconductor switching device module mounting structure with high heat dissipation effect of the utility model;

[0032] Figure 4 Is the semiconductor switching device installation mode corresponding to two semiconductor switching devices of each heat dissipation pressing plate in the semiconductor switching device module mounting structure with high heat dissipation effect of the utility model;

[0033] Figure 5 Is the structure schematic diagram of mounting to radiator; Figure 3 , Figure 4

[0034] Figure 6 Is the external view of radiator;

[0035] Figure 7 Is a kind of positioning mounting seat provided by semiconductor switching device module mounting structure with high heat dissipation effect of the utility model;

[0036] Figure 8 Is another positioning mounting seat provided by semiconductor switching device module mounting structure with high heat dissipation effect of the utility model;

[0037] Figure 9 Is the placement schematic diagram of heat dissipation pressing plate in the positioning mounting seat shown in; Figure 7

[0038] Figure 10 Is the installation diagram of the positioning mounting seat of two modules in inverter output control circuit of the utility model on circuit board;

[0039] Figure 11 Is the internal structure diagram of; Figure 10

[0040] Figure 12 Is the installation structure diagram of rectification module and inverter module on circuit board;

[0041] Figure 13 Is the structure diagram of mounting heat dissipation fin; Figure 12

[0042] ​​​​In the figure: circuit board 1; card joint hole 11; rectifier module 2; inverter module 3; radiator 4; second mounting hole 41; positioning mounting seat 5; mounting slot 51; mounting clamping part 52; heat dissipation pressing plate 53; first mounting hole 531; accommodation space 54; isolation cavity 55; semiconductor switching device 6; heat dissipation fin 7; screw hole 8. DETAILED DESCRIPTION

[0043] The utility model will be further explained in connection with the drawings below.

[0044] As Figures 3-5 shown, the embodiment provides a split type semiconductor single tube and generator control board plug-in mounting structure, comprising, a plurality of semiconductor switching devices 6; a plurality of heat dissipation fins 7, for contacting the semiconductor switching device 6 through a surface, the other surface contacts the inner surface of the radiator 4 to transfer the heat of the semiconductor switching device 6 to the radiator 4, to Figure 3 and Figure 4 , that is, the upper surface of the heat dissipation fin 7 contacts the corresponding semiconductor switching device 6, and the lower surface is used to contact the radiator 4, as Figure 5 shown. The heat dissipation pressing plate 53 is located on the side of the semiconductor switching device 6 away from the heat dissipation fin 7, and is used to be tightly connected with the radiator 4, and under the action of the tight connection, the semiconductor switching device 6 is pressed towards the radiator 4 to make the two surfaces of the heat dissipation fin 7 tightly adhere to the semiconductor switching device 6 and the radiator 4 respectively. The heat dissipation pressing plate 53 has a first mounting hole 531, which is arranged at a position not contacting the semiconductor switching device 6, and is used to tightly connect the heat dissipation pressing plate 53 with the radiator 4 by bolts to press the semiconductor switching device 6 towards the radiator 4.

[0045] As Figure 5 and Figure 6 shown, when put into use, the radiator 4 with the second mounting hole 41 matched with the first mounting hole 531 is used, one surface of the heat dissipation fin 7 tightly adheres to the radiator 4, the other surface of the semiconductor switching device 6 tightly adheres to the heat dissipation fin 7, and the heat dissipation pressing plate 53 is pressed on the upper surface of the semiconductor switching device 6, and the heat dissipation pressing plate 53 is tightly connected with the inner surface of the lowest radiator 4 by the bolt connection mode, and due to the pressing force of the bolt, the semiconductor switching device 6 is tightly pressed towards the radiator 4, at the same time, the two surfaces of the heat dissipation fin 7 realize the close contact with the semiconductor switching device 6 and the radiator 4 respectively, and the heat dissipation pressing plate 53 of the scheme adopts the elastic metal pressing sheet with the arc, which is specifically made of manganese steel material, the hardness of the material is high, and the elasticity is good, and the semiconductor switching device 6 can be pressed to the radiator for a long time, so that the heat generated by the semiconductor switching device 6 is transmitted to the radiator 4 through the heat dissipation fin 7, therefore, the mounting structure provided by the scheme can realize the better heat dissipation effect for a long time.

[0046] Specifically, each semiconductor switching device 6 corresponds to a heat sink 7, the heat sink 7 is a ceramic heat sink, and the surface of the heat sink 7 is coated with a heat-conducting silicone grease to further improve the heat dissipation effect.

[0047] Specifically, one heat dissipation pressing plate 53 corresponds to at least two semiconductor switching devices 6, the heat dissipation pressing plate 53 is used to press its corresponding at least two semiconductor switching devices 6 to the heat sink 4 so that the corresponding heat sink 7 is tightly attached to the semiconductor switching device 6 and the heat sink 4. As shown in Figure 3 one heat dissipation pressing plate 53 corresponds to six semiconductor switching devices 6, Figure 4 corresponding to two semiconductor switching devices 6.

[0048] Further, as shown in Figure 7 and Figure 8 the mounting structure of the present scheme further includes a positioning mounting seat 5 having a plurality of mounting grooves 51 for accommodating semiconductor switching devices 6 respectively, in use, a plurality of semiconductor switching devices 6 are accommodated in the mounting grooves 51 respectively, and the positioning mounting seat 5 has isolation cavities 55 between adjacent mounting grooves 51 to isolate the semiconductor switching devices 6 in each mounting groove 51 from each other. The mounting groove 51 is comparable in size to the corresponding semiconductor switching device 6 so that the semiconductor switching device 6 is snugly accommodated in the mounting groove 51. Comparable means that the semiconductor switching device 6 can be put in, but has a certain friction to the semiconductor switching device 6 placed in the mounting groove 51, such as generating a friction of about 5 Newton.

[0049] Further, as shown in Figure 9 the positioning mounting seat 5 has a space 54 between the mounting grooves 51, the heat dissipation pressing plate 53 is located at the space 54 and extends from the space 54 to each mounting groove 51, and the first mounting hole 531 is opened on the heat dissipation pressing plate 53 at the space 54 to press the semiconductor switching device 6 in each mounting groove 51 to the heat sink 4.

[0050] In addition, as shown in Figure 10 and Figure 11 the bottom of the positioning mounting seat 5 has a mounting clamping component 52 for mounting and clamping the positioning mounting seat 5 to the circuit board 1, and the used circuit board 1 has a clamping hole 1 adapted to the mounting clamping component 52.

[0051] As shown in Figures 10-13 the present embodiment also provides a generator inverter, the circuit includes a circuit board 1, a rectifier module 2 and an inverter module 3 mounted on the circuit board 1, and a heat sink 4 covering the circuit board 1 for heat dissipation of the rectifier module 2 and the inverter module 3, the mounting structure of the rectifier module 2 and the inverter module 3 of the present embodiment is improved as described above, and the circuit board 1 and the heat sink 4 are correspondingly improved.

[0052] As Figure 12 , Figure 13 In this embodiment, the heat dissipation pressing plate 53 of the rectifier module 2 corresponds to six semiconductor switching devices 6, the positioning mounting seat 5 of the rectifier module 2 has six mounting slots 51, each mounting slot 51 corresponds to one semiconductor switching device 6, the six mounting slots 51 are oppositely arranged in groups of three, and the accommodation space 54 is located between the two groups of mounting slots 51, and the six semiconductor switching devices 6 mounted in the six mounting slots 51 are oppositely arranged in groups of three.

[0053] In this embodiment, the heat dissipation pressing plate 53 of the inverter module 3 corresponds to two semiconductor switching devices 6, and the inverter module 3 includes two positioning mounting seats 5, each positioning mounting seat 5 has two mounting slots 51, each mounting slot 51 corresponds to one semiconductor switching device 6, each positioning mounting seat 5 corresponds to one heat dissipation pressing plate 53 and has an accommodation space 54, respectively, and the accommodation space 54 is located between the two mounting slots 51 of the positioning mounting seat 5, and the four semiconductor switching devices 6 mounted in the four mounting slots 51 are oppositely arranged in groups of two.

[0054] In use, each heat dissipation fin 7 can be placed between the corresponding semiconductor switching device 6 and the heat sink 4, and then the heat dissipation pressing plate 53 is used to cover and press the semiconductor switching device 6 and the heat dissipation fin 7, and is fixed on the heat sink 4 by means of bolts, so that the semiconductor switching device 6 and the heat dissipation fin 7 are tightly attached to the heat sink to ensure efficient heat dissipation of the semiconductor switching device 6. Then, the positioning mounting seat 5 is arranged on the several semiconductor switching devices 6 according to one mounting slot 51 of the positioning mounting seat 5 corresponding to each semiconductor switching device 6, and finally, the positioning mounting seat 5 is clamped and fixed on the circuit board 1 through the clamping component 52 and the clamping hole 11, and the pins of the semiconductor switching devices 6 in the positioning mounting seat 5 pass through the hole positions on the circuit board 1, and then the pins of the semiconductor switching devices 6 are welded at the hole positions. When a certain semiconductor switching device 6 of a certain module is damaged, the tin of the pin of the corresponding semiconductor switching device 6 is heated to remove the semiconductor switching device 6 and replace the semiconductor switching device 6, without the need to replace the entire module.

[0055] The specific embodiments described herein are merely illustrative of the spirit of the present application. Those skilled in the art to which the present application belongs can make various modifications or supplements to the described specific embodiments or use similar ways to replace them, without deviating from the spirit of the present application.

[0056] Although the terms circuit board 1; card connecting hole 11; rectifier module 2; inverter module 3; heat sink 4; second mounting hole 41; positioning mounting seat 5; mounting groove 51; mounting clamping part 52; heat sink pressing plate 53; first mounting hole 531; accommodation space 54; isolation cavity 55; semiconductor switching device 6; heat sink fin 7; screw hole 8 are used more in this article, the possibility of using other terms is not excluded. Using these terms is only for more convenient description and explanation of the essence of the utility model, and it is contrary to the spirit of the utility model to interpret them as any kind of additional limitation.

Claims

1. A plug-in mounting structure characterized by comprising: The utility model relates to a rectifier module (2) and an inverter module (3) are installed on the circuit board (1) through the plug-in mounting structure, and the rectifier module (2) and the inverter module (3) are connected through the plug-in mounting structure. A plurality of semiconductor switching devices (6); A heat dissipation fin (7) is used to transfer the heat of the semiconductor switching device (6) to the heat sink (4) by contacting one side of the heat dissipation fin (7) with the semiconductor switching device (6) and contacting the other side of the heat dissipation fin (7) with the inner surface of the heat sink (4); A heat dissipation pressing plate (53) is located on the side of the semiconductor switching device (6) away from the heat dissipation fin (7) and is used to be fastened to the heat sink (4), and the semiconductor switching device (6) is pressed to the heat sink (4) under the action of the fastening to make the two sides of the heat dissipation fin (7) tightly adhere to the semiconductor switching device (6) and the heat sink (4) respectively.

2. The plug-in mounting structure according to claim 1, wherein Each semiconductor switching device (6) corresponds to a heat dissipation fin (7); The heat dissipation fin (7) is a ceramic heat dissipation fin, and the surface of the heat dissipation fin (7) is coated with a heat-conducting silicone grease.

3. The plug-in mounting structure according to claim 1, wherein The heat dissipation pressing plate (53) is an elastic metal pressing plate with an arc.

4. The plug-in mounting structure according to claim 3, wherein The heat dissipation pressing plate (53) is made of manganese steel.

5. The plug-in mounting structure according to claim 1, wherein One heat dissipation pressing plate (53) corresponds to at least two semiconductor switching devices (6), and the heat dissipation pressing plate (53) is used to press the at least two semiconductor switching devices (6) corresponding to the heat dissipation pressing plate (53) to the heat sink (4) to make the corresponding heat dissipation fins (7) tightly adhere to the semiconductor switching devices (6) and the heat sink (4).

6. The plug-in mounting structure according to claim 5, wherein The heat dissipation pressing plate (53) has a first mounting hole (531) thereon, which is used to fasten the heat dissipation pressing plate (53) to the heat sink (4) through a bolt to press the semiconductor switching device (6) to the heat sink (4).

7. The plug-in mounting structure according to claim 6, wherein Further comprising a positioning mounting seat (5) having a plurality of mounting grooves (51) respectively used to accommodate the semiconductor switching devices (6); The plurality of semiconductor switching devices (6) accommodated in the mounting grooves (51) are isolated from each other by the mounting grooves (51); The positioning mounting seat (5) has a mounting clamping component (52) at the bottom, which is used to mount and clamp the positioning mounting seat (5) to the circuit board (1).

8. The plug-in mounting structure according to claim 7, wherein The positioning mounting seat (5) has a space (54) between the mounting grooves (51), the heat dissipation pressing plate (53) is located at the space (54) and extends from the space (54) to each mounting groove (51), and the first mounting hole (531) is formed on the heat dissipation pressing plate (53) at the space (54) to press the semiconductor switching device (6) in each mounting groove (51) to the heat sink (4).

9. A generator inverter comprising a circuit board (1), a rectification module (2) and an inverter module (3) mounted on the circuit board (1), and a heat sink (4) provided on the circuit board (1) for dissipating heat from the rectification module (2) and the inverter module (3), characterized in that, The rectifier module (2) and the inverter module (3) are installed on the circuit board (1) through the plug-in mounting structure as claimed in any one of claims 1-8.

10. The generator inverter of claim 9, wherein, The circuit board (1) has a clamping hole (11) matched with the mounting clamping component (52) of the rectifier module (2) and the inverter module (3); The heat sink (4) has a second mounting hole (41) on the same axis as the first mounting hole (531). The heat dissipation pressing plate (53) of the rectifier module (2) corresponds to six semiconductor switching devices (6), the positioning mounting seat (5) has six mounting grooves (51), each mounting groove (51) corresponds to one semiconductor switching device (6), the six mounting grooves (51) are oppositely arranged in groups of three, and the space (54) is located between the two groups of mounting grooves (51); The heat dissipation pressing plate (53) of the inverter module (3) corresponds to two semiconductor switching devices (6), includes two positioning mounting seats (5), each positioning mounting seat (5) is provided with two mounting grooves (51), each mounting groove (51) corresponds to one semiconductor switching device (6), each positioning mounting seat (5) corresponds to one heat dissipation pressing plate (53) and is respectively provided with the space (54), and the space (54) is located between the two mounting grooves (51) of the positioning mounting seat (5).

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