Power device, inverter device and electronic equipment

Abstract

The utility model is suitable for the technical field of inverters, and provides a power device, an inverter device and electronic equipment. The power device comprises a heat dissipation substrate, and the heat dissipation substrate is provided with a perforated PCB and an IGBT module. The perforated PCB is electrically connected with the IGBT module through a flexible cable; wherein the PCB with the holes is provided with a plurality of holes, the IGBT module is provided with a plurality of pins, the holes correspond to the pins, the pins are located in the holes, one end of the flexible cable is connected with the pins, and the other end of the flexible cable is connected to the PCB with the holes. According to the utility model, the trepanning treatment is carried out on the trepanned PCB at the positions corresponding to the pins of the IGBT module, and the flexible connection between the IGBT module and the PCB is realized through the arrangement of the flexible cable, so that the effect of improving the reliability of the electrical connection between the PCB and the IGBT module is achieved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to inverter technical field, especially relate to a power device, inverter device and electronic equipment. BACKGROUND

[0002] An inverter is a power electronic device that converts direct current (DC) to alternating current (AC). Its main function is to convert the electrical energy from a DC power source (such as solar panels, batteries, etc.) into AC power that can be used by household appliances or the power grid. Inverters have applications in many fields, especially in solar power systems, uninterruptible power supplies (UPS), and electric vehicles.

[0003] The prior art scheme is that when the IGBT pin and the open hole PCB board in the inverter power module establish an electrical connection, the IGBT pin and the open hole PCB board via-hole are usually connected by soldering. However, because the thermal expansion coefficients of the IGBT module and the PCB are different, the PCB and the IGBT pin are squeezed, the solder connecting the PCB and the IGBT pin is pulled, and the electrical connection between the PCB and the IGBT is prone to be poor. UTILITY MODEL CONTENT

[0004] The utility model provides a kind of power device, inverter device and electronic equipment, to solve the problem of poor electrical connection between PCB and IGBT in the power module of inverter in prior art.

[0005] The utility model embodiment is implemented as follows: the power device includes a heat dissipation substrate, an open hole PCB board and an IGBT module are arranged on the heat dissipation substrate; the open hole PCB board and the IGBT module are electrically connected by a flexible cable; wherein the open hole PCB board has a plurality of openings, the IGBT module has a plurality of pins, the openings and the pins are correspondingly arranged, the pins are located in the openings, one end of the flexible cable is connected to the pins, and the other end of the flexible cable is connected to the open hole PCB board.

[0006] Further, the flexible cable is connected to the pin by a pin or a connector.

[0007] Further, the flexible cable and the pin are integrally formed.

[0008] Further, the flexible cable is a twisted pair cable or a single-core cable.

[0009] Further, a buffer material is arranged in the opening, and the buffer material is arranged around the pin.

[0010] Further, the open hole PCB board is a flexible PCB board.

[0011] The utility model embodiment further provides an inverter device, the inverter device includes the power device as above.

[0012] The utility model embodiment further provides an electronic equipment, the electronic equipment includes the inverter device as above.

[0013] The utility model provides a kind of power device, inverter device and electronic equipment, which are suitable for inverter technical field.The power device includes heat dissipation substrate, and opening PCB board and IGBT module are arranged on the heat dissipation substrate;The opening PCB board and the IGBT module are electrically connected by flexible cable;Wherein, the opening PCB board has multiple openings, the IGBT module has multiple pins, the opening is arranged corresponding to the pin, the pin is located in the opening, one end of the flexible cable is connected with the pin, the other end of the flexible cable is connected to the opening PCB board.In the utility model, the opening PCB board is processed with opening in the position corresponding to the pin of IGBT module, and by the setting of flexible cable, the soft connection of IGBT module and PCB board is realized, the reliability of electrical connection between PCB board and IGBT module is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the module structure schematic view of electronic equipment provided by the utility model embodiment;

[0015] Figure 2 It is the module structure schematic view of inverter device provided by the utility model embodiment;

[0016] Figure 3 It is the structure schematic view of power device provided by the utility model embodiment;

[0017] Figure 4 It is Figure 3 The structure schematic view of opening PCB board in the power device described in it;

[0018] Figure 5 It is Figure 3 The local structure schematic view of opening PCB board in the power device described in it is provided with buffer material.

[0019] Main component symbol explanation: 1000, electronic equipment;1001, inverter device;100, power device;10, heat dissipation substrate;20, opening PCB board;30, IGBT module;40, flexible cable;21, opening;31, pin;50, buffer material. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the utility model clearer, the utility model will be described in further detail below in combination with the drawings and examples.

[0021] Please refer to Figure 1 The electronic device 1000 in the embodiment of the utility model can include the inverter device 1001 in the embodiment of the utility model. The electronic device 1000 can be specifically power electronic device 1000, household appliance, renewable energy device, power management device, industrial device, smart grid device and the like. The inverter device 1001 is arranged in the electronic device 1000 to convert electric energy.

[0022] Please refer to Figure 2 The inverter device 1001 in the embodiment of the utility model can include the power device 100 in the embodiment of the utility model. The power device 100 is a key component for realizing DC (direct current) to AC (alternating current) electric energy conversion in the inverter device 1001.

[0023] In order to solve the problem that the IGBT pin and the PCB board in the inverter power module in the prior art are hard connected by soldering to establish the electrical connection mode, which is prone to poor contact.

[0024] Please refer to Figures 3 to 5 The power device 100 in the embodiment of the utility model includes a heat dissipation substrate 10, which is the bottom part of the whole structure. A plurality of working elements can be arranged on the heat dissipation substrate 10, and the heat dissipation substrate 10 can provide heat dissipation support for the plurality of working elements. Optionally, the heat dissipation substrate 10 can be made of high thermal conductivity material, such as copper or aluminum, to effectively dissipate the heat generated by the working elements.

[0025] Please refer to Figure 3 、 Figure 4 and Figure 5 The heat dissipation substrate 10 is provided with an open hole PCB board 20 and an IGBT module 30, and each IGBT module 30 is a working element arranged on the heat dissipation substrate 10. In the utility model, the open hole PCB board 20 can be provided with a plurality of IGBT modules 30. One open hole PCB board 20 is arranged on a plurality of IGBT modules 30. For the electrical connection mode of the open hole PCB board 20 and each IGBT module 30, the open hole PCB board 20 and the IGBT module 30 are electrically connected through a flexible cable 40.

[0026] Wherein, each of the open-hole PCB board 20 has a plurality of openings 21, and each of the IGBT module 30 has a plurality of pins 31. The openings 21 of the open-hole PCB board 20 are arranged correspondingly with the pins 31 of the IGBT module 30, the pins 31 are located in the openings 21, one end of the flexible cable 40 is connected with the pins 31, and the other end of the flexible cable 40 is connected to the open-hole PCB board 20.

[0027] As shown in Figure 3 and Figure 4 Specifically, for the mode of arranging the flexible cable 40, first, the open-hole PCB board 20 is arranged in layers on the plurality of IGBT modules 30, then the openings 21 are formed on the open-hole PCB board 20, and the positions of the openings 21 correspond to the positions of the pins 31 of the IGBT modules 30. That is, each of the pins 31 of the IGBT module 30 is located in the opening 21, and the difference from the traditional IGBT and the open-hole PCB board 20 is that they are connected by soldering. In the utility model, a plurality of flexible cables 40 are arranged, one end of the flexible cable 40 is connected to the pin 31 of the IGBT module 30, and the other end of the flexible cable 40 is connected to the open-hole PCB board 20. Of course, the flexible cable 40 is welded to the open-hole PCB board 20.

[0028] Therefore, in the utility model, the open-hole PCB board 20 is processed by the opening 21 at the position corresponding to the pin 31 of the IGBT module 30, and the flexible cable 40 is arranged to realize the soft connection between the IGBT module 30 and the open-hole PCB board 20, thereby avoiding the hard connection (i.e. rigid connection) between the open-hole PCB board 20 and the pin 31 of the IGBT module 30, which helps to reduce the mechanical stress caused by thermal expansion and contraction or vibration, thereby achieving the effect of improving the reliability of the electrical connection between the open-hole PCB board 20 and the IGBT module 30. Optionally, the flexible cable 40 is a twisted pair cable or a single-core cable, which can be selected by the user according to the actual situation.

[0029] In addition, the open-hole PCB board 20 and the pin 31 of the IGBT module 30 are electrically connected through the flexible cable 40, and this flexible cable 40 realizes the soft connection, which can provide better flexibility and avoid stress and damage caused by hard connection, thereby achieving the effect of improving the reliability of the power device 100 as a whole. In addition, the flexible cable 40 can absorb the displacement caused by mechanical vibration and thermal expansion, thereby avoiding the stress concentration problem caused by rigid connection, especially in high-power applications, this soft connection helps to improve the reliability and stability of the power device 100. The flexible cable 40 can also be bent and adjusted according to the actual needs, which is suitable for complex circuit layout and occupies small space, thereby helping to realize the miniaturization design of the power device 100.

[0030] Further, in order to further reduce the hard contact between the open-hole PCB board 20 and the IGBT module 30, in a possible implementation, the open-hole PCB board 20 is a flexible PCB board, that is, the open-hole PCB board 20 can be an FPC board.

[0031] The FPC board not only has good electrical conductivity and electrical insulation performance, but also has high flexibility, which can adapt to different installation spaces and dynamic environments. By stacking the FPC board on the IGBT module 30, the flexible open-hole PCB board 20 and the IGBT module 30 are designed as a whole, and the open-hole PCB board 20 can be fixed on the IGBT module 30 by self-tapping screws, avoiding the stress concentration and poor contact problems caused by the hard connection between the open-hole PCB board 20 and the IGBT module 30. In addition, the design of the FPC board allows multiple layers of conductive wires to be integrated in the circuit, enabling it to support complex electrical connections while providing good vibration resistance.

[0032] Therefore, by arranging the FPC board, the hard contact between the open-hole PCB board 20 and the IGBT module 30 can be effectively reduced, thereby improving the overall reliability and stability of the power device 100.

[0033] As shown in FIG. 1, Figure 5 Further, for the open hole 21, in a possible implementation, a buffer material 50 is arranged in the open hole 21, and the buffer material 50 surrounds the pin 31.

[0034] Specifically, in the embodiment of the present application, the open-hole PCB board 20 is provided with a buffer material 50 in the open hole 21, and the buffer material 50 is specifically arranged around the pin 31 of the IGBT module 30. The buffer material 50 surrounding the pin 31 can provide additional protection for the pin 31 of the IGBT module 30, thereby improving the reliability of the electrical connection between the open-hole PCB board 20 and the IGBT module 30. Moreover, the use of the buffer material 50 can reduce the contact resistance between the open-hole PCB board 20 and the pin 31 of the IGBT module 30, so as to ensure that the open-hole PCB board 20 and the IGBT module 30 can achieve good electrical connection, thereby improving the reliability of signal transmission.

[0035] Optionally, the buffer material 50 can be silicone, polyurethane, foam material (such as polyethylene, polyurethane foam and ethylene-vinyl acetate copolymer), and rubber material, etc. Preferably, a silicone buffer material 50 can be arranged.

[0036] Further, for the arrangement mode of the open-hole PCB board 20 stacked on the IGBT module 30, in a possible implementation, the IGBT module 30 is provided with self-tapping screws, and the open-hole PCB board 20 is stacked on the IGBT module 30 by the self-tapping screws.

[0037] In this way, the perforated PCB 20 can be laminated on the IGBT module 30 and fixed by self-tapping screws, which can simplify the assembly process between the perforated PCB 20 and the IGBT module 30 and provide a stable mechanical connection. The self-tapping screws can be directly screwed into the pre-made holes of the IGBT module 30 without the need for additional nuts or washers, thereby improving the stability of the connection and ensuring that the perforated PCB 20 is not easily loosened in a high-temperature and high-vibration environment. In addition, this laminated structure can also achieve effective space saving, which is conducive to heat conduction and improves the heat dissipation efficiency.

[0038] Further, for the specific connection mode of the flexible cable 40, in one possible implementation, the flexible cable 40 is connected with the pin 31 through a pin or a connector. Specifically, one end of the flexible cable 40 can be crimped on the pin, and the pin is inserted with the pin 31 of the IGBT module 30. The connection mode through the pin is convenient and reliable for plugging, and can be suitable for occasions that need to be frequently disassembled or maintained, so as to facilitate the user to replace the flexible cable 40; or the flexible cable 40 can be connected with the pin 31 of the IGBT module 30 through a connector. The use of the connector can provide a more stable and durable contact for the flexible cable 40 and the pin 31, which helps to improve the reliability of the connection between the flexible cable 40 and the pin 31, and can be suitable for scenarios that need to be reliably operated for a long time.

[0039] Of course, the flexible cable 40 and the pin 31 can also be modularly arranged, that is, the flexible cable 40 and the pin 31 are integrally formed. This means that the pin 31 of the IGBT module 30 has integrated the flexible cable 40 when manufactured, and the pin 31 and the flexible cable 40 form an integral whole. In this way, the number of contact points in the power device 100 can be reduced, thereby improving the stability of the connection between the pin 31 and the flexible cable 40. Moreover, since the flexible cable 40 and the pin 31 are integrally formed, that is, the flexible cable 40 and the pin 31 have been pre-integrated, the modular design of the flexible cable 40 and the pin 31 can greatly simplify the installation and assembly process, and engineers no longer need to connect each flexible cable 40 with the pin 31 one by one, thereby saving time, improving the installation of the cable, and reducing the possibility of human error.

[0040] In the description of the present specification, the description referring to the terms "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0041] Furthermore, the foregoing is only considered illustrative of the principles of the application, and various modifications, omissions and additions thereof can be made which are in keeping with the spirit of the application. The disclosure herein of certain combinations does not exclude other combinations of the abovementioned elements, for example, those which do not specifically exclude in this or any following claims.

Claims

1. A power device, characterized by, The heat dissipation substrate is provided with an open-hole PCB plate and an IGBT module; the open-hole PCB plate and the IGBT module are electrically connected through a flexible cable; The open-hole PCB plate has a plurality of open holes, the IGBT module has a plurality of pins, the open holes are arranged in correspondence with the pins, the pins are located in the open holes, one end of the flexible cable is connected with the pins, and the other end of the flexible cable is connected to the open-hole PCB plate.

2. The power device of claim 1, wherein, The flexible cable is connected with the pins through a pin or a connector.

3. The power device of claim 1, wherein, The flexible cable is integrally formed with the pins.

4. The power device of claim 1, wherein, The flexible cable is a twisted pair cable or a single-core cable.

5. The power device of claim 1, wherein, A buffer material is arranged in the open hole and surrounds the pins.

6. The power device of claim 1, wherein, The open-hole PCB plate is a flexible PCB plate.

7. An inverter device characterized by comprising: The inverter device comprises the power device according to any one of claims 1 to 6.

8. An electronic device, comprising: The electronic device comprises the inverter device according to claim 7.

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