Aluminum-based circuit board hot-pressing leveling equipment capable of preventing buckling deformation

Abstract

The utility model discloses an aluminum-based circuit board hot-pressing leveling device capable of preventing buckling deformation, which belongs to the technical field of circuit board processing equipment and comprises a hot-pressing leveling support frame used for supporting the aluminum-based circuit board capable of preventing buckling deformation to be subjected to hot-pressing leveling, a protective plate is mounted on the side surface of the hot-pressing leveling support frame, a second motor is mounted on the side surface of the protective plate, and a first motor is mounted on the side surface of the second motor. An output shaft of the second motor is connected with a rotating shaft, the periphery of the rotating shaft is connected with a rotating disc, the periphery of the rotating disc is connected with a heating disc supporting frame and a cooling fan supporting frame, and the end, away from the rotating disc, of the heating disc supporting frame is provided with a heating disc used for hot pressing and leveling of the aluminum-based circuit board. A heating rod is installed on the side face of the heating disc, a cooling water tank is installed at the end, away from the rotating disc, of the cooling fan supporting frame, and a first heat dissipation plate is installed on the side face of the cooling water tank, the hot-pressed aluminum-based circuit board can be cooled in time, the performance of the circuit board is not affected, the product quality is improved, and the hot-pressing and leveling effect is better.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of circuit board processing equipment, especially an aluminum base circuit board hot pressing flattening equipment of preventing warping deformation. BACKGROUND

[0002] Aluminum base circuit board is a kind of printed circuit board with excellent heat dissipation performance. It takes aluminum alloy as base material, and connects conductive circuit and electronic component together through specific process, and hot pressing flattening is an important link in the production process of aluminum base circuit board. However, the existing hot pressing flattening equipment often appears the problem of warping deformation of aluminum base circuit board in the use process, which not only affects the quality of circuit board, but also reduces the production efficiency, the existing equipment can satisfy the basic hot pressing flattening demand, but cannot cool the hot-pressed aluminum base circuit board in time, influences circuit board performance, influences product quality, and the hot pressing flattening effect is not good.

[0003] Through the search, Chinese patent document (grant announcement number CN220422131U), the utility model belongs to the technical field of aluminum base circuit board processing equipment, especially an aluminum base circuit board hot pressing flattening equipment of preventing warping deformation, lacks the correction mechanism in the hot pressing plate down pressure process, and hot pressing plate may be easily caused to deviate, influences hot pressing effect, and the present application proposes the following scheme, including base, the top of base is fixedly connected with dustproof frame, and one side of dustproof frame is not closed and is arranged, and the central fixed connection of dustproof frame inner wall top is provided with mounting plate. The utility model discloses in use, by setting correction mechanism, avoid the deviation of hot pressing plate down pressure process, also guarantee the aluminum base plate in the placement platform even under pressure, avoid the warping deformation condition;Spring and buffer plate buffer the excess pressure generated by hot pressing plate down pressure, improve the good product rate of aluminum base plate hot pressing circuit in the placement platform;By setting storage mechanism, guarantee the integrity of hot-pressed finished product, avoid rubbing and scratching when stacking together, the equipment can satisfy the basic hot pressing flattening demand, but cannot cool the hot-pressed aluminum base circuit board in time, influence circuit board performance, influence product quality, and the hot pressing flattening effect is not good. UTILITY MODEL CONTENTS

[0004] The utility model discloses a kind of aluminum base circuit board hot pressing flattening equipment of preventing warping deformation, to solve the problem proposed in background art.

[0005] To achieve the above object, the utility model provides following technical scheme: a kind of aluminium-based circuit board hot-pressing flattening equipment of anti-warping deformation, including the hot-pressing flattening support frame for supporting the hot-pressing flattening of anti-warping deformation aluminium-based circuit board, the side of the hot-pressing flattening support frame is equipped with baffle, the side of the baffle is equipped with second motor, the output shaft of second motor is connected with rotating shaft, the outer periphery of rotating shaft is connected with rotating disc, the outer periphery of rotating disc is connected with heating disc support frame and cooling fan support frame, the one end of heating disc support frame away from rotating disc is equipped with heating disc for aluminium-based circuit board hot-pressing flattening, the side of heating disc is equipped with heating rod, the one end of cooling fan support frame away from rotating disc is equipped with cooling water tank, the side of cooling water tank is equipped with first heat sink, the side of first heat sink away from cooling water tank is equipped with fan frame, the inside of fan frame is equipped with heat dissipation fan, the side of fan frame away from first heat sink is equipped with second heat sink, the outer periphery of rotating shaft is equipped with rotating ring.

[0006] Preferably, the top of the hot-pressing flattening support frame is provided with a hot-pressing flattening bottom plate, the side of the hot-pressing flattening bottom plate is connected with a second side baffle, the side of the second side baffle is provided with a second telescopic rod, and the movable part of the second telescopic rod is provided with a second positioning plate.

[0007] Preferably, a groove is formed in the hot-pressing flattening bottom plate, the inner wall of the groove is provided with a first motor, and the output shaft of the first motor is connected with a semicircular baffle.

[0008] Preferably, the side of the hot-pressing flattening support frame is provided with a first side baffle, the side of the first side baffle is provided with a first telescopic rod, and the movable part of the first telescopic rod is connected with a first positioning plate.

[0009] Preferably, the top of the hot-pressing flattening support frame is provided with a fixing plate, the top of the fixing plate is provided with an air cylinder, the output end of the air cylinder is connected with an air pressure rod, the one end of the air pressure rod away from the air cylinder is provided with a hot-pressing flattening pressing plate, and the bottom of the hot-pressing flattening support frame is provided with a base.

[0010] Preferably, the side of the hot-pressing flattening support frame is provided with a conveying frame, the side of the conveying frame is provided with a third motor, the output shaft of the third motor is connected with a roller, and the outer periphery of the roller is connected with a conveying belt.

[0011] Preferably, the side of the conveying frame is provided with a side support, the transverse inner wall of the side support is provided with an adjusting rod, and one end of the adjusting rod is connected with a detection rod for detecting the flatness of the aluminium-based circuit board.

[0012] Compared with the prior art, the utility model has the following technical effects and advantages:

[0013] The anti-warping aluminum-based circuit board hot-pressing flattening equipment, thanks to the structure of the heating disc and the heat dissipation plate, the heating disc and the heating rod are moved below the aluminum-based circuit board to heat the aluminum-based circuit board, the air cylinder is opened, the hot-pressing flattening pressing plate is pressed down, the aluminum-based circuit board is hot-pressed and flattened, after a certain time, the second motor is opened, the rotating shaft is moved below the aluminum-based circuit board, the heat dissipation fan exchanges heat between the aluminum-based circuit board and the cooling water tank, the first heat dissipation plate and the second heat dissipation plate accelerate the cooling of the aluminum-based circuit board, and the aluminum-based circuit board is prevented from warping and deforming, the structure can cool the hot-pressed aluminum-based circuit board in time, does not affect the performance of the circuit board, improves product quality, and the hot-pressing flattening effect is better.

[0014] The anti-warping aluminum-based circuit board hot-pressing flattening equipment, thanks to the structure of the semi-circular baffle and the positioning plate, the output shaft of the first motor rotates the semi-circular baffle, the protruding surface of the semi-circular baffle is higher than the surface of the hot-pressing flattening bottom plate, and the second telescopic rod and the first telescopic rod push the second positioning plate and the first positioning plate, so that the aluminum-based circuit board on the hot-pressing flattening bottom plate is moved to a fixed position on the hot-pressing flattening bottom plate, the structure can move the aluminum-based circuit board to the fixed position, prevent the aluminum-based circuit board from deviating, and affect the heating effect.

[0015] The anti-warping aluminum-based circuit board hot-pressing flattening equipment, thanks to the structure of the detection rod, the detection rod screens qualified aluminum-based circuit boards, and the warped and deformed aluminum-based circuit boards are blocked by the detection rod and can be hot-pressed and flattened again, the structure can screen the substandard aluminum-based circuit boards, reduces the time and process of manual screening, and improves the screening efficiency. SUMMARY

[0016] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings described below are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0017] Figure 1 It is a structural schematic view of the present application;

[0018] Figure 2 It is a structural schematic view of the first positioning plate and the second positioning plate of the present application;

[0019] Figure 3 It is a structural schematic view of the heating plate and the cooling fan of the present application;

[0020] Figure 4 It is a top view of the cooling fan of the present application;

[0021] Figure 5The utility model discloses a half round baffle's structure schematic drawing.

[0022] Mark explanation:

[0023] In the drawing: 1, hot pressing leveling support frame;101, air cylinder;102, base;103, guard plate;104, air pressure rod;105, hot pressing leveling pressing plate;106, fixed plate;2, hot pressing leveling bottom plate;201, first side baffle;202, first telescopic link;203, first positioning plate;204, second side baffle;205, second telescopic link;206, second positioning plate;207, first motor;208, half round baffle;209, recess;3, second motor;301, rotating shaft;302, rotating disc;303, heating disc support frame;304, cooling fan support frame;305, heating disc;306, heating rod;307, cooling water tank;308, first heat sink;309, fan frame;310, heat dissipation fan;311, second heat sink;312, rotating ring;4, conveying frame;401, roller;402, conveying belt;403, side support;404, detection rod;405, adjusting rod;406, third motor. DETAILED DESCRIPTION

[0024] In the following description, a large number of specific details are given to provide a more thorough understanding of the present application. However, it is apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other cases, some technical features known to the art are not described in order not to obscure the present application.

[0025] The connection mode can adopt existing modes such as bonding, welding, bolt connection and the like, and the actual needs are accurate.

[0026] For example, the first side baffle 201 and the second side baffle 204 can be connected to the first positioning plate 203 and the second positioning plate 206 respectively. Figures 1 to 5The device for preventing warping of aluminum-based circuit board hot pressing and flattening includes a hot pressing and flattening support frame 1 for supporting the aluminum-based circuit board hot pressing and flattening, a guard plate 103 is installed on the side of the hot pressing and flattening support frame 1, a second motor 3 is installed on the side of the guard plate 103, a rotating shaft 301 is connected to the output shaft of the second motor 3, a rotating disc 302 is connected to the outer periphery of the rotating shaft 301, a heating disc support frame 303 and a cooling fan support frame 304 are connected to the outer periphery of the rotating disc 302, a heating disc 305 for aluminum-based circuit board hot pressing and flattening is installed on the end of the heating disc support frame 303 away from the rotating disc 302, a heating rod 306 is installed on the side of the heating disc 305, a cooling water tank 307 is installed on the end of the cooling fan support frame 304 away from the rotating disc 302, a first heat sink 308 is installed on the side of the cooling water tank 307, a fan frame 309 is installed on the side of the first heat sink 308 away from the cooling water tank 307, a heat dissipation fan 310 is installed in the fan frame 309, a second heat sink 311 is installed on the side of the fan frame 309 away from the first heat sink 308, a rotating ring 312 is installed on the outer periphery of the rotating shaft 301, the second motor 3 is turned on, the rotating disc 302 rotates, the heating disc 305 and the heating rod 306 are moved to below the aluminum-based circuit board, the aluminum-based circuit board is heated, the air cylinder 101 is turned on, the hot pressing and flattening pressing plate 105 is pressed down, the aluminum-based circuit board is hot pressed and flattened, after a certain period of time, the second motor 3 is turned on, the rotating shaft 301 is moved to below the aluminum-based circuit board, the heat dissipation fan 310 is turned on, the heat dissipation fan 310 exchanges heat between the aluminum-based circuit board and the cooling water tank 307, the first heat sink 308 and the second heat sink 311 accelerate the cooling of the aluminum-based circuit board, and the aluminum-based circuit board is prevented from warping and deforming.

[0027] A hot pressing and flattening bottom plate 2 is installed on the top of the hot pressing and flattening support frame 1, and the hot pressing and flattening bottom plate 2 needs to quickly and uniformly transfer heat to the aluminum-based circuit board to ensure that the circuit board is uniformly heated during hot pressing and reduce warping and deformation caused by uneven temperature. For example, a metal material with high thermal conductivity, such as high-quality alloy steel, can efficiently conduct heat. The aluminum-based circuit board to be hot pressed and flattened is placed on the hot pressing and flattening bottom plate 2, a second side baffle 204 is connected to the side of the hot pressing and flattening bottom plate 2, a second telescopic rod 205 is installed on the side of the second side baffle 204, a second positioning plate 206 is installed on the movable part of the second telescopic rod 205, the second telescopic rod 205 and the first telescopic rod 202 push the second positioning plate 206 and the first positioning plate 203, so that the aluminum-based circuit board on the hot pressing and flattening bottom plate 2 is moved to a fixed position on the hot pressing and flattening bottom plate 2. A recess 209 is formed in the hot pressing and flattening bottom plate 2, a first motor 207 is installed on the inner wall of the recess 209, a semicircular baffle 208 is connected to the output shaft of the first motor 207, the first motor 207 is turned on, the output shaft of the first motor 207 rotates the semicircular baffle 208, and the protruding surface of the semicircular baffle 208 is higher than the surface of the hot pressing and flattening bottom plate 2.

[0028] The side of the hot pressing leveling support frame 1 is provided with a first side baffle 201, the side of the first side baffle 201 is provided with a first telescopic rod 202, the movable part of the first telescopic rod 202 is connected with a first positioning plate 203, the top of the hot pressing leveling support frame 1 is provided with a fixed plate 106, the top of the fixed plate 106 is provided with a pneumatic cylinder 101, the output end of the pneumatic cylinder 101 is connected with a pneumatic rod 104, the end of the pneumatic rod 104 away from the pneumatic cylinder 101 is provided with a hot pressing leveling plate 105, the bottom of the hot pressing leveling support frame 1 is provided with a base 102, the parts that need to support the hot pressing plate and bear the pressure in the hot pressing process have high strength, can bear various loads in the equipment operation process, and ensure the stability and reliability of the equipment. For example, high-strength carbon steel or alloy steel is commonly used as a support material.

[0029] The side of the hot pressing leveling support frame 1 is provided with a conveying frame 4, the side of the conveying frame 4 is provided with a third motor 406, the output shaft of the third motor 406 is connected with a roller 401, the outer periphery of the roller 401 is connected with a conveying belt 402, the side of the conveying frame 4 is provided with a side support 403, the transverse inner wall of the side support 403 is provided with an adjusting rod 405, the adjusting rod 405 is movable to adjust the height of the detection rod 404, one end of the adjusting rod 405 is connected with a detection rod 404 for detecting the flatness of the aluminum-based circuit board, the first positioning plate 203 pushes the aluminum-based circuit board conveying belt 402 in the direction, the detection rod 404 screens the qualified aluminum-based circuit board, and the warped aluminum-based circuit board is blocked by the detection rod 404, and can be re-pressed and flattened.

[0030] Working principle

[0031] The anti-warping aluminum-based circuit board hot-pressing leveling equipment, in use, firstly places the aluminum-based circuit board to be hot-pressed and leveled on the hot-pressing leveling bottom plate 2, starts the first motor 207, the output shaft of the first motor 207 rotates the semicircular baffle 208, the protruding surface of the semicircular baffle 208 is higher than the surface of the hot-pressing leveling bottom plate 2, the second telescopic rod 205 and the first telescopic rod 202 push the second positioning plate 206 and the first positioning plate 203, the aluminum-based circuit board on the hot-pressing leveling bottom plate 2 is moved to the fixed position on the hot-pressing leveling bottom plate 2, then the first positioning plate 203 and the second positioning plate 206 are retracted, the second motor 3 is started, the rotating disc 302 rotates, the heating disc 305 and the heating rod 306 are moved below the aluminum-based circuit board, the aluminum-based circuit board is heated, the cylinder 101 is started, the hot-pressing leveling pressing plate 105 is pressed down, the aluminum-based circuit board is hot-pressed and leveled, after a certain time, the second motor 3 is started, the rotating shaft 301 is moved below the aluminum-based circuit board, the cooling fan 310 exchanges heat between the aluminum-based circuit board and the cooling water tank 307, the first heat sink 308 and the second heat sink 311 accelerate the cooling of the aluminum-based circuit board, prevent the aluminum-based circuit board from warping and deforming, the first positioning plate 203 pushes the aluminum-based circuit board conveying belt 402, the detection rod 404 screens the qualified aluminum-based circuit board, the aluminum-based circuit board warping and deforming is blocked by the detection rod 404, and can be hot-pressed and leveled again.

[0032] It should be noted that, in this document, relational terms such as one and the other and at least one of are used solely to distinguish one entity or action from another entity or action, without necessarily requiring or implying that each modified entity or action must exist separately from another entity or action.

[0033] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made thereto without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. An apparatus for hot press lamination of a warpage-preventable aluminum-based circuit board, comprising a hot press lamination support frame (1) for supporting the hot press lamination of the warpage-preventable aluminum-based circuit board, characterized in that: The hot pressing leveling support frame (1) is provided with a guard plate (103) on the side, the guard plate (103) is provided with a second motor (3) on the side, the output shaft of the second motor (3) is connected with a rotating shaft (301), the outer periphery of the rotating shaft (301) is connected with a rotating disc (302), the outer periphery of the rotating disc (302) is connected with a heating disc support frame (303) and a cooling fan support frame (304), the heating disc support frame (303) is provided with a heating disc (305) for hot pressing leveling of an aluminum-based circuit board on the end away from the rotating disc (302), the heating disc (305) is provided with a heating rod (306) on the side, the cooling fan support frame (304) is provided with a cooling water tank (307) on the end away from the rotating disc (302), the cooling water tank (307) is provided with a first heat dissipation plate (308) on the side, the first heat dissipation plate (308) is provided with a fan frame (309) on the side away from the cooling water tank (307), the fan frame (309) is internally provided with a heat dissipation fan (310), the fan frame (309) is provided with a second heat dissipation plate (311) on the side away from the first heat dissipation plate (308), and the outer periphery of the rotating shaft (301) is provided with a rotating ring (312).

2. The apparatus for hot press lamination of an aluminum-based circuit board according to claim 1, wherein: The hot pressing leveling support frame (1) is provided with a hot pressing leveling bottom plate (2) on the top, the hot pressing leveling bottom plate (2) is connected with a second side baffle (204) on the side, the second side baffle (204) is provided with a second telescopic rod (205) on the side, and the movable part of the second telescopic rod (205) is provided with a second positioning plate (206).

3. The apparatus for hot press lamination of an aluminum-based circuit board according to claim 2, wherein: The hot pressing leveling bottom plate (2) is provided with a groove (209), and the inner wall of the groove (209) is provided with a first motor (207); the output shaft of the first motor (207) is connected with a semicircular baffle (208).

4. The apparatus for hot press lamination of an aluminum-based circuit board according to claim 2, wherein: The hot pressing leveling support frame (1) is provided with a first side baffle (201) on the side, the first side baffle (201) is provided with a first telescopic rod (202) on the side, and the movable part of the first telescopic rod (202) is connected with a first positioning plate (203).

5. The apparatus for hot press lamination of an aluminum-based circuit board according to claim 1, wherein: The hot pressing leveling support frame (1) is provided with a fixed plate (106) on the top, the fixed plate (106) is provided with a pneumatic cylinder (101) on the top, the output end of the pneumatic cylinder (101) is connected with a pneumatic rod (104), the pneumatic rod (104) is provided with a hot pressing leveling pressing plate (105) on the end away from the pneumatic cylinder (101), and the bottom of the hot pressing leveling support frame (1) is provided with a base (102).

6. The apparatus for hot press lamination of an aluminum-based circuit board according to claim 1, wherein: The hot pressing leveling support frame (1) is provided with a conveying frame (4) on the side, the conveying frame (4) is provided with a third motor (406) on the side, the output shaft of the third motor (406) is connected with a roller (401), and the outer periphery of the roller (401) is connected with a conveying belt (402).

7. The apparatus for hot press lamination of an aluminum-based wiring board according to claim 6, wherein: The side of the conveying frame (4) is provided with a side support (403), the lateral inner wall of the side support (403) is provided with an adjusting rod (405), one end of the adjusting rod (405) is connected with a detection rod (404) for detecting the flatness of the aluminum-based circuit board.

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