COB graphical integrated packaging substrate structure

Abstract

The utility model relates to the technical field of integrated chip packaging, in particular to a COB (Chip On Board) graphical integrated packaging substrate structure, which comprises a printed circuit board, an LED (Light Emitting Diode) chip arranged on the printed circuit board, a packaging piece arranged on the printed circuit board and the LED chip, and a driving chip and a heat dissipation piece arranged on the lower surface of the printed circuit board, a plurality of heat dissipation holes are formed in the printed circuit board, the heat dissipation holes are filled with heat conduction materials, heat dissipation fins of the heat dissipation piece are formed by a plurality of sheet-shaped metal sheets, the metal sheets are parallel to one another, and certain intervals are formed between the metal sheets. According to the COB graphical integrated packaging substrate structure, the working temperature of the LED chip can be effectively reduced, and the service life is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated chip packaging technical field, concretely relates to a COB graphical integrated packaging substrate structure. BACKGROUND

[0002] COB refers to Chip On Board, and the COB graphical integrated packaging substrate structure is a technology of directly packaging chips on a printed circuit board (PCB) or other substrate. In the COB integrated packaging substrate, the graphization mainly refers to making accurate circuit patterns on the surface of the substrate through processes such as photoetching and etching to realize the connection of the chips with external circuits and the mutual connection between the chips.

[0003] However, since the COB packaging integrates multiple LED chips on the same substrate, the gap between adjacent LED chips is small, and the density is large, so the heat generated by the operation of the LED chips is difficult to quickly spread, which can cause the local temperature at the position of the LED chips to significantly increase, and the excessively high temperature can accelerate the aging of the LED chips and shorten their service life. UTILITY MODEL CONTENT

[0004] Based on the technical problems existing in the prior art, the utility model provides a COB graphical integrated packaging substrate structure which can effectively reduce the working temperature of the LED chips and prolong the service life.

[0005] The utility model solves the technical problems by adopting the technical scheme of providing a COB graphical integrated packaging substrate structure, which comprises a printed circuit board, LED chips mounted on the printed circuit board, a packaging piece arranged on the printed circuit board and the LED chips, a driving chip and a heat dissipation piece arranged on the lower surface of the printed circuit board, a plurality of heat dissipation holes are formed in the printed circuit board, the heat dissipation holes are filled with a heat conductive material, the heat dissipation piece is composed of a plurality of sheet-shaped metal sheets to form heat dissipation fins, and the plurality of metal sheets are parallel to each other and have a certain spacing between the metal sheets.

[0006] Further, the printed circuit board comprises a substrate layer at the bottom, an insulating layer and a circuit layer at the top. The substrate layer is made of aluminum oxide ceramic or aluminum nitride ceramic material.

[0007] Further, the insulating layer is located between the substrate layer and the circuit layer, and the insulating layer is made of epoxy resin or polyimide material.

[0008] Further, a plurality of mounting grooves for mounting the LED chips are formed in the printed circuit board, and the shape of the bottom of the mounting grooves matches the shape of the LED chips.

[0009] Further, the number of the heat dissipation holes is equal to the number of the mounting grooves.

[0010] Further, the position of the heat dissipation hole corresponds to the position of the mounting groove, and the heat dissipation hole is filled with heat-conductive silicone grease.

[0011] Further, the LED chip comprises a first pin and a second pin, and the first pin and the second pin are electrically connected with the printed circuit board by means of soldering.

[0012] Further, the package comprises a dam and a package glue.

[0013] Further, the dam is used for enclosing the plurality of LED chips.

[0014] The beneficial effects of the present application are as follows: a COB graphical integrated package substrate structure is provided, which comprises a printed circuit board, an LED chip mounted on the printed circuit board, a package arranged on the printed circuit board and the LED chip, a driving chip arranged on the lower surface of the printed circuit board, and a heat dissipation member, a plurality of heat dissipation holes are formed on the printed circuit board, the heat dissipation holes are filled with heat-conductive materials, the heat dissipation member is composed of a plurality of sheet-shaped metal sheets to form heat dissipation fins, and the plurality of metal sheets are parallel to each other and have a certain spacing between the metal sheets. The substrate layer of the printed circuit board is made of metal materials such as aluminum and copper, which has good heat conductivity and electrical conductivity; the heat dissipation holes are arranged for dissipating heat of the LED chip fixed in the mounting groove, and the heat generated by the LED chip during operation is conducted out to ensure the normal operation of the LED chip, and the heat dissipation holes are filled with heat-conductive materials to improve the heat dissipation effect; the driving chip provides stable current and voltage, thereby effectively prolonging the service life of the LED chip; the heat dissipation member is fixed on the lower surface of the printed circuit board, the larger the surface area of the heat dissipation member in contact with air, the faster the heat dissipation speed, thereby improving the heat dissipation efficiency and prolonging the service life of the COB graphical integrated package substrate structure. BRIEF DESCRIPTION OF DRAWINGS

[0015] The present application will be further described below in combination with the drawings and embodiments.

[0016] Figure 1 is a sectional view of the COB graphical integrated package substrate structure provided by the present application;

[0017] Figure 2 is a top view of the COB graphical integrated package substrate structure provided by the present application.

[0018] The names and numbers of the components in the drawings are as follows:

[0019] The COB graphical integrated package substrate structure 100;

[0020] Printed circuit board 1, substrate layer 11, insulating layer 12, circuit layer 13, mounting groove 14, heat dissipation hole 15;

[0021] LED chip 2, first pin 21, second pin 22;

[0022] Package 3, dam 31, encapsulation glue 32;

[0023] Drive chip 4; heat dissipation piece 5. DETAILED DESCRIPTION

[0024] In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application will be described in detail in combination with the drawings. The figure is a simplified schematic diagram, which only schematically illustrates the basic of the present application, and therefore only shows the relevant components of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0025] As shown in Figure 1 The present embodiment provides a COB graphical integrated package substrate structure 100, which comprises a printed circuit board 1, an LED chip 2 mounted on the printed circuit board 1, a package 3 arranged on the printed circuit board 1 and the LED chip 2, a drive chip 4 arranged on the lower surface of the printed circuit board 1, and a heat dissipation piece 5.

[0026] In some embodiments, the printed circuit board 1 comprises a substrate layer 11 at the bottom, an insulating layer 12, and a circuit layer 13 at the top.

[0027] In some embodiments, the substrate layer 11 serves as the basic support component of the entire COB graphical integrated package substrate structure 100, and provides a platform for mounting and electrical connection of the chip. As an example, the substrate layer 11 is made of metal materials such as aluminum and copper, which have good thermal conductivity and electrical conductivity. As an example, the substrate layer 11 is made of ceramic materials such as alumina ceramic and aluminum nitride ceramic, which have high thermal conductivity and good insulation performance.

[0028] In some embodiments, the insulating layer 12 is located between the substrate layer 11 and the circuit layer 13, and is usually made of insulating materials. As an example, the insulating layer 12 is made of epoxy resin or polyimide material, which can prevent short circuit and signal interference between lines, and plays a role of isolation and protection.

[0029] In some embodiments, the circuit layer 13 is located on the surface of the printed circuit board 1 and is made by photolithography, etching and other processes. The circuit layer 13 includes various conductive lines and pads. The conductive lines are used to realize the electrical connection between the chip and the external circuit, and transmit the electrical signals emitted by the chip to the external device or other chips. The pads are the locations for mounting and soldering the chip.

[0030] In some embodiments, the printed circuit board 1 is also provided with a plurality of mounting grooves 14 for mounting the LED chips 2. The bottom of the mounting groove 14 is shaped to match the shape of the LED chip 2. The top of the mounting groove 14 is slightly larger than the bottom of the mounting groove 14, which facilitates the positioning and mounting of the LED chip 2 and avoids the displacement of the LED chip 2 during installation, further ensuring that the LED chip can be firmly attached or soldered to the printed circuit board 1.

[0031] In some embodiments, the printed circuit board 1 is also provided with a plurality of heat dissipation holes 15. The number of heat dissipation holes 15 is equal to the number of mounting grooves 14. The positions of the heat dissipation holes 15 correspond to the positions of the mounting grooves 14. The heat dissipation holes 15 are used to dissipate heat from the LED chips fixed in the mounting grooves 14 and conduct the heat generated by the LED chips during operation to ensure the normal operation of the LED chips. Further, the heat dissipation holes 15 are filled with heat-conducting materials for heat dissipation. As an example, the heat dissipation holes 15 are filled with heat-conducting silicone grease to reduce thermal resistance and improve heat dissipation effect.

[0032] In some embodiments, a plurality of LED chips 2 are provided and mounted on the printed circuit board 1. The LED chip 2 includes a first pin 21 and a second pin 22. The first pin 21 and the second pin 22 are electrically connected to the circuit layer 13 of the printed circuit board 1 by soldering. Specifically, the corresponding electrodes of the first pin 21 and the second pin 22 are opposite. If the first pin 21 is a positive pin, the second pin 22 is a negative pin. If the first pin 21 is a negative pin, the second pin 22 is a positive pin.

[0033] As Figure 2As shown, the package 3 comprises a dam 31 and a package glue 32. The dam 31 is used to enclose a plurality of LED chips 3, and the dam 31 is formed by applying glue to form a ring structure and then curing. The dam 31 is obtained by applying a ring of glue and then drying and curing. The dam 31 is simple to prepare, and the size and shape of the dam 31 can be adjusted according to actual requirements. Further, the dam 40 is a white dam, which is not transparent and does not absorb light, and is suitable for LED lamp beads with white light. In other embodiments, the color and shape of the dam 31 are not limited to this. The package glue 32 is located in the inner circle of the dam 31 and is used to cover all the LED chips 31 located in the dam 31. The package glue 32 is used to protect the chips from the external environment, while ensuring that the light emitted by the LED chips 31 can effectively pass through. In some examples, the package glue 31 is made of epoxy resin material, which has good optical transparency, moisture resistance and mechanical strength. The refractive index can be adjusted as needed to optimize the light emitting effect of the chip.

[0034] In some embodiments, the driving chip 4 is fixed to the lower surface of the printed circuit board 1, and the driving chip 4 is located at the middle position between two adjacent LED chips 2 to avoid affecting the heat dissipation effect of the LED chips 2. The driving chip 4 is used to control and drive the chip for the LED chips 2 to work. The driving chip 4 can convert and adjust the input power source to provide stable current or voltage for the LED chips 2, ensure that the LED can normally emit light, and can control the brightness, color and flicker effect of the LED chips 2. By providing stable current and voltage, the driving chip 4 can avoid damage to the LED chips 2 due to overcurrent, overvoltage and other abnormal conditions, thereby effectively prolonging the service life of the LED chips 2, and the driving chip 4 can ensure the brightness uniformity and color consistency of the LED chips 2.

[0035] In some embodiments, the heat dissipation member 5 is fixed to the lower surface of the printed circuit board 1, the heat dissipation member 5 is connected with the heat dissipation hole 15, and the heat dissipation member 5 is arranged around the driving chip 4. The heat dissipation member 5 is composed of a plurality of thin sheet-shaped metal sheets, and the plurality of metal sheets are parallel to each other and have a certain interval. The heat dissipation member 5 quickly conducts the heat generated by the light source to the metal sheets, and the metal sheets have good heat conduction performance, which can quickly transfer the heat from the light source to the heat dissipation fins, thereby reducing the temperature of the LED chips 2. Since the heat dissipation member 5 is composed of a plurality of thin sheet-shaped metal sheets, the surface area for heat dissipation can be greatly increased. By increasing the surface area, the heat dissipation member 5 can more effectively dissipate heat to the surrounding air. When the heat is conducted to the heat dissipation member 5, the larger the surface area of the heat dissipation member 5 in contact with the air, the faster the heat dissipation speed, thereby improving the heat dissipation efficiency.

[0036] The utility model discloses a COB graphical integrated packaging substrate structure 100 including printed circuit board 1, install LED chip 2 on printed circuit board 1, set up the packaging piece 3 on printed circuit board 1 and LED chip 2, drive chip 4 and the heat dissipation piece 5 of setting in the lower surface of printed circuit board 1, the substrate layer 11 of printed circuit board 1 adopts aluminium, copper and so on metal material to make, has good thermal conductivity and conductivity, the insulating layer 12 adopts epoxy resin or polyimide material to make, can prevent the short circuit and signal interference between circuit, plays the role of isolation and protection, still has a plurality of installation recess 14 for the LED chip 2 installation of setting up on printed circuit board 1, avoids the displacement of LED chip 2 when installing, further ensures that LED chip can firmly paste or weld on printed circuit board 1, is provided with the heat dissipation hole 15 for the heat dissipation of the LED chip fixed in the installation recess 14, transmits the heat generated when the LED chip works to guarantee the normal work of LED chip, and the heat dissipation hole 15 is filled with heat conducting material and improves the heat dissipation effect, drive chip 4 passes through providing stable current and voltage to effectively prolong the service life of LED chip 2, the heat dissipation piece 5 is fixed in the lower surface of printed circuit board 1, the surface area of heat dissipation piece 5 and air contact is greater, and the speed of heat emission is faster, thereby improve the heat dissipation efficiency.

[0037] In the description of the utility model, it is to explain, unless there is the explicit provision and limit term " install " " link " " connection " should be broad sense understanding, for example, can be fixed connection, also can be detachable connection or integral connection, can be mechanical connection, can be direct connection also can pass through the indirect connection of intermediate medium, can be the intercommunication of two elements or the interaction of two elements. For ordinary skilled person in the art, the above-mentioned terms can be understood according to the specific meaning of the utility model.

[0038] It needs to be understood that the orientation or position relationship indicated by the terms "length", "width", "upper", "lower", "front and back", "left and right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as limiting the utility model in that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation. Therefore, it cannot be understood as limiting the utility model.

[0039] The above is according to the ideal embodiment of the utility model for the enlightenment, through the above-mentioned description, relevant staff can make various changes and modifications without deviating from the scope of the utility model. The technical scope of the utility model must be determined by the scope of claims, not the content in the specification.

Claims

1. A COB graphical integrated package substrate structure, characterized in that: The application relates to a printed circuit board, LED chips mounted on the printed circuit board, a packaging member arranged on the printed circuit board and the LED chips, a driving chip arranged on the lower surface of the printed circuit board, and a heat dissipation member, wherein a plurality of heat dissipation holes are formed on the printed circuit board, the heat dissipation holes are filled with heat conductive material, and the heat dissipation member is composed of a plurality of sheet-shaped metal sheets which are parallel to each other and have intervals between the metal sheets.

2. The COB graphical integrated package substrate structure of claim 1, wherein: The printed circuit board comprises a substrate layer at the bottom, an insulating layer, and a circuit layer at the top.

3. The COB graphical integrated package substrate structure of claim 2, wherein: The substrate layer is made of alumina ceramic or aluminum nitride ceramic material.

4. The COB graphical integrated package substrate structure of claim 2, wherein: The insulating layer is arranged between the substrate layer and the circuit layer, and is made of epoxy resin or polyimide material.

5. The COB graphical integrated package substrate structure of claim 1, wherein: A plurality of mounting grooves for mounting the LED chips are formed on the printed circuit board, and the bottom shape of the mounting grooves matches the shape of the LED chips.

6. The COB graphical integrated package substrate structure of claim 5, wherein: The number of the heat dissipation holes is equal to the number of the mounting grooves.

7. The COB graphical integrated package substrate structure of claim 6, wherein: The positions of the heat dissipation holes correspond to the positions of the mounting grooves, and the heat dissipation holes are filled with heat conductive silicone grease.

8. The COB graphical integrated package substrate structure of claim 1, wherein: The LED chips comprise first pins and second pins, and the first pins and the second pins are electrically connected to the printed circuit board through soldering.

9. The COB graphical integrated package substrate structure of claim 1, wherein: The packaging member comprises a dam and packaging glue.

10. The COB graphical integrated package substrate structure of claim 9, wherein: The dam is used for enclosing a plurality of the LED chips.

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