Quartz wafer polishing equipment

Abstract

The utility model relates to quartz wafer polishing equipment, and belongs to the technical field of wafer processing equipment.The quartz wafer polishing equipment comprises a lower polishing disk and an upper polishing disk, the upper polishing disk is provided with a plurality of conveying pipes, the ends of the conveying pipes are inserted into the upper polishing disk, and the lower ends of the conveying pipes are provided with dispersing pipes arranged in the width direction of the polishing disk of the upper polishing disk; and the lower side of the upper polishing disc is provided with mounting grooves which are in one-to-one correspondence with the dispersing pipes and are provided with downward openings, the lower sides of the dispersing pipes are provided with a plurality of discharging pipes arranged in the length direction of the dispersing pipes, the lower sides of the discharging pipes are higher than the lower side of the upper polishing disc, and plugging pieces for plugging the discharging pipes are arranged in the dispersing pipes. The grinding aid has the effect of reducing the possibility of waste of the grinding aid.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafer processing equipment, in particular to a quartz wafer polishing device. BACKGROUND

[0002] When the surface of a quartz wafer is processed, the two sides of the quartz wafer are usually polished by a polishing device to improve the surface quality of the quartz wafer.

[0003] When polishing, the wafer is placed in a star wheel on the lower polishing disc, at this time one side of the star wheel is engaged with the gear at the center of the lower polishing disc, and the other side is engaged with the gear ring installed at the edge of the lower polishing disc and coaxial with the gear, the upper polishing disc is driven to move towards the wafer, until the upper and lower polishing discs are in contact with the side wall of the wafer, the driving gear, gear ring, lower polishing disc and upper polishing disc are simultaneously rotated, at this time the rotation direction of the lower polishing disc and the upper polishing disc is opposite, and the star wheel rotates along the circumference of the gear under the drive of the gear and the gear ring while rotating, the upper polishing disc is provided with a plurality of conveying pipes uniformly distributed along the circumference of the upper polishing disc, the grinding aid is conveyed between the upper and lower polishing discs through the conveying pipes to improve the polishing efficiency and quality, and the polishing debris flows with the grinding aid and separates from the lower polishing disc until the wafer polishing is completed.

[0004] In the related art, the grinding aid is conveyed between the upper and lower polishing discs through a plurality of conveying pipes, since the diameter of the conveying pipe is smaller than the polishing belt width of the lower polishing disc, thus it is easy to cause the possibility of loss of part of the grinding aid without contacting the surface of the wafer, thereby causing the possibility of waste of the grinding aid. CONTENT OF THE UTILITY MODEL

[0005] In order to reduce the possibility of waste of the grinding aid, the application provides a quartz wafer polishing device.

[0006] The quartz wafer polishing device provided by the application adopts the following technical scheme:

[0007] A quartz wafer polishing device, comprising a lower polishing disc and an upper polishing disc, a plurality of conveying pipes with end portions inserted into the upper polishing disc are arranged on the upper polishing disc, a dispersing pipe arranged along the polishing belt width direction of the upper polishing disc is arranged at the lower end of each conveying pipe, a mounting groove corresponding to each dispersing pipe and opening downward is arranged on the lower side of the upper polishing disc, a plurality of discharge pipes arranged along the length direction of the dispersing pipe are arranged on the lower side of the dispersing pipe, the height of the lower side of the discharge pipe is higher than the height of the lower side of the upper polishing disc, and a blocking piece blocking the discharge pipe is arranged in the dispersing pipe.

[0008] By adopting the technical scheme, the grinding aid is conveyed to the dispersion pipe through the conveying pipe and moves along the length direction of the dispersion pipe, and then moves to the space between the upper polishing disc and the lower polishing disc through the discharge pipe, so that the grinding aid is uniformly dispersed in the width direction of the upper polishing disc, and the upper polishing disc and the lower polishing disc rotate in opposite directions, so that the grinding aid is uniformly dispersed along the circumferential direction of the upper polishing disc quickly, the grinding aid is facilitated to contact the wafer, and the possibility of waste of the grinding aid is reduced.

[0009] Optionally, the dispersion pipe is square in cross section, the blocking member comprises a blocking plate inserted into the dispersion pipe and slidably connected to the inner side wall of the dispersion pipe in the height direction of the dispersion pipe, the lower ends of the conveying pipes are inserted into the corresponding dispersion pipes and are inserted into and fixedly connected to the blocking plate, the lower ends of the conveying pipes are flush with the lower side of the blocking plate, the discharge pipes on the same dispersion pipe are not opposite to the corresponding conveying pipes, the conveying pipes are slidably connected to the dispersion pipes, and the upper polishing disc is provided with a sliding member for driving the dispersion pipe to slide.

[0010] By adopting the technical scheme, when the upper polishing disc and the lower polishing disc are in abutment with the side wall of the wafer, the blocking plate is located on the upper side of the dispersion pipe, the conveying pipe is in communication with the dispersion pipe at this time, the grinding aid is facilitated to flow into the dispersion pipe and flow out through the discharge pipe, when the wafer polishing is completed, the sliding member drives the dispersion pipe to move upward until the blocking plate is in abutment with the lower side of the dispersion pipe, at this time, the end of the conveying pipe is blocked by the inner side wall of the dispersion pipe, and the discharge plate is blocked by the blocking plate, so that the possibility of the grinding aid flowing in the direction of the lower polishing disc is reduced, and the possibility of waste of the grinding aid is reduced.

[0011] Optionally, the sliding member comprises a first hydraulic cylinder located in the mounting groove and driving the dispersion pipe to move in the height direction of the conveying pipe, and the first hydraulic cylinders are fixedly connected to the upper polishing disc.

[0012] By adopting the technical scheme, the first hydraulic cylinder drives the dispersion pipe to move upward, so that the conveying pipe and the discharge pipe are simultaneously blocked by the dispersion pipe side wall and the blocking plate, and the possibility of waste of the grinding aid is reduced.

[0013] Optionally, a driving column is rotatably connected to the axis of the lower polishing disc, a limiting block capable of being inserted into the driving column is mounted on the inner side wall of the upper polishing disc, a second hydraulic cylinder for driving the upper polishing disc to move close to or away from the lower polishing disc is mounted on the upper side of the upper polishing disc, a contact point is mounted on the limiting block, the contact point is wirelessly connected to a control host, and the first hydraulic cylinders are wirelessly connected to the control host.

[0014] By adopting the technical scheme, when the wafer is polished, the upper polishing disc and the lower polishing disc are in abutment with the sidewall of the wafer, the limiting block is inserted into the driving column, and the contact point transmits the electrical signal to the control host, at this time, the conveying pipe is in communication with the discharge pipe, after the wafer is polished, the second hydraulic cylinder drives the upper polishing disc to be separated from the lower polishing disc until the limiting block is separated from the driving column, at this time, the contact point transmits the electrical signal to the control host again, and the control host drives the first hydraulic cylinder to drive the dispersion pipe to move upward until the conveying pipe and the discharge pipe are blocked, so that the opening and closing of the conveying pipe and the discharge pipe can be controlled in time, and the waste of grinding aids is reduced.

[0015] Optionally, the width of the discharge pipe arranged along the length direction of the dispersion pipe gradually increases towards the lower polishing disc.

[0016] By adopting the technical scheme, the shape of the discharge pipe enables the grinding aids moved to the lower polishing disc through the discharge pipe to be overlapped with each other in the polishing width direction of the lower polishing disc, so that the grinding aids can be uniformly dispersed in the polishing width direction of the lower polishing disc, and the possibility that part of the grinding aids cannot be in contact with the wafer is reduced, thereby reducing the waste of the grinding aids.

[0017] Optionally, the width of the discharge pipe arranged along the cross section of the dispersion pipe gradually decreases towards the lower polishing disc.

[0018] By adopting the technical scheme, when the grinding aids flow to the end of the discharge pipe away from the corresponding dispersion pipe, the shape of the discharge pipe enables the end of the discharge pipe close to the lower polishing disc to pressurize the grinding aids in the discharge pipe, so that the grinding aids can be uniformly dispersed in the polishing width direction of the lower polishing disc, and the possibility that part of the grinding aids cannot be in contact with the wafer is reduced.

[0019] Optionally, the lower side of the outside of the dispersion pipe is in abutment with a driving plate, the telescopic rods of the first hydraulic cylinder are fixedly connected with the corresponding driving plates, the upper side of the outside of the dispersion pipe is fixedly connected with a spring, and the spring is sleeved on the conveying pipe and fixedly connected with the outer sidewall of the conveying pipe.

[0020] By adopting the technical scheme, the first hydraulic cylinder drives the dispersion pipe to move upward until the conveying pipe and the discharge pipe are blocked, at this time, the spring is compressed, when the conveying pipe needs to be opened, the first hydraulic cylinder drives the driving plate to move downward, the spring restores the deformation and drives the dispersion pipe to move downward until the conveying pipe and the discharge pipe are opened, so that the opening and closing of the conveying pipe and the discharge pipe can be controlled.

[0021] Optionally, the discharge pipe is located in the middle of the width direction of the corresponding dispersion pipe, the lower side of the inside of the dispersion pipe is arranged as a slope that gradually inclines downward from the two sides to the middle, and the shape of the lower side of the sealing plate is adapted to the shape of the lower side of the inside of the dispersion pipe.

[0022] By adopting the above technical scheme, the slope on the lower side inside the dispersion pipe makes the grinding aid in the dispersion pipe move to the position opposite to the discharge pipe, so as to flow out through the discharge pipe, and the shape of the lower side of the blocking plate facilitates blocking the conveying pipe and the discharge pipe, reduces the possibility of the grinding aid flowing out through the gap, and further reduces the possibility of waste of the grinding aid.

[0023] To sum up, the present application includes at least one of the following beneficial technical effects:

[0024] The grinding aid moves between the upper polishing disc and the lower polishing disc through the conveying pipe, the dispersion pipe and the discharge pipe, which facilitates uniform dispersion of the grinding aid in the direction of the polishing belt width of the upper polishing disc, and the upper polishing disc and the lower polishing disc rotate in opposite directions, which facilitates uniform dispersion of the grinding aid along the circumference of the upper polishing disc, facilitates contact of the grinding aid with the wafer, and reduces the possibility of waste of the grinding aid.

[0025] When polishing the wafer, the blocking plate is located on the upper side inside the dispersion pipe, at this time the conveying pipe is in communication with the dispersion pipe, the grinding aid flows into the dispersion pipe, when the wafer polishing is completed, the sliding member drives the dispersion pipe to move upward until the blocking plate abuts against the lower side inside the dispersion pipe, at this time the end of the conveying pipe is blocked by the inner wall of the dispersion pipe, and the discharge plate is blocked by the blocking plate, which reduces the possibility of the grinding aid flowing in the direction of the lower polishing disc;

[0026] After the wafer polishing is completed, the second hydraulic cylinder drives the upper polishing disc to separate from the lower polishing disc until the limiting block separates from the driving column, at this time the contact point transmits the electrical signal to the control host, the control host drives the first hydraulic cylinder to move the dispersion pipe upward until the conveying pipe and the discharge pipe are both blocked, which facilitates timely control of the opening and closing of the conveying pipe and the discharge pipe, and reduces the possibility of waste of the grinding aid. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is the overall structure schematic diagram of the quartz wafer polishing equipment in the embodiment of the present application.

[0028] Figure 2 is the structure schematic diagram of the embodiment of the present application, which embodies the positional relationship between the upper polishing disc and the lower polishing disc.

[0029] Figure 3 is the structure schematic diagram of the embodiment of the present application, which embodies the positional relationship between the conveying pipe and the dispersion pipe.

[0030] Explanation of reference signs: 1, upper polishing disc; 11, driving column; 111, limiting groove; 12, fixing frame; 121, lifting rod; 122, abutting block; 123, mounting plate; 124, second hydraulic cylinder; 13, mounting hopper; 14, conveying pipe; 15, limiting block; 16, mounting groove; 2, lower polishing disc; 21, mounting frame; 211, second ring gear; 212, fourth gear; 213, first motor; 22, support frame; 23, first gear; 231, driving groove; 24, first ring gear; 241, second gear; 242, third gear; 25, star wheel; 3, driving assembly; 31, driving shaft; 32, second motor; 33, fifth gear; 34, sixth gear; 35, third ring gear; 4, dispersion pipe; 41, discharge pipe; 42, blocking plate; 43, spring; 44, driving plate; 45, first hydraulic cylinder; 5, workbench. DETAILED DESCRIPTION

[0031] The application will be further described in detail below with reference to the accompanying drawings.

[0032] The application discloses a quartz wafer polishing device. Figure 1 and Figure 2 The quartz wafer polishing device comprises an upper polishing disc 1 and a lower polishing disc 2 which are oppositely arranged in a vertical direction and in a circular ring shape, the lower polishing disc 2 is rotationally connected with a mounting frame 21 at the lower side, the mounting frame 21 is fixedly connected with a support frame 22 at the lower side, the support frame 22 is inserted on and rotationally connected with a workbench 5. A vertical first gear 23 which passes through the center of the mounting frame 21 and the lower polishing disc 2 is rotationally connected with the shaft center of the upper side of the support frame 22, the upper end of the first gear 23 is higher than the upper side of the lower polishing disc 2. A driving column 11 is rotationally connected with the upper side of the first gear 23, and the support frame 22 is provided with a driving assembly 3 which drives the driving column 11 and the first gear 23 to rotate simultaneously and reversely.

[0033] The lower polishing disc 2 is sleeved with a first ring gear 24 which is toothed towards the first gear 23 and has an upper end higher than the upper side of the lower polishing disc 2, the lower side of the first ring gear 24 is abutted and rotationally connected with the upper side of the support frame 22. A plurality of star wheels 25 which are arranged along the circumference of the first gear 23 and used for placing wafers are arranged between the upper side of the first ring gear 24 and the first gear 23, the lower side of the star wheel 25 is abutted with the upper side of the lower polishing disc 2, the side of the star wheel 25 close to the first gear 23 is engaged with the first gear 23, and the other side of the star wheel 25 is engaged with the first ring gear 24.

[0034] Referring to Figure 1 and Figure 2The lower end of the first gear 23 is engaged with the second gear 241 which is rotatably connected with the support frame 22. The second gear 241 is engaged with the third gear 242 which is rotatably connected with the upper side of the support frame 22 on the side close to the first gear ring 24. The third gear 242 is engaged with the lower side of the first gear ring 24 on the side away from the first gear 23.

[0035] The center of the mounting frame 21 is rotatably connected with the second gear ring 211 which is coaxial with the lower polishing disc 2 and fixedly connected with the lower side of the lower polishing disc 2. The side of the second gear ring 211 away from the third gear 242 is engaged with the fourth gear 212 which is rotatably connected with the mounting frame 21. The lower side of the fourth gear 212 is provided with the vertical first motor 213 which is fixedly connected with the lower side of the support frame 22.

[0036] Referring to Figure 1 and Figure 2 The upper side of the upper polishing disc 1 is fixedly connected with the vertical fixing frame 12. The outer side of the middle part of the fixing frame 12 is sleeved and fixedly connected with the annular mounting hopper 13 which is open upward and used for placing grinding aids. The lower side of the mounting hopper 13 is provided with a plurality of conveying pipes 14 which are uniformly distributed along the circumferential direction of the upper polishing disc 1 and face the lower polishing disc 2. In the embodiment of the application, four conveying pipes 14 are provided and communicate with the mounting hopper 13. The lower ends of the conveying pipes 14 penetrate the upper polishing disc 1 and are fixedly connected with the upper polishing disc 1.

[0037] The upper end of the fixing frame 12 is inserted with the vertical lifting rod 121 which is slidingly and rotatably connected with the upper end of the fixing member. One end of the lifting rod 121 which penetrates the upper end of the fixing frame 12 is fixedly connected with the abutting block 122 which has a diameter larger than the cross-sectional diameter of the lifting rod 121. The upper end of the lifting rod 121 is fixedly connected with the horizontal mounting plate 123. The lower side of the end of the mounting plate 123 away from the lifting rod 121 is provided with the vertical second hydraulic cylinder 124 which is fixedly connected with the upper side of the workbench 5.

[0038] The upper side of the upper polishing disc 1 is fixedly connected with two oppositely arranged limiting blocks 15. The side wall of the driving shaft 31 is provided with the vertical limiting groove 111 which is adapted to the limiting block 15. When the limiting block 15 is inserted in the limiting groove 111, the upper polishing disc 1 and the lower polishing disc 2 are respectively located on both sides of the vertical direction of the planet gear 25 and abut against the side wall of the planet gear 25.

[0039] The telescopic rod of the second hydraulic cylinder 124 is retracted, so that the lifting rod 121 and the abutting block 122 are driven to move downward by the mounting plate 123, the fixed frame 12 drives the upper polishing disc 1 to move to the direction close to the lower polishing disc 2 under the action of gravity, until the limiting block 15 is inserted into the limiting groove 111 on the driving column 11, at this time, the upper polishing disc 1 and the lower polishing disc 2 are in abutment with the side wall of the star wheel 25, the driving assembly 3 drives the first gear 23 and the driving column 11 to rotate reversely, at this time, the first gear ring 24 rotates with the first gear 23 under the driving of the second gear 241 and the third gear 242, the upper polishing disc 1 rotates with the driving column 11 in the same direction through the limiting block 15, and the first motor 213 drives the lower polishing disc 2 to rotate reversely with the upper polishing disc 1 through the fourth gear 212 and the second gear ring 211, so that the upper polishing disc 1 and the lower polishing disc 2 polish the two sides of the wafer at the same time, the star wheel 25 rotates along the circumference of the first gear 23 while self-rotating under the driving of the first gear ring 24 and the first gear 23, until the wafer surface polishing is completed.

[0040] When the wafer surface is polished, the grinding aid in the installation bucket 13 is conveyed to the space between the upper polishing disc 1 and the lower polishing disc 2 along the conveying pipe 14, so as to facilitate the grinding aid for the wafer, until the wafer polishing is completed.

[0041] With reference to Figure 2 The driving assembly 3 comprises a driving shaft 31 fixedly connected at the axis of the lower side of the driving column 11 and penetrating the first gear 23 and the support frame 22 at the same time, the lower end of the driving shaft 31 is provided with a second motor 32 fixedly connected with the lower side of the support frame 22, the second motor 32 is inserted into the workbench 5 and fixedly connected with the workbench 5. The first gear 23 is provided with a driving groove 231 opening downward, the driving groove 231 is provided with a fifth gear 33 sleeved on the driving shaft 31 and fixedly connected with the driving shaft 31, one side of the fifth gear 33 is engaged with a sixth gear 34 rotatably connected with the upper side of the support frame 22, the inner side wall of the first gear 23 is fixedly connected with a third gear ring 35 sleeved on the outer side of the sixth gear 34 and engaged with the sixth gear 34.

[0042] The second motor 32 drives the driving shaft 31 to rotate, at this time, the upper polishing disc 1 rotates with the driving column 11, and the fifth gear 33 on the driving shaft 31 drives the third gear ring 35 to drive the first gear 23 to rotate through the sixth gear 34, at this time, the rotating direction of the first gear 23 and the driving column 11 is reversed, which is convenient for polishing the wafer surface.

[0043] With reference to Figure 2 and Figure 3The lower end of the conveying pipe 14 is provided with a horizontal dispersion pipe 4 arranged along the polishing belt width direction of the upper polishing disc 1, the lower side of the upper polishing disc 1 is provided with a mounting groove 16 matched with the dispersion pipe 4, the dispersion pipe 4 is located in the mounting groove 16, and the lower side of the dispersion pipe 4 is fixedly connected with a plurality of discharge pipes 41 uniformly distributed along the length direction of the dispersion pipe 4, which are two in the embodiment of the application, and the discharge pipes 41 are in communication with the inside of the corresponding dispersion pipe 4. The width of the discharge pipe 41 in the length direction of the dispersion pipe 4 gradually increases to the side away from the dispersion pipe 4, and the width of the discharge pipe 41 in the cross-sectional direction of the dispersion pipe 4 gradually decreases to the side away from the dispersion pipe 4, the lower side of the discharge pipe 41 is higher than the lower side of the upper polishing disc 1, and the dispersion pipe 4 is provided with a blocking piece blocking the corresponding conveying pipe 14.

[0044] The cross section of the dispersion pipe 4 in the vertical direction is square, the lower end of the conveying pipe 14 is inserted into the middle of the length direction of the corresponding dispersion pipe 4 and is in communication with the inside of the dispersion pipe 4, and the discharge pipes 41 on the same dispersion pipe 4 are not opposite to the corresponding conveying pipe 14. The blocking piece includes a horizontal blocking plate 42 inserted into the inside of the dispersion pipe 4 and slidably connected with the side wall of the dispersion pipe 4, the lower end of the conveying pipe 14 passes through the middle of the length direction of the blocking plate 42, and the lower side of the blocking plate 42 is flat with the lower side of the conveying pipe 14, and the upper polishing disc 1 is provided with a sliding piece driving the dispersion pipe 4 to slide in the vertical direction. When the blocking plate 42 slides to the lower side in the inside of the corresponding dispersion pipe 4, the discharge pipe 41 and the conveying pipe 14 are blocked.

[0045] When the upper polishing disc 1 and the lower polishing disc 2 abut against the side wall of the wafer, the blocking plate 42 is located at the upper side in the inside of the dispersion pipe 4, at this time, the conveying pipe 14 is in communication with the dispersion pipe 4, the grinding aid is conveyed into the dispersion pipe 4 through the installation hopper 13 and the conveying pipe 14, and moves along the length direction of the dispersion pipe 4, and then moves to the between the upper polishing disc 1 and the lower polishing disc 2 through the discharge pipe 41, when the grinding aid flows to the end of the discharge pipe 41 away from the corresponding dispersion pipe 4, the shape of the discharge pipe 41 causes the end of the discharge pipe 41 close to the lower polishing disc 2 to pressurize the grinding aid in the discharge pipe 41, and at the same time, causes the grinding aid moving to the lower polishing disc 2 through the discharge pipe 41 to be able to overlap with each other in the polishing belt width direction of the lower polishing disc 2, so as to facilitate the uniform dispersion of the grinding aid in the polishing belt width direction of the lower polishing disc 2, and the upper polishing disc 1 and the lower polishing disc 2 rotate reversely, so as to facilitate the uniform dispersion of the grinding aid along the circumferential direction of the upper polishing disc 1, and facilitate the contact between the grinding aid and the wafer.

[0046] When the wafer polishing is completed, the sliding piece drives the dispersion pipe 4 to move upward until the blocking plate 42 abuts against the lower side in the inside of the dispersion pipe 4, at this time, the end of the conveying pipe 14 is blocked by the inner side wall of the dispersion pipe 4, and the discharge plate is blocked by the blocking plate 42, so as to reduce the possibility of the grinding aid flowing to the direction of the lower polishing disc 2.

[0047] Referring to Figure 2The sliding member comprises springs 43 sleeved on the outer side of the lower end of the conveying pipe 14, the lower end of each spring 43 is fixedly connected to the upper side of the outer side of the corresponding dispersion pipe 4, and the other end is fixedly connected to the outer side wall of the conveying pipe 14. The lower side of one end of the outer side of the dispersion pipe 4 is abutted by a horizontal driving plate 44, the end of the driving plate 44 away from the dispersion pipe 4 is bent upward at a right angle, and a first hydraulic cylinder 45 corresponding to the driving plate 44 is inserted and fixedly connected in each of the upper polishing discs 1, and the telescopic rod of the first hydraulic cylinder 45 is fixedly connected to the bent end of the driving plate 44.

[0048] The upper end of the side close to the driving column 11 of the limiting plate is provided with a contact point (not shown in the figure), and the contact point is wirelessly connected with a control host (not shown in the figure), and the first hydraulic cylinder 45 is wirelessly connected with the control host.

[0049] When the wafer is polished, the upper polishing disc 1 and the lower polishing disc 2 are abutted by the side wall of the wafer, the limiting block 15 is inserted in the driving column 11, and the contact point transmits an electric signal to the control host, at this time, the conveying pipe 14 is communicated with the discharge pipe 41, and after the polishing of the wafer is completed, the second hydraulic cylinder 124 drives the upper polishing disc 1 to be separated from the lower polishing disc 2 until the limiting block 15 is separated from the driving column 11, at this time, the contact point transmits an electric signal to the control host again, the control host drives the first hydraulic cylinder 45 to push the dispersion pipe 4 upward through the driving plate 44 until the conveying pipe 14 and the discharge pipe 41 are blocked, at this time, the spring 43 is compressed, when the conveying pipe 14 needs to be opened, the first hydraulic cylinder 45 drives the driving plate 44 to move downward, the spring 43 restores the deformation and pushes the dispersion pipe 4 to move downward until the conveying pipe 14 and the discharge pipe 41 are opened.

[0050] The lower side of the inner side of the dispersion pipe 4 is gradually recessed from the two ends to the middle, and the discharge pipe 41 corresponding to the same dispersion pipe 4 is located at the middle of the width direction of the dispersion pipe 4, and the shape of the lower side of the blocking plate 42 is adapted to the shape of the lower side of the inner side of the dispersion pipe 4.

[0051] The shape of the lower side of the inner side of the dispersion pipe 4 makes the grinding aid in the dispersion pipe 4 move to the position opposite to the discharge pipe 41, so as to facilitate the flow out through the discharge pipe 41, and the shape of the lower side of the blocking plate 42 facilitates the blocking of the conveying pipe 14 and the discharge pipe 41, and reduces the possibility of the flow out of the grinding aid through the gap.

[0052] The implementation principle of the quartz wafer polishing device in the embodiment of the application is as follows: when the wafer is polished, the blocking plate 42 is located on the upper side inside the dispersion pipe 4, the conveying pipe 14 is communicated with the dispersion pipe 4, the grinding aid is conveyed into the dispersion pipe 4 and moves along the length direction of the dispersion pipe 4, and then moves to the space between the upper polishing disc 1 and the lower polishing disc 2 through the discharge pipe 41. When the grinding aid flows to the end of the discharge pipe 41 away from the corresponding dispersion pipe 4, the shape of the discharge pipe 41 is such that the grinding aid in the discharge pipe 41 is pressurized by the discharge pipe 41, and at the same time, the grinding aid moving to the lower polishing disc 2 through the discharge pipe 41 can be overlapped with each other in the polishing width direction of the lower polishing disc 2, so that the grinding aid can be uniformly dispersed in the polishing width direction of the lower polishing disc 2, and the grinding aid can be in contact with the wafer.

[0053] The above are preferred embodiments of the application, and do not limit the protection scope of the application, so that: any equivalent changes made according to the structure, shape, principle of the application should be covered in the protection scope of the application.

Claims

1. A quartz wafer polishing device, characterized in that: The utility model provides a kind of polishing disc, including lower polishing disc (2) and upper polishing disc (1), the upper polishing disc (1) is equipped with multiple end insertion conveying pipe (14) in the upper polishing disc (1), the conveying pipe (14) lower end is equipped with dispersion pipe (4) being arranged along the polishing belt width direction of the upper polishing disc (1), the lower side of the upper polishing disc (1) is equipped with installation groove (16) corresponding with the dispersion pipe (4) and opening downward, the lower side of the dispersion pipe (4) is equipped with multiple outlet pipe (41) being arranged along the length direction of the dispersion pipe (4), the lower side height of the outlet pipe (41) is higher than the lower side height of the upper polishing disc (1), the dispersion pipe (4) is equipped with blocking piece blocking the outlet pipe (41).

2. The apparatus of claim 1, wherein: The dispersion pipe (4) is provided with a square cross section, the blocking piece includes a blocking plate (42) inserted into the dispersion pipe (4) and slidably connected with the inner wall of the dispersion pipe (4) along the height direction of the dispersion pipe (4), the lower end of the conveying pipe (14) is inserted into the corresponding dispersion pipe (4) and fixedly connected with the blocking plate (42), the lower end of the conveying pipe (14) is flush with the lower side of the blocking plate (42), the outlet pipes (41) on the same dispersion pipe (4) are not directly opposite to the corresponding conveying pipes (14), the conveying pipe (14) is slidably connected with the dispersion pipe (4), and the upper polishing disc (1) is provided with a sliding member for driving the dispersion pipe (4) to slide.

3. The apparatus of claim 2 wherein: The sliding member includes a first hydraulic cylinder (45) located in the installation groove (16) and driving the dispersion pipe (4) to move along the height direction of the conveying pipe (14), and the first hydraulic cylinder (45) is fixedly connected with the upper polishing disc (1).

4. The apparatus of claim 3 wherein: The lower polishing disc (2) is rotatably connected with a driving column (11) at the center, the inner wall of the upper polishing disc (1) is provided with a limiting block (15) capable of being inserted into the driving column (11), the upper side of the upper polishing disc (1) is provided with a second hydraulic cylinder (124) for driving the upper polishing disc (1) to move towards or away from the lower polishing disc (2), the limiting block (15) is provided with a contact, the contact is wirelessly connected with a control host, and the first hydraulic cylinder (45) is wirelessly connected with the control host.

5. The apparatus of claim 4 wherein: The width of the outlet pipe (41) arranged along the length direction of the dispersion pipe (4) gradually increases towards the lower polishing disc (2).

6. The apparatus of claim 5 wherein: The width of the outlet pipe (41) arranged along the cross section of the dispersion pipe (4) gradually decreases towards the lower polishing disc (2).

7. The apparatus of claim 6 wherein: The lower side of the outer part of the dispersion pipe (4) is abutted with a driving plate (44), the extension rod of the first hydraulic cylinder (45) is fixedly connected with the corresponding driving plate (44), the upper side of the outer part of the dispersion pipe (4) is fixedly connected with a spring (43), the spring (43) is sleeved on the conveying pipe (14) and fixedly connected with the outer wall of the conveying pipe (14).

8. The apparatus of claim 7 wherein: The discharge pipes (41) are located at the middle of the width direction of the corresponding dispersion pipes (4), the lower side of the inside of the dispersion pipes (4) is provided with a slope which gradually inclines downward from the two sides to the middle, and the lower side of the sealing plate (42) is shaped to be adapted to the shape of the lower side of the inside of the dispersion pipes (4).

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