Lifting placing device

Abstract

The utility model relates to the technical field of semiconductors, and discloses a lifting placing device, which comprises a top pin, a connecting plate, a voice coil motor and a linear bearing, the top pin and the linear bearing are arranged on the connecting plate to form a lifting table; the voice coil motor drives the lifting table to ascend until the top pin is higher than the surface of the suction cup; the wafer is placed on the top pin, the top pin adsorbs the wafer through vacuum, the voice coil motor drives the lifting table and the wafer to descend at the preset speed until the wafer stably falls on the surface of the suction cup, the wafer can be safely and stably placed on the suction cup, and collision is avoided due to the fact that the speed is controllable.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a lifting and placing device. Background Art

[0002] During wafer production or inspection, the wafer will be grabbed by a robotic arm and moved to a lifting platform, and then moved to the chuck (suction cup) carrier by the lifting platform. When the wafer is moved to the chuck, the wafer itself may be warped or the lifting height and speed cannot be accurately controlled, causing the wafer to collide with the chuck, affecting the wafer quality.

[0003] Conventional lifting platforms are generally divided into two types:

[0004] One method is to hollow out the adsorption surface of the chuck table so that the robotic arm can place the wafer directly on the chuck. This method requires changing the chuck structure, and the hollowed-out chuck cannot adsorb the entire area of ​​the wafer. The adsorption capacity will be weakened for warped wafers, which will ultimately affect the test results.

[0005] Another design is to use a cylinder to drive the lifting platform. The robotic arm places the wafer on the lifting platform and moves the wafer to the chuck through the cylinder. This method cannot accurately control the speed of wafer placement, and the change in air pressure will also affect the stability of the cylinder, which can easily cause the wafer and chuck to collide during the production process.

[0006] Therefore, a safe, reliable and stable lifting and placing device is needed so that the wafer can be placed on the chuck without collision, which is convenient for subsequent production or testing and other preparation processes.

[0007] The above content is only used to assist in understanding the technical solution of the present invention and does not constitute an admission that the above content is prior art. Utility Model Content

[0008] The main purpose of the utility model is to provide a lifting and placing device, which aims to solve the technical problem that the existing conventional lifting platform design has poor stability, which easily causes collisions when placing wafers, affecting subsequent production or testing and other preparation processes.

[0009] To achieve the above-mentioned purpose, the present invention provides a lifting and placing device, which comprises:

[0010] Top pin, connecting plate, voice coil motor, linear bearing;

[0011] The top pin and the linear bearing are arranged on the connecting plate and are combined into a lifting platform;

[0012] The voice coil motor drives the lifting platform to rise until the top pin is higher than the surface of the chuck;

[0013] The wafer is placed on the top pin, the top pin absorbs the wafer by vacuum, the voice coil motor drives the lifting platform and the wafer to descend at a preset speed until the wafer falls smoothly onto the surface of the chuck.

[0014] Preferably, the lifting placement device further comprises a turntable and a motor.

[0015] The voice coil motor is fixed inside the turntable, and the motor drives the turntable, the voice coil motor, the lifting platform and the chuck to rotate to adjust the angle of the wafer.

[0016] Preferably, the lifting placement device further comprises a reading head and a grating ruler.

[0017] The grating ruler is clamped at the outer end of one of the connecting plates, and the reading head is fixed on the outer side of the turntable.

[0018] The grating ruler moves with the lifting platform, the reading head reads the position of the grating ruler and feeds back the height position in real time, and the preset speed is controlled or adjusted according to the height position to make the wafer fall smoothly onto the surface of the chuck.

[0019] Preferably, the lifting placement device further comprises a guide column.

[0020] The guide column is arranged on the turntable.

[0021] The guide column is used for the up-and-down guiding of the lifting platform, and the linear bearing in the lifting platform slides on the guide column to avoid the deviation of the lifting platform.

[0022] Preferably, the number of the top pins and the linear bearings is three, the connecting plates are connected to the center of the voice coil motor, and the included angle of the connecting plates is 120°.

[0023] Preferably, the chuck is made of ceramic material, the adsorption surface has high flatness, and the surface is uniformly distributed with precise micropores.

[0024] Preferably, a vacuum suction nozzle is attached to each of the top pins.

[0025] In the embodiment, the lifting placing device comprises a top pin, a connecting plate, a voice coil motor and a linear bearing; the top pin and the linear bearing are arranged on the connecting plate and combined into a lifting platform; the voice coil motor drives the lifting platform to rise until the top pin is higher than the surface of a chuck; a wafer is placed on the top pin, the top pin absorbs the wafer through vacuum adsorption, the voice coil motor drives the lifting platform and the wafer to descend at a preset speed until the wafer is stably placed on the surface of the chuck, and the wafer can be safely and stably placed on the chuck, and collision is avoided due to controllable speed. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only represent some of the embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative effort.

[0027] Figure 1 FIG. 1 is a first structural schematic diagram of a lifting placing device according to an embodiment of the present application;

[0028] Figure 2 FIG. 2 is a second structural schematic diagram of the lifting placing device according to the embodiment of the present application.

[0029] DETAILED DESCRIPTION

[0030] Reference Name Reference Name 1 Top pin 2 Connection plate 3 Voice coil motor 4 Linear bearing 5 Rotary table 6 Motor 7 Suction cup 8 Reading head 9 Grating ruler 10 Guide pillar

[0031] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments only represent some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort fall within the scope of the present application.

[0033] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0034] In addition, if the description of "first", "second" and the like is involved in the embodiments of the utility model, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can be explicitly or implicitly included at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.

[0035] Referring to Figure 1 , Figure 2 , Figure 1 it is the first structure schematic view of the lifting placing device for an embodiment of the utility model, Figure 2 it is the second structure schematic view of the lifting placing device in an embodiment of the utility model.

[0036] As Figure 1 indicated, the lifting placing device comprises:

[0037] Top pin 1, connecting plate 2, voice coil motor 3, linear bearing 4;

[0038] The top pin 1 and the linear bearing 4 are arranged on the connecting plate 2 and combined into a lifting platform;

[0039] The voice coil motor 3 drives the lifting platform to rise until the top pin 1 is higher than the surface of chuck;

[0040] The wafer is placed on the top pin 1, the top pin 1 is vacuum adsorbed to the wafer, and the voice coil motor 3 drives the lifting platform and the wafer to descend at a preset speed until the wafer is stably landed on the surface of the chuck.

[0041] It should be understood that in the process of wafer production or detection, the wafer is grabbed by a mechanical arm to the lifting platform, and then the wafer is moved to the chuck (suction cup) stage by the lifting platform. Before the mechanical arm places the wafer, the voice coil motor 3 usually drives the lifting platform to rise to the highest point, so that the top pin 1 is higher than the surface of the chuck. The mechanical arm places the wafer on the top pin 1, the top pin 1 is vacuum adsorbed, and then the voice coil motor 3 drives the lifting platform and the wafer to slowly descend, and the whole descending speed can be controlled.

[0042] Further, as Figure 2 indicated, in the embodiment, the lifting placing device further comprises a turntable 5 and a motor 6.

[0043] The voice coil motor 3 is fixed inside the turntable 5, and the motor 6 drives the turntable 5, the voice coil motor 3, the lifting platform and the chuck 7 to rotate to adjust the angle of the wafer.

[0044] It can be understood that the motor 6 is usually a DD motor. The voice coil motor 3 (not shown in the figure) is fixed inside the turntable 5, and the DD motor 6 drives the turntable 5, the voice coil motor 3, the lifting platform and the chuck 7 to rotate to adjust the angle of the wafer, which is convenient for production and testing. The voice coil motor 3 rotates with the DD motor 6, saving the design space and height of the turntable. Figure 2 Further, as shown in the figure, in this embodiment, the lifting and placing device further comprises a reading head 8 and a grating ruler 9;

[0045] Figure 2 The grating ruler 9 is clamped at the outer end of the connecting plate 2, and the reading head 8 is arranged outside the motor 6;

[0046] The grating ruler 9 moves with the lifting platform, and the reading head 8 reads the position of the grating ruler 9 and feeds back the height position in real time, controls or adjusts the preset speed according to the height position, so that the wafer falls smoothly onto the surface of the chuck 7.

[0047] It should be noted that the grating ruler 9 moves up and down with the lifting platform. During the descending process, the reading head 8 reads the position of the grating ruler 9 and feeds back the height position in real time, so that the wafer can fall smoothly and accurately onto the surface of the chuck 7. The reading head 8 monitors the height and position of the top pin at all times. The preset speed is controllable, and can also be adjusted in real time according to the position, so as to ensure that the wafer can fall smoothly and accurately onto the surface of the chuck.

[0048] Further, as shown in the figure, in this embodiment, the lifting and placing device further comprises a guide column 10;

[0049] The guide column 10 is arranged on the turntable 5; Figure 2 The guide column 10 is used for the up and down guiding of the lifting platform, and the linear bearing 4 in the lifting platform slides on the guide column 10 to avoid the deviation of the lifting platform.

[0050] Further, as shown in the figure, in this embodiment, the lifting and placing device further comprises a guide column 10;

[0051] The guide column 10 is arranged on the turntable 5;

[0052] Figure 2 ​​As shown, in the embodiment, the number of the top pins 1 and the number of the linear bearings 4 are both three, the connecting plate 2 connects the center of the voice coil motor, and the included angle of the connecting plate 2 is 120°. The chuck 7 is made of ceramic material, the adsorbing surface has high flatness, and the surface is uniformly distributed with precise micropores. A vacuum suction nozzle is attached to each of the top pins 1.

[0053] In the specific implementation, the three top pins 1 and the three linear bearings 4 are fixed by the connecting plate 2. The reading head 8 is close to the grating ruler 9 and performs reading. The chuck 7 is made of ceramic material, the adsorbing surface has high flatness, and the surface is uniformly distributed with precise micropores, so that the adsorbing force is more uniform when the wafer is adsorbed on the chuck 7. A vacuum suction nozzle is attached to each of the top pins 1, so that the wafer adsorbed on the top pin 1 will not be deviated when the lifting platform moves up and down.

[0054] In the embodiment, the lifting and placing device comprises top pins 1, a connecting plate 2, a voice coil motor 3, and linear bearings 4. The top pins 1 and the linear bearings 4 are arranged on the connecting plate 2 and combined into a lifting platform. The voice coil motor 3 drives the lifting platform to rise until the top pins 1 are higher than the surface of the chuck. The wafer is placed on the top pins 1, the top pins 1 adsorb the wafer by vacuum adsorption, the voice coil motor 3 drives the lifting platform and the wafer to descend at a preset speed until the wafer is stably placed on the surface of the chuck, so that the wafer can be safely and stably placed on the chuck. Since the speed is controllable, collision is avoided. The linear bearings are used in the lifting process to avoid deviation of the lifting platform, so as to ensure the accuracy of subsequent production or testing. The voice coil motor 3 rotates together with the DD motor 6, so that the design space and height of the rotary table are saved. The height and position of the top pin are monitored at any time, so that the speed control is more accurate, and the wafer can be safely and stably placed on the chuck.

[0055] The above only describes the preferred embodiments of the present application, and does not limit the patent range of the present application. Any equivalent structural transformation or direct / indirect application in other related technical fields within the inventive concept of the present application and the contents of the present application specification and drawings are included in the patent protection range of the present application.

Claims

1. A lift and place apparatus, characterized by, The lifting placement device comprises a top pin, a connecting plate, a voice coil motor and a linear bearing. The top pin and the linear bearing are arranged on the connecting plate and combined into a lifting platform. The voice coil motor drives the lifting platform to rise until the top pin is higher than the surface of a chuck. A wafer is placed on the top pin, the top pin absorbs the wafer by vacuum, the voice coil motor drives the lifting platform and the wafer to descend at a preset speed until the wafer falls smoothly onto the surface of the chuck.

2. The lift and place device of claim 1, wherein, The lifting placement device further comprises a rotary table and a motor. The voice coil motor is fixed inside the rotary table, and the motor drives the rotary table, the voice coil motor, the lifting platform and the chuck to rotate to adjust the angle of the wafer.

3. The lift-and-place apparatus of claim 2, wherein, The lifting placement device further comprises a reading head and a grating ruler. The grating ruler is clamped at the outer end of one connecting plate, and the reading head is fixed outside the rotary table. The grating ruler moves with the lifting platform, the reading head reads the position of the grating ruler and feeds back the height position in real time, the preset speed is controlled or adjusted according to the height position, so that the wafer falls smoothly onto the surface of the chuck.

4. The lift and place device of claim 2, wherein, The lifting placement device further comprises a guide column. The guide column is arranged on the rotary table. The guide column is used for the upward and downward guidance of the lifting platform, and the linear bearing in the lifting platform slides on the guide column to avoid the deviation of the lifting platform.

5. The lift and place device of claim 1, wherein, The number of the top pin and the linear bearing is three, the connecting plate is connected to the center of the voice coil motor, and the included angle of the connecting plate is 120°.

6. The lift-and-place apparatus of claim 1, wherein, The chuck is made of ceramic material, the adsorption surface has high flatness, and the surface is uniformly distributed with precise micropores.

7. The lift placement device of any one of claims 1-6, wherein, A vacuum suction nozzle is attached to each top pin.

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