Magnet rotating mechanism of sputter coating machine

Abstract

The utility model provides a magnet rotating mechanism of a sputter coating machine, which comprises a process cavity, a target opening and closing mechanism is arranged above the process cavity, the magnet rotating mechanism is arranged in the target opening and closing mechanism, the target opening and closing mechanism comprises a target mounting plate, the bottom edge of the target mounting plate is connected with a target, and an upper cover plate is arranged above the target mounting plate. The magnet rotating mechanism penetrates through the upper cover plate and comprises a power assembly and a rotating magnet assembly, the power assembly is arranged above the upper cover plate, the rotating magnet assembly comprises a magnet fixing copper disc, a magnet mounting assembly and a plurality of magnets, and the magnets are fixed above the magnet mounting assembly; the plurality of magnets are connected with the power assembly through the magnet fixing copper disc, and the power assembly drives the rotating magnet assembly to rotate, so that a magnetic field generated by the plurality of magnets rotates, the uniformity and the direction consistency of the magnetic field are ensured, a relatively uniform space magnetic field is formed, ion distribution in the process cavity is more uniform, and coating is more uniform.

Description

Technical Field

[0001] The utility model relates to the technical field of sputtering coating, and more specifically to a magnet rotating mechanism of a sputtering coating machine. Background Art

[0002] Sputtering is a physical vapor deposition (PVD) process widely used in thin film fabrication. The principle of sputtering is to bombard a target with high-energy particles, knocking target particles off the target, causing them to deposit and form a thin film.

[0003] Uniformity is a key performance metric for thin film deposition using a magnetron sputtering vacuum coating machine. Therefore, studying the factors influencing magnetron sputtering uniformity can help achieve better uniform magnetron sputtering coating. Simply put, magnetron sputtering involves the use of an orthogonal electromagnetic field. A closed magnetic field binds electrons in a spiral motion around a target surface. During this motion, they continuously collide with a working gas, ionizing a large number of working gas ions. Under the influence of the electric field, the working gas ions are accelerated to bombard the target material, sputtering target atomic ions (or molecules) that are deposited on the substrate to form a thin film. Therefore, achieving uniform film deposition requires uniform sputtering of target atomic ions (or molecules), which requires that the working gas ions bombarding the target material be uniform.

[0004] Because the working gas ions are accelerated to bombard the target material under the influence of an electric field, a uniform electric field is required. The working gas ions are formed by the continuous collision of electrons bound by a closed magnetic field during motion, which requires a uniform magnetic field and uniform working gas distribution. In fact, the uniformity of the magnetic field and the uniformity of the working gas are the most important factors affecting film uniformity. The film is thicker where the magnetic field is stronger, and thinner where the field is weaker. The direction of the magnetic field is also a significant factor influencing uniformity. Regarding air pressure, under certain pressure conditions, the film is thicker where the pressure is higher, and thinner where the pressure is weaker.

[0005] Therefore, ensuring the uniformity and directional consistency of the magnetic field as much as possible and forming a relatively uniform spatial magnetic field is an important issue that needs to be solved at present. Utility Model Content

[0006] Therefore, in order to solve the above problems, the utility model provides a magnet rotating mechanism of sputtering coating machine, including process cavity 10, process cavity 10 top is equipped with target material opening and closing mechanism 20, magnet rotating mechanism 30 is located in target material opening and closing mechanism 20, target material opening and closing mechanism 20 includes target material mounting plate 21, target material mounting plate 21 is hollow annular structure, target material mounting plate 21 bottom edge is connected target material 23, target material mounting plate 21 top is equipped with upper cover plate 22, upper cover plate 22, target material mounting plate 21, target material 23 enclose and form installation chamber, magnet rotating mechanism 30 passes through upper cover plate 22 and is arranged, magnet rotating mechanism 30 includes power assembly 31, rotating magnet assembly 32, power assembly 31 is located in upper cover plate 22 top, rotating magnet assembly 32 is located in the installation chamber, rotating magnet assembly 32 includes magnet fixed copper disc 321, magnet mounting assembly 322, multiple magnets 323, multiple magnets 323 are fixed on magnet mounting assembly 322 top, multiple magnets 323 are connected with power assembly 31 through magnet fixed copper disc 321, drive rotating magnet assembly 32 to rotate through power assembly 31, so that the magnetic field of multiple magnets 323 rotates, guarantees the uniformity and direction consistency of magnetic field, forms a relatively uniform space magnetic field, so that the ion distribution in process cavity 10 is more uniform, and coating is more uniform.

[0007] A magnet rotating mechanism of sputtering coating machine, including process cavity 10, process cavity 10 top is equipped with target material opening and closing mechanism 20, magnet rotating mechanism 30 is located in target material opening and closing mechanism 20, characterized by: target material opening and closing mechanism 20 includes target material mounting plate 21, target material mounting plate 21 is hollow annular structure, target material mounting plate 21 bottom edge is connected target material 23, target material mounting plate 21 top is equipped with upper cover plate 22, upper cover plate 22, target material mounting plate 21, target material 23 enclose and form installation chamber, magnet rotating mechanism 30 passes through upper cover plate 22 and is arranged, magnet rotating mechanism 30 includes power assembly 31, rotating magnet assembly 32, power assembly 31 is located in upper cover plate 22 top, rotating magnet assembly 32 is located in the installation chamber, rotating magnet assembly 32 includes magnet fixed copper disc 321, magnet mounting assembly 322, multiple magnets 323, multiple magnets 323 are fixed on magnet mounting assembly 322 top, multiple magnets 323 are connected with power assembly 31 through magnet fixed copper disc 321, drive rotating magnet assembly 32 to rotate through power assembly 31, so that the magnetic field of multiple magnets 323 rotates, guarantees the uniformity and direction consistency of magnetic field, forms a relatively uniform space magnetic field, so that the ion distribution in process cavity 10 is more uniform, and coating is more uniform.

[0008] Further, the power assembly 31 comprises a motor, a synchronous wheel 312 and a belt 316, the motor is arranged on the upper cover plate 22, the motor is connected with the synchronous wheel 312 through the belt 316 on one side, the synchronous wheel 312 is connected with the magnet fixed copper disc 321 through the magnetic fluid 314 below, the connection between the magnetic fluid 314 and the magnet fixed copper disc 321 is provided with the mounting lock block 315, so that the motor drives the magnet fixed copper disc 321 to rotate through the synchronous wheel 312.

[0009] Further, the motor is provided with a synchronous wheel rotation protection cover 313 on one side, the synchronous wheel rotation protection cover 313 is sleeved outside the synchronous wheel 312, which is used for dust prevention.

[0010] Further, the magnet fixed copper disc 321 is provided with a magnet counterweight 324 outwardly protruding at the edge below, the center of the magnet fixed copper disc 321 is the rotation center, which is used for preventing the magnet 323 from swinging during rotation, so as to ensure that the center of gravity of the rotating magnet assembly 32 remains on the rotation center.

[0011] Further, the magnet mounting assembly 322 comprises a middle mounting plate 3221 and an outer mounting plate 3222, the outer mounting plate 3222 is a hollow ring, the shape of the plurality of magnets 323 corresponds to the shape of the magnetic field magnetic induction loop, one end of the magnet 323 is connected with the middle mounting plate 3221, and the other end is connected with the outer mounting plate 3222, so as to form a magnetic field loop.

[0012] Further, one side of the upper cover plate 22 is provided with a liquid cooling assembly 40, the liquid cooling assembly 40 comprises a liquid cooling connecting block and a liquid cooling pipe, the liquid cooling pipe comprises a water inlet liquid cooling pipe and a water outlet liquid cooling pipe, the water inlet liquid cooling pipe passes the water into the upper cover plate 22 through the water inlet end of the liquid cooling connecting block, and then the water is discharged from the water outlet liquid cooling pipe through the water outlet end of the liquid cooling connecting block, so as to cool the magnet 323.

[0013] Further, the upper cover plate 22 is further provided with a controller 33 above, which is used for controlling the motor speed.

[0014] Further, the upper cover plate 22 is further provided with a sensor assembly, which is used for detecting whether there is a magnetic field around.

[0015] Further, the target material mounting plate 21 is sleeved with an insulating protection cover 50 above, which is used for protecting the internal devices of the target material opening and closing mechanism 20.

[0016] The utility model discloses a sputter coating machine's magnet rotating mechanism, including process cavity 10, the process cavity 10 top is equipped with target material opening and closing mechanism 20, magnet rotating mechanism 30 is located in target material opening and closing mechanism 20, target material opening and closing mechanism 20 includes target material mounting panel 21, target material mounting panel 21 is hollow annular structure, target material mounting panel 21's bottom edge is connected target material 23, target material mounting panel 21 top is equipped with upper cover plate 22, upper cover plate 22, target material mounting panel 21, target material 23 enclose and form mounting chamber, magnet rotating mechanism 30 passes through upper cover plate 22 and sets up, magnet rotating mechanism 30 includes power assembly 31, rotating magnet assembly 32, power assembly 31 is placed in the upper cover plate 22 top, rotating magnet assembly 32 is placed in the mounting chamber, rotating magnet assembly 32 includes magnet fixed copper dish 321, magnet mounting assembly 322, a plurality of magnets 323, a plurality of magnets 323 are fixed on magnet mounting assembly 322 top, a plurality of magnets 323 are connected with power assembly 31 through magnet fixed copper dish 321, rotate rotating magnet assembly 32 through power assembly 31, to make a plurality of magnets 323 produce the magnetic field rotation, guarantee the uniformity and direction consistency of magnetic field, form a relatively uniform space magnetic field, to make the ion distribution in process cavity 10 more uniform, and the coating is more uniform. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is the installation position structure diagram of the magnet rotating mechanism of the sputter coating machine of the utility model.

[0018] Figure 2 It is the overall connection diagram of the magnet rotating mechanism of the sputter coating machine of the utility model.

[0019] Figure 3 It is the overall structure diagram of the magnet rotating mechanism of the sputter coating machine of the utility model.

[0020] Figure 4 It is the rotating magnet assembly structure diagram of the magnet rotating mechanism of the sputter coating machine of the utility model.

[0021] Figure 5 It is the rotating magnet assembly plan view of the magnet rotating mechanism of the sputter coating machine of the utility model.

[0022] Figure 6 It is the section view of the magnet rotating mechanism of the sputter coating machine of the utility model.

[0023] MAIN ELEMENT SYMBOL EXPLANATION

[0024] Process cavity 10, target material opening and closing mechanism 20, target material mounting plate 21, upper cover plate 22, target material 23, magnet rotating mechanism 30, power assembly 31, synchronous wheel 312, synchronous wheel rotating protection cover 313, magnetic fluid 314, mounting lock block 315, belt 316, rotating magnet assembly 32, magnet fixed copper disc 321, magnet mounting assembly 322, middle mounting plate 3221, outer mounting plate 3222, magnet 323, magnet counterweight 324, controller 33, liquid cooling assembly 40, insulation protection cover 50.

[0025] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. Specific embodiments Embodiments

[0026] As shown in the installation position structure diagram of the magnet rotating mechanism of the sputter coating machine of the present application; as shown in the overall connection structure diagram of the magnet rotating mechanism of the sputter coating machine of the present application; as shown in the overall structure diagram of the magnet rotating mechanism of the sputter coating machine of the present application; as shown in the rotating magnet assembly structure diagram of the magnet rotating mechanism of the sputter coating machine of the present application; as shown in the rotating magnet assembly plan view of the magnet rotating mechanism of the sputter coating machine of the present application; as shown in the cross-sectional view of the magnet rotating mechanism of the sputter coating machine of the present application. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6

[0027] ​​​​​​A magnet rotating mechanism of a sputtering coating machine includes a process chamber 10, a target opening and closing mechanism 20 is provided above the process chamber 10, and a magnet rotating mechanism 30 is provided in the target opening and closing mechanism 20, characterized in that: the target opening and closing mechanism 20 includes a target mounting plate 21, the target mounting plate 21 is a hollow annular structure, the bottom edge of the target mounting plate 21 is connected to the target 23, an upper cover plate 22 is provided above the target mounting plate 21, the upper cover plate 22, the target mounting plate 21, and the target 23 surround and form a mounting chamber, the magnet rotating mechanism 30 is arranged through the upper cover plate 22, the magnet rotating mechanism 30 includes a power component 31 and a rotating magnet component 32, The power component 31 is placed above the upper cover plate 22, and the rotating magnet component 32 is placed in the installation chamber. The rotating magnet component 32 includes a magnet fixing copper disk 321, a magnet installation component 322, and multiple magnets 323. The multiple magnets 323 are fixed above the magnet installation component 322. The multiple magnets 323 are connected to the power component 31 through the magnet fixing copper disk 321. The rotating magnet component 32 is driven to rotate by the power component 31, so that the magnetic field generated by the multiple magnets 323 rotates, ensuring the uniformity and direction consistency of the magnetic field, and forming a relatively uniform spatial magnetic field, so that the ion distribution in the process chamber 10 is more uniform and the coating is more uniform.

[0028] The power assembly 31 includes a motor, a synchronous pulley 312, and a belt 316. The motor is arranged on the upper cover 22. One side of the motor is connected to the synchronous pulley 312 through a belt 316. The lower side of the synchronous pulley 312 is connected to the magnet fixed copper disk 321 through a magnetic fluid 314. A mounting lock block 315 is provided at the connection between the magnetic fluid 314 and the magnet fixed copper disk 321, so that the motor drives the magnet fixed copper disk 321 to rotate through the synchronous pulley 312.

[0029] A synchronous wheel rotation protective cover 313 is provided on one side of the motor. The synchronous wheel rotation protective cover 313 is sleeved on the outside of the synchronous wheel 312 for dust prevention.

[0030] A magnet counterweight 324 is protruding outward from the bottom of the magnet fixing copper disk 321 near the edge. The center of the circle of the magnet fixing copper disk 321 is the center of rotation, which is used to prevent the magnet 323 from swinging during rotation, thereby ensuring that the center of gravity of the rotating magnet assembly 32 remains on the center of rotation.

[0031] The magnet mounting assembly 322 includes a middle mounting plate 3221 and an outer mounting plate 3222. The outer mounting plate 3222 is a hollow ring. The shape of the multiple magnets 323 corresponds to the shape of the magnetic field magnetic flux loop. One end of the magnet 323 is connected to the middle mounting plate 3221, and the other end is connected to the outer mounting plate 3222, so as to form a magnetic field loop.

[0032] The upper cover plate 22 is provided with a liquid cooling assembly 40 on one side, the liquid cooling assembly 40 comprises a liquid cooling connecting block and a liquid cooling pipe, the liquid cooling pipe comprises a water inlet liquid cooling pipe and a water outlet liquid cooling pipe, water is passed into the upper cover plate 22 through the water inlet end of the liquid cooling connecting block, and then the water is discharged from the water outlet liquid cooling pipe through the water outlet end of the liquid cooling connecting block, so that the magnet 323 is cooled.

[0033] The upper cover plate 22 is further provided with a controller 33 above, which is used for controlling the motor speed.

[0034] The upper cover plate 22 is further provided with a sensor assembly, which is used for detecting whether there is a magnetic field around.

[0035] The target material mounting plate 21 is provided with an insulating protective cover 50 above, which is used for protecting the internal device of the target material opening and closing mechanism 20.

[0036] The utility model discloses a kind of magnet rotating mechanisms of sputter coating machine, including process cavity 10, process cavity 10 is provided with target material opening and closing mechanism 20 above, magnet rotating mechanism 30 is located in target material opening and closing mechanism 20, the target material opening and closing mechanism 20 includes target material mounting plate 21, the target material mounting plate 21 is hollow annular structure, the bottom edge of the target material mounting plate 21 is connected target material 23, the upper cover plate 22 is provided with on the target material mounting plate 21, the upper cover plate 22, target material mounting plate 21, target material 23 are surrounded to form installation chamber, the magnet rotating mechanism 30 is set through the upper cover plate 22, the magnet rotating mechanism 30 includes power assembly 31, rotating magnet assembly 32, the power assembly 31 is placed on the upper cover plate 22, rotating magnet assembly 32 is placed in the installation chamber, the rotating magnet assembly 32 includes magnet fixed copper disc 321, magnet mounting assembly 322, multiple magnets 323, the multiple magnets 323 are fixed on magnet mounting assembly 322, and the multiple magnets 323 are connected with the power assembly 31 by magnet fixed copper disc 321, rotate rotating magnet assembly 32 by power assembly 31, so that the magnetic field generated by the multiple magnets 323 rotates, guarantee the uniformity and direction consistency of magnetic field, form a relatively uniform space magnetic field, so that ion distribution in process cavity 10 is more uniform, and coating is more uniform.

[0037] The above embodiments only express several implementation manners of the utility model, and the description is more specific and detailed, but it cannot be understood as the limitation of the utility model patent scope. It should be pointed out that, for ordinary skilled person in the art, without departing from the concept of the utility model, a plurality of deformations and improvements can be made, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be according to the appended claims.

Claims

1. A magnet rotating mechanism of a sputtering coating machine, comprising a process cavity (10), a target opening and closing mechanism (20) is arranged above the process cavity (10), and a magnet rotating mechanism (30) is arranged in the target opening and closing mechanism (20), characterized in that: The target opening and closing mechanism (20) includes a target mounting plate (21), which is a hollow annular structure, the bottom edge of the target mounting plate (21) is connected with a target (23), an upper cover plate (22) is arranged above the target mounting plate (21), the upper cover plate (22), the target mounting plate (21) and the target (23) form an installation cavity, a magnet rotating mechanism (30) is arranged through the upper cover plate (22), the magnet rotating mechanism (30) includes a power assembly (31) and a rotating magnet assembly (32), the power assembly (31) is arranged above the upper cover plate (22), the rotating magnet assembly (32) is arranged in the installation cavity, the rotating magnet assembly (32) includes a magnet fixed copper disc (321), a magnet mounting assembly (322) and a plurality of magnets (323), the plurality of magnets (323) are fixed above the magnet mounting assembly (322), the plurality of magnets (323) are connected with the power assembly (31) through the magnet fixed copper disc (321), the rotating magnet assembly (32) is driven to rotate by the power assembly (31), so that the magnetic field generated by the plurality of magnets (323) rotates to form a relatively uniform spatial magnetic field.

2. The magnet rotating mechanism of a sputtering film deposition machine according to claim 1, wherein: The power assembly (31) includes a motor, a synchronous wheel (312) and a belt (316), the motor is arranged on the upper cover plate (22), the motor is connected with the synchronous wheel (312) through the belt (316) on one side, the synchronous wheel (312) is connected with the magnet fixed copper disc (321) through a magnetic fluid (314) below, an installation lock block (315) is arranged at the connection position of the magnetic fluid (314) and the magnet fixed copper disc (321), so that the motor drives the magnet fixed copper disc (321) to rotate through the synchronous wheel (312).

3. The magnet rotating mechanism of the sputtering coating machine according to claim 2, wherein: A synchronous wheel rotation protection cover (313) is arranged on one side of the motor, the synchronous wheel rotation protection cover (313) is arranged outside the synchronous wheel (312) to prevent dust.

4. The magnet rotating mechanism of a sputtering film deposition machine according to claim 1, wherein: A magnet counterweight (324) is arranged outwardly at the edge of the magnet fixed copper disc (321), the center of the magnet fixed copper disc (321) is the rotation center, which is used for preventing the magnet (323) from swinging during rotation, so as to ensure that the center of gravity of the rotating magnet assembly (32) is kept on the rotation center.

5. The magnet rotating mechanism of a sputtering film deposition machine as claimed in claim 1, wherein: The magnet mounting assembly (322) includes a middle mounting plate (3221) and an outer mounting plate (3222), the outer mounting plate (3222) is a hollow annular structure, the shape of the plurality of magnets (323) corresponds to the shape of the magnetic field magnetic induction loop, one end of the magnet (323) is connected with the middle mounting plate (3221), and the other end is connected with the outer mounting plate (3222), so that the magnetic field loop is formed.

6. The magnet rotating mechanism of a sputtering film deposition machine according to claim 1, wherein: A liquid cooling assembly (40) is provided on one side of the upper cover plate (22). The liquid cooling assembly (40) includes a liquid cooling connection block and a liquid cooling pipe. The liquid cooling pipe includes a water inlet liquid cooling pipe and a water outlet liquid cooling pipe. The water inlet liquid cooling pipe passes water into the upper cover plate (22) through the water inlet end of the liquid cooling connection block, and then discharges water from the water outlet liquid cooling pipe at the water outlet end of the liquid cooling connection block, thereby cooling the magnet (323).

7. The magnet rotating mechanism of a sputtering film deposition machine as claimed in claim 1, wherein: A controller (33) is also provided above the upper cover plate (22) for controlling the motor speed.

8. The magnet rotating mechanism of a sputtering film deposition machine as claimed in claim 1, wherein: The upper cover plate (22) is also provided with a sensor assembly for detecting whether there is a magnetic field in the surrounding area.

9. The magnet rotating mechanism of a sputtering film deposition machine as claimed in claim 1, wherein: An insulating protective cover (50) is sleeved above the target mounting plate (21) to protect the internal devices of the target opening and closing mechanism (20).

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