Glass-coated nano-copper electrode type thermistor

Abstract

The utility model relates to the technical field of resistors, and discloses a glass-coated nano-copper electrode type thermistor which comprises a protective sleeve, a resistor body is fixedly connected in the protective sleeve, a thermistor chip is arranged in the resistor body, a high-temperature sintering electrode is fixedly connected to the outer wall of the thermistor chip, and the high-temperature sintering electrode is fixedly connected to the outer wall of the thermistor chip. The lower surface of the high-temperature sintering electrode is fixedly connected with a copper sheet, the inner wall of the protective layer is fixedly connected with a ceramic solidified body, the ceramic solidified body is fixedly connected with the outer wall of the copper sheet, the lower surface of the thermistor chip is provided with a glass filling layer, and a heat dissipation assembly is arranged in the resistor body. And the heat dissipation assembly is used for transferring heat inside the resistor to the outside. According to the utility model, the working temperature of the thermistor is effectively reduced, the influence of overheating on the accuracy and stability of the resistance characteristic is reduced, the service life of the thermistor is further prolonged, and the stability of the connection between the pins and the external circuit is enhanced at the same time.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of resistance, especially to a glass cladding nanometer copper electrode type thermistor. BACKGROUND

[0002] In the field of modern electronic technology, as an important temperature-sensitive component, thermistors are widely used in various electronic devices and systems for temperature measurement, temperature control, and over-temperature protection of circuits. Among them, glass cladding nanometer copper electrode type thermistors have certain advantages in certain specific application scenarios due to their unique structure and performance characteristics.

[0003] However, as electronic devices continue to develop towards miniaturization and high power density, the problem of heat generated by thermistors during operation is increasingly prominent.

[0004] Although traditional glass cladding nanometer copper electrode type thermistors have certain performance in electrical properties and stability, poor heat dissipation performance is one of the most prominent problems. From the material characteristics, although glass as a cladding material has good insulation, chemical stability, and protection effect on the internal nanometer copper electrode and thermistor element, its thermal conductivity coefficient is relatively low, which means that the heat conduction rate in the glass layer is relatively slow, which is not conducive to the rapid dissipation of heat from the inside of the thermistor to the external environment, thereby affecting the accuracy and stability of its resistance characteristics, leading to the shortening of the service life of the thermistor, increasing the maintenance cost of electronic devices, and reducing the reliability and service life of the device. SUMMARY

[0005] To make up for the above shortcomings, the utility model provides a glass cladding nanometer copper electrode type thermistor, aiming to improve the poor heat dissipation performance of traditional glass cladding nanometer copper electrode type thermistors, thereby not conducive to the rapid dissipation of heat from the inside of the thermistor to the external environment, and thereby leading to the shortening of the service life of the thermistor.

[0006] To achieve the above purpose, the utility model provides the following technical scheme: a glass cladding nanometer copper electrode type thermistor, comprising a protective sleeve, the protective sleeve is internally fixedly connected with a resistance body, the resistance body is internally provided with a thermistor chip, the thermistor chip is fixedly connected with a high-temperature sintered electrode on the outer wall, the lower surface of the high-temperature sintered electrode is fixedly connected with a copper sheet, the resistance body is internally provided with a protective layer, the inner wall of the protective layer is fixedly connected with a ceramic solidified body, the ceramic solidified body is fixedly connected with the outer wall of the copper sheet, the lower surface of the thermistor chip is provided with a glass filling layer, the resistance body is internally provided with a heat dissipation assembly, the heat dissipation assembly is used for transferring the heat inside the resistance to the outside.

[0007] Further, the heat dissipation assembly comprises a heat dissipation groove, the heat dissipation groove is arranged in the resistance body, and the heat dissipation hole one is arranged in the inner wall of the protective sleeve.

[0008] Further, the outer wall of the protective sleeve is fixedly connected with a welding head, the lower surface of the welding head is fixedly connected with a pin one, and the lower surface of the welding head is fixedly connected with a pin two.

[0009] Further, the pin one and the pin two are provided with bending parts, so that the thermistor can be better fixed.

[0010] Further, the outer wall of the pin one and the pin two is fixedly connected with a connecting sleeve.

[0011] Further, the connecting sleeve is made of conductive rubber, the conductive rubber has the flexibility and elasticity of rubber, can be tightly attached around the lead, and plays a sealing and buffering role.

[0012] Further, the protective layer is filled with glass glaze, the glass glaze has excellent insulation performance, and can effectively prevent the chip from being short-circuited with the external circuit.

[0013] Further, the resistance body is provided with a heat dissipation hole two.

[0014] The utility model has the following beneficial effects:

[0015] 1、 in the utility model, through the setting of heat dissipation groove, heat dissipation hole one and heat dissipation hole two, heat dissipation groove can gather heat and transmit to the inner wall of protective sleeve, and through the setting of heat dissipation hole one, protective sleeve can exchange heat with the outside air, through the setting of heat dissipation hole two, the heat in the deep part of thermistor can be directly dissipated, through the common action of two heat dissipation holes, the working temperature of thermistor is effectively reduced, the influence of overheating on the accuracy and stability of resistance characteristics is reduced, and the service life of thermistor is prolonged, and the equipment reliability is improved.

[0016] 2、 in the utility model, through the setting of ceramic solidified body, copper sheet, high-temperature sintering electrode and thermistor chip can be effectively fixedly connected, the stability of the internal structure of thermistor and the reliability of electrical connection are guaranteed, through the setting of pin bending part, thermistor can be better fixed, and through the connecting sleeve made of conductive rubber on the outer side of pin, the lead is tightly attached by the flexibility and elasticity, plays a sealing and buffering role, prevents the influence of external factors on pin connection, and enhances the stability of pin and external circuit connection. DRAWINGS

[0017] Figure 1 A three-dimensional structure schematic view of a glass-coated nano-copper electrode type thermistor is provided.

[0018] Figure 2 A glass-coated nano-copper electrode type thermistor's heat dissipation groove part structure schematic view is provided in the utility model.

[0019] Figure 3 A glass-coated nano-copper electrode type thermistor's copper sheet part structure schematic view is provided in the utility model.

[0020] Legend:

[0021] 1, protective sleeve; 2, heat dissipation hole one; 3, resistance body; 4, heat dissipation groove; 5, heat dissipation hole two; 6, thermistor chip; 7, high-temperature sintering electrode; 8, copper sheet; 9, protective layer; 10, ceramic solidified body; 11, glass filling layer; 12, welding head; 13, pin one; 14, pin two; 15, connecting sleeve. Specific implementation

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0023] Reference Figure 1 - Figure 3The utility model provides an embodiment: a kind of glass cladding nanometer copper electrode type thermistor, including protective sleeve 1, resistance body 3 is fixedly connected in protective sleeve 1 inside, resistance body 3 inside is provided with thermistor chip 6, high temperature sintering electrode 7 is fixedly connected to the outer wall of thermistor chip 6, copper sheet 8 is fixedly connected to the lower surface of high temperature sintering electrode 7, resistance body 3 inside is provided with protective layer 9, ceramic solidified body 10 is fixedly connected to the inner wall of protective layer 9, ceramic solidified body 10 is fixedly connected with the outer wall of copper sheet 8, copper sheet 8, high temperature sintering electrode 7 and thermistor chip 6 can be effectively fixedly connected by ceramic solidified body 10, effectively avoid that three are disconnected due to external factor, thermistor chip 6 lower surface is provided with glass filling layer 11, glass glaze protective layer 9 has excellent insulating property, can effectively prevent thermistor chip 6 and external circuit short circuit and other problems, resistance body 3 inside is provided with heat dissipation component, heat dissipation component is used to transfer the heat in resistance to outside, heat dissipation component includes heat dissipation groove 4, heat dissipation groove 4 is set in resistance body 3 inside, protective sleeve 1 inside is provided with heat dissipation hole one 2, when heat is generated in thermistor, a part of heat will be transferred to resistance body 3 surface first, by the setting of heat dissipation groove 4, heat will be further gathered in heat dissipation groove 4, most of heat can be transferred to protective sleeve 1 by heat dissipation groove 4, due to the existence of heat dissipation hole one 2, the heat on protective sleeve 1 can be exchanged with outside air through these holes, external cold air can enter protective sleeve 1 inside by heat dissipation hole one 2, and heat exchange is carried out with the heat on the surface of protective sleeve 1, so that heat is taken away, thereby reducing the temperature of protective sleeve 1, and the temperature of thermistor is indirectly reduced, simultaneously by the setting of heat dissipation hole two 5, it can more directly emit the heat generated when thermistor works, it and heat dissipation hole one 2 mutually cooperate, form a more perfect heat dissipation channel system, heat dissipation hole two 5 can quickly conduct the heat in the deep place of thermistor to outside, and heat dissipation hole one 2 is responsible for emitting the heat near protective sleeve 1, the heat in thermistor can be more comprehensive, more efficient to emit to outside environment by the joint action of the two.

[0024] Refer to Figure 1 - Figure 3The outer wall of the protective sleeve 1 is fixedly connected with a welding head 12, the lower surface of the welding head 12 is fixedly connected with a pin 13, the lower surface of the welding head 12 is fixedly connected with a pin 14, and the pin 13 and the pin 14 are provided with a bending part. It is worth mentioning here that the surface bending part of the pin 13 and the pin 14 plays an important role because in actual application, such a bending part can change the shape of the pin, form a specific cooperation relationship with the surrounding installation structure, etc., so that the thermistor can be better fixed, and the position of the thermistor in the corresponding circuit environment or use scene is more stable and not prone to displacement due to external shaking, pulling and other conditions. The outer wall of the pin 13 and the pin 14 is fixedly connected with a connecting sleeve 15, and the connecting sleeve 15 is made of conductive rubber. The reason for using conductive rubber to make the connecting sleeve 15 is that conductive rubber has unique performance advantages. The conductive rubber has the flexibility and elasticity of rubber. Such flexibility enables the connecting sleeve 15 to deform to a certain extent when facing different installation angles, lead directions, etc., and better adapt to various complex working conditions. At the same time, its elasticity ensures that the connecting sleeve 15 can always maintain a certain degree of close fitting after being attached around the lead, and will not easily loosen. Based on these characteristics, the connecting sleeve 15 can be closely attached around the lead, thereby playing a sealing and buffering role. For example, when external impact or vibration is transmitted, the connecting sleeve 15 can rely on its elasticity to buffer the impact, avoiding direct impact on the lead and causing damage to the lead, thereby ensuring the stability and electrical performance of the connection.

[0025] Working principle: when heat is generated inside the thermistor, part of the heat will first be transmitted to the surface of the resistance body 3. Through the arrangement of the heat dissipation groove 4, the heat will be further collected in the heat dissipation groove 4. Most of the heat can be transmitted to the protective sleeve 1 through the heat dissipation groove 4. Due to the presence of the heat dissipation hole 2, the heat on the protective sleeve 1 can be exchanged with the outside air through these holes. The cold air outside can enter the inside of the protective sleeve 1 through the heat dissipation hole 2, exchange heat with the surface of the protective sleeve 1, and make the heat be taken away, thereby reducing the temperature of the protective sleeve 1, and indirectly reducing the temperature of the thermistor. At the same time, through the arrangement of the heat dissipation hole 2, it can more directly dissipate the heat generated by the thermistor during work. It cooperates with the heat dissipation hole 2 to form a more perfect heat dissipation channel system. The heat dissipation hole 2 can quickly conduct the heat in the deep part of the thermistor to the outside, and the heat dissipation hole 2 is responsible for dissipating the heat near the protective sleeve 1. The two work together to make the heat inside the thermistor more comprehensively and efficiently dissipate to the outside environment;

[0026] When the thermistor is in use, the glass glaze protection layer 9 in the thermistor has excellent insulation performance, which can effectively prevent the thermistor chip 6 from short circuiting with external circuit and other problems, thereby prolonging the service life, the copper sheet 8, the high-temperature sintering electrode 7 and the thermistor chip 6 can be effectively fixed and connected through the ceramic solidified body 10, which can effectively avoid the disconnection of the three due to external factors, the thermistor can be better fixed through the setting of the surface bending parts of the pin one 13 and the pin two 14, and the connecting sleeve 15 arranged outside the pin can be made of conductive rubber, the connecting sleeve 15 can be tightly attached around the lead wire through the flexibility and elasticity of the conductive rubber, thereby playing the role of sealing and buffering.

[0027] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it still can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A glass-coated nano-copper electrode type thermistor comprising a protective sheath (1), characterized in that: The protection cover (1) is internally fixedly connected with a resistance body (3), the resistance body (3) is internally provided with a thermistor chip (6), the thermistor chip (6) is fixedly connected with a high-temperature sintering electrode (7) on the outer wall, the lower surface of the high-temperature sintering electrode (7) is fixedly connected with a copper sheet (8), the resistance body (3) is internally provided with a protective layer (9), the inner wall of the protective layer (9) is fixedly connected with a ceramic solidified body (10), the ceramic solidified body (10) is fixedly connected with the outer wall of the copper sheet (8), the lower surface of the thermistor chip (6) is provided with a glass filling layer (11), the resistance body (3) is internally provided with a heat dissipation assembly, and the heat dissipation assembly is used for transmitting heat inside the resistance to the outside.

2. The glass-coated nano-copper electrode type thermistor according to claim 1, characterized in that: The heat dissipation assembly comprises a heat dissipation groove (4), the heat dissipation groove (4) is opened in the resistance body (3), and the protection cover (1) is internally provided with a heat dissipation hole (2).

3. The glass-coated nano-copper electrode type thermistor according to claim 1, characterized in that: The outer wall of the protection cover (1) is fixedly connected with a welding head (12), the lower surface of the welding head (12) is fixedly connected with a pin (13), and the lower surface of the welding head (12) is fixedly connected with a pin (14).

4. The glass-coated nano-copper electrode type thermistor according to claim 3, characterized in that: The pin (13) and the pin (14) are provided with a bending portion, so that the thermistor can be better fixed.

5. The glass-coated nano-copper electrode type thermistor according to claim 4, characterized in that: The outer wall of the pin (13) and the pin (14) is fixedly connected with a connecting sleeve (15).

6. The glass-coated nano-copper electrode type thermistor according to claim 5, characterized in that: The connecting sleeve (15) is made of conductive rubber, the conductive rubber has the flexibility and elasticity of rubber, can be closely attached around the lead wire, and plays the role of sealing and buffering.

7. The glass-coated nano-copper electrode type thermistor according to claim 1, characterized in that: The protective layer (9) is filled with glass glaze, the glass glaze has excellent insulation performance, and can effectively prevent the chip from short-circuiting with the external circuit.

8. The glass-coated nano-copper electrode type thermistor according to claim 1, characterized in that: The resistance body (3) is internally provided with a heat dissipation hole (5).

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