Head support device

Abstract

The utility model provides a head supporting device which comprises a supporting body and a ventilation mechanism. The supporting body comprises a supporting face, the supporting face comprises a front area for supporting the head and a rear area far away from the head, the front area is provided with a first air outlet, the rear area is provided with a first air inlet, the ventilation mechanism comprises a ventilation piece and a first air guide mechanism, the ventilation piece is located in the supporting body, and the first air guide mechanism is located in the supporting body. The first air guide mechanism comprises a first air suction face and a first air outlet face, the first air suction face is arranged towards the first air inlet, the first air outlet face is arranged towards the ventilation piece, and the ventilation piece comprises a first ventilation hole at least communicated with the first air outlet part. By means of the technical scheme, the problems that heat accumulates and moisture is not prone to being dissipated in the using process of a traditional supporting device are solved, comfort and adaptability to using scenes are enhanced, and the practical effect is remarkable.

Description

Technical Field

[0001] This utility model relates to the field of sleep products, specifically to a head support device. Background Technology

[0002] With improved living standards and increased emphasis on sleep quality, pillow designs on the market are becoming increasingly diverse, especially those designed to improve sleep comfort. During sleep, head temperature regulation significantly impacts comfort, particularly in summer or high-temperature environments. Heat generated by the head during sleep cannot dissipate quickly enough, leading to feelings of heat and affecting sleep quality. To address this issue, many pillow brands have launched products with cooling effects, commonly utilizing gel coatings and ice silk fabric covers.

[0003] Gel materials have good thermal conductivity and cooling effects, making them widely used in pillow surfaces as a means of rapid cooling. By coating the pillow surface with a layer of gel, a cooling effect is felt instantly upon contact. The gel coating absorbs heat from the head, reducing heat accumulation and thus alleviating the feeling of heat. On the other hand, ice silk covers, due to their smoothness, breathability, and cooling properties, are also commonly used to alleviate the feeling of heat during sleep. Ice silk covers utilize a special fiber structure that enhances airflow, lowers the surface temperature of the pillow, and provides a comfortable feel.

[0004] However, while these technologies can provide a cooling sensation when first put on the pillow, their effect is often short-lived. This is because, although the gel coating can initially absorb some heat, its cooling effect gradually diminishes over time as the gel's heat absorption capacity reaches saturation. While the ice silk cover can maintain a cooling effect on the pillow surface to some extent, this effect is dependent on the ambient temperature and airflow. In poorly ventilated or high-temperature environments, the cooling effect of the ice silk cover is significantly reduced. Therefore, after lying down for a long time, users may still feel the pillow getting warm, as the brain cannot effectively dissipate heat, leading to a decline in overall sleep quality. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a head support device with adjustable ventilation.

[0006] To solve the above-mentioned technical problems, this utility model provides a head support device, including a support body and a ventilation mechanism; the support body includes a support surface, the support surface includes a front area supporting the head and a rear area away from the head, the front area is provided with a first air outlet, and the rear area is provided with a first air inlet, the ventilation mechanism includes a ventilation component and a first air guide mechanism, the ventilation component is located in the support body, the first air guide mechanism includes a first air intake surface and a first air outlet surface, the first air intake surface is disposed facing the first air inlet, the first air outlet surface is disposed facing the ventilation component, and the ventilation component includes a first ventilation hole that communicates with at least a portion of the first air outlet.

[0007] In a preferred embodiment, the ventilation component includes a second ventilation hole and a ventilation cavity, the first air outlet surface is disposed facing the second ventilation hole, and the second ventilation hole communicates with the first ventilation hole through the ventilation cavity.

[0008] In a preferred embodiment, the second ventilation hole and the first ventilation hole are disposed on the same plane.

[0009] In a preferred embodiment, the second ventilation hole is located on the side of the ventilation component, and the first ventilation hole is located on the upper surface of the ventilation component.

[0010] In a preferred embodiment, the ventilation mechanism further includes a temperature control mechanism and a first air guide channel, the first air guide channel including a channel between the first air inlet and the first air outlet, the temperature control mechanism being used to adjust the temperature of the first air guide channel.

[0011] In a preferred embodiment, the ventilation component is provided with a clearance hole, which corresponds to at least a portion of the temperature control mechanism.

[0012] In a preferred embodiment, the temperature control mechanism includes an active temperature regulating element and a first passive temperature conducting element, the active temperature regulating element being connected to the first passive temperature conducting element, the first passive temperature conducting element being disposed within the ventilation component and at least partially corresponding to the clearance hole.

[0013] In a preferred embodiment, the first passive temperature-conducting element includes a transverse base and a longitudinal base, the longitudinal base being connected to the transverse base and extending toward the rear side of the support body, and the first air guide mechanism being disposed adjacent to the transverse base on the side near the longitudinal base.

[0014] In a preferred embodiment, there is a gap between the longitudinal base and the rear side of the support body, the gap allowing air from the first air guide mechanism to pass through.

[0015] In a preferred embodiment, the first passive thermal conductive element is T-shaped or L-shaped.

[0016] In a preferred embodiment, the active temperature regulating element is a semiconductor heating element, and the first passive temperature conducting element is connected to a first temperature control side of the semiconductor heating element; wherein the first temperature control side is a cooling side or a heating side.

[0017] In a preferred embodiment, the temperature control mechanism includes a second passive temperature conducting element connected to the second temperature control side of the semiconductor heating element, and the ventilation mechanism further includes a second air guide channel and a second air guide mechanism. The second passive temperature conducting element is at least partially located within the second air guide channel, and the second air guide mechanism is disposed within the second air guide channel. The second air guide channel includes a second air inlet and a second air outlet, and the second air outlet is located on the rear side of the support body.

[0018] In a preferred embodiment, the first air guide mechanism includes a plurality of first air intake fans, which are arranged side by side on one side of the transverse base near the longitudinal base.

[0019] In a preferred embodiment, it further includes at least one of the following temperature detection mechanisms:

[0020] A first temperature sensor is installed on the support body to detect the ambient temperature;

[0021] A second temperature sensor, disposed on the support surface, is used to detect the head temperature;

[0022] A third temperature sensor is placed near the first ventilation hole to detect the temperature near the third ventilation opening.

[0023] In a preferred embodiment, a control box is further included, which is detachably connected to the support body. The control box includes a temperature display module for receiving the temperature from the temperature detection mechanism.

[0024] Compared with the prior art, the technical solution of this utility model has the following beneficial effects:

[0025] The support body has a built-in ventilation system, including a first air duct and a first air guide mechanism, which allows air to circulate within the support body. The air outlet of the first air duct directs the air directly to the support surface. This design effectively removes heat from around the user's head, reducing stuffiness and improving overall comfort, especially in summer or high-temperature environments, significantly enhancing the user experience.

[0026] The temperature control mechanism can actively adjust the temperature within the first air duct, providing a suitable temperature according to the user's needs, whether for cooling or heating. This active temperature control function allows the device to adapt to different seasons and environments, such as providing a cooling sensation in summer and a moderate temperature in winter, thereby greatly improving the applicability and comfort of the head support device. Attached Figure Description

[0027] Figure 1 This is an exploded view of the head support device in the first embodiment of the present invention.

[0028] Figure 2 This is an exploded view of the temperature control mechanism in the first embodiment of this utility model;

[0029] Figures 3a-3b These are a top view and a cross-sectional view of the head support device in the first embodiment of this utility model, respectively;

[0030] Figure 4 This is a schematic diagram of the airflow direction when the first air guide mechanism draws air from the outside in the first embodiment of the present invention. At this time, the airflow flows from top to bottom.

[0031] Figure 5 This is a schematic diagram of the airflow direction when the first air guide mechanism draws air from the outside in the first embodiment of the present invention. At this time, the airflow flows along the ventilation cavity.

[0032] Figure 6 This is an exploded view of the temperature control mechanism in the second embodiment of this utility model;

[0033] Figure 7 This is a schematic diagram of the airflow direction when the first air guide mechanism draws air from the outside in the second embodiment of the present utility model. At this time, the airflow flows in from the first air inlet and flows out from the first air outlet.

[0034] Figure 8 This is a schematic diagram of the airflow direction when the first air guide mechanism draws air from the outside in the second embodiment of the present invention. At this time, the airflow flows along the ventilation cavity to connect the first air inlet and the first air outlet.

[0035] Figure 9 This is an exploded view of the head support device in the second embodiment of this utility model;

[0036] Figure 10 This is a three-dimensional schematic diagram of the temperature control mechanism in the third embodiment of this utility model;

[0037] Figure 11 This is a schematic diagram of the airflow direction when the first air guide mechanism draws air from the outside in the third embodiment of this utility model. At this time, the airflow flows into the ventilation cavity.

[0038] Figure 12This is a schematic diagram of the airflow direction when the first air guide mechanism draws air from the outside in the third embodiment of this utility model. At this time, the airflow flows from the ventilation cavity to the first ventilation hole.

[0039] Figure 13 This is an exploded view of the head support device in the third embodiment of this utility model. Detailed Implementation

[0040] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0041] First Embodiment

[0042] See Figure 1-Figure 5 This embodiment provides a head support device on which a user can rest while sleeping. The head support device includes a support body 1 and a ventilation mechanism. The support body 1 has a shape that is higher at the front and back and lower in the middle. The front of the support body 1 is used to support the user's neck, and the middle part of the support body 1 is used to support the user's head. The support body 1 is made wholly or partially of a resilient material such as memory foam, which will not be described in detail here.

[0043] The support body 1 includes an upward-facing support surface 11 for supporting the user's head. In this embodiment, the support surface 11 includes a front area 111 for supporting the head and a rear area 112 near the front area. The front area 111 is provided with a first air outlet 211, and the rear area 112 is provided with a first air inlet 215.

[0044] The ventilation mechanism includes a ventilation component 26 and a first air guide mechanism 22. The ventilation component 26 is located within the support body 1. The first air guide mechanism 22 includes a first suction surface 221 and a first air outlet surface 222. The first air guide mechanism 22 guides airflow from the first suction surface 221 into the air and from the first air outlet surface 222 outwards. The first suction surface 221 faces the first air inlet 215, and the first air outlet surface 222 faces the ventilation component 26. The ventilation component 26 includes a first ventilation hole 261 that communicates at least partially with the first air outlet 211.

[0045] The ventilation component 26 further includes a second ventilation hole 262 and a ventilation cavity 264. The first air outlet surface 222 is disposed facing the second ventilation hole 262, and the second ventilation hole 262 communicates with the first ventilation hole 261 through the ventilation cavity 264. In this embodiment, the second ventilation hole 262 and the first ventilation hole 261 are disposed on the same plane.

[0046] The ventilation mechanism includes a first air guide channel and a first air guide mechanism 22. The first air guide channel is formed within the support body 1 and the ventilation component 26. The first air guide channel includes a first air outlet 211 and a first air inlet 215.

[0047] The first air guiding mechanism 22 is disposed within the first air guiding channel. The first air guiding mechanism 22 guides airflow sequentially through the first air inlet 215, the first suction surface 221, the first air outlet 222, the second ventilation hole 262, the ventilation cavity 264, and the first ventilation opening 261, and exits from the first air outlet 211. This airflow can cool the user's head. In this embodiment, the first air guiding channel is defined by the path of airflow between the first air inlet 215, the first suction surface 221, the first air outlet 222, the second ventilation hole 262, the ventilation cavity 264, the first ventilation opening 261, and the first air outlet 211.

[0048] In this embodiment, the ventilation mechanism further includes a temperature control mechanism 23, which is used to adjust the temperature of the first air guide channel. After the temperature of the first air guide channel decreases, the temperature of the airflow flowing out of the first air guide channel also decreases accordingly. Since the temperature control mechanism 23 cools the first air guide channel, the temperature of the blown airflow is more uniform and controllable. In some simpler alternatives, the temperature control mechanism 23 can also heat the first air guide channel. Therefore, the temperature control mechanism 23 is a cooling mechanism or a heating mechanism. In this embodiment, the ventilation component 26 is provided with a clearance hole 263, which corresponds to at least a portion of the temperature control mechanism 23.

[0049] The temperature control mechanism 23 includes an active temperature regulating element 231 and a first passive temperature conducting element 232. The active temperature regulating element 231 is connected to the first passive temperature conducting element 232. The first passive temperature conducting element 232 is at least partially located within the ventilation cavity 264 of the ventilation component 26, and at least partially corresponds to the clearance hole 263. The active temperature regulating element 231 is a semiconductor heating element, and the first passive temperature conducting element 232 is connected to the first temperature control side 2311 of the semiconductor heating element; wherein, the first temperature control side 2311 is a cooling side or a heating side. In this embodiment, the first temperature control side 2311 is a cooling side.

[0050] The temperature control mechanism 23 includes a second passive temperature conducting element 233, which is connected to the second temperature control side 2312 of the semiconductor heating and cooling sheet. The ventilation mechanism also includes a second air guide channel and a second air guide mechanism 25. The second passive temperature conducting element 233 is at least partially located in the second air guide channel, and the second air guide mechanism 25 is disposed in the second air guide channel. The second air guide channel includes a second air inlet 241 and a second air outlet, with the second air outlet located on the rear side of the support body 1.

[0051] At least a portion of the first passive heat-conducting element 232 is disposed within the first airflow channel. In this embodiment, the first passive heat-conducting element 232 includes a first base 2321 and a plurality of first heat dissipation fins 2322 disposed on the first base 2321. The first passive heat-conducting element 232 is entirely made of aluminum. In some simpler alternatives, a phase change element such as a heat pipe can also be disposed on the first passive heat-conducting element 232, which will not be elaborated here. The first passive heat-conducting element 232 can simply perform the function of passively conducting heat or cold. Those skilled in the art can make specific considerations based on factors such as cost and volume. In this embodiment, the plurality of first heat dissipation fins 2322 are disposed within the first airflow channel, and a channel is formed between two adjacent first heat dissipation fins 2322. Airflow can pass through the channels, carrying the cold air on the first heat dissipation fins 2322, thereby reducing the temperature of the airflow.

[0052] In this embodiment, the first base 2321 is T-shaped. The first base 2321 includes a transverse base 2323 and a longitudinal base 2324 connected to the middle of the transverse base 2323 and extending towards the rear of the support body 1. The first air guide mechanism 22 is disposed adjacent to the transverse base 2323 on the side near the longitudinal base 2324. A gap 2325 is provided between the longitudinal base 2324 and the rear of the support body 1, allowing airflow from the first air guide mechanism 22 to pass through. In this embodiment, the first base 2321 is T-shaped. The first heat dissipation fins 2322 are spaced apart along the left-right direction of the support body 1 on the lower side of the transverse base 2323. The upper side of the longitudinal base 2324 abuts against the cooling side of the semiconductor heat sink. Two openings are formed on both sides of the first base 2321, located on the rear side of the support body 1 and on the left and right sides of the support body 1. The support surface 11 is provided with two first air inlets 215 corresponding to the two empty spaces, and airflow can enter the first air guide channel from the first air inlets 215.

[0053] The first airflow channel extends downward from the first air inlet 215 of the support surface 11 to the second ventilation hole 262, then extends into the ventilation cavity 264, and finally extends upward from the first ventilation hole 261 to connect with the first air outlet 211. The first air outlet 211 corresponds to the front area of ​​the support surface 11, i.e., the user's neck area, and serves to dissipate heat. In this embodiment, the first heat dissipation fin 2322 is located inside the ventilation cavity 264, and the airflow passes through the first heat dissipation fin 2322 when passing through the ventilation cavity 264. The first passive temperature conducting element 232 extends and is disposed on the rear side of the support body 1 (i.e., the horizontal base 2323), and the airflow mechanism includes two first air intake fans.

[0054] The second passive temperature-conducting element 233 is connected to the heating side of the semiconductor heating element, and at least a portion of the second passive temperature-conducting element 233 is disposed within the second air duct. In this embodiment, the second passive temperature-conducting element 233 includes a second base 2331 and a plurality of second heat dissipation fins 2332 disposed on the second base 2331. The second passive temperature-conducting element 233 is entirely made of aluminum. In some simpler alternatives, a phase change element such as a heat pipe can also be disposed on the second passive temperature-conducting element 233, which will not be elaborated here. The second passive temperature-conducting element 233 can simply perform the function of passively conducting heat or cold.

[0055] The second airflow channel is defined by the path of airflow sequentially passing through the second air inlet 241, the second airflow guiding mechanism 25, the second passive heat-conducting element 233, and the second air outlet. In this embodiment, the second air inlet is located in the rear area, the second airflow channel is located entirely on the rear side of the support body 1, and the second airflow guiding mechanism 25 includes a second intake fan. Specifically, the semiconductor heat sink is sandwiched between the second base 2331 and the first base 2321, with the second base 2331 located at the top. Multiple second heat dissipation fins 2332 are arranged on the upper side of the second base 2331 extending along the front-rear direction of the support body 1. A channel is formed between adjacent second heat dissipation fins 2332. The second intake fan draws air from above, the airflow enters between the second heat dissipation fins 2332, and exhausts air from the rear. A baffle 2333 is provided in front of the second heat dissipation fins 2332 to prevent airflow from flowing out from the front and affecting the user's sleep.

[0056] In this embodiment, a temperature detection mechanism may also be provided. This mechanism is used to detect one or more of the ambient temperature, the temperature of the first air outlet 211, or the user's head temperature. It can also intelligently regulate the active temperature control element 231 via electronic programs to achieve intelligent temperature control. Specifically, the head support device includes at least one of the following temperature detection mechanisms: a first temperature sensor disposed on the support body for detecting the ambient temperature; a second temperature sensor disposed on the support surface for detecting the head temperature; and a third temperature sensor disposed near the first ventilation hole for detecting the temperature near the first ventilation outlet.

[0057] The head support device also includes a control box 27, which is detachably connected to the support body 1. The control box 27 includes a temperature display module for receiving the temperature from the temperature detection mechanism.

[0058] Second embodiment

[0059] See Figures 6-9 The difference between this embodiment and the first embodiment is that: the first base 2321 is L-shaped, the longitudinal base 2324 is located on the right side of the support body 1, and a space capable of accommodating two first air intake fans is formed on the left side of the second base 2331. The two first air intake fans are arranged side by side in this space. The second ventilation hole 262 is provided on the side of the ventilation component 26, and the first ventilation hole 261 is provided on the upper surface of the ventilation component 26.

[0060] Correspondingly, the second air outlet is located on the right side of the support body 1, the second base 2331 is located above the longitudinal base 2324, and the semiconductor heating and cooling sheet is sandwiched between the two; wherein, the second air intake fan is arranged side by side with the first air intake fan.

[0061] Third embodiment

[0062] See Figures 10-13 The difference between this embodiment and the first embodiment is that both the first passive temperature-conducting element 232 and the second passive temperature-conducting element 233 are located on the right side of the support body 1. In this embodiment, a third air intake fan 4 is provided on the right side of the support body 1, but the first passive temperature-conducting element 232 is not provided there. In this embodiment, the first air intake fan is a side-entry fan. The second ventilation hole 262 is located on the side of the ventilation component 26, and the first ventilation hole 261 is located on the upper surface of the ventilation component 26. The first air intake fan and the second air intake fan are arranged vertically.

[0063] The above description is only a preferred embodiment of the present utility model, but the design concept of the present utility model is not limited thereto. Any non-substantial modifications made to the present utility model by those skilled in the art within the scope of the technology disclosed in the present utility model using this concept shall be deemed as an infringement of the protection scope of the present utility model.

Claims

1. A head support device, characterized in that, The system includes a support body and a ventilation mechanism. The support body includes a support surface, which includes a front area supporting the head and a rear area away from the head. The front area has a first air outlet, and the rear area has a first air inlet. The ventilation mechanism includes a ventilation component and a first air guide mechanism. The ventilation component is located within the support body. The first air guide mechanism includes a first suction surface and a first air outlet surface. The first suction surface is disposed facing the first air inlet, and the first air outlet surface is disposed facing the ventilation component. The ventilation component includes a first ventilation hole that communicates at least partially with the first air outlet.

2. The head support device as described in claim 1, characterized in that: The ventilation component includes a second ventilation hole and a ventilation cavity. The first air outlet is disposed facing the second ventilation hole, and the second ventilation hole communicates with the first ventilation hole through the ventilation cavity.

3. The head support device as described in claim 2, characterized in that: The second ventilation hole is located on the same plane as the first ventilation hole.

4. The head support device as described in claim 2, characterized in that: The second ventilation hole is located on the side of the ventilation component, and the first ventilation hole is located on the upper surface of the ventilation component.

5. A head support device as described in claim 1, characterized in that: The ventilation mechanism further includes a temperature control mechanism and a first air guide channel. The first air guide channel includes a channel between the first air inlet and the first air outlet. The temperature control mechanism is used to adjust the temperature of the first air guide channel.

6. The head support device as described in claim 5, characterized in that: The ventilation component is provided with clearance holes, which are provided for at least a portion of the temperature control mechanism.

7. A head support device as described in claim 6, characterized in that: The temperature control mechanism includes an active temperature regulating element and a first passive temperature conducting element. The active temperature regulating element is connected to the first passive temperature conducting element, which is located inside the ventilation component and at least partially corresponds to the clearance hole.

8. The head support device as described in claim 7, characterized in that: The first passive temperature-conducting element includes a horizontal base and a vertical base. The vertical base is connected to the horizontal base and extends toward the rear side of the support body. The first air guide mechanism is disposed adjacent to the side of the horizontal base near the vertical base.

9. The head support device as described in claim 8, characterized in that: There is a gap between the longitudinal base and the rear side of the support body, which allows air from the first air guide mechanism to pass through.

10. The head support device as described in claim 7, characterized in that: The first passive temperature-conducting element is T-type or L-type.

11. A head support device as described in claim 7, characterized in that: The active temperature regulating element is a semiconductor heating element, and the first passive temperature conducting element is connected to the first temperature control side of the semiconductor heating element; wherein, the first temperature control side is the cooling side or the heating side.

12. A head support device as described in claim 11, characterized in that: The temperature control mechanism includes a second passive temperature conducting element connected to the second temperature control side of the semiconductor heating and cooling sheet. The ventilation mechanism also includes a second air guide channel and a second air guide mechanism. The second passive temperature conducting element is at least partially located within the second air guide channel, and the second air guide mechanism is disposed within the second air guide channel. The second air guide channel includes a second air inlet and a second air outlet, with the second air outlet located at the rear side of the support body.

13. A head support device as described in claim 8, characterized in that: The first air guide mechanism includes a plurality of first air intake fans, which are arranged side by side on one side of the transverse base near the longitudinal base.

14. A head support device as described in claim 1, characterized in that: It also includes at least one of the following temperature detection mechanisms: A first temperature sensor is installed on the support body to detect the ambient temperature; A second temperature sensor, disposed on the support surface, is used to detect the head temperature; A third temperature sensor is placed near the first ventilation hole to detect the temperature near the third ventilation opening.

15. A head support device as described in claim 14, characterized in that: It also includes a control box, which is detachably connected to the support body. The control box includes a temperature display module for receiving the temperature from the temperature detection mechanism.

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