Automatic heat conduction material printing device

Abstract

The utility model discloses an automatic heat conduction material printing device which comprises a conveying line, a brushing mechanism, an adsorption mechanism and a pressing mechanism, the brushing mechanism, the adsorption mechanism and the pressing mechanism are arranged in the conveying direction of the conveying line, the brushing mechanism is used for uniformly brushing a heat conduction material on a sample tray, and the adsorption mechanism is used for transferring a substrate to the position above the sample tray. The pressing mechanism is used for uniformly pressing the substrate on the sample tray, the sample tray is arranged on a cooling platform, and the sample tray and the cooling platform synchronously move on the conveying line. According to the printing device, the heat conduction material can be automatically and evenly smeared on the sample tray and evenly pressed on the substrate, stress is even, and the yield and the machining efficiency can be effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of dry etching technology, specifically to an automated thermal conductive material printing device. Background Technology

[0002] In the photolithography-patterning process, dry etching (IBE) is used to remove unwanted film layers to form the designed pattern. The dry etching mechanism involves introducing Ar into a vacuum, ionizing it to form plasma, which is then led out in a beam through a gate. The ions are accelerated and bombard the material surface, removing the unwanted film layer; this is a purely physical process. Typically, a photoresist mask is used on the sample surface. The entire dry etching process causes significant heat accumulation on the surface. For fragile materials with poor thermal conductivity, such as ceramic and silicon substrates, excessively high temperatures can lead to product breakage, photoresist denaturation or even carbonization, and the inability to remove the photoresist subsequently. Because dry etching equipment operates under vacuum, heat conduction can only be achieved through contact between the substrate and a water-cooled platform. Currently, the common practice in the industry is to use a spring to hold the product in place, thereby making close contact between the product and the cooling platform to achieve cooling. However, this method has the following drawbacks: it is not suitable for substrates with thicker film layers, resulting in long etching times, high heat accumulation, and fragmentation; poor thermal conductivity leads to photoresist carbonization; and the use of springs and other tooling can cause thinner substrates to break. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides an automated thermal conductive material printing device. This device can automatically and evenly apply thermal conductive material to a sample tray and evenly press it against the substrate, resulting in uniform force distribution and effectively improving yield and processing efficiency.

[0004] An automated thermal conductive material printing device includes a conveyor line and a coating mechanism, an adsorption mechanism, and a pressing mechanism arranged along the conveyor line. The coating mechanism is used to uniformly coat a thermal conductive material on a sample tray. The adsorption mechanism is used to transfer a substrate to the top of the sample tray. The pressing mechanism is used to uniformly press the substrate onto the sample tray. The sample tray is placed on a cooling platform and moves synchronously with the cooling platform on the conveyor line.

[0005] As a preferred embodiment of the above technical solution, the coating mechanism includes a coating disk, the upper limit of which is provided with a screen for printing, the coating disk is driven to move vertically up and down by a first lifting drive, a scraper is provided above the coating disk, the scraper is driven to move vertically up and down by a second lifting drive and can be driven to move laterally by a first horizontal drive.

[0006] As a preferred embodiment of the above technical solution, a baffle is provided parallel to one side of the scraper, and the baffle is driven to move vertically up and down by a third lifting drive component and moves horizontally synchronously with the scraper.

[0007] As a preferred embodiment of the above technical solution, the adsorption mechanism includes a suction cup frame, which is driven to move vertically up and down by a fourth lifting drive component and can be driven to move laterally by a second horizontal drive component. A substrate support frame is provided on the side of the conveyor line located on the lateral movement path of the suction cup frame.

[0008] As a preferred embodiment of the above technical solution, the suction cup holder includes four vacuum suction cups arranged in a square array.

[0009] As a preferred embodiment of the above technical solution, the pressing mechanism includes a pressure plate and a support plate arranged in parallel vertically, and the pressure plate and the support plate are driven to move vertically up and down by a fifth lifting drive member and a sixth lifting drive member, respectively.

[0010] As a preferred embodiment of the above technical solution, multiple sets of rolling support modules are uniformly arranged along the length of the conveyor line in the middle section.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] This thermal conductive material printing device adopts fully automated operation, which can improve production efficiency and reduce labor costs for enterprises; it can automatically and evenly apply thermal conductive material to the sample tray and evenly press it against the substrate, resulting in uniform force and effectively improving the yield rate. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of the present utility model. Figure 1 .

[0014] Figure 2 This is a schematic diagram of the structure of the present utility model. Figure 2 .

[0015] The attached figures are labeled as follows: 1-Conveyor line, 2-Coating mechanism, 3-Adsorption mechanism, 4-Pressure mechanism, 5-Sample tray, 6-Substrate, 7-Cooling platform, 8-Coating plate, 9-Screen mesh, 10-First lifting drive, 11-Scraper, 12-Second lifting drive, 13-First horizontal drive, 14-Baffle, 15-Third lifting drive, 16-Suction cup frame, 17-Fourth lifting drive, 18-Second horizontal drive, 19-Substrate support frame, 20-Vacuum suction cup, 21-Pressure plate, 22-Support plate, 23-Fifth lifting drive, 24-Sixth lifting drive, 25-Rolling support module. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0017] The present invention will now be described in further detail with reference to the accompanying drawings:

[0018] like Figure 1 , Figure 2 An automated thermal conductive material printing device includes a conveyor line 1 and a coating mechanism 2, an adsorption mechanism 3, and a pressing mechanism 4 arranged along the conveyor line 1. The coating mechanism 2 is used to uniformly coat a thermal conductive material onto a sample tray 5. The adsorption mechanism 3 is used to transfer a substrate 6 above the sample tray 5. The pressing mechanism 4 is used to uniformly press the substrate 6 onto the sample tray 5. The sample tray 5 is placed on a cooling platform 7 and moves synchronously with the cooling platform 7 on the conveyor line 1. Specifically, the coating mechanism 2, adsorption mechanism 3, and pressing mechanism 4 are all mounted above the conveyor line 1 via an inverted U-shaped support frame.

[0019] In this embodiment, the coating mechanism 2 includes a coating disk 8, with a screen 9 for printing mounted on its upper limit. The coating disk 8 is driven to move vertically up and down by a first lifting drive 10. A scraper 11 is provided above the coating disk 8. The scraper 11 is driven to move vertically up and down by a second lifting drive 12 and can also move laterally by a first horizontal drive 13. Specifically, the coating disk 8 has holes that cooperate with the screen 9. The first lifting drive 10 is used to control the distance between the coating disk 8 and the sample tray 5, the second lifting drive 12 is used to control the distance between the scraper 11 and the coating disk 8 to ensure that the coating thickness meets the requirements, and the first horizontal drive 13 is used to realize the coating action of the scraper 11.

[0020] In this embodiment, a baffle 14 is provided parallel to one side of the scraper 11. The baffle 14 is driven to move vertically up and down by a third lifting drive 15 and moves horizontally synchronously with the scraper 11. Specifically, the third lifting drive 15 is used to control the distance between the baffle 14 and the application disk 8. When the scraper 11 is applying the material, excess heat-conducting material can accumulate between the baffle 14 and the scraper 11, preventing the heat-conducting material from overflowing during the application process.

[0021] In this embodiment, the adsorption mechanism 3 includes a suction cup frame 16. The suction cup frame 16 is driven to move vertically up and down by a fourth lifting drive 17 and can be driven to move laterally by a second horizontal drive 18. A substrate support frame 19 is provided on the side of the conveyor line 1 along the lateral movement path of the suction cup frame 16. Specifically, the fourth lifting drive 17 is used to control the vertical height of the suction cup frame 16 and the suction and release height of the substrate 6. The suction cup frame 16 can transfer the substrate 6 from the substrate support frame 19 to the sample tray 5 of the conveyor line 1 via the second horizontal drive 18.

[0022] In this embodiment, the suction cup holder 16 includes four vacuum suction cups 20 arranged in a square array. Specifically, the substrate 6 is also arranged in a square array on the substrate support frame 19, with each vacuum suction cup 20 corresponding to one substrate 6.

[0023] In this embodiment, the pressing mechanism 4 includes a pressure plate 21 and a support plate 22 arranged parallel to each other vertically. The pressure plate 21 and the support plate 22 are driven to move vertically up and down by a fifth lifting drive 23 and a sixth lifting drive 24, respectively. Specifically, the sixth lifting drive 24 first lifts the assembly of the cooling platform 7, the sample tray 5, and the substrate 6 and removes it from the conveyor line 1. Then, the fifth lifting drive 23 drives the pressure plate 21 downward to evenly press the substrate 6 onto the sample tray 5.

[0024] In this embodiment, multiple sets of rolling support modules 25 are uniformly arranged along the length of the middle section of the conveyor line 1. The rolling support modules 25 are used to provide upward support force for the conveyed components on the conveyor line 1.

[0025] The working principle of this embodiment is as follows.

[0026] 1. When in use, place the cooling platform 7 and sample tray 5 at the left end of the conveyor line 1. The equipment positions the sample tray 5 at the first station. The first lifting drive 10 drives the coating tray 8 to descend, placing the screen 9 for printing thermal conductive material on the coating tray 8. The screen 8 has grooves around its perimeter to fix it to the coating tray 8, preventing relative sliding during vacuum grease printing.

[0027] 2. Take an appropriate amount of vacuum grease and cover it on the screen 9. Start the equipment. The first horizontal drive component 13 drives the scraper 11 to move back and forth, so that the vacuum grease is evenly covered on the screen 9 and evenly adhered to the sample tray 5 through the screen 9.

[0028] 3. After vacuum grease printing is completed, the first lifting drive 10 drives the coating plate 8 to rise; the equipment starts the conveyor line 1 and moves the sample tray 5 to the second station; the suction cup frame 16 picks up the substrate 6 by vacuum adsorption, and after releasing the vacuum, places the substrate 6 on the sample tray 5 at the position where vacuum grease is printed.

[0029] 4. After the substrate 6 is placed, the conveyor line 1 carries the sample tray 5 containing the substrate 1 to the third station; the support plate 22 lifts the assembly of the cooling platform 7, sample tray 5 and substrate 6 and separates it from the conveyor line 1, and the pressure plate descends to apply pressure, so that the substrate, vacuum grease and cooling platform are in close contact.

[0030] 5. After the base / 6 is installed, the conveyor line 1 is started, which transports the sample tray 5 to the fourth station. The operator can remove the sample tray 5, install it into the IBE equipment, set the process parameters, and start etching.

[0031] In this embodiment, the lifting drive component is a cylinder, and the horizontal drive component is a linear module. The structure and working principle of the lifting drive component and the horizontal drive component are existing technologies, and their structure and working principle will not be described in detail here.

[0032] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An automated thermal conductive material printing device, characterized in that: The system includes a conveyor line and a coating mechanism, an adsorption mechanism, and a pressing mechanism arranged along the conveyor line. The coating mechanism is used to uniformly coat a thermally conductive material onto a sample tray. The adsorption mechanism is used to transfer a substrate to a position above the sample tray. The pressing mechanism is used to uniformly press the substrate onto the sample tray. The sample tray is placed on a cooling platform and moves synchronously with the cooling platform on the conveyor line.

2. The automated thermal conductive material printing device according to claim 1, characterized in that: The coating mechanism includes a coating disk with a screen for printing at its upper limit. The coating disk is driven to move vertically up and down by a first lifting drive. A scraper is provided above the coating disk. The scraper is driven to move vertically up and down by a second lifting drive and can also move laterally by a first horizontal drive.

3. The automated thermal conductive material printing device according to claim 2, characterized in that: A baffle is provided parallel to one side of the scraper. The baffle is driven to move vertically up and down by a third lifting drive and moves horizontally synchronously with the scraper.

4. The automated thermal conductive material printing device according to claim 1, characterized in that: The adsorption mechanism includes a suction cup frame, which is driven to move vertically up and down by a fourth lifting drive and can be driven to move laterally by a second horizontal drive. A substrate support frame is provided on the side of the conveyor line along the lateral movement path of the suction cup frame.

5. The automated thermal conductive material printing device according to claim 4, characterized in that: The suction cup holder includes four vacuum suction cups arranged in a square array.

6. The automated thermal conductive material printing device according to claim 1, characterized in that: The pressing mechanism includes a pressure plate and a support plate arranged parallel to each other, and the pressure plate and the support plate are driven to move vertically up and down by a fifth lifting drive and a sixth lifting drive, respectively.

7. The automated thermal conductive material printing device according to claim 1, characterized in that: Multiple sets of rolling support modules are evenly arranged along the length of the conveyor line in the middle section.

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