Ultra-pure deionized water self-purification and purification precision cleaning equipment for semiconductor parts

Abstract

The utility model relates to the technical field of precision cleaning in the semiconductor industry, in particular to ultrapure deionized water self-purification precision cleaning equipment for semiconductor parts, which comprises a water purification system, a first cleaning tank, a second cleaning tank and a drain pipe. The water purifier, the pump and the heating system are sequentially arranged on the clean water pipeline, the water purifier is connected with the water inlet pipe and connected to the clean water pipeline to supply water to the first cleaning tank, and an overflow valve is arranged between the first cleaning tank and the second cleaning tank. According to the ultrapure deionized water self-purification and purification precise cleaning equipment for the semiconductor parts, through the technical means of online purification, double-tank cleaning, intelligent monitoring and management and the like, the problems that in the prior art, the resistivity of water quality is unstable, and the cleaning quality is difficult to guarantee are effectively solved; and the method has important significance on improving the cleaning quality and the production efficiency of semiconductor parts.

Description

Technical Field

[0001] This utility model relates to the field of precision cleaning technology in the semiconductor industry, specifically to a precision cleaning equipment for semiconductor parts that uses ultrapure deionized water for self-purification. Background Technology

[0002] With the rapid development of the semiconductor industry, especially the continuous advancement of IC (integrated circuit) and 3C (computer, communication, and consumer electronics) equipment technologies, the requirements for the surface cleanliness of semiconductor components are becoming increasingly stringent. To meet the high standards of the semiconductor industry, precision cleaning equipment must use ultra-high resistivity pure water as the basic cleaning medium. However, in existing technologies, even ultrapure water with a source strength of 18 MΩ·cm will gradually decrease in resistivity over time due to contamination from air oxidation, dust, and other particulate matter after being injected into the cleaning tank, making it difficult to maintain a stable high resistivity state.

[0003] The precision cleaning equipment currently used in the industry typically uses water with a resistivity in the range of 2–4 MΩ·cm. This water quality often fails to meet the high cleanliness requirements of semiconductor components. To meet testing standards, products often need to undergo repeated cleaning, or the water needs to be replaced each time. This not only increases production costs but also reduces production efficiency.

[0004] Therefore, developing a precision cleaning device for ultrapure deionized water self-purification of semiconductor parts that can purify and maintain high resistivity deionized water online is of great significance for improving the cleaning quality and production efficiency of semiconductor components. Utility Model Content

[0005] To address the aforementioned issues, this invention provides a precision cleaning device for semiconductor components using ultrapure deionized water self-purification and refining. This device effectively solves problems such as unstable water resistivity and difficulty in guaranteeing cleaning quality in existing technologies through online purification, dual-tank cleaning, and intelligent monitoring and management. It is of great significance for improving the cleaning quality and production efficiency of semiconductor components.

[0006] The technical solution of this utility model is as follows:

[0007] A precision cleaning device for ultrapure deionized water self-purification and purification of semiconductor components includes a water purification system, a first cleaning tank, a second cleaning tank, and a drain pipe. The water purification system includes a water purifier, a pump, and a heating system, which are sequentially arranged on a clean water pipeline. The water purifier is connected to an inlet pipe and supplies water to the first cleaning tank. An overflow valve is provided between the first and second cleaning tanks.

[0008] The water purifier is a resin polishing mixed bed purifier.

[0009] The volume of the first and second cleaning tanks is 1000L-4000L.

[0010] The pump's circulation rate is 220 L / min.

[0011] The heating system is an electrically heated pure water heater.

[0012] Liquid level sensors are installed in the first and second cleaning tanks.

[0013] Temperature control sensors are installed in the first and second cleaning tanks.

[0014] A water resistivity tester is installed in the first and second cleaning tanks, and a water resistivity display meter is installed outside the first and second cleaning tanks.

[0015] A flow meter is installed at the front end of the first cleaning tank on the clean water pipeline.

[0016] The beneficial effects of this utility model are as follows:

[0017] 1. This utility model discloses a precision cleaning device for semiconductor components using ultrapure deionized water self-purification and refining. The device is equipped with two cleaning tanks (a first cleaning tank and a second cleaning tank). The first cleaning tank contains highly purified water, which is used for the second cleaning stage to ensure the final cleaning effect. The secondary purified water overflowing from the first cleaning tank is used for the first preliminary cleaning stage, realizing the tiered utilization of water resources, which not only ensures the cleaning quality but also reduces production costs.

[0018] 2. This utility model discloses a precision cleaning equipment for ultrapure deionized water self-purification and refining of semiconductor components. By installing a liquid level sensor, a temperature control sensor, and a water resistivity tester, the equipment can monitor the liquid level, temperature, and water resistivity in the cleaning tank in real time, ensuring the safety and stability of the cleaning process. The water resistivity display provides intuitive data display, making it easy for operators to understand and adjust the cleaning parameters in a timely manner, thereby improving production efficiency.

[0019] 3. The present invention discloses a precision cleaning equipment for semiconductor components using ultrapure deionized water self-purification and refining. This equipment can stably provide high resistivity deionized water, avoiding the need for repeated cleaning and water replacement due to water quality issues, thereby improving the cleaning quality and production efficiency of semiconductor components. Attached Figure Description

[0020] The advantages and solutions of this application will become clear to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this invention.

[0021] In the attached diagram:

[0022] Figure 1 This is a schematic diagram of the composition of a precision cleaning device for ultrapure deionized water self-purification and purification of semiconductor parts according to an embodiment of the present invention.

[0023] The components represented by the various reference numerals in the diagram are:

[0024] This utility model comprises: 1. a first cleaning tank, 2. a second cleaning tank, 3. an inlet pipe, 4. a water purifier, 5. a pump, 6. a clean water pipeline, 7. a heating system, 8. a drain pipe, 9. an overflow valve, 10. a liquid level sensor, 11. a temperature control sensor, 12. a water resistivity tester, 13. a water resistivity display meter, and 14. a flow meter. Detailed Implementation

[0025] like Figure 1 As shown, the ultrapure deionized water self-purification precision cleaning equipment for semiconductor parts includes a water purification system, a first cleaning tank 1, a second cleaning tank 2, and a drain pipe 8.

[0026] The water purification system, as the core part of the equipment, consists of a water purifier 4, a pump 5, and a heating system 7. These components are connected in series on the clean water pipeline 6 to form a complete water purification process.

[0027] At the beginning of the water purification system, the water purifier 4 is connected to the inlet pipe 3 and is responsible for purifying the incoming source water. According to the features of this invention, the water purifier 4 is preferably a resin polishing mixed-bed purifier. This purifier is internally composed of a premixed mixture of highly purified and transformed H-type cation exchange resin and OH-type anion exchange resin, forming a multi-stage mixed-bed structure. In the mixed bed, the cation and anion resins are uniformly mixed, allowing the cation and anion exchange reactions to occur almost simultaneously, thereby efficiently removing ionic impurities from the water and improving the quality of the effluent.

[0028] The water purified by the water purifier 4 is circulated by pump 5. The circulation rate of pump 5 is set to 220 L / min to ensure sufficient and uniform water flow in the cleaning tank, which helps improve the cleaning effect. Simultaneously, a heating system 7 is installed after pump 5 to heat the circulating water to meet the specific temperature requirements during the cleaning of semiconductor components. The heating system 7 is preferably an electric pure water heater, which has advantages such as fast heating speed and precise temperature control.

[0029] At the end of the water purification system, the clean water pipeline 6 delivers purified and heated water to the first cleaning tank 1. The first cleaning tank 1 contains highly purified water for the second cleaning of semiconductor components. To ensure cleaning quality, the volume of the first cleaning tank 1 is set within the range of 1000L-4000L to accommodate sufficient cleaning water. A flow meter 14 is installed on the clean water pipeline 6 at the front end of the first cleaning tank 1 to measure the amount of purified water injected into the first cleaning tank 1.

[0030] An overflow valve 9 is installed between the first cleaning tank 1 and the second cleaning tank 2. When the water level in the first cleaning tank 1 reaches a set height, excess water flows into the second cleaning tank 2 through the overflow valve 9. The water in the second cleaning tank 2 serves as secondary clean water for the first preliminary cleaning of semiconductor components. Similarly, the volume of the second cleaning tank 2 is also set within the range of 1000L-4000L.

[0031] To enable real-time monitoring of the cleaning process, this invention installs a liquid level sensor 10, a temperature control sensor 11, and a water resistivity tester 12 in the first cleaning tank 1 and the second cleaning tank 2, respectively. The liquid level sensor 10 monitors changes in the water level within the cleaning tank to ensure sufficient but not excessive water volume; the temperature control sensor 11 monitors the water temperature to ensure the cleaning process is conducted within a suitable temperature range; and the water resistivity tester 12 monitors the water resistivity within the cleaning tank in real time to assess the purity of the cleaning water.

[0032] In addition, a water resistivity display meter 13 is installed on the outside of the first cleaning tank 1 and the second cleaning tank 2. This display meter is connected to the water resistivity tester 12 and can intuitively display the water resistivity value in the cleaning tank, so that operators can understand the quality of the cleaning water at any time and adjust the cleaning parameters or perform necessary maintenance operations accordingly.

[0033] Finally, the wastewater in the cleaning tank is discharged through drain pipe 8. The entire cleaning equipment is compact in structure and easy to operate, enabling efficient and precise cleaning of semiconductor parts and meeting the stringent requirements of the semiconductor industry for the cleanliness of parts surfaces.

Claims

1. A precision cleaning device for ultrapure deionized water self-purification and purification of semiconductor components, characterized in that, It includes a water purification system, a first cleaning tank (1), a second cleaning tank (2) and a drain pipe (8). The water purification system includes a water purifier (4), a pump (5) and a heating system (7). The water purifier (4), the pump (5) and the heating system (7) are sequentially installed on the clean water pipeline (6). The water purifier (4) is connected to the inlet pipe (3) and is connected to the clean water pipeline (6) to supply water to the first cleaning tank (1). An overflow valve (9) is installed between the first cleaning tank (1) and the second cleaning tank (2).

2. The precision cleaning equipment for ultrapure deionized water self-purification and purification of semiconductor components according to claim 1, characterized in that, The water purifier (4) is a resin polishing mixed bed purifier.

3. The precision cleaning equipment for ultrapure deionized water self-purification and purification of semiconductor components according to claim 1, characterized in that, The volume of the first cleaning tank (1) and the second cleaning tank (2) is 1000L-4000L.

4. The precision cleaning equipment for ultrapure deionized water self-purification and purification of semiconductor components according to claim 3, characterized in that, The circulation rate of the pump (5) is 220 L / min.

5. The precision cleaning equipment for ultrapure deionized water self-purification and purification of semiconductor components according to claim 1, characterized in that, The heating system (7) is an electric heating pure water heater.

6. The precision cleaning equipment for ultrapure deionized water self-purification and purification of semiconductor components according to claim 1, characterized in that, Liquid level sensors (10) are installed in the first cleaning tank (1) and the second cleaning tank (2).

7. The precision cleaning equipment for ultrapure deionized water self-purification and purification of semiconductor components according to claim 1, characterized in that, Temperature control sensors (11) are installed in the first cleaning tank (1) and the second cleaning tank (2).

8. The precision cleaning equipment for ultrapure deionized water self-purification and purification of semiconductor components according to claim 1, characterized in that, A water resistivity tester (12) is installed in the first cleaning tank (1) and the second cleaning tank (2), and a water resistivity display meter (13) is installed outside the first cleaning tank (1) and the second cleaning tank (2).

9. The precision cleaning equipment for ultrapure deionized water self-purification and purification of semiconductor components according to claim 1, characterized in that, A flow meter (14) is installed on the clean water pipeline (6) corresponding to the front end of the first cleaning tank (1).

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