Grinding fluid supply system and grinding equipment

Abstract

The utility model relates to a grinding fluid supply system and grinding equipment. The grinding fluid supply system comprises a grinding fluid spraying arm, a first supply pipeline, a switching module, a second supply pipeline and a backflow pipeline. And a first supply pipeline is arranged in the grinding fluid spraying arm. The switching module is located below the grinding fluid spraying arm and communicates with the first supply pipeline. And the second supply pipeline and the return pipeline are respectively communicated with the switching module. The switching module is used for communicating the first supply pipeline with the second supply pipeline in the first working state and communicating the second supply pipeline with the backflow pipeline in the second working state. The problems of grinding fluid crystallization and blockage can be effectively solved, and the product yield can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and in particular to a polishing slurry supply system and polishing equipment. Background Technology

[0002] In the Chemical Mechanical Polishing (CMP) process, a slurry supply system is required to supply slurry to the polishing machine. Slurry is a liquid containing a large number of fine solid particles; when the slurry is still, these solid particles easily precipitate and crystallize.

[0003] Currently, during the supply of polishing slurry, there are instances where the slurry remains stagnant in some pipelines (such as within filters). This can easily lead to blockages and crystallization in these pipelines, thereby affecting the polishing effect of the polishing machine on the wafers. For example, it can cause surface scratches on the wafer products during polishing, resulting in a decrease in product yield. Utility Model Content

[0004] Based on this, the present disclosure provides a polishing slurry supply system and polishing equipment to effectively solve the problems of polishing slurry crystallization and clogging, which is beneficial to improving product yield.

[0005] To achieve the above objectives, in a first aspect, some embodiments of this disclosure provide a polishing slurry supply system. The polishing slurry supply system includes a polishing slurry spraying arm, a first supply line, a switching module, a second supply line, and a return line. The first supply line is disposed within the polishing slurry spraying arm. The switching module is located below the polishing slurry spraying arm and is connected to the first supply line. The second supply line and the return line are respectively connected to the switching module. The switching module is used to connect the first and second supply lines in a first operating state, and to connect the second supply line and the return line in a second operating state.

[0006] In some embodiments, the polishing slurry supply system further includes a filter. The filter is located on a second supply line.

[0007] In some embodiments, the polishing slurry supply system further includes a flow controller. The flow controller is located on the second supply line. The flow controller is configured to control the flow rate of the polishing slurry within the second supply line.

[0008] In some embodiments, the polishing slurry supply system further includes a flow signaler. The flow signaler is located within the polishing slurry spray arm and disposed on a first supply line. The flow signaler is configured to detect the flow rate of the polishing slurry in the first supply line to obtain a flow detection signal. A flow controller is coupled to the flow signaler and configured to receive the flow detection signal to control the flow rate of the polishing slurry in a second supply line based on the flow detection signal.

[0009] In some embodiments, the polishing slurry supply system further includes a filter located on a second supply line. A flow controller is located on the second supply line between the filter and the switching module.

[0010] In some embodiments, the flow controller includes a normally open flow controller.

[0011] In some embodiments, the polishing slurry supply system further includes a valve distribution box. The valve distribution box is located at the end of the second supply line and return line away from the switching module. The valve distribution box is configured to control the pressure and flow rate of the polishing slurry in the second supply line and return line.

[0012] In some embodiments, the polishing slurry supply system further includes a polishing slurry supply source. The polishing slurry supply source connects to the end of the second supply line and the return line away from the switching module. The valve distribution box is located on the second supply line and the return line between the polishing slurry supply source and the switching module.

[0013] In some embodiments, the concentration of polishing slurry in the second supply line, the return line, and the first supply line is the same as the concentration of polishing slurry in the polishing slurry supply source.

[0014] Secondly, according to some embodiments, this disclosure also provides a grinding apparatus. The grinding apparatus includes a grinding mill stand. The grinding mill stand includes a grinding fluid supply system as described in the first aspect of the embodiments of this disclosure.

[0015] In summary, the unexpected effects that the grinding slurry supply system and grinding equipment provided in this disclosure can achieve are:

[0016] In this embodiment, a first supply pipeline is disposed inside the polishing slurry spraying arm, and a switching module is disposed below the polishing slurry spraying arm. The switching module is connected to the first supply pipeline, the second supply pipeline, and the return pipeline. This not only effectively shortens the supply length of the first supply pipeline but also allows the switching module to control the connection between the first and second supply pipelines for polishing slurry supply. This ensures that the polishing slurry in the second supply pipeline maintains continuous flow during polishing slurry supply through its connection with the first supply pipeline. Alternatively, the switching module can control the connection between the second supply pipeline and the return pipeline for polishing slurry return, ensuring that the polishing slurry in the second supply pipeline maintains continuous flow during polishing slurry return through its connection with the return pipeline. Thus, this embodiment effectively avoids the problems of polishing slurry crystallization and blockage in the first and second supply pipelines, ensuring the polishing effect of the polishing machine and preventing surface scratches on wafer products caused by polishing slurry crystallization, thereby improving product yield.

[0017] Details of one or more embodiments of this disclosure are set forth in the following drawings and description. Other features, objects, and advantages of this disclosure will become apparent from the specification, drawings, and claims. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments or conventional technologies of this disclosure, the accompanying drawings used in the description of the embodiments or conventional technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a grinding fluid supply system provided in some embodiments;

[0020] Figure 2 This is a schematic diagram of another grinding fluid supply system provided in some embodiments;

[0021] Figure 3 This is a comparison chart of the control of grinding fluid flow rate provided in some embodiments.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1- Grinding fluid spraying arm, 2- First supply line, 3- Switching module, 4- Second supply line, 5- Return line, 6- Grinding fluid supply source, 7- Filter, 8- Valve distribution box, 9- Flow controller, 10- Flow signal device. Detailed Implementation

[0024] To facilitate understanding of this disclosure, a more complete description will now be given with reference to the accompanying drawings, in which preferred embodiments of the present disclosure are shown. However, this disclosure may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure.

[0026] It should be understood that when an element or layer is referred to as being "on," "adjacent to," or "connected to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, regions, layers, doping types, and / or portions, these elements, components, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, doping type, or portion from another element, component, region, layer, doping type, or portion. Therefore, without departing from the teachings of this disclosure, the first element, component, region, layer, doping type, or portion discussed below may be referred to as a second element, component, region, layer, or portion.

[0027] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that when the terms “comprise” and / or “comprising” are used in this specification, the presence of the stated feature, integer, step, operation, element, and / or part is established, but the presence or addition of one or more other features, integers, steps, operations, elements, parts, and / or groups is not excluded. Meanwhile, when used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0028] Embodiments of the invention are described herein with reference to cross-sectional views that serve as schematic diagrams of preferred embodiments (and intermediate structures) of the present disclosure, thus allowing for the anticipation of variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances. Embodiments of the present disclosure should not be limited to the specific shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing techniques. Therefore, the regions shown in the figures are substantially schematic, and their shapes do not represent the actual shapes of regions of the device, nor do they limit the scope of the present disclosure.

[0029] In conventional polishing slurry supply systems, a deionization water (DIW) rinsing process is typically included to prevent slurry sedimentation and crystallization. However, during the DIW rinsing process, some slurry may remain stagnant in certain pipelines (e.g., within the filter), which can easily lead to blockages and crystallization in these areas. This can result in scratches on the surface of the polished wafers, reducing product yield. Furthermore, after the DIW rinsing process, a large amount of slurry needs to be pre-flushed to drain any remaining deionized water from the pipelines. This wastes slurry and increases process costs. Additionally, the mixing of deionized water with the slurry during drainage can affect the concentration of the slurry within the pipelines, further reducing product yield.

[0030] Based on this, the present disclosure provides a polishing slurry supply system and polishing equipment to effectively solve the problems of polishing slurry crystallization and clogging, which is beneficial to improving product yield.

[0031] In some embodiments, firstly, please refer to Figure 1 This disclosure provides a slurry supply system in several embodiments. The system includes a slurry arm 1, a first supply line 2, a switching module 3, a second supply line 4, and a return line 5. The first supply line 2 is housed within the slurry arm 1. The switching module 3 is located below the slurry arm 1 and communicates with the first supply line 2. The second supply line 4 and the return line 5 are respectively connected to the switching module 3. Specifically, the switching module 3 connects the first supply line 2 and the second supply line 4 in a first operating state, and connects the second supply line 4 and the return line 5 in a second operating state.

[0032] For example, switching module 3 includes, but is not limited to, switching valves.

[0033] It should be noted that, as Figure 1 As indicated by the arrows, when the switching module 3 connects the first supply pipe 2 and the second supply pipe 4 in the first working state, the polishing slurry supply system is in the polishing slurry supply stage. The polishing slurry flows sequentially through the first supply pipe 2, the switching module 3, and the second supply pipe 4 within the polishing slurry spraying arm 1, and is sprayed through the polishing slurry spraying arm 1. When the switching module 3 connects the second supply pipe 4 and the return pipe 5 in the second working state, the polishing slurry supply system is in the polishing slurry return stage. The polishing slurry flows sequentially through the first supply pipe 2, the switching module 3, and the return pipe 5 to be discharged from the pipe. During both the polishing slurry supply stage and the polishing slurry return stage, the polishing slurry within the second supply pipe 4 remains in flow.

[0034] In this embodiment, the first supply pipe 2 is disposed inside the polishing slurry spraying arm 1, and the switching module 3 is disposed below the polishing slurry spraying arm 1, so that the switching module 3 is connected to the first supply pipe 2, the second supply pipe 4, and the return pipe 5 respectively. This not only effectively shortens the supply length of the first supply pipe 2, but also controls the connection between the first supply pipe 2 and the second supply pipe 4 to supply polishing slurry through the switching module 3. This allows the polishing slurry in the second supply pipe 4 to maintain constant flow during the polishing slurry supply through its connection with the first supply pipe 2. Alternatively, the switching module 3 controls the connection between the second supply pipe 4 and the return pipe 5 to allow the polishing slurry to return, so that the polishing slurry in the second supply pipe 4 can maintain constant flow during the polishing slurry return through its connection with the return pipe 5. Thus, the embodiments disclosed herein can effectively avoid the problem of crystallization and blockage of the polishing slurry in the first supply line 2 and the second supply line 4, so as to ensure the polishing effect of the polishing machine and avoid the problem of scratches on the surface of the wafer product caused by the crystallization of the polishing slurry, which is conducive to improving the product yield.

[0035] Furthermore, it is worth mentioning that by confining the first supply pipe 2 only inside the polishing slurry spraying arm 1, the length of the first supply pipe 2 is relatively short, making it less prone to polishing slurry crystallization. Therefore, there is no need to include a deionization water (DIW) cleaning step. Thus, compared with the inclusion of a deionization water cleaning step in related technologies, the embodiments of this disclosure can avoid the problems of polishing slurry waste and impact on polishing slurry concentration caused by the inclusion of a deionization water cleaning step.

[0036] In some embodiments, please continue reading Figure 1 The polishing slurry supply system also includes a polishing slurry supply source 6. The polishing slurry supply source 6 is connected to the end of the second supply line 4 and the return line 5 away from the switching module 3.

[0037] In some embodiments, please continue reading Figure 1 The grinding fluid supply system also includes a filter 7. The filter 7 is located on the second supply line 4.

[0038] For example, filter 7 is located on the second supply line 4 between the polishing slurry supply source 6 and the switching module 3.

[0039] For example, filter 7 includes, but is not limited to, Y-type filters, basket filters, T-type filters, degassing filters, or hand-cranked brush filters.

[0040] It should be noted that filter 7 is used to filter and remove crystals and precipitates generated in the grinding slurry, while retaining the original fine solid particles in the grinding slurry.

[0041] In some embodiments, please continue reading Figure 1The grinding fluid supply system also includes a valve distribution box 8. The valve distribution box 8 is located at the end of the second supply line 4 and the return line 5 away from the switching module 3. The valve distribution box 8 is configured to control the pressure and flow rate of the grinding fluid in the second supply line 4 and the return line 5.

[0042] For example, the valve distribution box 8 is located on the second supply line 4 and return line 5 between the grinding fluid supply source 6 and the switching module 3.

[0043] For example, the Valve Manifold Box 8 (VMB) includes embedded multi-branch piping. The Valve Manifold Box 8 is used to distribute the grinding fluid from a single source to multiple branch piping. Specifically, the Valve Manifold Box 8 can individually regulate the pressure of each branch piping (e.g., the second supply line 4 and the return line 5), thereby controlling the pressure and flow rate of the grinding fluid in the second supply line 4 and the return line 5.

[0044] In some embodiments, the concentration of polishing slurry in the second supply line 4, the return line 5, and the first supply line 2 is the same as the concentration of polishing slurry in the polishing slurry supply source 6.

[0045] It should be noted that this embodiment does not require a deionized water cleaning step. Compared with the deionized water cleaning step in related technologies, this embodiment does not have the problem of deionized water affecting the concentration of the polishing slurry. Therefore, the concentration of the polishing slurry in the second supply pipeline 4, the return pipeline 5, and the first supply pipeline 2 is the same as the concentration of the polishing slurry in the polishing slurry supply source 6. This is beneficial for controlling the polishing effect of the polishing machine by adjusting the concentration of the polishing slurry, thereby improving the product yield.

[0046] In some embodiments, please refer to Figure 2 The polishing slurry supply system also includes a flow controller 9. The flow controller 9 is located on the second supply line 4. The flow controller 9 is configured to control the flow rate of the polishing slurry within the second supply line 4.

[0047] For example, the flow controller 9 can control the flow rate of the grinding fluid in the second supply line 4 to rise from 0 and eventually stabilize at the target flow rate threshold X.

[0048] In some embodiments, please continue reading Figure 2 The grinding fluid supply system also includes a filter 7 located on the second supply line 4. A flow controller 9 is located on the second supply line 4 between the filter 7 and the switching module 3.

[0049] For example, the polishing slurry is filtered through filter 7 before flowing into flow controller 9, effectively preventing flow controller 9 from becoming clogged due to polishing slurry crystallization.

[0050] In some embodiments, please continue reading Figure 2 The polishing slurry supply system also includes a flow signal device 10. The flow signal device 10 is located inside the polishing slurry spray arm 1 and is mounted on the first supply line 2. The flow signal device 10 is configured to detect the flow rate of the polishing slurry in the first supply line 2 to obtain a flow detection signal. A flow controller 9 is coupled to the flow signal device 10 and is configured to receive the flow detection signal to control the flow rate of the polishing slurry in the second supply line 4 based on the flow detection signal.

[0051] For example, the flow signal device 10 includes, but is not limited to, a flow sensor. The flow signal device 10 may be, for example, a differential pressure flow meter, a volumetric flow meter, a turbine flow meter, or an electromagnetic flow meter.

[0052] For example, during the preparation stage before the polishing slurry supply system starts supplying polishing slurry, the polishing slurry flow rate corresponding to the flow detection signal acquired by the flow signaler 10 is 0. During the polishing slurry supply stage, the polishing slurry flows out from the polishing slurry supply source 6 and flows sequentially through the valve distribution box 8, filter 7, flow controller 9, switching module 3, and flow signaler 10 on the second supply pipeline 4, and is sprayed onto the wafer through the polishing spray arm. At this time, the polishing slurry flow rate corresponding to the flow detection signal acquired by the flow signaler 10 is Y. During the polishing slurry return stage, the remaining polishing slurry in the second supply pipeline 4 flows sequentially through the valve distribution box 8, filter 7, flow controller 9, switching module 3, and valve distribution box 8 on the return pipeline 5 and returns to the polishing slurry supply source 6. At this time, no polishing slurry flows in the first supply pipeline 2, and the polishing slurry flow rate corresponding to the flow detection signal acquired by the flow signaler 10 is 0.

[0053] For example, 0 < Y ≤ X.

[0054] For example, during the preparation phase before the grinding slurry supply system starts supplying grinding slurry, the flow controller 9 can be preset to set the target flow threshold X.

[0055] In some embodiments, the flow controller 9 includes a normally open flow controller.

[0056] For example, the flow controller 9 is normally open and receives the flow detection signal fed back by the flow signal transmitter 10 in real time, and regulates the flow rate of the polishing fluid in the second supply pipeline 4 in real time. For example, when the polishing fluid flow rate corresponding to the flow detection signal is significantly greater than 0, the flow controller 9 controls the polishing fluid flow rate Y in the second supply pipeline 4 to increase from 0 to the target flow rate threshold X.

[0057] It should be noted that the flow controller 9 remains open during the preparation, slurry supply, and slurry return phases. This allows for real-time detection of the slurry flow rate in the first supply line 2, with timely feedback of the detection signal to the flow controller 9. This enables the flow controller 9 to control the slurry flow rate in the second supply line 4 based on the real-time flow rate in the first supply line 2. Therefore, when the switching module 3 switches to the first state, the slurry flow rate in the second supply line 4 equals the target flow rate threshold X, and the second supply line 4 is connected to the first supply line 2, causing the slurry flow rate in the first supply line 2 to instantly rise from 0 to the target flow rate threshold X. When the switching module 3 switches to the second state, the second supply line 4 is disconnected from the first supply line 2, and the slurry flow rate in the first supply line 2 instantly drops from the target flow rate threshold X back to 0. This helps to solve the problem of lag in the flow control of the grinding fluid in the first supply line 2 when the grinding fluid supply system switches states (e.g., from the preparation stage to the grinding fluid supply stage, and from the grinding fluid supply stage to the grinding fluid return stage), eliminates the response time, realizes instantaneous changes in the flow of the grinding fluid in the first supply line 2, and ensures the stability of the initial flow in the first supply line 2 during the grinding fluid supply stage.

[0058] In some examples, please refer to Figure 3 Taking the target flow rate threshold X as an example, the variation curves of the grinding fluid flow rate Y in the first supply pipeline 2 of the grinding fluid supply system provided in this embodiment and the conventional grinding fluid supply system without the flow signal device 10 in related technologies are verified as a function of time. The vertical axis represents the grinding fluid flow rate Y (in m³ / s), and the horizontal axis represents time t (in seconds).

[0059] Please see Figure 3 In Figure (a), in a conventional grinding slurry supply system, after entering the grinding slurry supply stage, the grinding slurry flow rate in the first supply pipeline 2 slowly increases from the flow rate 0 to the target flow rate threshold X. However, the response time of the flow rate change is long, the initial flow rate is significantly lower than the target flow rate threshold X, and there is a flow rate fluctuation problem.

[0060] Please see Figure 3 In Figure (b) of this disclosure, in the grinding fluid supply system provided in this embodiment, when entering the grinding fluid supply stage, the grinding fluid flow rate in the first supply pipeline 2 instantly rises from flow rate 0 to the target flow rate threshold X, wherein there is no response time for the flow rate change and the flow rate is stable.

[0061] As described above, the grinding fluid supply system provided in this embodiment helps to solve the problem of lag in the control of the grinding fluid flow rate in the first supply pipeline 2, eliminates the response time, realizes the instantaneous change of the grinding fluid flow rate in the first supply pipeline 2, and ensures the stability of the flow rate in the first supply pipeline 2 during the grinding fluid supply stage.

[0062] Secondly, this disclosure also provides a grinding apparatus according to some embodiments. The grinding apparatus also possesses all the technical advantages of the aforementioned grinding slurry supply system. It should be noted that the parts that are the same as or corresponding to those in the above embodiments can be referred to the corresponding descriptions in the above embodiments, and will not be elaborated upon below.

[0063] In some embodiments, the grinding apparatus includes a grinding machine; the grinding machine includes a grinding fluid supply system as described in the first aspect of the present disclosure.

[0064] For example, grinding equipment includes, but is not limited to, chemical mechanical polishing (CMP) equipment.

[0065] For example, a grinding machine is used to grind a wafer to obtain a wafer product.

[0066] For example, the grinding equipment also includes a cleaning machine. The cleaning machine is used to clean the ground wafer products.

[0067] In summary, the unexpected effects that the grinding slurry supply system and grinding equipment provided in this disclosure can achieve are:

[0068] In this embodiment, the first supply pipe 2 is disposed inside the polishing slurry spraying arm 1, and the switching module 3 is disposed below the polishing slurry spraying arm 1, so that the switching module 3 is connected to the first supply pipe 2, the second supply pipe 4, and the return pipe 5 respectively. This not only effectively shortens the supply length of the first supply pipe 2, but also controls the connection between the first supply pipe 2 and the second supply pipe 4 to supply polishing slurry through the switching module 3. This allows the polishing slurry in the second supply pipe 4 to maintain constant flow during the polishing slurry supply through its connection with the first supply pipe 2. Alternatively, the switching module 3 controls the connection between the second supply pipe 4 and the return pipe 5 to allow the polishing slurry to return, so that the polishing slurry in the second supply pipe 4 can maintain constant flow during the polishing slurry return through its connection with the return pipe 5. Thus, the embodiments disclosed herein can effectively avoid the problem of crystallization and blockage of the polishing slurry in the first supply line 2 and the second supply line 4, so as to ensure the polishing effect of the polishing machine and avoid the problem of scratches on the surface of the wafer product caused by the crystallization of the polishing slurry, which is conducive to improving the product yield.

[0069] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0070] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0071] The embodiments described above are merely examples of several implementation methods of this disclosure, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure.

Claims

1. A grinding fluid supply system, characterized in that, include: A polishing slurry spraying arm, wherein a first supply pipeline is provided inside the polishing slurry spraying arm; The switching module is located below the grinding fluid spraying arm and is connected to the first supply pipeline; The second supply line and the return line are respectively connected to the switching module; The switching module is used to connect the first supply pipeline and the second supply pipeline in the first operating state, and to connect the second supply pipeline and the return pipeline in the second operating state.

2. The grinding fluid supply system according to claim 1, characterized in that, Also includes: A filter is located on the second supply line.

3. The grinding fluid supply system according to claim 1, characterized in that, Also includes: A flow controller, located on the second supply line, is configured to control the flow rate of the grinding fluid within the second supply line.

4. The grinding fluid supply system according to claim 3, characterized in that, Also includes: A flow signal device, located inside the polishing slurry spraying arm and disposed on the first supply pipeline, is configured to: detect the flow rate of the polishing slurry in the first supply pipeline to obtain a flow detection signal; The flow controller is coupled to the flow signaler and is configured to receive the flow detection signal to control the flow rate of the grinding fluid in the second supply pipeline according to the flow detection signal.

5. The grinding fluid supply system according to claim 4, characterized in that, The grinding fluid supply system further includes a filter located on the second supply pipeline; The flow controller is located on the second supply line between the filter and the switching module.

6. The grinding fluid supply system according to claim 4, characterized in that, The flow controller includes a normally open flow controller.

7. The grinding fluid supply system according to claim 1, characterized in that, Also includes: The valve distribution box, located at the end of the second supply line and the return line away from the switching module, is configured to control the pressure and flow rate of the grinding fluid in the second supply line and the return line.

8. The grinding fluid supply system according to claim 7, characterized in that, Also includes: A grinding fluid supply source is connected to the second supply pipeline and the end of the return pipeline away from the switching module; The valve distribution box is located on the second supply pipeline and the return pipeline between the grinding fluid supply source and the switching module.

9. The grinding fluid supply system according to claim 8, characterized in that, The concentration of the polishing slurry in the second supply pipeline, the return pipeline, and the first supply pipeline is the same as the concentration of the polishing slurry in the polishing slurry supply source.

10. A grinding apparatus, characterized in that, include: A grinding machine, including a grinding fluid supply system as described in any one of claims 1 to 9.

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