PCB electroplating device

Abstract

The utility model provides a PCB (Printed Circuit Board) electroplating device and relates to the technical field of PCB electroplating. The PCB electroplating device comprises a cylinder body, a supporting mechanism and a cantilever assembly, wherein the cylinder body is used for accommodating a processing solution; the supporting mechanism comprises a supporting frame, a vibration piece, a bearing frame and a vibration piece, the supporting frame and the bearing frame are both fixedly arranged on the cylinder body and are both arranged close to the top opening of the cylinder body, the bearing frame abuts against the supporting frame, the vibration piece is arranged on the supporting frame and can drive the supporting frame to vibrate in the height direction, and the vibration piece is arranged on the bearing frame and can drive the bearing frame to vibrate; the cantilever assembly is used for hanging a PCB, and the cantilever assembly is arranged above the supporting frame. According to the PCB electroplating device, the electroplating uniformity of the PCB can be ensured, and the rejection rate of the PCB is reduced.

Description

Technical Field

[0001] This utility model relates to the field of PCB electroplating technology, and in particular to a PCB electroplating apparatus. Background Technology

[0002] A PCB (Pinted Circuit Board) is used to support and mount electronic components. PCB plating is done to meet the soldering and mounting requirements of these components. Numerous micro-holes are pre-installed on the PCB, and copper plating is applied to the inside of these micro-holes.

[0003] Most existing PCB board electroplating pretreatment processes involve clamping the PCB board with a hanger and immersing it in a degreasing tank for reaction. However, grease, oil stains, and other contaminants that may be present on the PCB board surface can easily be carried into the tank. During PCB board electroplating, the grease, oil stains, and other contaminants attached to the PCB board make it difficult to control the electroplating precision, resulting in deviations in electroplating uniformity and a high scrap rate of PCB boards. Utility Model Content

[0004] The purpose of this invention is to provide a PCB electroplating device that can ensure the uniformity of electroplating on PCB boards and reduce the scrap rate of PCB boards.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] PCB electroplating equipment, including:

[0007] The cylinder is used to hold the processing solution;

[0008] The support mechanism includes a support frame, a vibrating element, a bearing frame, and a vibrating element. The support frame and the bearing frame are both fixedly mounted on the cylinder body and are both located near the top opening of the cylinder body. The bearing frame abuts against the support frame. The vibrating element is mounted on the support frame and can drive the support frame to vibrate along the height direction. The vibrating element is mounted on the bearing frame and can drive the bearing frame to vibrate.

[0009] A cantilever assembly for suspending a PCB board is disposed above the support frame.

[0010] As a further technical solution, the support frame includes a support frame and two support rods. The two support rods are fixedly connected to the inner wall of the cylinder at intervals along the X direction, and each of the two support rods is provided with a vibrating element. The support frame is disposed above the two support rods and is drively connected to the output shaft of the two vibrating elements. The support frame abuts against the bearing frame.

[0011] As a further technical solution, the support frame includes two first support shafts and two second support shafts, and the support mechanism also includes multiple vibration buffers;

[0012] Two first support shafts are spaced apart along the X direction and are connected to the output shafts of the two vibrating elements in a corresponding transmission manner. Each second support shaft is fixedly connected to the two first support shafts and is located above the two first support shafts. The two second support shafts are spaced apart along the Y direction.

[0013] Both of the second support shafts abut against the bearing frame, and the vibration buffer is provided between the ends of the two second support shafts and the corresponding support rods.

[0014] As a further technical solution, the vibration buffer is configured as a flexible component, which is fixedly disposed between the corresponding end of the second support shaft and the support rod.

[0015] As a further technical solution, the support mechanism also includes multiple sets of guide components. Each of the two first support shafts and the corresponding support rods is provided with a guide component, and each guide component can guide the two first support shafts to vibrate along the height direction.

[0016] As a further technical solution, each of the guide components includes a guide wheel and a guide mounting plate. The guide mounting plate is fixedly disposed below the corresponding first support shaft, and the guide wheel is rotatably disposed on the guide mounting plate and rolls in cooperation with the corresponding support rod.

[0017] As a further technical solution, the support frame also includes a guide plate, which is disposed above the support frame and extends along the X direction, and the cantilever assembly is disposed on the guide plate.

[0018] As a further technical solution, the support frame includes a support rod and a support plate. The support rod is fixedly connected to the inner wall of the cylinder and located between the two support rods. The support plate is movably disposed above the support rod and abuts against the support frame. The vibrating element is disposed in the middle of the support plate.

[0019] As a further technical solution, the support mechanism also includes multiple vibration damping components, and the support frame also includes an adjustment plate;

[0020] The adjusting plate is adjustable above the bearing rod, and the bearing plate is provided on the adjusting plate by a plurality of vibration buffers.

[0021] As a further technical solution, the support frame also includes two abutment auxiliary components. The two abutment auxiliary components are fixedly spaced along the X direction on the upper end surface of the support plate, and both abut against the side of the support frame near the support rod.

[0022] Compared with the prior art, the technical advantages of the PCB electroplating device provided by this utility model are as follows:

[0023] Because a vibrating element is installed on the support frame, which abuts against the support frame, and the cantilever assembly is movably mounted on the support frame, the PCB board is first suspended on the cantilever assembly during PCB electroplating. Then, the vibrating element is activated, causing the support frame to vibrate along the height direction. Simultaneously, the vibrating element generates vibration force and displacement, which are transmitted to the cantilever assembly through the support frame. This ensures that the vibration, force, and displacement in the height direction all act on the PCB board through the cantilever assembly. This allows the PCB board to fully react with the processing solution in the tank, while simultaneously removing any grease, oil, or other contaminants that may be present on the PCB board surface during the multiple vibrations. This prevents deviations in the electroplating uniformity caused by grease, oil, and other contaminants in subsequent electroplating processes, thereby reducing the PCB board scrap rate. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the PCB electroplating apparatus provided in this embodiment of the utility model;

[0026] Figure 2 This is an exploded view of the PCB electroplating apparatus provided in this embodiment of the present invention;

[0027] Figure 3 This is a front view of the PCB electroplating apparatus provided in this embodiment of the utility model.

[0028] In the picture:

[0029] 200. Support mechanism; 210. Support frame; 211. Support frame; 2111. First support shaft; 2112. Second support shaft; 212. Support rod; 213. Guide plate; 220. Vibrating component; 230. Bearing frame; 231. Bearing rod; 232. Bearing plate; 233. Adjusting plate; 234. Abutment auxiliary component; 240. Vibrating component; 250. Vibration buffer component; 260. Guide assembly; 261. Guide wheel; 262. Guide mounting plate; 270. Vibration buffer component;

[0030] 300. Cantilever assembly. Detailed Implementation

[0031] Before explaining any implementation of this application in detail, it should be understood that this application is not limited to its application to the structural details and component arrangements set forth in the following description or shown in the above drawings.

[0032] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0033] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "and / or" relationship.

[0034] In this application, the terms "connection," "combination," "coupling," and "installation" can refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without the need for an intermediary, while an indirect connection refers to two parts or components each being connected to at least one intermediary, with the connection achieved through the intermediary. Furthermore, "connection" and "coupling" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0035] In this application, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the values ​​and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​not using relative terms should also be disclosed as specific values ​​with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.

[0036] In this application, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0037] In this application, the directional terms "upper," "lower," "left," "right," "front," and "rear" are used to describe the orientation and positional relationships shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when an element is mentioned as being connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as upper side, lower side, left side, right side, front side, and rear side not only represent positive orientation but can also be understood as lateral orientation. For example, "below" can include directly below, lower left, lower right, lower front, and lower rear.

[0038] Combination Figures 1 to 3As shown, the PCB electroplating apparatus provided in this embodiment is used to complete the electroplating of PCB boards. During the electroplating process, it can ensure the uniformity of the electroplating of the PCB board and reduce the scrap rate of the PCB board. Specifically, the PCB electroplating apparatus includes a cylinder, a support mechanism 200, and a cantilever assembly 300: the cylinder is used to contain the processing solution; the support mechanism 200 includes a support frame 210, a vibrating element 220, a carrier frame 230, and a vibrating element 240. The support frame 210 and the carrier frame 230 are both fixedly installed on the cylinder and are both located near the top opening of the cylinder. The carrier frame 230 abuts against the support frame 210. The vibrating element 220 is installed on the support frame 210 and can drive the support frame 210 to vibrate in the height direction. The vibrating element 240 is installed on the carrier frame 230 and can drive the carrier frame 230 to vibrate; the cantilever assembly 300 is used to suspend the PCB board and is located above the support frame 210.

[0039] Because a vibrating element 240 is installed on the support frame 230, which abuts against the support frame 210, and a vibrating element 220 is installed on the support frame 210, the cantilever assembly 300 is movably mounted on the support frame 210. Therefore, during PCB electroplating, the PCB is first suspended on the cantilever assembly 300; then the vibrating elements 240 and 220 are activated. The vibrating element 220 drives the support frame 210 to vibrate along the height direction, while the vibrating element 240 generates vibration force and vibration displacement, which are transmitted to the cantilever assembly 300 through the support frame 210. This ensures that the vibration, vibration force, and vibration displacement in the height direction are all applied to the PCB through the cantilever assembly 300, allowing the PCB to fully react with the processing solution in the cylinder. At the same time, any grease, oil, or other contaminants that may be present on the PCB surface are removed during the multiple vibration processes, thus preventing deviations in the electroplating uniformity caused by grease, oil, and other contaminants in the subsequent electroplating process and reducing the scrap rate of the PCB.

[0040] Preferably, the support frame 210 includes a support frame 211 and two support rods 212. The two support rods 212 are fixedly connected to the inner wall of the cylinder at intervals along the X direction, and each of the two support rods 212 is provided with a vibrating element 220. The support frame 211 is located above the two support rods 212 and is connected to the output shaft of the two vibrating elements 220. The support frame 211 abuts against the bearing frame 230.

[0041] The vibrating element 220 can be configured as a cylinder, hydraulic cylinder, or motor, depending on actual needs. In this embodiment, the vibrating element 220 is configured as a cylinder. The output axis of the cylinder extends away from the support rod 212 and can extend and retract in the Z direction. The output shafts of both cylinders are connected to the support frame 211. The cantilever assembly 300 is positioned above the support frame 211. When the two cylinders start operating, they drive the support frame 211 to rise in the Z direction. Simultaneously, since the support frame 211 abuts against the bearing frame 230, the vibration displacement and vibration force generated by the vibrating element 220 are transmitted to the support frame 211, thereby generating forces in different directions on the cantilever assembly 300 mounted on the support frame 211. This facilitates the removal of contaminants from the PCB board suspended on the cantilever assembly 300. Furthermore, since both support rods 212 are fixedly connected to the cylinder body, the impact of forces in different directions on the cylinder body is reduced, ensuring the service life of the cylinder body.

[0042] Preferably, the support frame 211 includes two first support shafts 2111 and two second support shafts 2112, and the support mechanism 200 also includes a plurality of vibration buffers 250; the two first support shafts 2111 are spaced apart along the X direction and are connected to the output shafts of the two vibrating elements 220 in a corresponding transmission manner; each second support shaft 2112 is fixedly connected to the two first support shafts 2111 and is located above the two first support shafts 2111, and the two second support shafts 2112 are spaced apart along the Y direction; both second support shafts 2112 abut against the bearing frame 230, and vibration buffers 250 are provided between the ends of the two second support shafts 2112 and the corresponding support rods 212. With this configuration, when the cylinder output shaft extends to drive the support frame 211 to rise, and then as the cylinder output shaft retracts, the support frame 211 falls under its own weight. During the fall, a certain downward pressure is generated. The vibration buffer 250 located between the end of the second support shaft 2112 and the corresponding support rod 212 can offset this downward pressure, preventing all the downward pressure from being transmitted to the cylinder body through the support rod 212 and causing damage to the cylinder body.

[0043] Preferably, the vibration buffer 250 is a flexible component, fixedly disposed between the end of the corresponding second support shaft 2112 and the support rod 212. Thus, during the operation of the vibrating components 220 and 240, the flexible component is prevented from detaching from the end of the corresponding second support shaft 2112 and the support rod 212 due to external force, further ensuring the buffering and shock absorption effect, thereby further reducing the probability of cylinder damage due to external force. The vibration buffer 270 can be configured as a buffer spring, rubber component, or silicone component according to actual needs; no specific limitation is made here.

[0044] Preferably, the support mechanism 200 further includes multiple sets of guide components 260. Guide components 260 are provided between the two first support shafts 2111 and the corresponding support rods 212. Each guide component 260 can guide the two first support shafts 2111 to vibrate in the height direction.

[0045] Combination Figures 1 to 3 As shown, in this embodiment, four sets of guide components 260 are provided. These four sets of guide components 260 are respectively positioned at both ends of the two support rods 212. The two sets of guide components 260 arranged opposite each other along the X-direction cooperate with each other. During the operation of the vibrating elements 220 and 240, misalignment between the support frame 230 and the support frame 210 in the X-direction can be avoided, and the support frame 230 is guided to vibrate within a predetermined area, thereby ensuring the stable operation of the support mechanism 200. To avoid interference between the guide components 260 and the cylinder body, in this embodiment, the two sets of guide components 260 arranged opposite each other in the X-direction are located on the side where the two support rods 212 are close to each other.

[0046] Specifically, each guide assembly 260 includes a guide wheel 261 and a guide mounting plate 262. The guide mounting plate 262 is fixedly disposed below the corresponding first support shaft 2111. The guide wheel 261 is rotatably disposed on the guide mounting plate 262 and rolls with the corresponding support rod 212. The axis of the guide wheel 261 extends along the Y direction and rolls with the side wall of the support rod 212, limiting the relative position of the bearing frame 230 and the support frame 210 while avoiding sliding friction between them, thereby reducing the energy consumption of the vibrating elements 220 and 240.

[0047] Preferably, the support frame 210 further includes a guide plate 213, which is disposed above the support frame 211 and extends along the X direction. The cantilever assembly 300 is disposed on the guide plate 213. Two guide plates 213 are provided, and the two guide plates 213 are fixedly connected to the two second support shafts 2112 in a one-to-one correspondence, and are both located above the corresponding second support shafts 2112. The guide plates 213 are connected to the corresponding second support shafts 2112 by welding, riveting, or screwing. The height-direction vibrations, vibration forces, and vibration displacements generated by vibrating elements 220 and 240 are all transmitted to the corresponding guide plates 213 via the second support shaft 2112. Since the cantilever assembly 300 is connected to both guide plates 213, the guide plates 213 can drive the cantilever assembly 300 to vibrate at a certain frequency. Furthermore, the cantilever assembly 300 drives the PCB board to vibrate at a certain frequency within the processing solution. During the PCB board electroplating process, the PCB board is in a continuously vibrating environment, which effectively removes contaminants from the PCB board surface, making the electroplated layer of the PCB board more uniform and ensuring the electroplating quality of the PCB board, thereby further reducing the scrap rate of the PCB board electroplating. In this embodiment, the vibration of the cantilever assembly 300 driven by the guide plates 213 not only simplifies the transmission structure but also ensures operational reliability.

[0048] As a further technical solution, the support frame 230 includes a support rod 231 and a support plate 232. The support rod 231 is fixedly connected to the inner wall of the cylinder and is located between two support rods 212. The support plate 232 is movably disposed above the support rod 231 and abuts against the support frame 211. The vibration element 240 is disposed in the middle of the support plate 232.

[0049] Combination Figures 1 to 3 As shown, two support rods 231 are provided, and the two support rods 231 are fixedly connected to the inner wall of the cylinder at intervals along the X direction. The support plate 232 is movably disposed above the support rods 231, and both ends of the support plate 232 in the length direction abut against the two second support shafts 2112 respectively. The vibrating element 240 is disposed in the middle of the support plate 232. With this configuration, when the vibrating element 240 operates and generates vibration force and vibration displacement, the upward vibration force and vibration displacement are transmitted to the two second support shafts 2112 through the support plate 232, and then drive the cantilever assembly 300 to vibrate through the corresponding guide plate 213, so as to remove contaminants on the PCB board surface. The downward vibration force and vibration displacement are canceled out during the downward movement of the support plate 232 because the support plate 232 is movably disposed above the support rods 231, so as to avoid excessive transmission of downward vibration force and vibration displacement to the cylinder and damage to the cylinder. In this embodiment, the vibrating element 240 is a vibration motor.

[0050] As a further technical solution, the support mechanism 200 also includes multiple vibration buffers 270, and the support frame 230 also includes an adjustment plate 233; the adjustment plate 233 is adjustablely disposed above the support rod 231, and the support plate 232 is disposed on the adjustment plate 233 through multiple vibration buffers 270.

[0051] Specific combination Figure 2 As shown in this embodiment, multiple vibration buffers 270 are spaced apart between the support plate 232 and the adjustment plate 233. Through the damping effect of the multiple vibration buffers 270, the service life of the cylinder can be effectively avoided due to the vibration and vibration of the vibrating elements 240 and 220 during the electroplating process of the PCB board. At the same time, since the adjustment plate 233 is adjustable above the support rod 231, by adjusting the distance between the adjustment plate 233 and the support rod 231, the support plate 232 is always in contact with the support frame 211 during the vibration process, thereby ensuring the vibration transmission effect.

[0052] Preferably, the support frame 230 further includes two abutment auxiliary members 234, which are fixedly spaced along the X direction on the upper surface of the support plate 232 and abut against the side of the support frame 211 near the support rod 212. This further enhances the abutment effect between the support frame 230 and the support frame 211, thereby ensuring that the vibration force and vibration displacement generated by the vibrating element 240 are better transmitted to the cantilever assembly 300, thus further improving the removal effect of contaminants on the PCB board.

[0053] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A PCB electroplating apparatus, characterized in that, include: The cylinder is used to hold the processing solution; The support mechanism (200) includes a support frame (210), a vibrating element (220), a bearing frame (230), and a vibrating element (240). The support frame (210) and the bearing frame (230) are both fixedly mounted on the cylinder body and are both located near the top opening of the cylinder body. The bearing frame (230) abuts against the support frame (210). The vibrating element (220) is mounted on the support frame (210) and can drive the support frame (210) to vibrate in the height direction. The vibrating element (240) is mounted on the bearing frame (230) and can drive the bearing frame (230) to vibrate. A cantilever assembly (300) for suspending a PCB board is disposed above the support frame (210).

2. The PCB electroplating apparatus according to claim 1, characterized in that, The support frame (210) includes a support frame (211) and two support rods (212). The two support rods (212) are fixedly connected to the inner wall of the cylinder at intervals along the X direction, and the two support rods (212) are provided with the vibrating element (220). The support frame (211) is located above the two support rods (212) and is connected to the output shaft of the two vibrating elements (220) for transmission. The support frame (211) abuts against the bearing frame (230).

3. The PCB electroplating apparatus according to claim 2, characterized in that, The support frame (211) includes two first support shafts (2111) and two second support shafts (2112), and the support mechanism (200) also includes a plurality of vibration buffers (250); Two first support shafts (2111) are spaced apart along the X direction and are connected to the output shafts of the two vibrating elements (220) in a corresponding transmission manner. Each second support shaft (2112) is fixedly connected to the two first support shafts (2111) and located above the two first support shafts (2111). The two second support shafts (2112) are spaced apart along the Y direction. Both of the second support shafts (2112) abut against the bearing frame (230), and the vibration buffer (250) is provided between the ends of the two second support shafts (2112) and the corresponding support rods (212).

4. The PCB electroplating apparatus according to claim 3, characterized in that, The vibration buffer (250) is configured as a flexible component, which is fixedly disposed between the corresponding end of the second support shaft (2112) and the support rod (212).

5. The PCB electroplating apparatus according to claim 3, characterized in that, The support mechanism (200) further includes multiple sets of guide components (260). Each of the two first support shafts (2111) and the corresponding support rod (212) is provided with a guide component (260), and each guide component (260) can guide the two first support shafts (2111) to vibrate in the height direction.

6. The PCB electroplating apparatus according to claim 5, characterized in that, Each of the guide components (260) includes a guide wheel (261) and a guide mounting plate (262). The guide mounting plate (262) is fixedly disposed below the corresponding first support shaft (2111). The guide wheel (261) is rotatably disposed on the guide mounting plate (262) and rolls with the corresponding support rod (212).

7. The PCB electroplating apparatus according to claim 2, characterized in that, The support frame (210) also includes a guide plate (213), which is disposed above the support frame (211) and extends along the X direction. The cantilever assembly (300) is disposed on the guide plate (213).

8. The PCB electroplating apparatus according to claim 2, characterized in that, The support frame (230) includes a support rod (231) and a support plate (232). The support rod (231) is fixedly connected to the inner wall of the cylinder and located between the two support rods (212). The support plate (232) is movably disposed above the support rod (231) and abuts against the support frame (211). The vibrating element (240) is disposed in the middle of the support plate (232).

9. The PCB electroplating apparatus according to claim 8, characterized in that, The support mechanism (200) also includes multiple vibration buffers (270), and the support frame (230) also includes an adjustment plate (233); The adjusting plate (233) is adjustable above the bearing rod (231), and the bearing plate (232) is disposed on the adjusting plate (233) through a plurality of vibration buffers (270).

10. The PCB electroplating apparatus according to claim 9, characterized in that, The support frame (230) also includes two abutting auxiliary parts (234). The two abutting auxiliary parts (234) are fixedly spaced along the X direction on the upper end surface of the support plate (232) and abut against the side of the support frame (211) near the support rod (212).

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