Silicon wafer heating device

Abstract

The utility model relates to the technical field of heating equipment, in particular to a silicon wafer heating device, which comprises a box body, a heater, an upper fan, a lower fan and a plurality of turn-over mechanisms, the heater is arranged at the bottom in the box body and used for heating fluid, the upper fan is arranged on the top surface of the box body, and the lower fan is arranged on the bottom surface of the box body. The upper draught fan and the lower draught fan are used for enabling fluid in the box body to flow, the turn-over mechanism is arranged in the box body and located above the heater, and the turn-over mechanism is used for placing a silicon wafer and providing power for turn-over of the silicon wafer; the turn-over mechanism comprises a driving assembly, a first bearing plate and a second bearing plate, through the design of the turn-over mechanism, automatic turn-over of a silicon wafer in the drying process is achieved, so that drying of the two faces of the silicon wafer is completed, the structure is simple, efficiency is high, turn-over and carrying of the silicon wafer can be achieved at the same time, the working efficiency in the production and machining process is improved, and the production cost is reduced. The method is suitable for industrial batch production.

Description

Technical Field

[0001] This utility model relates to the field of heating equipment technology, and in particular to a silicon wafer heating device. Background Technology

[0002] Silicon wafer heating devices are primarily used to heat silicon wafers during semiconductor manufacturing. This heating process typically involves critical processes such as oxidation, impurity diffusion, and annealing, which are essential for the performance and reliability of semiconductor devices. The main purpose of double-sided silicon wafer processing is to improve the performance and quality of the wafers. Double-sided processing eliminates saw marks and damaged layers generated during the single-crystal dicing process, and improves the shape accuracy of the wafers. These wafers all require double-sided processing. Previously, the flipping process was done manually, which was inefficient. Furthermore, existing silicon wafer flipping devices suffer from complex structures, high manufacturing costs, and low operating efficiency. Utility Model Content

[0003] The technical problem to be solved by this utility model is: in order to overcome the problem that silicon wafers in the prior art need to be processed on both sides, and the flipping is usually done manually, which is inefficient, a silicon wafer heating device is provided.

[0004] The technical solution adopted by this utility model to solve its technical problem is: a silicon wafer heating device, including a box, a heater, an upper fan, a lower fan and several flipping mechanisms. The heater is arranged at the bottom of the box and is used to heat the fluid. The upper fan is arranged on the top surface of the box and the lower fan is arranged on the bottom surface of the box. The upper fan and the lower fan are used to make the fluid flow in the box. The flipping mechanism is arranged in the box and is located above the heater. The flipping mechanism is used to place the silicon wafer and provide power for flipping the silicon wafer.

[0005] The flipping mechanism includes a drive assembly, a first receiving plate, and a second receiving plate. The drive assembly is fixedly connected to the housing, the first receiving plate is rotatably connected to the housing, and the second receiving plate is rotatably connected to the housing. The output end of the drive assembly is connected to the first and second receiving plates. The drive assembly provides power for the closing and separating of the first and second receiving plates. Both the first and second receiving plates are used for placing silicon wafers. Through the design of the flipping mechanism, the automatic flipping of silicon wafers during the drying process is realized, thereby completing the drying of both sides of the silicon wafers. The structure is simple and efficient, and it can simultaneously realize the flipping and handling of silicon wafers, improving the work efficiency in the production and processing process and making it suitable for industrial mass production.

[0006] To solve the problem of silicon wafers getting stuck when flipping, the method further includes a first placement groove on the first receiving plate, the first placement groove having a first main contact surface and a first secondary contact surface, and a second placement groove on the second receiving plate, the second placement groove having a second main contact surface and a second secondary contact surface.

[0007] When the first receiving plate and the second receiving plate are closed, the height of the second secondary contact surface of the second placement groove is lower than the height of the first secondary contact surface of the first placement groove.

[0008] To address the issue of silicon wafers cracking due to height differences, a buffer assembly is further included on the second contact surface to absorb the potential energy during wafer flipping.

[0009] The device further includes a buffer assembly comprising a buffer block and a spring, with one end of the spring fixedly connected to the buffer block and the other end fixedly connected to a second contact surface.

[0010] The device further includes a drive assembly comprising a motor, a rotating wheel, a first connecting rod, and a second connecting rod. The motor is fixedly connected to the housing. One end of the first connecting rod is rotatably connected to the rotating wheel, and the other end is rotatably connected to the first receiving plate. One end of the second connecting rod is rotatably connected to the rotating wheel, and the other end is rotatably connected to the second receiving plate.

[0011] It further includes the connection point of the first connecting rod and the rotating wheel being arranged opposite to the connection point of the second connecting rod and the rotating wheel.

[0012] The beneficial effects of this utility model are as follows: The silicon wafer heating device provided by this utility model realizes the automatic flipping of silicon wafers during the drying process through the design of the flipping mechanism, thereby completing the drying of both sides of the silicon wafer. It has a simple structure, high efficiency, and can simultaneously realize the flipping and handling of silicon wafers, improving the work efficiency in the production and processing process, and is suitable for industrial mass production. Attached Figure Description

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a cross-sectional structural schematic diagram of the present invention;

[0016] Figure 3 This is a utility model Figure 2 Enlarged structural diagram at point A;

[0017] Figure 4 This is a schematic diagram of the structure of the first and second receiving plates of this utility model in a closed state.

[0018] In the diagram: 1. Housing, 2. Heater, 3. Upper fan, 4. Lower fan, 5. Flipping mechanism, 51. Drive assembly, 511. Motor, 512. Rotating wheel, 513. First connecting rod, 514. Second connecting rod, 52. First receiving plate, 521. First placement slot, 5211. First main contact surface, 5212. First secondary contact surface, 53. Second receiving plate, 531. Second placement slot, 5311. Second main contact surface, 5312. Second secondary contact surface, 54. Buffer assembly, 541. Buffer block, 542. Spring. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0020] like Figure 1 This is a schematic diagram of the structure of the present invention, a silicon wafer heating device, characterized in that it includes a housing 1, a heater 2, an upper fan 3, a lower fan 4, and several flipping mechanisms 5. The heater 2 is arranged at the bottom of the housing 1 and is used to heat the fluid. The upper fan 3 is arranged on the top surface of the housing 1, and the lower fan 4 is arranged on the bottom surface of the housing 1. The upper fan 3 and the lower fan 4 are used to make the fluid flow in the housing 1. The flipping mechanisms 5 are arranged inside the housing 1 and are located above the heater 2. The flipping mechanisms 5 are used to place the silicon wafer and provide power for flipping the silicon wafer. The air outlet of the upper fan 3 is facing upward, and the air outlet of the lower fan 4 is facing upward, so that the air force of the upper fan 3 and the lower fan 4 is superimposed, which accelerates the air flow in the housing 1.

[0021] like Figure 3 , Figure 4 As shown, the flipping mechanism 5 includes a drive assembly 51, a first receiving plate 52, and a second receiving plate 53. The drive assembly 51 is fixedly connected to the housing 1, the first receiving plate 52 is rotatably connected to the housing 1, and the second receiving plate 53 is rotatably connected to the housing 1. The output end of the drive assembly 51 is connected to the first receiving plate 52 and the second receiving plate 53. The drive assembly 51 is used to provide power for the closing and separating of the first receiving plate 52 and the second receiving plate 53. Both the first receiving plate 52 and the second receiving plate 53 are used for placing silicon wafers.

[0022] In the initial state, both the first receiving plate 52 and the second receiving plate 53 are placed horizontally.

[0023] In the initial state, the connection point between the first connecting rod 513 and the rotating wheel 512 is located below the rotating connection point between the first receiving plate 52 and the housing 1, and the connection point between the second connecting rod 514 and the rotating wheel 512 is located below the rotating connection point between the second receiving plate 53 and the housing 1.

[0024] like Figure 3 , Figure 4 As shown, a first placement groove 521 is provided on the first receiving plate 52, the first placement groove 521 has a first main contact surface 5211 and a first secondary contact surface 5212, and a second placement groove 531 is provided on the second receiving plate 53, the second placement groove 531 has a second main contact surface 5311 and a second secondary contact surface 5312.

[0025] When the first receiving plate 52 and the second receiving plate 53 are closed, the height of the second secondary contact surface 5312 of the second placement groove 531 is lower than the height of the first secondary contact surface 5212 of the first placement groove 521.

[0026] like Figure 3 , Figure 4 As shown, a buffer assembly 54 is arranged on the second contact surface 5312. The buffer assembly 54 is used to absorb the potential energy when the silicon wafer is flipped. The buffer assembly 54 includes a buffer block 541 and a spring 542. One end of the spring 542 is fixedly connected to the buffer block 541, and the other end is fixedly connected to the second contact surface 5312. The buffer block 541 can also be made of an elastic material, such as high-temperature resistant rubber.

[0027] The drive assembly 51 includes a motor 511, a rotating wheel 512, a first connecting rod 513, and a second connecting rod 514. The motor 511 is fixedly connected to the housing 1. One end of the first connecting rod 513 is rotatably connected to the rotating wheel 512, and the other end is rotatably connected to the first receiving plate 52. One end of the second connecting rod 514 is rotatably connected to the rotating wheel 512, and the other end is rotatably connected to the second receiving plate 53.

[0028] The connection point between the first connecting rod 513 and the rotating wheel 512 is arranged opposite to the connection point between the second connecting rod 514 and the rotating wheel 512.

[0029] When the plates close, the motor 511 starts, causing the rotating wheel 512 to rotate counterclockwise. The rotating wheel 512, through the first connecting rod 513, pulls the connection between the first connecting rod 513 and the rotating wheel 512 on the first receiving plate 52 towards the rotating wheel 512, causing the first receiving plate 52 to rotate clockwise. The rotating wheel 512, through the second connecting rod 514, pulls the connection between the second connecting rod 514 and the rotating wheel 512 on the second receiving plate 53 away from the rotating wheel 512, causing the first receiving plate 52 to rotate counterclockwise, thus closing the first receiving plate 52 and the second receiving plate 52. During the closing process, the silicon wafers located on the first receiving plate 52 are also subjected to force when the first receiving plate 52 rotates clockwise. Therefore, the silicon wafers on it will fall into the second placement groove 531 of the second receiving plate 53.

[0030] During separation, the motor 511 starts, causing the rotating wheel 512 to rotate clockwise. The rotating wheel 512, through the first connecting rod 513, pulls the connection between the first connecting rod 513 and the rotating wheel 512 on the first receiving plate 52 away from the rotating wheel 512, causing the first receiving plate 52 to rotate counterclockwise. The rotating wheel 512, through the second connecting rod 514, pulls the connection between the second connecting rod 514 and the rotating wheel 512 on the second receiving plate 53 closer to the rotating wheel 512, causing the first receiving plate 52 to rotate clockwise, thus separating the first receiving plate 52 and completing the flipping.

[0031] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A silicon wafer heating device, characterized in that, The device includes a housing (1), a heater (2), an upper fan (3), a lower fan (4), and several flipping mechanisms (5). The heater (2) is located at the bottom of the housing (1) and is used to heat the fluid. The upper fan (3) is located on the top surface of the housing (1), and the lower fan (4) is located on the bottom surface of the housing (1). The upper fan (3) and the lower fan (4) are used to make the fluid flow in the housing (1). The flipping mechanisms (5) are located inside the housing (1) and above the heater (2). The flipping mechanisms (5) are used to place the silicon wafer and provide power for flipping the silicon wafer. The flipping mechanism (5) includes a drive assembly (51), a first receiving plate (52), and a second receiving plate (53). The drive assembly (51) is fixedly connected to the housing (1). The first receiving plate (52) is rotatably connected to the housing (1). The second receiving plate (53) is rotatably connected to the housing (1). The output end of the drive assembly (51) is connected to the first receiving plate (52) and the second receiving plate (53). The drive assembly (51) is used to provide power for the closing and separating of the first receiving plate (52) and the second receiving plate (53). Both the first receiving plate (52) and the second receiving plate (53) are used for placing silicon wafers.

2. The silicon wafer heating device as described in claim 1, characterized in that: The first receiving plate (52) is provided with a first placement groove (521), the first placement groove (521) has a first main contact surface (5211) and a first secondary contact surface (5212), and the second receiving plate (53) is provided with a second placement groove (531), the second placement groove (531) has a second main contact surface (5311) and a second secondary contact surface (5312); When the first receiving plate (52) and the second receiving plate (53) are closed, the height of the second secondary contact surface (5312) of the second placement groove (531) is lower than the height of the first secondary contact surface (5212) of the first placement groove (521).

3. The silicon wafer heating device as described in claim 2, characterized in that: A buffer assembly (54) is arranged on the second contact surface (5312), which is used to absorb the potential energy when the silicon wafer is flipped.

4. The silicon wafer heating device as described in claim 3, characterized in that: The buffer assembly (54) includes a buffer block (541) and a spring (542). One end of the spring (542) is fixedly connected to the buffer block (541), and the other end is fixedly connected to the second contact surface (5312).

5. The silicon wafer heating device as described in claim 1, characterized in that: The drive assembly (51) includes a motor (511), a rotating wheel (512), a first connecting rod (513), and a second connecting rod (514). The motor (511) is fixedly connected to the housing (1). One end of the first connecting rod (513) is rotatably connected to the rotating wheel (512), and the other end is rotatably connected to the first receiving plate (52). One end of the second connecting rod (514) is rotatably connected to the rotating wheel (512), and the other end is rotatably connected to the second receiving plate (53).

6. The silicon wafer heating device as described in claim 5, characterized in that: The connection between the first connecting rod (513) and the rotating wheel (512) is arranged opposite to the connection between the second connecting rod (514) and the rotating wheel (512).

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