Surface-mounted diode with plastic package structure

Abstract

The utility model discloses a surface-mounted diode with a plastic package structure, which comprises a semiconductor chip, the surface of the semiconductor chip is fixedly connected with a plastic package part, the surface of the plastic package part is fixedly connected with a protective shell, two sides of the top of the protective shell are respectively provided with a buffer mechanism, and the protective shell comprises an anti-oxidation layer, an insulating layer, an antistatic layer and a corrosion-resistant layer. The outer wall of the anti-oxidation layer is fixedly connected with an insulating layer, the outer wall of the insulating layer is fixedly connected with an anti-static layer, the outer wall of the anti-static layer is fixedly connected with a corrosion-resistant layer, and the buffer mechanism comprises two mounting grooves, two sliding columns, two buffer springs, two sliding sleeves, two connecting rods and a protective plate. The plastic package part is arranged on the surface of the semiconductor chip, so that the influence of external moisture and dust is avoided, the buffer mechanism is arranged to play a role in buffering physical impact, and the influence and damage to the main body part of the diode are reduced.

Description

Technical Field

[0001] This utility model relates to the field of diode technology, specifically to a surface-mount diode with a plastic-encapsulated structure. Background Technology

[0002] Surface mount diodes are surface-mount components widely used in circuits to control current direction and protect circuit components. They have advantages such as small size and stable performance.

[0003] However, existing surface-mount diodes have the following drawbacks:

[0004] (1) Existing surface mount diodes lack a good protective structure, and the chips are easily affected by moisture and static electricity, which reduces their durability;

[0005] (2) Existing surface mount diodes lack buffer protection structures and are easily damaged by accidental impacts, affecting normal use. Utility Model Content

[0006] The purpose of this invention is to provide a surface-mount diode with a plastic-encapsulated structure to solve the problems mentioned in the background art, such as the lack of a good protective structure for existing surface-mount diodes, the susceptibility of the chip to moisture and static electricity, which reduces durability, and the lack of a buffer protection structure on the surface-mount diode, which makes it susceptible to damage from accidental impacts and affects normal use.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a surface-mount diode with a plastic-encapsulated structure, comprising a semiconductor chip, a plastic-encapsulated portion fixedly connected to the surface of the semiconductor chip, a protective shell fixedly connected to the surface of the plastic-encapsulated portion, and buffer mechanisms installed on both sides of the top of the protective shell. The protective shell includes an anti-oxidation layer, an insulating layer, an antistatic layer, and a corrosion-resistant layer. An insulating layer is fixedly connected to the outer wall of the anti-oxidation layer, an antistatic layer is fixedly connected to the outer wall of the insulating layer, and a corrosion-resistant layer is fixedly connected to the outer wall of the antistatic layer. The buffer mechanism includes two mounting slots, two sliding pillars, two buffer springs, two sliding sleeves, two connecting rods, and a protective plate. Thermally conductive films are fixedly connected to both the front and back sides of the semiconductor chip, and heat dissipation fins are fixedly connected to the surface of the thermally conductive films.

[0008] When using a surface-mount diode with a plastic-encapsulated structure according to this technical solution, the plastic-encapsulated portion is provided on the surface of the semiconductor chip to avoid the influence of external moisture and dust, and the buffer mechanism can buffer the physical impact received, reducing the impact and damage to the main body of the diode.

[0009] In a preferred embodiment of this invention, two mounting slots are formed on one side of the top of the protective shell. A sliding column is fixedly connected to the inner wall of each mounting slot. A sliding sleeve is slidably connected to the surface of each sliding column. A connecting rod is rotatably connected to the surface of each sliding sleeve. A protective plate is rotatably connected to one end of each connecting rod. A buffer spring is fitted onto one side of the sliding column surface. The protective plate provides protection against impacts from external objects.

[0010] In a preferred embodiment of this invention, one end of the buffer spring is fixedly connected to the sliding sleeve, and the other end of the buffer spring is fixedly connected to the inner wall of the mounting groove. The buffer spring effectively cushions the impact force, reducing potential damage.

[0011] In a preferred embodiment of this invention, a positive electrode pin is fixedly connected to one side of the bottom of the semiconductor chip, and a negative electrode pin is fixedly connected to the other side of the bottom of the semiconductor chip. Both the positive and negative electrode pins are located outside the protective casing. The pins are provided for electrical connection to a surface-mount diode.

[0012] In a preferred embodiment of this invention, a buffer pad is fixedly connected to the surface of the protective plate. The buffer pad reduces damage to the protective plate from physical impacts.

[0013] As a preferred embodiment of this invention, the guard plate has a chamfer in the middle. The chamfer reduces impact damage.

[0014] In a preferred embodiment of this invention, reinforcing ribs are fixedly connected to the surfaces of both the positive and negative leads. These reinforcing ribs prevent the leads from deforming.

[0015] In a preferred embodiment of this invention, both the bottom ends of the positive and negative leads are coated with a flux coating. This flux coating facilitates soldering of the leads.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] 1. By providing a plastic encapsulation portion on the surface of the semiconductor chip, the semiconductor chip is encapsulated to avoid the influence of external moisture and dust, and heat dissipation is good. By providing an anti-oxidation layer inside the protective case, the core is prevented from oxidizing and good electrical contact is ensured. An insulating layer is provided to prevent short circuits and leakage. An anti-static layer is provided to prevent static electricity accumulation and protect the diode from electrostatic discharge damage. An outer corrosion-resistant layer is provided to prevent chemical substances in the environment from damaging the diode and improve the chip's durability.

[0018] 2. By setting buffer mechanisms on both sides of the top of the surface mount diode, the protective plates act as a barrier when subjected to physical impact, preventing direct collision with the surface mount diode. When the protective plates are moved by the impact, they will compress the buffer spring. Under the action of the buffer spring, the impact force can be buffered, thereby reducing the impact and damage to the main body of the surface mount diode and improving safety. Attached Figure Description

[0019] Figure 1 This is a perspective view of the present utility model;

[0020] Figure 2 This is a cross-sectional view of the present invention;

[0021] Figure 3 This is a cross-sectional view of the protective shell of this utility model;

[0022] Figure 4 This is a cross-sectional view of the buffer mechanism of this utility model.

[0023] In the diagram: 1. Semiconductor chip; 2. Molding unit; 3. Positive lead; 4. Negative lead; 5. Sheath; 501. Antioxidant layer; 502. Insulating layer; 503. Antistatic layer; 504. Corrosion resistant layer; 6. Thermal conductive film; 7. Heat sink fins; 8. Buffer mechanism; 801. Mounting slot; 802. Sliding column; 803. Buffer spring; 804. Sliding sleeve; 805. Connecting rod; 806. Protective plate; 9. Buffer pad; 10. Chamfer; 11. Reinforcing rib; 12. Flux coating. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-4This utility model provides a surface-mount diode with a plastic-encapsulated structure, including a semiconductor chip 1, a plastic-encapsulated part 2 fixedly connected to the surface of the semiconductor chip 1, a protective shell 5 fixedly connected to the surface of the plastic-encapsulated part 2, and buffer mechanisms 8 installed on both sides of the top of the protective shell 5. The protective shell 5 includes an anti-oxidation layer 501, an insulating layer 502, an antistatic layer 503, and a corrosion-resistant layer 504. The outer wall of the anti-oxidation layer 501 is fixedly connected to the insulating layer 502, the outer wall of the insulating layer 502 is fixedly connected to the antistatic layer 503, and the outer wall of the antistatic layer 503 is fixedly connected to the corrosion-resistant layer 504, thereby improving the protection of the semiconductor chip 1. The buffer mechanism 8 includes two mounting slots 801, two sliding pillars 802, two buffer springs 803, two sliding sleeves 804, two connecting rods 805, and a protective plate 806, which play a role in buffering and anti-collision. Thermal conductive films 6 are fixedly connected to the front and back of the semiconductor chip 1, and heat dissipation fins 7 are fixedly connected to the surface of the thermal conductive films 6, which can accelerate the dissipation of heat.

[0026] In use, a plastic encapsulation portion 2 is provided on the surface of the semiconductor chip 1 to encapsulate the semiconductor chip 1 and prevent it from being affected by external moisture and dust. A thermally conductive film 6 is provided to facilitate the conduction of heat to the heat dissipation fins 7 and improve heat dissipation performance. An anti-oxidation layer 501 is provided inside the protective shell 5 to prevent the core from oxidizing and ensure good electrical contact. An insulating layer 502 is provided to prevent short circuits and leakage. An antistatic layer 503 is provided to prevent static electricity accumulation and protect the diode from damage caused by electrostatic discharge. An anti-corrosion layer 504 is provided on the outer layer to prevent chemical substances in the environment from damaging the diode and improve the durability of the chip.

[0027] Two mounting slots 801 are formed on one side of the top of the protective shell 5. The inner walls of the two mounting slots 801 are fixedly connected to sliding pillars 802. The surfaces of the two sliding pillars 802 are slidably connected to sliding sleeves 804. The surfaces of the two sliding sleeves 804 are rotatably connected to connecting rods 805. One end of the two connecting rods 805 is rotatably connected to a protective plate 806 for protection. A buffer spring 803 is fitted on one side of the surface of the sliding pillar 802. One end of the buffer spring 803 is fixedly connected to the sliding sleeve 804, and the other end of the buffer spring 803 is fixedly connected to the inner wall of the mounting slot 801 to prevent displacement. A buffer pad 9 is fixedly connected to the surface of the protective plate 806. The middle of the protective plate 806 is provided with a chamfer 10 to reduce collision damage.

[0028] In use, buffer mechanisms 8 are provided on both sides of the top of the surface mount diode. When subjected to physical impact, the protective plate 806 acts as a barrier to prevent direct collision with the surface mount diode. When the protective plate 806 is moved by the impact, it will drive the sliding sleeve 804 to move on the surface of the sliding column 802 through the connecting rod 805, which will compress the buffer spring 803. Under the action of the elastic force of the buffer spring 803, the impact force can be buffered, reducing the impact and damage to the main body of the surface mount diode. The silicone buffer pad 9 and the chamfer 10 can reduce the collision damage between the foreign object and the protective plate 806.

[0029] A positive electrode pin 3 is fixedly connected to one side of the bottom of the semiconductor chip 1, and a negative electrode pin 4 is fixedly connected to the other side of the bottom of the semiconductor chip 1. One end of the positive electrode pin 3 and one end of the negative electrode pin 4 are both placed outside the protective shell 5 for conducting electricity. Reinforcing ribs 11 are fixedly connected to the surfaces of the positive electrode pin 3 and the negative electrode pin 4 to improve the structural strength. The bottom ends of the positive electrode pin 3 and the negative electrode pin 4 are coated with flux coating 12 to facilitate soldering.

[0030] In use, the positive pin 3 and negative pin 4 are used for the electrical connection of the surface mount diode. The reinforcing ribs 11 on the pins can improve their strength and prevent them from bending and deforming. The rosin-based flux coating 12 is used to help the solder flow during the soldering process and clean the solder joint, making pin soldering more convenient.

[0031] In practical use, this utility model's surface-mount diode with a plastic-encapsulated structure features an epoxy resin encapsulation portion 2 on the surface of the semiconductor chip 1, encapsulating the semiconductor chip 1 to prevent it from being affected by external moisture and dust. A thermally conductive film 6 facilitates heat conduction to the heat dissipation fins 7, improving heat dissipation performance. A silver-plated anti-oxidation layer 501 is provided inside the protective shell 5 to prevent core oxidation and ensure good electrical contact. A polytetrafluoroethylene insulating layer 502 prevents short circuits and leakage. An antistatic layer 503, using an antistatic coating, prevents static electricity accumulation and protects the diode from electrostatic discharge damage. An outer layer is also provided with a... The etch layer 504, made of ceramic coating, can prevent damage to the diode from chemicals in the environment and improve the chip's durability. Buffer mechanisms 8 are provided on both sides of the top of the surface-mount diode. When subjected to physical impact, the protective plate 806 acts as a barrier, preventing direct collision with the surface-mount diode. When the protective plate 806 is moved by an impact, it will drive the sliding sleeve 804 to move on the surface of the sliding column 802 via the connecting rod 805, compressing the buffer spring 803. The spring force of the buffer spring 803 then buffers the impact force, reducing the impact and damage to the main body of the surface-mount diode and improving safety.

[0032] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A surface-mount diode with a plastic-encapsulated structure, comprising a semiconductor chip (1), characterized in that: A molding compound (2) is fixedly connected to the surface of the semiconductor chip (1). A protective shell (5) is fixedly connected to the surface of the molding compound (2). Buffer mechanisms (8) are installed on both sides of the top of the protective shell (5). The protective shell (5) includes an anti-oxidation layer (501), an insulating layer (502), an antistatic layer (503), and a corrosion-resistant layer (504). An insulating layer (502) is fixedly connected to the outer wall of the anti-oxidation layer (501). An insulating layer (504) is fixedly connected to the outer wall of the insulating layer (502). An antistatic layer (503) is provided, and a corrosion-resistant layer (504) is fixedly connected to the outer wall of the antistatic layer (503). The buffer mechanism (8) includes two mounting slots (801), two sliding columns (802), two buffer springs (803), two sliding sleeves (804), two connecting rods (805), and a protective plate (806). Thermal conductive films (6) are fixedly connected to both the front and back sides of the semiconductor chip (1), and heat dissipation fins (7) are fixedly connected to the surface of the thermal conductive films (6).

2. A surface-mount diode with a plastic-encapsulated structure according to claim 1, characterized in that: Two mounting slots (801) are opened on one side of the top of the protective shell (5). The inner walls of the two mounting slots (801) are fixedly connected with sliding columns (802). The surfaces of the two sliding columns (802) are slidably connected with sliding sleeves (804). The surfaces of the two sliding sleeves (804) are rotatably connected with connecting rods (805). One end of the two connecting rods (805) is rotatably connected with a protective plate (806). A buffer spring (803) is sleeved on one side of the surface of the sliding column (802).

3. A surface-mount diode with a plastic-encapsulated structure according to claim 2, characterized in that: One end of the buffer spring (803) is fixedly connected to the sliding sleeve (804), and the other end of the buffer spring (803) is fixedly connected to the inner wall of the mounting groove (801).

4. A surface-mount diode with a plastic-encapsulated structure according to claim 1, characterized in that: A positive electrode pin (3) is fixedly connected to one side of the bottom end of the semiconductor chip (1), and a negative electrode pin (4) is fixedly connected to the other side of the bottom end of the semiconductor chip (1). Both the positive electrode pin (3) and the negative electrode pin (4) are placed outside the protective shell (5).

5. A surface-mount diode with a plastic-encapsulated structure according to claim 2, characterized in that: A buffer pad (9) is fixedly connected to the surface of the guard plate (806).

6. A surface-mount diode with a plastic-encapsulated structure according to claim 1, characterized in that: The guard plate (806) has a chamfer (10) in the middle.

7. A surface-mount diode with a plastic-encapsulated structure according to claim 4, characterized in that: The positive pin (3) and the negative pin (4) are both fixedly connected with reinforcing ribs (11).

8. A surface-mount diode with a plastic-encapsulated structure according to claim 4, characterized in that: The bottom of the positive pin (3) and the bottom of the negative pin (4) are both coated with a flux coating (12).

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