Soldering paste stirring device for high-temperature semiconductor die bonding

Abstract

The utility model discloses a soldering paste stirring device for high-temperature semiconductor die bonding, which belongs to the technical field of soldering paste, aims at solving the problems that the structure is complicated and the soldering paste is inconvenient to stir, place and take, and comprises a driving device, a rotating shaft and a rotating disc, and the rotating shaft is driven by the driving device to rotate to drive the rotating disc to rotate. An adjusting and stirring mechanism is arranged on the rotating shaft and connected with a rotating disc, a mounting disc is arranged on the rotating disc, and a solder paste tank is detachably mounted on the mounting disc; by means of the arranged adjusting and stirring mechanism, soldering paste can be fully stirred and mixed conveniently when stirred, the structure is simple, implementation is convenient, the feasibility and operability of the device are improved, and the production efficiency is improved. The soldering paste in the soldering paste tank can be rapidly stirred and mixed by adjusting the stirring mechanism, meanwhile, the soldering paste in the soldering paste tank can be conveniently placed and taken, and the convenience in the operation process is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to solder paste technical field, concretely relates to a solder paste stirring device for high temperature semiconductor die bonding. BACKGROUND

[0002] Solder paste is also called tin paste, English name solder paste, gray audio body. Solder paste is a new type of welding raw material that emerges with SMT (surface mount technology), which is a paste mixture formed by mixing solder powder, flux and other surfactants, thixotropic agents, etc. It is mainly used for welding of electronic components in SMT industry.

[0003] In the prior art, the patent No. CN214346000U discloses a kind of stirring device for solder paste, the above-mentioned patent rotating frame, outer material tank, inner material tank, first rotary drive mechanism and second rotary drive mechanism, the first rotary drive mechanism is connected rotating frame, to drive rotating frame rotation, the outer material tank is arranged on rotating frame, the inner material tank is used to contain solder paste, the inner material tank is detachably assembled in outer material tank and can revolve around a central axis, the second rotary drive mechanism is arranged on the outer material tank and connected to the inner material tank, to drive the inner material tank to revolve. The way of revolution + revolution is used for fully mixing and forming. The existing stirring blade is discarded, and the structure is simple, the floor area is not large, and it can be well applied to laboratory for preparing small amount of solder paste. However, the following problems still exist in actual use: starting from reality, although the device can be fully mixed and stirred by revolution and revolution during the stirring process of solder paste, the structure is complex, multiple motors are needed to cooperate, and it is inconvenient to place and take the solder paste, which reduces the practicality.

[0004] Therefore, a solder paste stirring device for high temperature semiconductor die bonding is needed to solve the problems of complex structure and inconvenient stirring, placing and taking in the prior art. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a solder paste stirring device for high temperature semiconductor die bonding to solve the problems in the background art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a solder paste stirring device for high temperature semiconductor die bonding, including drive device, pivot and rotary disc, the pivot is driven to rotate by drive device and drives rotary disc to rotate, the pivot is provided with adjusting stirring mechanism and is connected with rotary disc, the rotary disc is provided with mounting disc, and the tin paste tank is detachably installed on the mounting disc.

[0007] The adjusting stirring mechanism is connected with the mounting disc through a rotating disc, and is used for adjusting the rotation of the mounting disc.

[0008] It is worth mentioning that the mounting disc is provided with five mounting discs on the upper part of the rotating disc, and the five mounting discs are connected with the adjusting stirring mechanism.

[0009] Further, the adjusting stirring mechanism comprises a connecting groove, the connecting groove is arranged in the rotating shaft, a limiting groove is arranged in the connecting groove, a limiting plate is arranged in the connecting groove through the limiting groove, the upper part of the limiting plate is fixedly connected with a movable rod, the top end of the movable rod is fixedly connected with an electric telescopic rod, the upper part of the electric telescopic rod is provided with a mounting groove in the rotating shaft for mounting the electric telescopic rod, a connecting block is fixedly connected to the outer side of the movable rod and arranged close to the top end, a through groove is arranged on the rotating shaft corresponding to the connecting block for limiting sliding of the connecting block on the rotating shaft, one end of the connecting block is hingedly connected with a connecting rod through a hinge rod, the upper end of the connecting rod is hingedly connected with a movable block through a hinge rod, the movable block is provided with a movable groove on the rotating disc corresponding to the movable block for rotation of the movable block, a fixed shaft is fixedly connected in the movable groove, and the movable block is rotatably arranged in the movable groove through the fixed shaft.

[0010] Further, the limiting groove is arranged in the connecting groove.

[0011] As a preferred embodiment, the connecting block is arranged on the movable rod, and the five connecting blocks are uniformly distributed on the movable rod and correspond to the five mounting discs.

[0012] As a preferred embodiment, the through groove is arranged at the same height as the connecting groove.

[0013] Compared with the prior art, the solder paste stirring device for high-temperature semiconductor die bonding has at least the following beneficial effects:

[0014] (1) The adjusting stirring mechanism can be used for fully stirring and mixing the solder paste, and has the advantages of simple structure, easy implementation, improved implementability and operability.

[0015] (2) The adjusting stirring mechanism can quickly stir and mix the solder paste in the tin paste tank, and is convenient for placing and taking the solder paste in the tin paste tank, improving the convenience in the operation process. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is worth mentioning that the mounting disc is provided with five mounting discs on the upper part of the rotating disc, and the five mounting discs are connected with the adjusting stirring mechanism.

[0017] Figure 2 It is the second view angle structure schematic view of the utility model;

[0018] Figure 3 It is the cut structure schematic view of the utility model;

[0019] Figure 4 It is the split structure schematic view of the utility model.

[0020] In the drawing: 1, drive device;2, rotating shaft;3, rotating disc;4, adjusting stirring mechanism;401, connecting groove;402, limiting groove;403, limiting plate;404, movable rod;405, electric telescopic rod;406, mounting groove;407, connecting block;408, through groove;409, connecting rod;4010, movable block;4011, movable groove;4012, fixed shaft;5, mounting disc;6, tin paste jar. DETAILED DESCRIPTION

[0021] The utility model is further described below in combination with examples.

[0022] Please refer to Figures 1-4 The utility model provides a kind of soldering tin paste stirring device for high-temperature semiconductor die bonding, including drive device 1, rotating shaft 2 and rotating disc 3, rotating shaft 2 is driven to rotate by drive device 1 and drives rotating disc 3 to rotate, adjusting stirring mechanism 4 is provided on rotating shaft 2 and is connected with rotating disc 3, rotating disc 3 is provided on mounting disc 5, and tin paste jar 6 is detachably installed on mounting disc 5.

[0023] Drive device 1, rotating shaft 2 and rotating disc 3 have been specifically disclosed in the patent with the patent announcement No.

[0024] Adjusting stirring mechanism 4 is connected with mounting disc 5 by rotating disc 3, and adjusting stirring mechanism 4 is used for rotating adjustment to mounting disc 5.

[0025] Further as Figure 1 , Figure 2 and Figure 3 It is worth specifically explained that five mounting discs 5 are provided on the upper portion of rotating disc 3, and the five mounting discs 5 are respectively connected with adjusting stirring mechanism 4.

[0026] By adjusting stirring mechanism 4, the tin paste can be fully stirred and mixed when stirring, and the structure is simple and easy to implement, which improves the implementability and operability of the device.

[0027] Further as Figure 2 , Figure 3 and Figure 4As shown, it is worth noting that the adjusting stirring mechanism 4 comprises a connecting groove 401 opened in the rotating shaft 2, a limiting groove 402 arranged in the connecting groove 401, a limiting plate 403 limited and slidably arranged in the connecting groove 401 through the limiting groove 402, a movable rod 404 fixedly connected to the upper portion of the limiting plate 403, an electric telescopic rod 405 fixedly connected to the top end of the movable rod 404, an installation groove 406 opened in the rotating shaft 2 and used for installing the electric telescopic rod 405, a connecting block 407 fixedly connected to the outer side of the movable rod 404 and arranged close to the top end, a through groove 408 opened in the rotating shaft 2 and used for limiting and sliding the connecting block 407, a connecting rod 409 hingedly connected to one end of the connecting block 407, a movable block 4010 hingedly connected to the upper end of the connecting rod 409, a movable groove 4011 opened in the rotating disc 3 and used for rotating the movable block 4010, a fixing shaft 4012 fixedly connected in the movable groove 4011, the movable block 4010 rotatably arranged in the movable groove 4011 through the fixing shaft 4012, the movable block 4010 connected to the bottom of the mounting disc 5, the limiting groove 402 arranged in the connecting groove 401 in a cross shape, five connecting blocks 407 arranged on the movable rod 404, and the five connecting blocks 407 evenly distributed on the movable rod 404 and arranged corresponding to the five mounting discs 5, and the through groove 408 opened with the same height as the connecting groove 401.

[0028] In use, the electric telescopic rod 405 drives the movable rod 404 to slide in the connecting groove 401, and the limiting plate 403 enables the movable rod 404 to stably slide in the connecting groove 401, the connecting block 407 slides in the through groove 408 during the sliding of the movable rod 404, the connecting block 407 drives the connecting rod 409 to move, the movable block 4010 rotates in the movable groove 4011 through the fixing shaft 4012, the mounting disc 5 connected to the movable block 4010 reciprocatingly swings, and the rotating disc 3 rotates, thereby improving the efficiency of mixing the tin paste in the tin paste tank 6.

[0029] The scheme has the following working process: when the device is used, the driving device 1 can drive the rotating shaft 2 to rotate, so that the rotating disc 3 rotates, and the tin paste tank 6 arranged thereon can be quickly rotated, so as to mix the tin paste in it. At the same time, in the process of rotation, the electric telescopic rod 405 is operated to make the electric telescopic rod 405 push the movable rod 404 to slide in the connecting groove 401, and the limiting plate 403 is arranged to make the movable rod 404 slide stably in the connecting groove 401. In the sliding process of the movable rod 404, the connecting block 407 slides in the through groove 408, and the connecting rod 409 is driven to move through the sliding of the connecting block 407, so that the movable block 4010 rotates in the movable groove 4011 through the fixed shaft 4012, so that the mounting disc 5 connected with the movable block 4010 reciprocating swings, and the rotation of the rotating disc 3 can improve the mixing efficiency of the tin paste in the tin paste tank 6. At the same time, the tin paste tank 6 is detachably arranged on the upper part of the mounting disc 5, which is convenient for placing and taking the tin paste in the tin paste tank 6, and greatly improves the convenience of the device.

[0030] In summary: by setting the adjusting stirring mechanism 4, the solder paste can be conveniently and fully stirred and mixed when stirring, and the structure is simple and easy to implement, which improves the implementability and operability of the device; the solder paste in the tin paste tank 6 can be quickly stirred and mixed by the adjusting stirring mechanism 4, and the solder paste in the tin paste tank 6 can be conveniently placed and taken, which improves the convenience in the operation process.

Claims

1. A solder paste stirring device for high-temperature semiconductor die bonding, comprising a driving device (1), a rotating shaft (2), and a rotating disk (3), characterized in that: The rotating shaft (2) is driven by the driving device (1) to drive the rotating disk (3) to rotate. The rotating shaft (2) is provided with an adjusting stirring mechanism (4) and connected to the rotating disk (3). The rotating disk (3) is provided with an installation disk (5). A solder paste container (6) is detachably installed on the installation disk (5). The adjusting stirring mechanism (4) is connected to the mounting plate (5) via the rotating disk (3), and the adjusting stirring mechanism (4) is used to adjust the rotation of the mounting plate (5).

2. The solder paste stirring device for high-temperature semiconductor die bonding according to claim 1, characterized in that: Five mounting discs (5) are provided on the upper part of the rotating disc (3), and the five mounting discs (5) are respectively connected to the adjusting stirring mechanism (4).

3. The solder paste stirring device for high-temperature semiconductor die bonding according to claim 2, characterized in that: The regulating stirring mechanism (4) includes a connecting groove (401), which is located inside the rotating shaft (2). A limiting groove (402) is provided inside the connecting groove (401). A limiting plate (403) is slidably provided inside the connecting groove (401) through the limiting groove (402). A movable rod (404) is fixedly connected to the upper part of the limiting plate (403). An electric telescopic rod (405) is fixedly connected to the top of the movable rod (404). An installation groove (406) for installing the electric telescopic rod (405) is provided inside the rotating shaft (2) on the upper part of the electric telescopic rod (405). A connecting block (407) is fixedly connected to the outside of the movable rod (404) and located near the top. A matching through groove (408) is provided on the rotating shaft (2) for the connecting block (407) to be limited and slidably disposed on the rotating shaft (2). One end of the connecting block (407) is hinged to a connecting rod (409) through a hinge rod. The upper end of the connecting rod (409) is hinged to a movable block (4010) through a hinge rod. The movable block (4010) is provided with a movable groove (4011) on the rotating disk (3) for its rotation. A fixed shaft (4012) is fixedly connected in the movable groove (4011). The movable block (4010) is rotatably disposed in the movable groove (4011) through the fixed shaft (4012). The top of the movable block (4010) is connected to the bottom of the mounting disk (5).

4. The solder paste stirring device for high-temperature semiconductor die bonding according to claim 3, characterized in that: The limiting groove (402) is arranged in a cross shape inside the connecting groove (401).

5. The solder paste stirring device for high-temperature semiconductor die bonding according to claim 4, characterized in that: Five connecting blocks (407) are provided on the movable rod (404), and the five connecting blocks (407) are evenly distributed on the movable rod (404) and are provided corresponding to the five mounting plates (5).

6. The solder paste stirring device for high-temperature semiconductor die bonding according to claim 5, characterized in that: The height of the through groove (408) is the same as the height of the connecting groove (401).

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