Scribing assembly

Abstract

The utility model relates to the technical field of semiconductor production, and particularly discloses a scribing assembly which comprises a carrying table and a scribing piece. The top surface of the carrying table is a plane; the scribing piece is fixed on the top surface of the carrying table; and the scribing piece protrudes out of the top surface of the carrying table. According to the scribing assembly provided by the scheme, the scribing piece is fixed on the carrying table, so that a worker can drive the wafer to rub with the scribing piece by holding the wafer with two hands, and compared with the mode of holding the scribing piece with the hands, the stability of the scribing process can be improved, so that the scribing success rate and the scribing efficiency are improved; when the wafer needs to be broken, the scribing piece fixed on the carrying table can be used as a supporting structure for breaking the wafer, so that researchers can break the wafer conveniently, and the wafer breaking difficulty is reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more particularly to a dicing assembly. Background Technology

[0002] In the field of semiconductor device manufacturing and research, wafer cross-section inspection is a process used to evaluate the internal structural integrity of devices, the bonding state of material interfaces, and potential defects. Especially in research settings, researchers often need to conduct cross-section analysis on small batches of experimental wafers of various specifications; in this process, the wafers need to be cut or broken before cross-section analysis to form a cross-section.

[0003] If dedicated equipment is used on a mass production line for the chip breaking process of small batches (usually single digits), there will be problems such as high cost due to large resource consumption, long start-up and adjustment cycles, and low efficiency due to cumbersome operation. Therefore, the commonly used chip breaking process is still done manually by staff.

[0004] The existing method for breaking wafers involves manually applying pressure to the area of ​​the wafer to be broken using a scribing tool with a hardness higher than that of the wafer substrate (such as a diamond blade or a tungsten carbide blade) to form a continuous stress concentration line. After scribing, researchers slowly apply a force perpendicular to the scribing direction until the wafer breaks along the scribing line to obtain a cross-section that can be observed under a microscope.

[0005] However, small-sized wafers (less than 1 inch) are not easy to break when being broken, which presents a problem of difficulty in breaking them; for large-sized wafers, when operating the scribing parts, the scribing parts are prone to deviate from the preset path, forming invalid scribing marks, thus resulting in a low success rate. Utility Model Content

[0006] In view of this, the purpose of this application is to provide a dicing assembly to solve some or all of the above-mentioned problems.

[0007] To achieve the above-mentioned technical objectives, this application provides a dicing assembly, including: a stage and a dicing component;

[0008] The top surface of the platform is a plane;

[0009] The scribing element is fixed to the top surface of the stage;

[0010] The engraving protrudes from the top surface of the stage.

[0011] Furthermore, the platform is provided with a groove, and the scribing element is adhered to the groove, or...

[0012] The platform and the engraving part are integrally formed.

[0013] Furthermore, the engraving element is needle-shaped or triangular pyramid-shaped.

[0014] Furthermore, the tip of the scribing element is located at the edge of the stage.

[0015] Furthermore, the platform is provided with scale lines.

[0016] Furthermore, the scale lines are perpendicular to the length direction of the engraving.

[0017] Furthermore, both the stage and the scribing element comprise multiple components;

[0018] Each of the aforementioned platforms is connected to a corresponding engraving element.

[0019] Furthermore, the plurality of the aforementioned scribing components include: diamond scribing components and titanium alloy scribing components.

[0020] Furthermore, it also includes: a support platform;

[0021] The support platform is provided with a mounting slot for the platform to be placed in.

[0022] Furthermore, the side of the mounting groove is provided with a pick-up and put-out port that opens in the horizontal direction.

[0023] Furthermore, a friction pad is provided at the bottom of the platform.

[0024] As can be seen from the above technical solutions, this application provides a dicing assembly, including: a stage and a dicing component; the top surface of the stage is a plane; the dicing component is fixed to the top surface of the stage; the dicing component protrudes from the top surface of the stage.

[0025] In the dicing assembly provided by this solution, the dicing component is fixed on the stage, allowing the operator to hold the wafer with both hands and rub it against the dicing component. Compared to holding the dicing component by hand, this improves the stability of the dicing process, thereby increasing the success rate and efficiency of dicing. When it is necessary to break the wafer, the dicing component fixed on the stage can serve as a support structure for breaking the wafer, making it easier for researchers to break the wafer and reducing the difficulty of breaking it. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1This is a schematic diagram of the structure of a dicing assembly provided in an embodiment of this application;

[0028] Figure 2 A partially enlarged view of a dicing assembly provided in an embodiment of this application;

[0029] Figure 3 A schematic diagram of a support platform for a dicing assembly provided in an embodiment of this application;

[0030] In the diagram: 10, platform; 11, groove; 12, scale line; 20, engraved part; 30, support platform; 31, mounting groove; 32, loading / unloading port. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments in this application specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection claimed in this application.

[0032] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0034] Please see Figure 1 and Figure 2 The present application provides a dicing assembly, including: a stage 10 and a dicing member 20; the top surface of the stage 10 is a plane; the dicing member 20 is fixed to the top surface of the stage 10; the dicing member 20 protrudes from the top surface of the stage 10.

[0035] In existing wafer breaking processes, the scribing tool is typically a cutting tool. During the operation, researchers need to hold the tool with one hand and the wafer with the other. When only cross-sectional inspection of the wafer is required, the wafer is held directly by hand; when maintaining wafer surface cleanliness is necessary (such as when breaking the wafer is for miniaturization), the wafer can be held using tweezers or other clamping devices. Regardless of the method, the formation of the scribing marks requires the researcher to perform the work with one hand. Therefore, for large wafers, there is a high risk of the scribing tool deviating from the preset trajectory. After the scribing marks are formed, breaking small wafers becomes very difficult.

[0036] In this design, the stage 10 serves as a support structure for the scribe 20, allowing it to be fixed in place. When breaking small-sized wafers, the scribe 20 acts as a stress point. Specifically, the scribe is aligned with the scribe 20, and force is applied to both sides of the wafer. Since the wafer is a brittle structure, the support of the scribe 20 makes it easier to break along the scribe lines, reducing the difficulty of breaking. The same principle applies to breaking large-sized wafers; the support of the scribe 20 reduces the risk of breakage at non-scribe points during the breaking process.

[0037] In actual operation, the method of forming the scoring can follow the existing technology, that is, after the worker forms the scoring with a knife, the worker can use the scoring component provided in this solution to break the piece.

[0038] As one implementation method, the scribing process can be performed by the scribing assembly provided in this solution. Specifically, taking the example where the wafer is only used for cross-sectional studies and the researcher can directly hold the wafer, during operation, the researcher holds both sides of the wafer with both hands, then moves the wafer to contact the scribing component 20 and slide relative to the scribing component 20, so that the scribing component 20 forms scribing marks on the wafer. Compared to holding the scribing component 20 with one hand, this solution allows researchers to change the way they work by holding the scribing component 20 to holding the wafer with both hands, and then moving the wafer to slide along the length of the scribing component 20. The sliding process improves the continuity, uniformity, and path stability of the scribing process by utilizing the stability of the stage 10, reducing the risk of scribing failure due to hand tremors, and also reducing the risk of hand cuts in existing scribing methods.

[0039] As described above, this solution can be used independently for the wafer breaking process, or it can be used for both the scribe formation and wafer breaking processes. In the latter process, after the scribe lines are formed, researchers can directly break the wafers onto the scribe assembly, resulting in highly fluid movements and thus higher operational efficiency. In summary, this solution has high applicability and can change the way researchers scribe small batches of wafers, improving the stability of the scribe process, increasing the success rate of scribes, and reducing the risk of personnel injury.

[0040] In one embodiment, the scribing element 20 is needle-shaped or triangular pyramid-shaped, that is, one end of the scribing element 20 along the length direction is a pointed tip.

[0041] When the engraving part 20 is a triangular pyramid shape, its tip is located on the outer side of the engraving part 20, such as... Figure 2 As shown.

[0042] In practical applications, the depth of the scribing affects the effectiveness of end-face inspection. When the scribing is shallow, there is insufficient stress concentration on the wafer surface, and the risk of the fracture path deviating from the scribing is high when breaking the wafer. When the scribing is deep, deep cracks are prone to occur at the scribing point, causing step-like delamination on the cross-section, resulting in an incomplete cross-section and the scribing masking the true internal defects, thus affecting the inspection effect.

[0043] In this design, the front end of the scribing component 20 is a sharp point, ensuring that during the scribing process, a mark is formed only when the wafer contacts the front end of the scribing component 20. Compared to the linear contact of cutting tools, the point contact provided by this design offers more concentrated pressure. Combined with the method of holding the wafer with both hands, this allows for more precise scribing. Furthermore, if excessive force is applied locally during the scribing process, resulting in an overly deep mark in a specific area, researchers can make timely adjustments upon discovery, thus providing a higher tolerance for errors and reducing the risk of the overall mark being too deep and masking actual defects.

[0044] In one implementation, the front end of the scribing member 20 is located at the edge of the stage 10 to facilitate scribing of the wafer.

[0045] In one embodiment, a groove 11 is provided on the stage 10; the scribing element 20 is adhered to the groove 11.

[0046] The groove 11 allows the engraved part 20 to be inserted, making it easy to fix.

[0047] As one implementation method, the stage 10 and the engraving part 20 are integrally formed, that is, the two can be produced in one piece using the same material.

[0048] In one embodiment, the stage 10 is provided with scale lines 12.

[0049] The scale line 12 allows researchers to compare the position of the markings before or during the marking process, enabling them to quickly determine the starting point of the markings, thus improving the marking accuracy during manual operation and enhancing the consistency of markings on multiple pieces. Simultaneously, the scale line 12 helps researchers determine if there is any deviation during the marking process, thereby improving the accuracy of the marking.

[0050] In a more specific embodiment, the scale line 12 is perpendicular to the length direction of the scribe 20, so that the scribe direction is perpendicular to the scale line 12, which makes it easier for researchers to visually compare the scale position.

[0051] In one implementation, both the stage 10 and the scribing element 20 include multiple components; the multiple stages 10 and the multiple scribing elements 20 are connected in a one-to-one correspondence. The multiple scribing elements 20 include: diamond scribing elements and titanium alloy scribing elements.

[0052] Diamond scribing tools are suitable for semiconductor wafers made of high-hardness compounds, such as silicon carbide and aluminum nitride. Titanium alloy scribing tools have higher toughness and are suitable for wafers with high brittleness, such as molybdenum disulfide flexible substrates and ultrathin silicon wafers.

[0053] In one embodiment, see Figure 3 The dicing assembly provided in this embodiment also includes: a support platform 30; the support platform 30 is provided with an installation groove 31 for the platform 10 to be placed in.

[0054] The support platform 30 can serve as a workstation for placing the platform 10, facilitating unified planning and management of the laboratory.

[0055] Optionally, the side of the mounting slot 31 is provided with a horizontally opening pick-up and drop opening 32 to facilitate the staff to pick up and drop the platform 10.

[0056] In another embodiment, a friction pad is provided at the bottom of the platform 10. The friction pad increases the friction between the platform 10 and the contact surface, allowing the operator to place the platform 10 directly on the table for work.

[0057] The above are merely preferred embodiments of this application and are not intended to limit the present invention. Although the present application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the foregoing examples or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A dicing assembly, characterized in that, include: Platform (10) and engraving part (20); The top surface of the platform (10) is a plane; The engraving element (20) is fixed to the top surface of the stage (10); The engraving (20) protrudes from the top surface of the platform (10).

2. The dicing assembly according to claim 1, characterized in that, The platform (10) is provided with a groove (11) and the engraving (20) is adhered to the groove (11), or, The platform (10) and the engraving part (20) are integrally formed.

3. The dicing assembly according to claim 2, characterized in that, The engraving part (20) is needle-shaped or triangular pyramid-shaped.

4. The dicing assembly according to claim 3, characterized in that, The tip of the engraving (20) is located at the edge of the stage (10).

5. The dicing assembly according to claim 1, characterized in that, The stage (10) is provided with scale lines (12).

6. The dicing assembly according to claim 5, characterized in that, The scale line (12) is perpendicular to the length direction of the engraving (20).

7. The dicing assembly according to claim 1, characterized in that, Both the stage (10) and the scribing element (20) include multiple components; Each of the multiple platforms (10) is connected to each of the multiple engraving elements (20) in a one-to-one correspondence; The plurality of the aforementioned scribing elements (20) include: diamond scribing elements and titanium alloy scribing elements.

8. The dicing assembly according to claim 1, characterized in that, Also includes: Support platform (30); The support platform (30) is provided with an installation slot (31) for the platform (10) to be placed.

9. The dicing assembly according to claim 8, characterized in that, The side of the mounting groove (31) is provided with a pick-up and put-out port (32) that opens in the horizontal direction.

10. The dicing assembly according to claim 1, characterized in that, The bottom of the stage (10) is provided with a friction pad.

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