Water-cooled jacket

Abstract

The water-cooled jacket is applied to the single crystal furnace and comprises an inner cylinder and an outer cylinder which are coaxially sleeved, the inner barrel is provided with a first surface and a second surface which are opposite, and the outer barrel is provided with a third surface and a fourth surface which are opposite; the first surface and the fourth surface are configured to be in contact with hot air flow, and a cavity used for containing a refrigerant is formed between the second surface and the third surface; at least one of the first surface, the second surface, the third surface and the fourth surface is provided with a plurality of grooves. According to the invention, the requirement of growth of large-size monocrystalline silicon can be met, and the requirement of growth of high-quality monocrystalline silicon can also be met.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically to a water cooling jacket. Background Technology

[0002] In the semiconductor industry, the growth of single-crystal silicon requires processes such as high-temperature melting of polycrystalline silicon, growth of single-crystal silicon, and cooling of single-crystal silicon. As the feature linewidth of integrated circuits (ICs) develops towards high-end processes below 10nm, the quality requirements for high-specification silicon wafers of 12-inch to 18-inch are more stringent. It is necessary to strictly control the V / G ratio (V is the single-crystal pulling speed, and G is the axial temperature gradient of the solid-liquid interface) and the thermal history of the crystal rod cooling in order to regulate the defect distribution of the wafer from the center to the edge.

[0003] Water-cooled jackets serve as cooling devices during the growth of monocrystalline silicon, using water circulation to remove the heat generated during the growth process.

[0004] The water-cooling jacket in the related technology adopts a structure in which the inner cylinder and the outer cylinder are coaxially fitted. However, the surfaces of the inner cylinder and the outer cylinder that come into contact with the hot air flow are both smooth surfaces, which have limited heat exchange capacity and cannot meet the needs of large-size single crystal silicon growth. Utility Model Content

[0005] The utility model description section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This utility model description section is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] To address the existing problems, this utility model provides a water-cooling jacket for use in a single crystal furnace, the water-cooling jacket comprising:

[0007] An inner cylinder and an outer cylinder are coaxially fitted together; the inner cylinder has a first surface and a second surface opposite each other, and the outer cylinder has a third surface and a fourth surface opposite each other; the first surface and the fourth surface are configured to contact a hot airflow, and a chamber for containing refrigerant is formed between the second surface and the third surface;

[0008] The first surface, the second surface, the third surface, and the fourth surface are provided with a plurality of grooves.

[0009] In some embodiments of this application, at least one of the first surface, the second surface, the third surface, and the fourth surface is provided with:

[0010] At least one groove group, each groove group comprising a plurality of grooves arranged sequentially along the circumference of the surface, wherein when there are at least two groove groups, adjacent groove groups are spaced apart along the axial direction of the water-cooling jacket.

[0011] In some embodiments of this application, the water-cooling jacket has a first end and a second end disposed opposite to each other, the first end being configured to be close to the molten liquid in the crucible inside the single crystal furnace;

[0012] When the number of trench groups is at least two, the trench group closer to the first end includes more trenches.

[0013] In some embodiments of this application,

[0014] When the number of groove groups is at least two, the closer the groove group is to the first end, the smaller the circumferential spacing between two adjacent grooves in the multiple grooves it includes.

[0015] In some embodiments of this application,

[0016] When the number of groove groups is at least two, the closer the groove group is to the first end, the greater the ratio of the total width of all the grooves included to the circumferential unfolded length of the surface area corresponding to the groove group.

[0017] In some embodiments of this application, the spacing between two adjacent trenches in the same trench group is consistent.

[0018] In some embodiments of this application, the angle between the extension direction of the groove and the axial direction of the water-cooling jacket is within a preset range; wherein, the preset range is -60° to 60°.

[0019] In some embodiments of this application, among the multiple trenches on the same surface, at least two trenches are staggered and arranged in a grid pattern.

[0020] In some embodiments of this application, the grooves on the first surface are micrometer-level and / or millimeter-level grooves; and / or, the grooves on the fourth surface are micrometer-level and / or millimeter-level grooves.

[0021] In some embodiments of this application, the trenches on the second surface and / or the third surface are micron-sized trenches.

[0022] The water-cooling jacket of this application, by providing multiple grooves on at least one of the first, second, third, and fourth surfaces, can increase the heat exchange contact area between the water-cooling jacket and the hot airflow or refrigerant, enhance the heat exchange efficiency between the hot airflow or refrigerant and the water-cooling jacket, and enable the water-cooling jacket to more fully absorb the heat during the monocrystalline silicon growth process, and the refrigerant to more fully absorb the heat transferred to the water-cooling jacket during the monocrystalline silicon growth process, thereby providing support for the growth of larger-sized crystal rods. Attached Figure Description

[0023] The following drawings, which are incorporated herein by reference as part of this invention, are provided for understanding the invention. The drawings illustrate embodiments of the invention and their descriptions, serving to explain the principles of the invention.

[0024] In the attached image:

[0025] Figure 1 A schematic diagram of the unfolded first surface of a specific embodiment of the present invention is shown.

[0026] Figure 2 A schematic diagram of the structure of a water-cooling jacket according to a specific embodiment of the present invention is shown. Detailed Implementation

[0027] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0028] It should be understood that this invention can be embodied in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of this invention to those skilled in the art. In the drawings, for clarity, the dimensions of layers and regions, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0029] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this utility model, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.

[0030] Spatial relation terms such as “below,” “under,” “below,” “below,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0031] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0032] The water-cooling jacket in the related technology adopts a structure in which the inner cylinder and the outer cylinder are coaxially fitted, but the surfaces of the inner cylinder in contact with the hot airflow and the outer cylinder in contact with the hot airflow are both smooth surfaces;

[0033] On the one hand, the heat transfer capacity of a smooth surface is limited, making it difficult to meet the needs of large-size single-crystal silicon growth;

[0034] On the other hand, smooth surfaces cannot achieve axial gradient heat transfer, making it difficult to meet the requirements for high-quality single-crystal silicon growth.

[0035] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solutions proposed in this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0036] The following is for reference. Figure 1 and Figure 2 This application describes a water-cooled jacket according to an embodiment of the present application. The water-cooled jacket is applied to a single crystal furnace and includes an inner cylinder 101 and an outer cylinder 102 coaxially fitted together. The inner cylinder 101 has opposing first surfaces 110 and second surfaces 120, and the outer cylinder 102 has opposing third surfaces 130 and fourth surfaces 140. The first surfaces 110 and fourth surfaces 140 are configured to contact hot air flow, and a chamber 103 for containing refrigerant is formed between the second surface 120 and the third surface 130. At least one of the first surface 110, the second surface 120, the third surface 130, and the fourth surface 140 is provided with a plurality of grooves.

[0037] This application increases the heat exchange contact area between the inner cylinder 101, outer cylinder 102, and hot airflow by providing multiple grooves on the first surface 110 and / or the fourth surface 140—effectively expanding the heat exchange specific surface area. A larger heat exchange contact area enhances the heat exchange efficiency between the hot airflow and the first surface 110 and fourth surface 140, allowing the water-cooling jacket to more fully absorb the heat generated during the single-crystal silicon growth process, achieving a synergistic effect of increased heat exchange specific surface area and improved heat exchange capacity. Furthermore, this not only allows for faster crystal growth but also supports the growth of larger crystal ingots.

[0038] Similarly, this application increases the heat exchange contact area between the inner cylinder 101, outer cylinder 102, and the refrigerant inside the chamber 103 by providing multiple grooves on the third surface 130 and / or on the fourth surface 140—that is, effectively expanding the heat exchange specific surface area. A larger heat exchange contact area enhances the heat exchange efficiency between the refrigerant and the second surface 120 and the third surface 130, allowing the refrigerant to more fully absorb the heat transferred to the water-cooling jacket during the single-crystal silicon growth process, achieving a synergistic effect of increased heat exchange specific surface area and improved heat exchange capacity. Based on this, it not only allows for faster crystal growth but also supports the growth of larger crystal ingots.

[0039] In some embodiments, the grooves on the first surface 110 in contact with the hot airflow are micrometer-level and / or millimeter-level grooves; and / or, the grooves on the fourth surface 140 in contact with the hot airflow are micrometer-level and / or millimeter-level grooves.

[0040] Taking the grooves on the first surface 110 and the fourth surface 140 in contact with the hot airflow as micron-level and millimeter-level grooves as examples, the grooves can be first machined on the first surface 110 and the fourth surface 140 by mechanical processing, and the size of the grooves is at the millimeter level; then, a nanosecond, picosecond or femtosecond laser is used to scan and process the micron-level grooves on the first surface 110 and the fourth surface 140 based on the millimeter-level grooves that have been machined.

[0041] In some embodiments, the grooves on the second surface 120 and / or the third surface 130 that contact the refrigerant are micron-sized grooves.

[0042] For example, before the inner cylinder 101 and the outer cylinder 102 are welded together, laser micromachining (e.g., using nanosecond, picosecond, or femtosecond lasers) is performed on the second surface 120 of the inner cylinder 101 and the third surface 130 of the outer cylinder 102 to form micron-sized trenches. These micron-sized trenches can significantly increase the specific surface area, and the roughened second surface 120 and third surface 130 help reduce the thickness of the laminar boundary layer, reduce thermal resistance, and thus enhance heat transfer.

[0043] In some embodiments, multiple grooves on the same surface may each be a single stripe structure; or, among the multiple grooves on the same surface, at least two grooves may be staggered in a grid distribution.

[0044] Taking the micron-sized grooves on the first surface 110 and the fourth surface 140 in contact with the hot airflow as an example, the micron-sized grooves can be a single stripe structure, or they can be two micron-sized grooves with different directions intersecting to form a grid shape.

[0045] The millimeter-scale grooves on the first surface 110 and the fourth surface 140 that come into contact with the hot airflow, and the micrometer-scale grooves on the second surface 120 and the third surface 130 that come into contact with the refrigerant, can be configured as a single stripe structure or intersecting to form a grid shape, as described above, without limitation.

[0046] Whether it is the groove on the first surface 110 and the fourth surface 140 that come into contact with the hot airflow or the groove on the second surface 120 and the third surface 130 that come into contact with the refrigerant, they all have structural parameters such as length L, width W and depth H.

[0047] For example, taking millimeter-level grooves on the first surface 110 and the fourth surface 140 in contact with the hot airflow as an example, the width-to-depth ratio (W / H) of the millimeter-level groove ranges from 1:3 to 3:1, and the depth H ranges from 1 mm to 5 mm. No specific limit is placed on the specific parameter values.

[0048] Taking the micron-level trenches on the first surface 110 and the fourth surface 140 in contact with the hot airflow as an example, the depth of the micron-level trenches is 50 microns to 300 microns and the width is 50 microns to 500 microns.

[0049] Taking the grooves on the second surface 120 and the third surface 130 that come into contact with the refrigerant as an example, the depth of the micron-sized grooves is 50 micrometers to 100 micrometers and the width is 50 micrometers to 100 micrometers.

[0050] In some embodiments, the cross-sectional shape of the trench along its extension direction may include a triangle, a square, a rectangle, a trapezoid, or a circle, etc., and this application does not limit it.

[0051] Specifically, grooves with different cross-sectional shapes can increase the effective heat transfer area of ​​the first surface 110 by changing the groove shape.

[0052] For example, taking the grooves on the first surface 110 and the fourth surface 140 in contact with the hot airflow as an example, when the cross-sectional shape of the groove is semi-circular, its surface area ratio with that of the smooth first surface 110 without grooves is 1.57; when the cross-sectional shape of the groove is square, the ratio is 3; and when the cross-sectional shape of the groove is triangular, the ratio is 2. These differences indicate that by selecting an appropriate cross-sectional shape, the heat exchange contact area between the inner cylinder 101, the outer cylinder 102, and the hot airflow can be adjusted accordingly to meet the heat exchange requirements in different scenarios.

[0053] It is understandable that the grooves on the second surface 120 and the third surface 130 in contact with the refrigerant may also have similar cross-sectional shapes in order to specifically adjust the heat exchange contact area between the inner cylinder 101, the outer cylinder 102 and the refrigerant, and there is no limitation on this.

[0054] For example, Figure 1 A schematic diagram of the unfolded first surface 110 in contact with the hot airflow is shown, which has grooves 111 with a rectangular cross-sectional shape. It can be understood that the schematic diagram of the unfolded fourth surface 140 in contact with the hot airflow can be compared with... Figure 1 Similarly, this will not be elaborated upon here.

[0055] Of course, the unfolded schematic diagrams of the second surface 120 and the third surface 130 in contact with the refrigerant can also be compared with... Figure 1 Similarly, this will not be elaborated upon here.

[0056] In some embodiments, at least one of the first surface 110, the second surface 120, the third surface 130 and the fourth surface 140 is provided with at least one groove group, each groove group including a plurality of grooves arranged sequentially along the circumference of the surface, and when the number of groove groups is at least two, adjacent two groove groups are distributed at intervals along the axial direction of the water cooling jacket.

[0057] In each trench group, multiple trenches are arranged sequentially along the circumference of the surface, which can effectively increase the heat exchange contact area between the surface and the hot airflow or refrigerant within a single trench group, and enhance the local heat exchange efficiency. The design of adjacent trench groups being distributed at intervals along the axial direction of the water-cooling jacket allows for flexible design of parameters (such as number, total width ratio, etc.) for different trench groups according to the cooling requirements of different temperature regions along the crystal rod axis, facilitating axial gradient heat exchange.

[0058] For example, taking the first surface 110 in contact with the hot airflow as an example, such as Figure 1 As shown, at least one groove group is provided on the first surface 110. Each groove group includes a plurality of grooves 111 arranged sequentially along the circumference of the first surface 110. When the number of groove groups is at least two, two adjacent groove groups are distributed at intervals along the axial direction of the water cooling jacket.

[0059] It should be noted that each trench group includes multiple trenches arranged sequentially along the circumference of the surface. The specific arrangement can be that at least two adjacent trenches are arranged alternately within each trench group, or that at least two adjacent trenches are arranged alternately within each trench group. This application does not limit this arrangement.

[0060] In some embodiments, the spacing distribution of multiple trenches within the same trench group is flexibly designed to adapt to different heat exchange scenarios: multiple trenches within the same trench group can be evenly spaced along the circumference of the surface or non-uniformly spaced. This application does not limit the specific spacing method.

[0061] For example, when the spacing between two adjacent trenches in the same trench group is consistent, the heat exchange area of ​​the surface within the trench group can be uniformly distributed circumferentially, which helps to improve the circumferential uniformity of heat exchange between the hot airflow or refrigerant and the water-cooled jacket, and avoids temperature fluctuations caused by local heat exchange imbalance.

[0062] In some embodiments, the water-cooling jacket has a first end and a second end disposed opposite to each other. The first end is configured to be close to the molten liquid in the crucible inside the single crystal furnace. Along the direction from the first end to the second end, when the number of groove groups is at least two, the groove group closer to the first end includes more grooves; conversely, the groove group closer to the second end includes fewer grooves. The first end of the water-cooling jacket is close to the molten liquid in the crucible and is a high-temperature zone, while the second end of the water-cooling jacket is far from the molten liquid and is a low-temperature zone.

[0063] Specifically, within each trench group, the closer to the first end of the water-cooling jacket, the more trenches it contains. This dense trench structure significantly increases the effective heat exchange contact area between the surface and the hot airflow or refrigerant, improving the heat exchange rate per unit time and thus enhancing the heat dissipation capacity of the high-temperature region to meet the strong heat dissipation requirements generated during crystal growth around the molten liquid. Conversely, the number of trenches gradually decreases as the trench groups approach the second end of the water-cooling jacket. This design can adapt to the weak heat dissipation requirements of the low-temperature region, maintaining the stability of the axial temperature field of the crystal rod while avoiding temperature field fluctuations caused by overcooling, ensuring the continuity and stability of the crystal growth interface.

[0064] By designing an axial gradient of the number of grooves, the heat transfer capacity is distributed in a gradient at different distances from the melt surface. This allows the axial heat transfer capacity gradient of the water-cooled jacket to match the axial temperature distribution characteristics of the crystal rod above the molten liquid, thereby providing support for controlling the V / G ratio at the solid-liquid interface and ensuring the growth quality of high-quality monocrystalline silicon.

[0065] For example, taking the first surface 110 in contact with the hot airflow as an example, such as Figure 1 As shown, the first surface 110 is provided with a plurality of groove groups. Along the direction from the first end to the second end, the closer the groove group is to the first end, the more grooves 111 it includes.

[0066] In some embodiments, when the number of trench groups is at least two, the trench group closer to the first end has a smaller circumferential spacing between two adjacent trenches. Conversely, the trench group closer to the second end has a larger circumferential spacing between two adjacent trenches.

[0067] Specifically, regarding the trench spacing design: in the trench group closer to the first end, the spacing between two adjacent trenches in the circumferential direction is smaller—this densely distributed trench can significantly increase the heat exchange contact area between the surface and the hot airflow or refrigerant, improve the heat exchange efficiency in the high-temperature zone, and accurately meet the strong heat dissipation requirements generated by crystal growth around the molten liquid; as the axial direction extends towards the second end, the spacing between two adjacent trenches in the circumferential direction in each trench group gradually increases, making the trench distribution sparser, which can reduce the heat exchange contact area between the surface and the hot airflow or refrigerant, adapt to the weak heat dissipation requirements in the low-temperature zone, avoid overcooling due to excessive heat exchange, and at the same time maintain the stability of the axial temperature field of the crystal rod, ensuring the continuity of the crystal growth interface.

[0068] By designing the axial spacing gradient of the aforementioned trenches, the heat transfer capacity is distributed in a gradient at different distances from the melt surface. This allows the axial heat transfer capacity gradient of the water-cooled jacket to match the axial temperature distribution characteristics of the crystal rod above the molten liquid, thereby providing support for controlling the V / G ratio at the solid-liquid interface and ensuring the growth quality of high-quality monocrystalline silicon.

[0069] For example, taking the first surface 110 in contact with the hot airflow as an example, such as Figure 1 As shown, the first surface 110 is provided with multiple groove groups. The closer the groove group is to the first end, the smaller the circumferential spacing between two adjacent grooves 111 in the multiple grooves 111 included therein.

[0070] In some embodiments, when the number of trench groups is at least two, the trench group closer to the first end has a larger ratio of the total width of all its trenches to the circumferential unfolded length of the corresponding surface area. Conversely, the trench group closer to the second end has a smaller ratio of the total width of all its trenches to the circumferential unfolded length of the corresponding surface area.

[0071] Specifically, in each trench group, the closer to the first end of the water-cooling jacket, the larger the ratio of the total width of all the trenches to the circumferential length of the corresponding surface area. This design ensures that the area of ​​the surface corresponding to the high-temperature zone is covered by trenches, increasing the effective heat exchange contact area between the surface and the hot airflow or refrigerant, enhancing the heat exchange efficiency of the high-temperature zone, and meeting the strong heat dissipation requirements generated during crystal growth around the molten liquid. Conversely, the ratio gradually decreases in each trench group closer to the second end of the water-cooling jacket, meaning that the area of ​​the corresponding surface area covered by trenches is reduced. This adapts to the weak heat dissipation requirements of the low-temperature zone while avoiding overcooling due to an excessively high trench ratio, thereby maintaining the stability of the axial temperature field of the crystal rod and ensuring the continuity and integrity of the crystal growth interface.

[0072] This axial proportional gradient design allows for a gradient distribution of heat transfer capacity at different distances from the melt surface. The axial heat transfer capacity gradient of the water-cooled jacket can match the axial temperature distribution characteristics of the crystal rod above the molten liquid, thereby providing support for controlling the V / G ratio at the solid-liquid interface and ultimately ensuring the growth quality of high-quality monocrystalline silicon.

[0073] For example, taking millimeter-level grooves on the first surface 110 in contact with the hot airflow as an example, along the direction from the first end to the second end, the first surface 110 is provided with a total of 5 groove groups, namely the first groove group, the second groove group, the third groove group, the fourth groove group, and the fifth groove group. The ratio R of the total width of all millimeter-level grooves in the first groove group to the circumferential unfolded length R of the area of ​​the first surface 110 corresponding to that groove group is 90% to 70%. The ratio R of the total width of all millimeter-level grooves in the second groove group to the circumferential unfolded length R of the area of ​​the first surface 110 corresponding to that groove group is 90% to 70%. The ratio R of the circumferential unfolded length of region 0 is 70%~50%. The ratio R of the total width of all millimeter-level grooves in the third groove group to the circumferential unfolded length of the corresponding first surface 110 region is 50%~30%. The ratio R of the total width of all millimeter-level grooves in the fourth groove group to the circumferential unfolded length of the corresponding first surface 110 region is 30%~10%. The ratio R of the total width of all millimeter-level grooves in the fifth groove group to the circumferential unfolded length of the corresponding first surface 110 region is 10%~0%.

[0074] Taking the micrometer-level trenches on the first surface 110 in contact with the hot airflow as an example, the depth of the micrometer-level trenches is 50 micrometers to 300 micrometers. Along the direction from the first end to the second end, the first surface 110 has a total of 5 trench groups, namely the first trench group, the second trench group, the third trench group, the fourth trench group, and the fifth trench group. In the first trench group, the width of the micrometer-level trenches is 50 micrometers to 100 micrometers, and the ratio R of the total width of all micrometer-level trenches in the first trench group to the circumferential unfolded length R of the corresponding area of ​​the first surface 110 is 90% to 70%. In the second trench group, the width of the micrometer-level trenches is 100 micrometers to 200 micrometers, and the ratio R of the total width of all micrometer-level trenches in the second trench group to the circumferential unfolded length R of the corresponding area of ​​the first surface 110 is 70% to 50%. The third trench group... The width of the inner micron-level trenches is 200 micrometers to 300 micrometers. The ratio R of the total width of all micron-level trenches in the third trench group to the circumferential unfolded length of the corresponding area of ​​the first surface 110 is 50% to 30%. The width of the micron-level trenches in the fourth trench group is 300 micrometers to 400 micrometers. The ratio R of the total width of all micron-level trenches in the fourth trench group to the circumferential unfolded length of the corresponding area of ​​the first surface 110 is 30% to 10%. The width of the micron-level trenches in the fifth trench group is 400 micrometers to 500 micrometers. The ratio R of the total width of all micron-level trenches in the fifth trench group to the circumferential unfolded length of the corresponding area of ​​the first surface 110 is 10% to 0%.

[0075] Taking the micron-level trenches on the second surface 120 in contact with the refrigerant as an example, the depth of the micron-level trenches is 50 microns to 100 microns, the width is 50 microns to 100 microns, and the cumulative width of the micron-level trenches accounts for 90% to 20% of the width of the area.

[0076] In some embodiments, the angle between the extension direction of the groove and the axial direction of the water jacket is within a preset range.

[0077] The preset range can be set to -60° to 60°, or other suitable ranges can be selected according to actual needs; this application does not limit this. It should be noted that when the included angle is 0°, the extension direction of the groove is parallel to the axis of the water-cooling jacket.

[0078] Specifically, when the angle between the groove and the axial direction is within a preset range (not 0°), it can guide the hot airflow or refrigerant to form an orderly oblique flow path when flowing over the surface. This avoids the problem of insufficient heat exchange caused by the hot airflow or refrigerant flowing too fast when the groove extends along the pure axial direction, thereby extending the contact time between the hot airflow or refrigerant and the water-cooled jacket, so that the water-cooled jacket can exchange heat with the hot airflow or refrigerant more evenly.

[0079] In some embodiments, the extension directions of the multiple trenches may be consistent or inconsistent, and there is no limitation on this.

[0080] For example, within the same trench group, the extension directions of adjacent trenches are inconsistent—that is, there is an angle between the extension directions of adjacent trenches, causing multiple trenches on the surface to be distributed in a grid pattern. This grid can divide the contact area between the surface and the hot airflow or refrigerant into multiple independent and interconnected flow sub-regions. On the one hand, it can guide the hot airflow or refrigerant to form a multi-path orderly flow within the grid structure, effectively avoiding the dead zones in the hot airflow or refrigerant flow that are easily generated by trenches with a single extension direction. On the other hand, it can significantly extend the contact time between the hot airflow or refrigerant and the surface, while making the heat exchange of the water-cooled jacket more uniform, avoiding heat exchange imbalance caused by the stagnation or rapid flow of hot airflow or refrigerant in local areas, thereby improving the overall consistency of heat exchange.

[0081] In some embodiments, a blackening treatment layer is provided on the first surface 110, and / or, a blackening treatment layer is provided on the fourth surface.

[0082] Specifically, a blackening process can be performed after removing surface slag and oxides from the laser scan. The blackening is carried out by methods such as chemical blackening or vapor deposition to form a blackened layer on the first surface 110 and / or the fourth surface 140.

[0083] During the growth of monocrystalline silicon, the crystal and the flow guide tube inside the monocrystalline furnace continuously radiate heat. However, the substrate of the water-cooling jacket (such as stainless steel) typically has a low inherent absorption coefficient, making it difficult to fully absorb this radiant heat and potentially limiting its absorption efficiency. By applying a blackening treatment layer to the first surface 110, the absorption efficiency of the first surface 110 for the radiant heat from the crystal and flow guide tube can be significantly improved, allowing the heat to be efficiently carried away through heat exchange between the inner cylinder 101 and the refrigerant. Similarly, applying a blackening treatment layer to the fourth surface 140 can simultaneously enhance the absorption capacity of the fourth surface 140 for the surrounding radiant heat, creating a synergistic effect with the blackening treatment layer of the inner cylinder 101 and strengthening the overall absorption efficiency of the water-cooling jacket for radiant heat.

[0084] In some embodiments of the water-cooled jacket of this application, micron-level and millimeter-level processing technologies can be used to process four groups of grooves in a unidirectional or grid-like distribution on the first surface 110, and / or on the fourth surface 140.

[0085] For example, Table 1 below shows the surface area ratios under different processing techniques and distribution forms, with the first surface 110 or the fourth surface 140 of the smooth surface in the related art as a reference: including the surface area ratio of the smooth surface relative to itself in the related art, the surface area ratio of the first surface 110 and the fourth surface 140 of the unidirectional distributed groove obtained by millimeter-level and micrometer-level processing techniques respectively, relative to the smooth surface, and the surface area ratio of the first surface 110 and the fourth surface 140 of the grid distributed groove obtained by millimeter-level and micrometer-level processing techniques respectively, relative to the smooth surface.

[0086] Table 1: Surface area ratio of water-cooled jackets under different processing techniques and groove distribution patterns

[0087]

[0088] According to another aspect of this application, a single crystal furnace is provided. The single crystal furnace includes: a furnace body with an internal furnace cavity; a crucible disposed within the furnace cavity; and a water-cooling jacket disposed within the furnace cavity above the crucible.

[0089] The water cooling jacket can be implemented as described above, as can be found in the description above, and will not be repeated here.

[0090] In summary, the water-cooled jacket and single-crystal furnace according to the embodiments of this application, by providing multiple grooves on at least one of the first, second, third, and fourth surfaces, can increase the heat exchange contact area between the water-cooled jacket and the hot airflow or refrigerant, enhance the heat exchange efficiency between the hot airflow or refrigerant and the water-cooled jacket, and enable the water-cooled jacket to more fully absorb the heat during the single-crystal silicon growth process, and the refrigerant to more fully absorb the heat transferred to the water-cooled jacket during the single-crystal silicon growth process, thereby providing support for the growth of larger-sized crystal rods.

[0091] Furthermore, the arrangement of multiple groove groups at intervals along the axial direction of the water-cooling jacket facilitates axial gradient heat transfer, providing support for the growth of high-quality monocrystalline silicon.

[0092] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of this application. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of this application. All such changes and modifications are intended to be included within the scope of this application as claimed in the appended claims.

[0093] Similarly, it should be understood that, in order to simplify this application and aid in understanding one or more aspects of the application, various features of this application may sometimes be grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of this application. However, this approach should not be construed as reflecting an intention that the claimed application requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, the point of application is that the corresponding technical problem can be solved with fewer features than all of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of this application.

[0094] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0095] It should be noted that the above embodiments are illustrative of this application and not limiting of it, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

Claims

1. A water-cooled jacket, applied to a single crystal furnace, characterized in that, The water-cooling jacket includes: An inner cylinder and an outer cylinder are coaxially fitted together; the inner cylinder has a first surface and a second surface opposite each other, and the outer cylinder has a third surface and a fourth surface opposite each other; the first surface and the fourth surface are configured to contact a hot airflow, and a chamber for containing refrigerant is formed between the second surface and the third surface; The first surface, the second surface, the third surface, and the fourth surface are provided with a plurality of grooves.

2. The water-cooled jacket according to claim 1, characterized in that, At least one of the first surface, the second surface, the third surface, and the fourth surface is provided with: At least one groove group, each groove group comprising a plurality of grooves arranged sequentially along the circumference of the surface, and when the number of groove groups is at least two, adjacent two groove groups are spaced apart along the axial direction of the water-cooling jacket.

3. The water-cooled jacket according to claim 2, characterized in that, The water-cooling jacket has a first end and a second end that are arranged opposite to each other, and the first end is configured to be close to the molten liquid in the crucible inside the single crystal furnace. When the number of trench groups is at least two, the trench group closer to the first end includes more trenches.

4. The water-cooled jacket according to claim 3, characterized in that, When the number of groove groups is at least two, the closer the groove group is to the first end, the smaller the circumferential spacing between two adjacent grooves in the multiple grooves it includes.

5. The water-cooled jacket according to claim 3, characterized in that, When the number of groove groups is at least two, the closer the groove group is to the first end, the greater the ratio of the total width of all the grooves included to the circumferential unfolded length of the surface area corresponding to the groove group.

6. The water-cooled jacket according to claim 2, characterized in that, In the same trench group, the spacing between two adjacent trenches is consistent.

7. The water-cooled jacket according to claim 1, characterized in that, The angle between the extension direction of the groove and the axial direction of the water-cooling jacket is within a preset range. The preset range is -60° to 60°.

8. The water-cooled jacket according to claim 1, characterized in that, Among the multiple grooves on the same surface, at least two grooves are staggered and distributed in a grid pattern.

9. The water-cooled jacket according to claim 1, characterized in that, The grooves on the first surface are micrometer-level and / or millimeter-level grooves; and / or, the grooves on the fourth surface are micrometer-level and / or millimeter-level grooves.

10. The water-cooled jacket according to claim 1, characterized in that, The grooves on the second surface and / or the third surface are micron-sized grooves.

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