Coil module, wireless charging device and electronic equipment

Abstract

The utility model provides a coil module, which comprises a coil assembly, the coil assembly comprises an insulating base layer, a coil bundle and a first wire bundle, and the coil bundle comprises a coil part arranged on the first surface of the insulating base layer; the first wire harness is arranged on the second surface of the insulating base layer, one end of the first wire harness penetrates through the insulating base layer and is connected to the first end of the coil part, the other end of the first wire harness extends out of the edge of the coil part, and the first surface and the second surface are arranged oppositely. The utility model also provides a wireless charging device provided with the coil module and electronic equipment provided with the wireless charging device.

Description

Technical Field

[0001] This utility model relates to the field of coils, and more particularly to a coil module, a wireless charging device equipped with the coil module, and an electronic device equipped with the coil module. Background Technology

[0002] Currently, with the development and rapid popularization of new energy and electric vehicles, portable mobile terminal devices such as mobile phones and smart wearable devices are increasingly using wireless charging in real life. This wireless charging technology differs from wired connections in that it transmits electrical energy without contact. Specifically, it transmits wireless power through electromagnetic induction or magnetic resonance between the contactless power receiver and the contactless power transmitter, thereby charging the rechargeable battery of the portable mobile terminal device. The coil is an essential component for contactless power transmission between the contactless power transmitter and receiver. However, existing coils are generally traditional wire-wound coils, which typically employ at least two overlapping and stacked layers, resulting in a relatively large thickness that cannot meet the trend of increasingly thinner electronic devices. Utility Model Content

[0003] The purpose of this utility model is to provide a thinner coil module, a wireless charging device equipped with the coil module, and an electronic device equipped with the coil module.

[0004] To solve the above-mentioned technical problems, the present invention provides a coil module, which includes a coil assembly. The coil assembly includes an insulating base layer, a coil bundle, and a first wire bundle. The coil bundle includes a coil portion disposed on a first surface of the insulating base layer. The first wire bundle is disposed on a second surface of the insulating base layer. One end of the first wire bundle passes through the insulating base layer and is connected to a first end of the coil portion. The other end of the first wire bundle extends out of the edge of the coil portion. The first surface and the second surface are disposed opposite to each other.

[0005] This utility model also provides a wireless charging device, which includes a coil module, a housing, and a circuit board. The coil module and the circuit board are disposed within the housing. The coil module includes a coil assembly, which includes an insulating base layer, a coil bundle, and a first wire bundle. The coil bundle includes a coil portion disposed on a first surface of the insulating base layer. The first wire bundle is disposed on a second surface of the insulating base layer, with one end of the first wire bundle passing through the insulating base layer and connected to a first end of the coil portion. The other end of the first wire bundle extends beyond the edge of the coil portion. The first surface and the second surface are disposed opposite to each other. The coil module is electrically connected to the circuit board and is used for contactless power transmission.

[0006] This utility model also provides an electronic device, which includes a coil module, a housing, a battery, and a motherboard. The coil module, the motherboard, and the battery are all disposed within the housing, and the coil module is electrically connected to the motherboard. The coil module includes a coil assembly, which includes an insulating base layer, a coil bundle, and a first wire bundle. The coil bundle includes a coil portion disposed on a first surface of the insulating base layer. The first wire bundle is disposed on a second surface of the insulating base layer, with one end of the first wire bundle passing through the insulating base layer and connected to a first end of the coil portion, and the other end of the first wire bundle extending beyond the edge of the coil portion. The first surface and the second surface are disposed opposite to each other. The coil module is used for non-contact power reception, and the battery stores the power provided by the coil module.

[0007] The coil module provided by this utility model has wires running on the first surface of the insulating base layer to form a coil section, and wires running on the second surface to form a first wire bundle. One end of the first wire bundle passes through the insulating base layer and connects to the first end of the coil section to form a complete circuit. Compared with the prior art winding coils that use at least two layers of coil stacking, the coil module provided by this utility model reduces one layer of coil section, thereby reducing the overall thickness of the coil module to meet the development trend of thinner electronic devices equipped with coil modules. Attached Figure Description

[0008] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0009] Figure 1 This is a three-dimensional structural diagram of the coil module provided in the first embodiment of this utility model.

[0010] Figure 2 yes Figure 1 A three-dimensional exploded view of the coil module.

[0011] Figure 3 yes Figure 2 A further exploded three-dimensional structural diagram of the coil module in the diagram.

[0012] Figure 4 yes Figure 3 Enlarged 3D view of the coil assembly.

[0013] Figure 5 yes Figure 4 A three-dimensional structural diagram of the coil assembly from another perspective.

[0014] Figure 6 yes Figure 5 A schematic diagram of the front structure of the coil assembly.

[0015] Figure 7 yes Figure 6 An enlarged view of part VII in the diagram.

[0016] Figure 8 yes Figure 4 One of the three-dimensional sectional views of the coil assembly in the image.

[0017] Figure 9 yes Figure 8 A cross-sectional view of the coil assembly.

[0018] Figure 10 yes Figure 1 A cross-sectional view of the coil module in the diagram.

[0019] Figure 11 yes Figure 10 An exploded view of the coil module.

[0020] Figure 12 yes Figure 10 An enlarged view of part XII in the image.

[0021] Figure 13 This is a front view of the coil assembly provided in the second embodiment of the present invention.

[0022] Figure 14 yes Figure 13 An enlarged view of section XIV in the image.

[0023] Figure 15 This is a front view of the coil assembly provided in the third embodiment of this utility model.

[0024] Figure 16 yes Figure 14 An enlarged view of the XVI portion.

[0025] Figure 17 This is a front view of the coil assembly provided in the fourth embodiment of this utility model.

[0026] Figure 18 This is a front view of the coil assembly provided in the fifth embodiment of this utility model.

[0027] Figure 19 yes Figure 18 A three-dimensional exploded view of the coil module.

[0028] Figure 20 yes Figure 18 One of the cross-sectional views of the coil module in the image.

[0029] Figure 21 yes Figure 20 An exploded view of the coil module.

[0030] Figure 22 This is a cross-sectional view of the coil module provided in the sixth embodiment of this utility model.

[0031] Figure 23 yes Figure 22 An exploded view of the coil module.

[0032] Figure 24 This is a three-dimensional structural diagram of a wireless charging device provided in one embodiment of the present invention.

[0033] Figure 25 This is a three-dimensional structural schematic diagram of an electronic device provided in another embodiment of the present invention.

[0034] Figure 26 yes Figure 24 The wireless charging device in the middle gives Figure 25 A schematic diagram showing the charging status of electronic devices.

[0035] Key designation: 100, Coil module; 30, Coil assembly; 32, Insulating base layer; 322, First surface; 324, Second surface; 325, Through hole; 326, Insulating tab; 34, Coil bundle; 340, Coil section; 341, First end; 342, Second end; 343, Metal trace; 345, Second wire bundle; 346, Second contact point; 35, First flexible circuit board; 352, First protrusion; 36, First wire bundle; 363, Connecting wire. Bundle; 364, First contact point; 37, Second flexible circuit board; 372, Second protrusion; 50, Support layer; 52, Support surface; 522, Receiving groove; 524, Clearance space; 54, Back side; 60, Covering layer; 70, Heat dissipation layer; 72, Through groove; 80, Covering film; 200, Wireless charging device; 210, Housing; 220, Circuit board; 400, Electronic device; 410, Outer shell; 420, Motherboard; 430, Battery; 450, Display screen. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] Furthermore, the following descriptions of various embodiments are based on the accompanying illustrations and are used to illustrate specific embodiments that can be implemented in this application. Directional terms used in this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are merely for reference to the accompanying illustrations. Therefore, the directional terms used are for better and clearer explanation and understanding of this application, and are not intended to indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0038] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed," "connected," "linked," and "set on" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] Please see Figures 1 to 3 The first embodiment of this utility model provides a coil module 100, which includes a coil assembly 30, a support layer 50, a cover layer 60, a heat dissipation layer 70, and a cover film 80. The support layer 50 is stacked on the heat dissipation layer 70, and the coil assembly 30 is disposed on the side of the support layer 50 away from the heat dissipation layer 70. The coil assembly 30 includes an insulating base layer 32, a coil bundle 34, and a first wire bundle 36. The insulating base layer 32 includes a first surface 322 and a second surface 324, which are disposed opposite to each other. The coil bundle 34 includes... A coil portion 340 is disposed on the first surface 322. The coil portion 340 includes a first end 341 and a second end 342. The first end 341 is closer to the center line L of the coil portion 340 than the second end 342, and the second end 342 is closer to the edge of the coil portion 340 than the first end. A first wire bundle 36 is disposed on the second surface 324 of the insulating base layer 32. One end of the first wire bundle 36 passes through the insulating base layer 32 and connects to the first end 341 of the coil portion 340, and the other end of the first wire bundle 36 extends out of the edge of the coil portion 340. A cover film 80 covers the side of the coil assembly 30 facing away from the insulating base layer 32. The cover film 80 is used to protect the surface of the coil assembly 30 from corrosion by external substances, increase the wear resistance and dirt resistance of the coil assembly 30, and improve the reliability and service life of the coil assembly 30.

[0040] Understandably, the coil module 100 can be applied to contactless power receiving devices, which may be, but are not limited to, electronic devices such as mobile phones, smartwatches, tablets, or smart wearables. The coil module 100 can provide power to the battery of the contactless power receiving device. The coil module 100 can also be applied to contactless power transmitting devices, such as wireless charging devices, where the coil module 100 can charge the contactless power receiving device.

[0041] The coil module 100 provided by this utility model only has wiring on the first surface 322 of the insulating base layer 32 to form a coil portion 340, and wiring on the second surface 324 to form a first wire bundle 36. One end of the first wire bundle 36 passes through the insulating base layer 32 and connects to the first end 341 of the coil portion 340 to form a complete circuit. Compared with the prior art winding coils that use at least two layers of coil stacking, the coil module 100 provided by this utility model reduces one layer of coil portion, thereby reducing the thickness of the coil assembly 30 and the overall thickness of the coil module 100, which meets the development trend of thinner electronic devices equipped with the coil module 100. Secondly, the coil assembly 30 adopts a single-sided wiring method, which reduces the thickness of the remaining stacked layers and provides space for increasing the copper thickness of the wiring in the coil portion 340, thereby reducing the AC resistance of the coil assembly 30 and improving the charging efficiency. Furthermore, by providing only one cover film 80 on a single coil section 340, the need for a cover film on the surface of the insulating base layer 32 opposite to the coil section 340 is eliminated, further reducing the thickness of the coil module 100 and better meeting the needs of lightweight portable devices for contactless power transmission. This thickness refers to the dimensions of each component of the coil module 100 in the stacking direction.

[0042] In this embodiment, the insulating base layer 32 is circular and can be, but is not limited to, insulating organic fiber sheets, polymer insulating sheets, or composite insulating sheets. The coil assembly 30 is attached to one side of the insulating base layer 32, and the first wire bundle 36 is attached to the other side of the insulating base layer 32. The support layer 50 is a rectangular nanocrystal, the heat dissipation layer 70 is a rectangular heat dissipation fin, and the cover film 80 is a circular film. In other embodiments, the insulating base layer 32 can be, but is not limited to, a rectangular insulating sheet, a polygonal insulating sheet, an elliptical insulating sheet, or an irregularly shaped insulating sheet; the support layer 50 can be, but is not limited to, a circular nanocrystal, a polygonal nanocrystal, an elliptical nanocrystal, or an irregularly shaped nanocrystal.

[0043] like Figures 4-9As shown, the coil portion 340 includes multiple turns of metal trace 343. The multiple turns of metal trace 343 are formed by a single metal trace winding around the first surface 322 of the insulating base layer 32 from the outside in to form a spiral coil. The multiple turns of metal trace 343 can be wound clockwise or counterclockwise. Since the multiple turns of metal trace 343 can be wound clockwise or counterclockwise to form the spiral coil portion 340, the routing of the metal trace 343 is not limited, and the coil portion 340 can be manufactured according to actual needs. In this embodiment, the multiple turns of metal trace 343 can be wound clockwise. The multiple turns of metal trace 343 are spaced apart, each turn of metal trace 343 is circular, and the multiple turns of metal trace 343 are coaxial. The first end 341 is located inside the coil portion 340, and the second end 342 is located at the outer edge of the coil portion 340. In this embodiment, the cross-section of the metal trace 343 is rectangular. The outer diameter of the outermost metal trace 343 of the coil portion 340 is less than or equal to the diameter of the first surface 322, so that the coil portion 340 is located within the first surface 322. In other embodiments, each turn of the metal trace 343 may also be rectangular, polygonal, or elliptical. Since the metal trace 343 may be circular, rectangular, polygonal, or elliptical, the coil portion 340 can be designed as a spiral coil of various shapes according to implementation needs.

[0044] Optionally, the length direction of the first wire harness 36 is parallel to the radial direction of the coil portion 340, and the end of the first wire harness 36 away from the first end 341 extends beyond the outer edge of the insulating base layer 32. Because the first wire harness 36 extends radially along the coil portion 340, its length is relatively short, which not only saves manufacturing materials but also improves charging efficiency. In this embodiment, the cross-section of the first wire harness 36 is rectangular. In other embodiments, the cross-section of the first wire harness 36 may be, but is not limited to, circular, polygonal, or oblong.

[0045] Optionally, the insulating base layer 32 has a through hole 325 facing the first end 341 of the coil bundle 34. A connecting wire bundle 363 is provided in the through hole 325, and the connecting wire bundle 363 connects the first end 341 of the coil bundle 34 and one end of the first wire bundle 36. The connecting wire bundle 363 is a metal bundle. By opening the through hole 325 in the insulating base layer 32, one end of the first wire bundle 36 can be connected to the first end 341 of the coil bundle 34 through the connecting wire bundle 363, thereby enabling the coil assembly 30 to form a complete circuit.

[0046] Optionally, the coil bundle 34 further includes a second wire bundle 345. One end of the second wire bundle 345 is connected to the second end 342 of the coil portion 340. The first end 341 of the coil bundle 34 is closer to the center line L of the coil portion 340 than the second end 342. The other end of the second wire bundle 345 extends beyond the outer edge of the insulating base layer 32. Providing the second wire bundle 345 at the second end 342 of the coil bundle 34 facilitates connection to the circuit system of the contactless charging device. The first wire bundle 36 has a first contact point 364 at its end extending from the coil bundle 34, and the second wire bundle 345 has a second contact point 346 at its end extending from the edge of the insulating base layer 32. The first contact point 364 and the second contact point 346 are used for connection to the circuit system of the contactless charging device. Figure 7 As shown, the current flows out of the first wire harness 36 through the second wire harness 345 along the multi-turn metal wire 343, the connecting wire harness 363 and the connecting wire harness 363.

[0047] In this embodiment, the second wire harness 345 is close to the first wire harness 36. Preferably, the second wire harness 345 is parallel to the first wire harness 36 at a distance. The first wire harness 36 and the second wire harness 345 are two jumpers of the coil module 100, respectively. Setting the first wire harness 36 and the second wire harness 345 to be parallel at a distance not only facilitates processing but also facilitates connection to the circuit system of the contactless charging device.

[0048] The coil module 100 also includes a first flexible circuit board 35 and a second flexible circuit board 37. The first flexible circuit board 35 is disposed on the first surface 322 of the insulating base layer 32, and the second flexible circuit board 37 is disposed on the second surface 324 of the insulating base layer 32. The coil bundle 34 is disposed on the first flexible circuit board 35, and the first wire bundle 36 is disposed on the second flexible circuit board 37. The coil bundle 34 is formed by running metal wires on the first flexible circuit board 35, and the first wire bundle 36 is formed by running metal wires on the second flexible circuit board 37. By forming the coil bundle 34 by running metal wires on the first flexible circuit board 35 and the first wire bundle 36 by running metal wires on the second flexible circuit board 37, the thickness of both the coil bundle 34 and the first wire bundle 36 can be designed to be relatively thin, which is beneficial for reducing the overall thickness of the coil module 100. The first flexible circuit board 35 includes a first protrusion 352 protruding along the length direction of the second wire harness 345, the second flexible circuit board 37 includes a second protrusion 372 protruding along the length direction of the first wire harness 36, and the insulating base layer 32 also includes an insulating protrusion 326 disposed between the first protrusion 352 and the second protrusion 372, that is, the insulating protrusion 326 is clamped by the first protrusion 352 and the second protrusion 372.

[0049] Please see Figure 3 and Figures 10-12The support layer 50 is made of nanocrystals and includes a support surface 52 and a back surface 54 disposed opposite to each other. The coil assembly 30 is disposed on the support surface 52 of the support layer 50. A receiving groove 522 is provided on the support surface 52, and the first wire harness 36 and the second flexible circuit board 37 are accommodated in the receiving groove 522. In this embodiment, the receiving groove 522 is a strip-shaped groove corresponding to the second flexible circuit board 37, and one end of the receiving groove 522 passes through the side of the support layer 50. The width of the receiving groove 522 is greater than the width of the second flexible circuit board 37, and the depth of the receiving groove 522 is greater than the thickness of the second flexible circuit board 37, so that the first wire harness 36 and the second flexible circuit board 37 can be completely accommodated in the receiving groove 522. That is, when the coil assembly 30 is placed on the support layer 50, the first wire harness 36 and the second flexible circuit board 37 are accommodated in the receiving groove 522, and the support surface 52 is supported by the insulating base layer 32, thereby further reducing the thickness of the coil module 100. The shape of the support layer 50 may be the same as or different from the shape of the insulating base layer 32. The area of ​​the support surface 52 of the support layer 50 is greater than or equal to the area of ​​the second surface 324, so that the second surface 324 of the insulating base layer 32 can fall entirely within the area of ​​the support surface 52. In this embodiment, the support surface 52 is rectangular, the second surface 324 is circular, and the diameter of the second surface 324 is smaller than the length and width of the support surface 52.

[0050] Optionally, the cover layer 60 is housed in the receiving groove 522 of the support layer 50, and the cover layer 60 covers the first wire harness 36 and the second flexible circuit board 37. The cover layer 60 can be a polyester film or a polypropylene film, etc., covering the second flexible circuit board 37. The cover layer 60 can protect the surfaces of the first wire harness 36 and the second flexible circuit board 37 from corrosion by external substances, increase the wear resistance and stain resistance of the first wire harness 36 and the second flexible circuit board 37, and improve the reliability and service life of the first wire harness 36 and the second flexible circuit board 37. The shape of the cover layer 60 is consistent with the shape of the receiving groove 522. In this embodiment, the width of the cover layer 60 is less than or equal to the width of the receiving groove 522, and the thickness of the cover layer 60 is less than the depth of the receiving groove 522. When the cover layer 60, the second flexible circuit board 37, and the first wire harness 36 are all housed in the receiving groove 522, the cover layer 60 covers the first wire harness 36 and the second flexible circuit board 37. The surfaces of the second flexible circuit board 37 and the first wire harness 36 facing away from the cover layer 60 are coplanar with the support surface 52, or the surfaces of the second flexible circuit board 37 and the first wire harness 36 facing away from the cover layer 60 are located within the receiving groove 522. The cover layer 60 can be, but is not limited to, an ultra-thin black cover film, a polyimide film, or an FPC cover film, etc., and the thickness of the cover layer 60 is between 3 μm and 7.5 μm.

[0051] Optionally, the heat dissipation layer 70 is disposed on the surface of the support layer 50 facing away from the coil assembly 30, that is, the heat dissipation layer 70 is attached to the back surface 54 of the support layer 50. The heat dissipation layer 70 is used to dissipate heat from the coil assembly 30 during operation, preventing the coil assembly 30 from overheating, thereby protecting the normal operation of the coil assembly 30 and extending its service life. The shape of the heat dissipation layer 70 is consistent with the shape of the support layer 50 so that the heat dissipation layer 70 can be completely attached to the back surface 54 of the support layer 50. In this embodiment, the heat dissipation layer 70 is made of heat-dissipating graphite, which can improve the heat dissipation efficiency of the coil module 100. In other embodiments, the heat dissipation layer 70 may also be made of, but is not limited to, thermally conductive silicone pads, thermally conductive grease, etc.

[0052] Optionally, a cover film 80 covers the surfaces of the coil portion 340 and the first flexible circuit board 35 facing away from the insulating base layer 32. The shape of the cover film 80 is consistent with the shape of the insulating base layer 32 so that the cover film 80 can completely cover the coil portion 340 and the first flexible circuit board 35. In this embodiment, the cover film 80 is circular, and the diameter of the cover film 80 is equal to the diameter of the insulating base layer 32. In other embodiments, the diameter of the cover film 80 is slightly larger than or equal to the outer diameter of the outermost metal trace 343 of the coil portion 340. The cover film 80 can be, but is not limited to, an ultra-thin black cover film, a polyimide film, or an FPC cover film, and the thickness of the cover film 80 is between 3 μm and 7.5 μm. The cover layer 60 can protect the surfaces of the coil portion 340 and the first flexible circuit board 35 from corrosion by external substances, increase the wear resistance and stain resistance of the coil portion 340 and the first flexible circuit board 35, and improve the reliability and service life of the coil portion 340 and the first flexible circuit board 35.

[0053] When assembling the coil module 100, the cover layer 60 is placed in the receiving groove 522, and the coil assembly 30 is placed on the support surface 52 of the support layer 50, so that the first wire harness 36, the second flexible circuit board 37, and the second protrusion 372 are accommodated in the receiving groove 522. The cover layer 60 covers the first wire harness 36 and the second protrusion 372, and the second surface 324 is connected to the support surface 52 of the support layer 50, thereby ensuring the flatness of the entire coil assembly 30, improving wireless power transmission efficiency, and improving the coil module 100. The temperature rise during power transmission of 00 improves the user experience and further reduces the thickness of the coil module 100; the ends of the second wire harness 345 and the first wire harness 36 away from the coil part 340 extend out of the outer side of the insulating base layer 32, so that the first contact point 364 and the second contact point 346 are exposed; the cover film 80 is covered and positioned on the surface of the coil part 340 away from the support layer 50, and there is epoxy adhesive between the cover film 80 and the coil part 340; the heat dissipation layer 70 is attached and connected to the back side 54 of the support layer 50. The support layer 50 can absorb energy from the electromagnetic field and convert it into electrical energy, transmitting it to the receiving end to improve power transmission efficiency. Secondly, it enables power transmission over longer distances, expanding the application scenarios of wireless power transmission. Furthermore, the support layer 50 helps dissipate heat from the coil module 100, further improving power transmission speed and efficiency. The support layer 50 has high saturation magnetic flux density and relative permeability, significantly reducing the volume and mass of the magnetic coupling mechanism while maintaining shielding effectiveness, making it suitable for wireless charging environments of portable electronic devices. The support layer 50 also effectively reduces energy loss during power transmission, minimizing heat generation and electromagnetic interference to the environment surrounding the coil module 100. In other embodiments, the support layer 50 can also be made of materials other than nanocrystalline materials that possess the aforementioned effects.

[0054] In other embodiments, the material of the insulating base layer 32 of the coil module 100 and the material of the cover film 80 can be interchanged.

[0055] Please refer to the following: Figures 13-14 The structure of the coil module in the second embodiment of this utility model is similar to that of the coil module 100 in the first embodiment, except that the structure of the coil assembly 30a in the second embodiment is slightly different from that in the first embodiment. Specifically, the winding direction of the metal trace 343 of the coil portion 340a in the second embodiment is opposite to that of the metal trace 343 of the coil portion 340 in the first embodiment. In the second embodiment, the coil portion 340a is formed by a single metal trace winding around the first flexible circuit board 35 from the outside to the inside to form a spiral coil, with multiple turns of the metal trace 343 winding counterclockwise. The multiple turns of the metal trace 343 are spaced apart from each other, each turn of the metal trace 343 is circular, and the multiple turns of the metal trace 343 are coaxial.

[0056] The function and beneficial effects of the coil assembly 30a in the second embodiment are the same as those of the coil assembly in the first embodiment, and will not be repeated here.

[0057] Please refer to the following: Figures 15-16 The structure of the coil module in the third embodiment of this utility model is similar to that of the coil module 100 in the first embodiment. The difference lies in that the structure of the coil assembly 30b in the third embodiment is slightly different from that in the first embodiment. Specifically, in the third embodiment, the insulating base layer 32a is a rectangular flexible circuit board, and the coil part 340b is rectangular. A metal trace is formed by winding multiple turns of spaced metal trace 343b around the first flexible circuit board 35 from the outside to the inside. The multiple turns of metal trace 343b form a spiral coil, and each turn of metal trace 343b is rectangular. The multiple turns of metal trace 343b can be wound clockwise or counterclockwise. In this embodiment, the multiple turns of metal trace 343b are wound clockwise.

[0058] In other embodiments, a metal trace 343b is formed on the first flexible circuit board 35 by wrapping around the first flexible circuit board 35 in a counterclockwise direction from the outside to the inside, forming a spiral coil, and each turn of the metal trace 343b is rectangular.

[0059] The function and beneficial effects of the coil assembly 30b in the third embodiment are the same as those of the coil assembly in the first embodiment, and will not be repeated here.

[0060] Please see Figure 17 The structure of the coil module in the fourth embodiment of this utility model is similar to that of the coil module 100 in the first embodiment, except that the structure of the coil assembly 30c in the fourth embodiment is slightly different from that in the first embodiment. Specifically, in the fourth embodiment, the insulating base layer 32c is an elliptical insulating sheet, and the coil part 340c is elliptical in shape. A metal trace is formed by winding multiple turns of spaced metal trace 343c from the outside to the inside on the first flexible circuit board 35. The multiple turns of metal trace 343c form a spiral coil, and each turn of metal trace 343c is elliptical. The multiple turns of metal trace 343c can be wound clockwise or counterclockwise. In this embodiment, the multiple turns of metal trace 343c are wound clockwise.

[0061] In other embodiments, a metal trace is formed on the first flexible circuit board 35 by wrapping multiple turns of spaced metal trace 343c from the outside to the inside in a counterclockwise direction. The multiple turns of metal trace 343c form a spiral coil, and each turn of metal trace 343c is elliptical.

[0062] The function and beneficial effects of the coil assembly 30c in the fourth embodiment are the same as those of the coil assembly in the first embodiment, and will not be repeated here.

[0063] In other embodiments, the insulating base layer may also be a polygonal insulating sheet, and the first flexible circuit board may also be a polygonal flexible circuit board. The coil portion is polygonal, and a metal trace is formed by wrapping multiple turns of spaced metal traces from the outside to the inside on the first flexible circuit board. The multiple turns of metal traces form a spiral coil, and each turn of metal trace is polygonal. The multiple turns of metal traces can be wrapped clockwise or counterclockwise.

[0064] Please refer to the following: Figures 18-21 The structure of the coil module in the fifth embodiment of this utility model is similar to that of the coil module 100 in the first embodiment. The difference lies in that the structure of the support layer 50a in the fifth embodiment is slightly different from that in the first embodiment. Specifically, in the fifth embodiment, the receiving groove 522 of the support layer 50a passes through the back side of the support layer 50a away from the support surface 52, that is, the receiving groove 522 passes through the back side 54 of the support layer 50a. When the cover layer 60 is accommodated in the receiving groove 522, the back side of the cover layer 60 away from the first wire harness 36 and the second protruding piece 372 is coplanar with the back side 54 of the support layer 50a, that is, the back side of the cover layer 60 is coplanar with the back side 54 of the support layer 50a. In order to make the back side of the cover layer 60 coplanar with the back side 54 of the support layer 50a, not only does the receiving groove 522 need to pass through the entire support layer 50a, but the thickness of the support layer 50a also needs to be reduced. Therefore, the thinned support layer 50a further reduces the overall thickness of the coil module.

[0065] Optionally, the support surface 52 of the support layer 50a is provided with a clearance space 524, which connects to the receiving groove 522, and the insulating base layer 32 is accommodated in the clearance space 524. When the coil assembly 30 is placed on the support layer 50a, the first wire harness 36, the second flexible circuit board, the second protrusion 372, and the insulating protrusion 326 are all accommodated in the receiving groove 522, and the insulating base layer 32 is accommodated in the clearance space 524, which can further reduce the overall thickness of the coil module. In this embodiment, when the insulating base layer 32 is accommodated in the clearance space 524, the first surface 322 of the insulating base layer 32 is coplanar with the support surface 52 of the support layer 50a. In other embodiments, when the insulating base layer 32 is accommodated in the clearance space 524, the first surface 322 of the insulating base layer 32 is close to the support surface 52, that is, the first surface 322 can be located inside the clearance space 524 or outside the clearance space 524.

[0066] In other embodiments, the receiving groove 522 may not penetrate the back surface 54 of the support layer 50a. The support surface 52 of the support layer 50a is provided with a clearance space 524, which is connected to the receiving groove 522. The cover layer 60 is housed in the receiving groove 522. The first wire harness 36, the second flexible circuit board, the second protrusion 372, and the insulating protrusion 326 are all housed in the receiving groove 522 and supported by the cover layer 60. The insulating base layer 32 is housed in the clearance space 524. The first surface 322 is close to the support surface 52, or the first surface 322 is coplanar with the support surface 52.

[0067] In this embodiment, the insulating base layer 32 of the coil module can be accommodated within the clearance space 524 of the support layer 50a, thereby further reducing the overall thickness of the coil module, improving wireless power transmission efficiency, further reducing charging temperature rise, and enhancing user experience.

[0068] like Figures 22-23 As shown, the structure of the coil module in the sixth embodiment of this application is similar to that of the coil module in the first embodiment, except that: in the sixth embodiment, the receiving groove 522 on the support layer 50 passes through the back surface 54 of the support layer 50, and a through groove 72 is formed on the heat dissipation layer 70 facing the receiving groove 522. Specifically, a receiving groove 522 is provided on the support surface 52 of the support layer 50 facing the first wire harness 36, and the receiving groove 522 passes through the back surface 54 of the support layer 50; a through groove 72 is provided on the front surface of the heat dissipation layer 70 facing the receiving groove 522, and the through groove 72 passes through the back surface of the heat dissipation layer 70. When the coil assembly 30 is installed onto the support surface 52 of the support layer 50, the ends of the second flexible circuit board, the first wire harness 36, and the connecting wire harness 363 away from the coil bundle 34 are accommodated in the receiving groove 522. The heat dissipation layer 70 is attached to the back surface 54 of the support layer 50, with the through groove 72 facing the receiving groove 522. Then, the cover layer 60 is attached from the through groove 72 to the back surface of the first wire harness 36 away from the coil bundle 34, and the cover layer 60 is accommodated in the through groove 72. Preferably, the back surface of the cover layer 60 is coplanar with the back surface of the heat dissipation layer 70. When the coil assembly 30 is placed on the support layer 50, the second flexible circuit board, the first wire harness 36, and the connecting wire harness 363 are all accommodated in the receiving groove 522, and the cover layer 60 is accommodated in the through groove 72, thereby further reducing the overall thickness of the coil module.

[0069] Understandably, the depth and width of the receiving groove 522 on the support layer 50 are determined by the thickness and width of the second flexible circuit board 37, the first wire harness 36 and the second protrusion. The receiving groove 522 may or may not penetrate the heat dissipation layer 70.

[0070] like Figure 24As shown, one embodiment of this application also provides a wireless charging device 200. The wireless charging device 200 includes a coil module 100, a housing 210, and a circuit board 220 as described in any of the above embodiments. The coil module 100 and the circuit board 220 are disposed within the housing 210. The coil module 100 is electrically connected to the circuit board 220 and is used for contactless power transmission. A charging platform is provided on the housing 210, and the coil module 100 is located near the inner surface of the charging platform or disposed on the charging platform. When the wireless charging device 200 charges a device placed on the charging platform, the coil module 100 generates a magnetic field. The coil in the device being charged undergoes electromagnetic induction with the magnetic field, thereby generating a current and converting electromagnetic energy into electrical energy to charge the battery in the device being charged.

[0071] Because the coil module 100 is thinner, the overall thickness of the wireless charging device 200 can be reduced to meet the requirements of lightweight design of the wireless charging device 200.

[0072] like Figure 25 As shown, another embodiment of this application also provides an electronic device 400. The electronic device 400 includes a coil module 100, a housing 410, a motherboard 420, and a battery 430 as described in any of the above embodiments. The coil module 100, motherboard 420, and battery 430 are all disposed within the housing 410. The coil module 100 and battery 430 are electrically connected to the motherboard 420. The battery 430 provides power to the motherboard 420 and other electronic components. The coil module 100 is used for contactless power reception to provide power to the battery 430. When the battery 430 of the electronic device 400 needs charging, the electronic device 400 is placed on the charging platform of a wireless charging device, such that the coil module 100 on the electronic device 400 is directly opposite the coil module 100 of the wireless charging device. After the wireless charging device is powered on, the coil module 100 of the wireless charging device generates a changing magnetic field. The coil module 100 on the electronic device 400 senses this magnetic field and generates current to charge the battery 430.

[0073] Optionally, the coil module 100 is located near or disposed on the inner surface of the housing 410.

[0074] In this embodiment, the electronic device 400 is a mobile phone. The electronic device 400 also includes a display screen 450, and a battery 430 provides power to the display screen 450, which is electrically connected to the motherboard. In other embodiments, the electronic device 400 can also be, but is not limited to, electronic products that require charging, such as tablet computers, smartwatches, or smart wearable devices. Various electronic products include a coil module 100.

[0075] The coil module 100 in the electronic device 400 of this application is thinner, thereby reducing the overall thickness of the electronic device 400 to meet the requirements of lightweight design of the electronic device 400 and facilitating the layout of other electronic components within the electronic device 400.

[0076] like Figure 26 As shown, when the wireless charging device 200 is used to charge the electronic device 400, the electronic device 400 is placed on the charging platform of the wireless charging device 200. The wireless charging device 200 is connected to an external power source. The coil module 100 of the wireless charging device 200 generates a magnetic field. The coil module 100 in the electronic device 400 senses the magnetic field and generates a current to charge the battery 430 of the electronic device 400.

[0077] The above are the implementation methods of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications are also considered to be within the protection scope of the present utility model.

Claims

1. A coil module, characterized in that, The coil module includes a coil assembly, which includes an insulating base layer, a coil bundle, and a first wire bundle. The coil bundle includes a coil portion disposed on a first surface of the insulating base layer. The first wire bundle is disposed on a second surface of the insulating base layer. One end of the first wire bundle passes through the insulating base layer and is connected to a first end of the coil portion. The other end of the first wire bundle extends out of the edge of the coil portion. The first surface and the second surface are disposed opposite to each other.

2. The coil module according to claim 1, characterized in that, The insulating base layer has a through hole facing the first end of the coil bundle, and a connecting wire bundle is provided in the through hole. The connecting wire bundle is connected between the first end of the coil bundle and one end of the first wire bundle.

3. The coil module according to claim 1, characterized in that, The coil section includes multiple turns of metal traces, which are spiral-shaped and wound clockwise or counterclockwise.

4. The coil module according to claim 3, characterized in that, The metal traces are circular, rectangular, polygonal, or elliptical.

5. The coil module according to claim 1, characterized in that, The coil module further includes a first flexible circuit board and a second flexible circuit board. The first flexible circuit board is disposed on a first surface of the insulating base layer, and the second flexible circuit board is disposed on a second surface of the insulating base layer. The coil bundle is disposed on the first flexible circuit board, and the first wire bundle is disposed on the second flexible circuit board.

6. The coil module according to claim 1, characterized in that, The length direction of the first wire bundle is parallel to the radial direction of the coil portion.

7. The coil module according to claim 1, characterized in that, The coil bundle also includes a second wire bundle, one end of which is connected to the second end of the coil portion, the first end being closer to the center line of the coil portion than the second end, and the other end of the second wire bundle extending beyond the edge of the insulating base layer.

8. The coil module according to claim 7, characterized in that, The first wire harness is parallel to the second wire harness at intervals. The first wire harness has a first contact point at one end extending out of the insulating base layer, and the second wire harness has a second contact point at one end extending out of the edge of the insulating base layer.

9. The coil module according to any one of claims 1-8, characterized in that, The coil module further includes a support layer, the coil assembly is disposed on the support surface of the support layer, and a receiving groove is provided on the support surface. The second flexible circuit board and the first wire harness of the coil module are housed in the receiving groove.

10. The coil module according to claim 9, characterized in that, The coil module also includes a cover layer disposed in the receiving slot, the cover layer covering the first wire harness and the second flexible circuit board.

11. The coil module according to claim 10, characterized in that, The receiving groove passes through the back side of the support layer opposite to the support surface, and the covering layer is opposite to the back side of the first wire harness and is coplanar with the back side of the support layer.

12. The coil module according to claim 9, characterized in that, The support surface of the support layer is provided with an avoidance space, the avoidance space is connected to the receiving groove, and the insulating base layer is housed in the avoidance space.

13. The coil module according to claim 9, characterized in that, The coil module further includes a heat dissipation layer disposed on the surface of the support layer opposite to the coil assembly.

14. The coil module according to claim 9, characterized in that, The support layer is made of nanocrystals.

15. The coil module according to claim 1, characterized in that, The coil module also includes a cover film that covers the side of the coil assembly away from the insulating base layer, and the material of the cover film is interchangeable with the material of the insulating base layer.

16. A wireless charging device, characterized in that, The wireless charging device includes a coil module, a housing, and a circuit board as described in any one of claims 1-15. The coil module and the circuit board are disposed within the housing. The coil module is electrically connected to the circuit board. The coil module is used for contactless power transmission.

17. An electronic device, characterized in that, The electronic device includes a coil module, a housing, a battery, and a motherboard as described in any one of claims 1-15. The coil module, the motherboard, and the battery are all disposed within the housing. The coil module is electrically connected to the motherboard. The coil module is used for contactless power reception. The battery stores the power supplied by the coil module.

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