Controller

Abstract

The utility model relates to the technical field of control equipment, in particular to a controller which comprises a first shell and a second shell. The first shell and the second shell are buckled to form a mounting cavity; a first PCB (Printed Circuit Board) and a second PCB which are spaced in parallel are arranged in the mounting cavity; the surface, close to the second PCB, of the first PCB is provided with a plurality of surface-mounted MOS transistors which are arranged at intervals. Through structural optimization, the controller is convenient to assemble, and the size of the controller can be effectively reduced.

Description

Technical Field

[0001] This application relates to the field of control equipment technology, and more specifically, to a controller. Background Technology

[0002] In electric vehicles, motorcycles, and other vehicles, a large PCB board is typically housed within the controller housing, on which through-hole MOSFETs are soldered. These through-hole MOSFETs are large and tall, requiring significant vertical space when mounting them on the PCB. Furthermore, the commonly used through-hole MOSFETs are not only difficult to solder, resulting in a high rate of soldering defects, but they also need to be placed close to the side wall of the controller housing. This increases the assembly complexity of the controller, significantly increasing labor and time costs in production, and ultimately reducing production efficiency. Utility Model Content

[0003] The purpose of this application is to provide a controller that, through structural optimization, not only facilitates assembly but also effectively reduces the size of the controller.

[0004] The embodiments of this application are implemented as follows:

[0005] This application provides a controller, including a first housing and a second housing; the first housing and the second housing are fastened together to form a mounting cavity; a first PCB board and a second PCB board are disposed in parallel spaced apart in the mounting cavity; a plurality of surface-mount MOSFETs are disposed on the surface of the first PCB board near the second PCB board; a first through hole is formed on the second PCB board, and a second through hole is formed on the second housing; a conductive connecting post is vertically disposed on the first PCB board, the conductive connecting post having a wiring end away from the first housing, the conductive connecting post passing through the first through hole and the second through hole, so that the wiring end is located outside the mounting cavity.

[0006] As an optional implementation, the surface of the first PCB board facing away from the second PCB board is attached to the inner wall of the first housing, and the outer wall of the first housing is provided with a heat dissipation structure.

[0007] As an optional implementation, the second housing is provided with a U-shaped structure, which is arranged around the periphery of the wiring end, and the opening direction of the U-shaped structure is perpendicular to the axial direction of the conductive connection post.

[0008] As an optional implementation, there are two sets of conductive connecting posts. The terminals of the first set of conductive connecting posts are used to connect to the positive and negative terminals of the power supply, and the terminals of the second set of conductive connecting posts are used to connect to the load.

[0009] As an optional implementation, a support structure is also included, the support structure including a support plate and a plurality of support plate connecting portions disposed on the support plate; the support plate is connected to the first PCB board through the support plate connecting portions, the support plate has an insulating sleeve that passes through the first through hole and is sleeved outside the conductive connecting post; fasteners are provided between the first PCB board and the second PCB board, so that the surface of the second PCB board near the surface mount MOSFET abuts against the support plate.

[0010] As an optional implementation, the support plate has a connection hole, and an inter-board connector for connecting the first PCB board and the second PCB board is inserted into the connection hole.

[0011] As an optional implementation, a pin connector is provided on the second PCB board, and a pin connector head is provided on the outside of the second housing. A pin hole is opened on the pin connector head, and the pin of the pin connector passes through the pin hole.

[0012] As an optional implementation, an annular groove is formed on the first housing, and the projections of the first PCB board and the second PCB board on the first housing are located within the area enclosed by the annular groove. A sealing gasket that abuts against the second housing is embedded in the annular groove.

[0013] As an optional implementation, a first fixing hole is provided at intervals along the extension path of the annular groove, and a first connector is provided in the first fixing hole, which penetrates the sealing gasket and connects to the second housing; a second fixing hole is provided within the area enclosed by the annular groove, and a second connector is provided in the second fixing hole, which connects to the first PCB board.

[0014] As an optional implementation, positioning grooves are provided at intervals along the extension path of the annular groove, and the sealing gasket has positioning blocks embedded in the positioning grooves.

[0015] As an optional implementation, the first PCB board is provided with a support boss, which is used to support the conductive connecting post.

[0016] The beneficial effects of the embodiments of this application include:

[0017] This application provides a controller, including a first housing and a second housing; the first housing and the second housing are fastened together to form a mounting cavity. The mounting cavity of this application embodiment contains a first PCB board and a second PCB board spaced parallel to each other. Multiple surface-mount MOSFETs are arranged at intervals on the surface of the first PCB board near the second PCB board. This application embodiment uses two parallel-spaced PCB boards, which significantly reduces the PCB board coverage area compared to a single PCB board in the prior art, thereby effectively reducing the controller's area. This application embodiment arranges surface-mount MOSFETs between the first and second PCB boards. Compared to through-hole MOSFETs, this application embodiment allows for a smaller spacing between the first and second PCB boards using surface-mount MOSFETs, avoiding an increase in the controller's height. Therefore, this application embodiment not only facilitates assembly but also effectively reduces the controller's size. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is one of the structural schematic diagrams of the controller in an embodiment of this application;

[0020] Figure 2 This is a second schematic diagram of the controller structure according to an embodiment of this application;

[0021] Figure 3 This is the third schematic diagram of the controller structure in the embodiments of this application;

[0022] Figure 4 This is the fourth schematic diagram of the controller structure in the embodiments of this application;

[0023] Figure 5 This is the fifth schematic diagram of the controller in the embodiments of this application.

[0024] icon:

[0025] 100-First housing; 101-Second housing; 102-First PCB board; 103-Second PCB board; 104-Surface mount MOSFET; 105-Heat dissipation structure; 106-First through hole; 107-Second through hole; 108-Conductive connecting post; 109-Wire terminal; 110-U-shaped structure; 111-Support plate; 112-Support plate connecting part; 113-Insulating sleeve; 114-Fastener; 115-Connecting hole; 116-Inter-board connector; 117-Pin connector; 118-Pin connector connector; 119-Annular groove; 120-Sealing gasket; 121-First fixing hole; 122-Second fixing hole; 123-Positioning block. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0028] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0029] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] In electric vehicles, motorcycles, and other vehicles, a large PCB board is typically housed within the controller housing, on which through-hole MOSFETs are soldered. These through-hole MOSFETs are large and tall, requiring significant vertical space when mounting them on the PCB. Furthermore, the commonly used through-hole MOSFETs are not only difficult to solder, resulting in a high rate of soldering defects, but they also need to be placed close to the side wall of the controller housing. This increases the assembly complexity of the controller, significantly increasing labor and time costs in production, and ultimately reducing production efficiency.

[0031] To address the aforementioned technical problems, this application provides a controller.

[0032] Reference Figure 1 , Figure 2 as well as Figure 3 As shown, this application embodiment provides a controller, including a first housing 100 and a second housing 101; the first housing 100 and the second housing 101 are fastened together to form a mounting cavity; a first PCB board 102 and a second PCB board 103 are disposed in parallel spaced apart in the mounting cavity; a plurality of surface-mount MOSFETs 104 are disposed on the surface of the first PCB board 102 near the second PCB board 103.

[0033] The controller provided in this application includes a first housing 100 and a second housing 101; the first housing 100 and the second housing 101 are fastened together to form an installation cavity.

[0034] It should be noted that the specific structures of the first housing 100 and the second housing 101 in this application embodiment can be configured by those skilled in the art as needed, and no special limitation is made thereto. The purpose is to form an installation cavity by fastening the first housing 100 and the second housing 101 together.

[0035] Reference Figure 2 as well as Figure 3 As shown, the mounting cavity of this application embodiment is provided with a first PCB board 102 and a second PCB board 103 that are parallel to each other. The surface of the first PCB board 102 near the second PCB board 103 is provided with a plurality of surface-mount MOSFETs 104 arranged at intervals.

[0036] It should be noted that, in this embodiment of the application, the first PCB board 102 and the second PCB board 103 are installed in the mounting cavity. In order to reduce the size of the controller, the first PCB board 102 and the second PCB board 103 can be embedded in the mounting cavity formed by the first housing 100 and the second housing 101.

[0037] It should be noted that the projections of the first PCB board 102 and the second PCB board 103 onto the first housing 100 overlap. Preferably, the projections of the first PCB board 102 and the second PCB board 103 onto the first housing 100 completely overlap. That is to say, the first PCB board 102 and the second PCB board 103 are exactly the same size.

[0038] The surface-mount MOSFET 104 of this application embodiment can be soldered onto the first PCB board 102. The surface-mount MOSFET 104 does not need to be close to the side wall of the mounting chamber. The surface-mount MOSFET 104 can be arranged in an array on the surface of the first PCB board 102. The number of surface-mount MOSFETs 104 can be set as needed by those skilled in the art.

[0039] This embodiment employs two parallel, spaced PCBs, which significantly reduces the PCB coverage area compared to a single PCB in the prior art, thereby effectively reducing the controller's size. In this embodiment, a surface-mount MOSFET 104 is arranged between the first PCB 102 and the second PCB 103. Compared to through-hole MOSFETs, the surface-mount MOSFET 104 allows for a smaller spacing between the first PCB 102 and the second PCB, avoiding an increase in the controller's height. Therefore, this embodiment not only facilitates assembly but also effectively reduces the controller's size.

[0040] Reference Figure 1 As shown, in one optional implementation, the surface of the first PCB board 102 facing away from the second PCB board 103 is attached to the inner wall of the first housing 100, and the outer wall of the first housing 100 is provided with a heat dissipation structure 105.

[0041] Furthermore, in this embodiment of the application, the surface of the first PCB board 102 facing away from the second PCB board 103 is attached to the inner wall of the first housing 100, so that the first PCB board 102 is embedded in the first housing 100. This arrangement helps to avoid an increase in the size of the controller due to the gap between the first PCB board 102 and the first housing 100.

[0042] In addition, in this embodiment of the application, a heat dissipation structure 105 is provided on the outer wall of the first housing 100, so that the heat generated by the high-power devices on the first PCB board 102 can be directly dissipated through the heat dissipation structure 105, which helps to prevent the controller temperature from getting too high.

[0043] It should be noted that the specific structure of the heat dissipation structure 105 can be configured by those skilled in the art as needed, and no special limitations are imposed on it.

[0044] For example, the heat dissipation structure 105 of this application embodiment includes a plurality of heat dissipation toothed plates arranged at intervals on the outer wall of the first housing 100, and the heat dissipation toothed plates are arranged perpendicularly to the outer wall of the first housing 100. The arrangement surface of the heat dissipation toothed plates is greater than or equal to the orthographic projection of the first PCB board 102 on the first housing 100.

[0045] It should be noted that the heat dissipation plate and the first housing 100 can be integrally formed from metal materials, which facilitates the achievement of good heat dissipation effect.

[0046] Reference Figure 2 , Figure 3 as well as Figure 4 As shown, in one optional implementation, a first through hole 106 is formed on the second PCB board 103, and a second through hole 107 is formed on the second housing 101; a conductive connecting post 108 is vertically arranged on the first PCB board 102, the conductive connecting post 108 has a wiring end 109 away from the first housing 100, the conductive connecting post 108 passes through the first through hole 106 and the second through hole 107, so that the wiring end 109 is located outside the mounting chamber.

[0047] There are two sets of conductive connecting posts 108. The wiring end 109 of the first set of conductive connecting posts 108 is used to connect the positive and negative terminals of the power supply, and the wiring end 109 of the second set of conductive connecting posts 108 is used to connect the load.

[0048] It should be noted that one end of the conductive connecting post 108 is soldered to the first PCB board 102, and the other end, the wiring end 109, can extend through the first through hole 106 and the second through hole 107 to the outside of the second housing 101. Electrical connection with the power supply and the load can be achieved through the wiring end 109. The controller provided in this embodiment can be used in electric vehicles such as electric bicycles and electric motorcycles; therefore, the load can be a three-phase motor.

[0049] Furthermore, the first PCB board 102 is provided with a support boss, and the conductive connecting post 108 can be connected to the support boss by soldering. It should be noted that the support boss is made of metal, which enables the first PCB board 102 to be electrically connected to the conductive connecting post 108.

[0050] Reference Figure 1 as well as Figure 4 As shown, as an optional implementation, the second housing 101 is provided with a U-shaped structure 110, which is arranged around the wiring end 109. The opening direction of the U-shaped structure 110 is perpendicular to the axial direction of the conductive connection post 108.

[0051] It should be noted that, in this embodiment of the application, a U-shaped structure 110 is provided on the second housing 101. The U-shaped structure 110 is arranged along the periphery of the wiring end 109. The cable connecting the power supply and the three-phase motor can be accommodated through the opening of the U-shaped structure 110, that is, the cable can be inserted through the opening of the U-shaped structure 110 and electrically connected to the wiring end 109. In this embodiment of the application, the U-shaped structure 110 not only protects the wiring end 109, but also accommodates the cable, which is beneficial for a reliable and safe connection between the cable and the wiring end 109.

[0052] Reference Figure 2 as well as Figure 3 As shown, as an optional implementation, a support structure is also included, which includes a support plate 111 and a plurality of support plate connecting portions 112 disposed on the support plate 111; the support plate 111 is connected to the first PCB board 102 through the support plate connecting portions 112, and the support plate 111 has an insulating sleeve 113 that passes through the first through hole 106 and is sleeved on the outside of the conductive connecting post 108; a fastener 114 is provided between the first PCB board 102 and the second PCB board 103, so that the surface of the second PCB board 103 near the surface mount MOSFET 104 abuts against the support plate 111.

[0053] The embodiments of this application also include a support structure, which, along with fasteners 114, enables the first PCB board 102 and the second PCB board 103 to be stably mounted inside the mounting cavity.

[0054] In this embodiment, the fastener 114 includes an insert nut inserted on the first PCB board 102. The end of the insert nut away from the first PCB board 102 abuts against the second PCB board 103. The first PCB board 102 and the second PCB board 103 are fixed by inserting a screw connected to the insert nut from one side of the second PCB board 103.

[0055] It should be noted that the insert nut has a columnar structure, and its length is equal to the distance between the first PCB board 102 and the second PCB. In addition, multiple small insulating bosses are arranged at intervals around the periphery of the first PCB board 102, and the insert nut is arranged on the small insulating bosses.

[0056] Furthermore, refer to Figure 3 As shown, the support structure in this embodiment includes a support plate 111 and a plurality of support plate connecting parts 112 disposed on the support plate 111. The support plate connecting parts 112 can be sleeved on the outside of the insert nut and connected to the first PCB board 102 through the insert nut, or they can be directly connected to the first PCB board 102 through screws.

[0057] It should be noted that the support plate 111 is parallel to the first PCB board 102, and the support plate 111 has a large contact surface with the second PCB board 103, which can reliably support the second PCB board 103.

[0058] In this embodiment, the supporting structure has an insulating sleeve 113 sleeved on the outside of the conductive connecting post 108. The insulating sleeve 113 can achieve insulation between the conductive connecting post 108 and the second PCB board 103.

[0059] Reference Figure 3 As shown, as an optional implementation, the support plate 111 has a connection hole 115, and an inter-board connector 116 for connecting the first PCB board 102 and the second PCB board 103 is inserted into the connection hole 115.

[0060] Reference Figure 1 , Figure 2 as well as Figure 4 As shown, in one optional implementation, a pin connector 117 is provided on the second PCB board 103, and a pin connector joint 118 is provided on the outside of the second housing 101. A pin hole is opened on the pin connector joint 118, and the pin of the pin connector 117 passes through the pin hole.

[0061] It should be noted that, in this embodiment of the application, the pin connector 118 and the U-shaped structure 110 are located on the same plane, which facilitates wiring operations by the staff.

[0062] Reference Figure 5 As shown, in an optional embodiment, an annular groove 119 is formed on the first housing 100. The projections of the first PCB board 102 and the second PCB board 103 on the first housing 100 are located within the area enclosed by the annular groove 119. A sealing gasket 120 that abuts against the second housing 101 is embedded in the annular groove 119.

[0063] The annular groove 119 has a first fixing hole 121 spaced along its extension path. The first fixing hole 121 has a first connector that passes through the sealing gasket 120 and connects to the second housing 101. The annular groove 119 has a second fixing hole 122 within its range. The second fixing hole 122 has a second connector that connects to the first PCB board 102.

[0064] Among them, reference Figure 5 As shown, positioning grooves are provided at intervals along the extension path of the annular groove 119, and the sealing gasket 120 has positioning blocks 123 embedded in the positioning grooves.

[0065] The embodiment of this application enhances the sealing of the installation chamber by setting the sealing gasket 120, preventing foreign objects such as dust from entering the installation chamber and achieving effective protection for internal components.

[0066] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A controller, characterized in that, The system includes a first housing (100) and a second housing (101); the first housing (100) and the second housing (101) are fastened together to form an installation chamber; a first PCB board (102) and a second PCB board (103) are arranged in parallel and spaced apart in the installation chamber; a plurality of surface-mount MOSFETs (104) are arranged at intervals on the surface of the first PCB board (102) near the second PCB board (103); a first through hole (106) is opened on the second PCB board (103), and a second through hole (107) is opened on the second housing (101); a conductive connecting post (108) is vertically arranged on the first PCB board (102), and the conductive connecting post (108) has a wiring end (109) away from the first housing (100), and the conductive connecting post (108) passes through the first through hole (106) and the second through hole (107), so that the wiring end (109) is located outside the installation chamber.

2. The controller according to claim 1, characterized in that, The second housing (101) is provided with a U-shaped structure (110), which is arranged around the terminal (109). The opening direction of the U-shaped structure (110) is perpendicular to the axial direction of the conductive connecting post (108).

3. The controller according to claim 2, characterized in that, There are two sets of conductive connecting posts (108). The wiring end (109) of the first set of conductive connecting posts (108) is used to connect the positive and negative terminals of the power supply, and the wiring end (109) of the second set of conductive connecting posts (108) is used to connect the load.

4. The controller according to any one of claims 1-3, characterized in that, It also includes a support structure, which includes a support plate (111) and a plurality of support plate connecting parts (112) disposed on the support plate (111); the support plate (111) is connected to the first PCB board (102) through the support plate connecting parts (112), and the support plate (111) has an insulating sleeve (113) that passes through the first through hole (106) and is sleeved outside the conductive connecting post (108); a fastener (114) is provided between the first PCB board (102) and the second PCB board (103) so that the surface of the second PCB board (103) near the surface mount MOS transistor (104) abuts against the support plate (111).

5. The controller according to claim 4, characterized in that, The support plate (111) has a connection hole (115), and an inter-board connector (116) for connecting the first PCB board (102) and the second PCB board (103) is inserted into the connection hole (115).

6. The controller according to any one of claims 1-3, characterized in that, The second PCB board (103) is provided with a pin connector (117), and the second housing (101) is provided with a pin connector connector (118) on the outside. The pin connector connector (118) has a pin hole, and the pin of the pin connector (117) passes through the pin hole.

7. The controller according to any one of claims 1-3, characterized in that, An annular groove (119) is formed on the first housing (100). The projections of the first PCB board (102) and the second PCB board (103) on the first housing (100) are located within the area enclosed by the annular groove (119). A sealing gasket (120) that abuts against the second housing (101) is embedded in the annular groove (119).

8. The controller according to claim 7, characterized in that, The annular groove (119) has a first fixing hole (121) spaced along its extension path. The first fixing hole (121) has a first connector that passes through the sealing gasket (120) and connects to the second housing (101). The annular groove (119) has a second fixing hole (122) within its enclosure. The second fixing hole (122) has a second connector that connects to the first PCB board (102).

9. The controller according to claim 7, characterized in that, Positioning grooves are provided at intervals along the extension path of the annular groove (119), and the sealing gasket (120) has a positioning block (123) embedded in the positioning groove.

10. The controller according to any one of claims 1-3, characterized in that, The first PCB board (102) is provided with a support boss, which is used to support the conductive connecting post (108).

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