Air cooling and water cooling combined radiator

By designing a heatsink that combines air cooling and water cooling, utilizing semiconductor cooling chips and water-cooling guide plates, along with a ventilation shroud and a cooling fan, the problem of combining air cooling and water cooling is solved, achieving a more efficient heat dissipation effect.

CN223515209UActive Publication Date: 2025-11-04XINYANG TONGYU ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202422918722.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-28
Publication Date
2025-11-04
Estimated Expiration
2034-11-28

AI Technical Summary

Technical Problem

In existing technologies, air-cooled and water-cooled radiators are difficult to combine, resulting in insufficient heat dissipation speed of heat-generating objects and failure to meet heat dissipation requirements.

Method used

Design a heat sink that combines air cooling and water cooling. It uses a semiconductor cooling chip and a water cooling guide plate inside the casing, combined with a ventilation shroud and a cooling fan, to achieve the combined heat dissipation effect of air cooling and water cooling.

Benefits of technology

It improves the heat dissipation speed of heat-generating objects, meets the heat dissipation requirements of heat-generating objects, and enhances the heat dissipation effect by combining air cooling and water cooling.

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Abstract

The utility model discloses an air cooling and water cooling combined radiator which comprises a shell, a ventilation hood is arranged in the shell, the left end and the right end of the ventilation hood both penetrate through the shell and extend into the shell, the bottom face of the ventilation hood is fixedly communicated with an air inlet hood, the bottom end of the air inlet hood penetrates through the shell and extends to the lower portion of the shell, and the air inlet hood is fixedly communicated with the bottom face of the ventilation hood. A semiconductor chilling plate is fixedly embedded in the inner wall of the shell, a plurality of cooling fins are fixedly connected to the back face of the semiconductor chilling plate, a water cooling guide plate is fixedly embedded in the front face of the shell, two supporting covers are fixedly embedded in the outer surface of a ventilation cover, and supporting plates are fixedly connected to the inner walls of the two supporting covers. And heat dissipation fans are fixedly mounted on the side faces, close to each other, of the two supporting plates correspondingly, and the two heat dissipation fans are located in the two supporting covers correspondingly. The heat dissipation device has the characteristic of combining air cooling and water cooling for heat dissipation, can meet the heat dissipation requirement of a heating object, and improves the heat dissipation speed of the heating object.
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Description

Technical Field

[0001] This application relates to the field of radiator technology, and more particularly to a radiator that combines air cooling and water cooling. Background Technology

[0002] A radiator is a device used to transfer heat from one object to another or to dissipate heat into the surrounding environment. Radiators use three heat transfer methods—conduction, convection, and radiation—to achieve heat dissipation. When a heat-generating object comes into direct contact with a radiator, heat is transferred from the object with a higher temperature to the radiator with a lower temperature through the thermal motion of molecules. A radiator is a collective term for a series of devices used to conduct and release heat.

[0003] Current heat sinks are typically either air-cooled or water-cooled. Air cooling uses flowing air to dissipate heat from the product, while water cooling uses a cooling medium. However, it is currently difficult to combine air cooling and water cooling. Air cooling or water cooling alone cannot meet the heat dissipation requirements of heat-generating objects, thereby reducing the heat dissipation rate. Therefore, to solve the above problems, we provide a heat sink that combines air cooling and water cooling. Utility Model Content

[0004] The purpose of this invention is to provide a heat sink that combines air cooling and water cooling to solve the problems mentioned in the background art.

[0005] The embodiments of this application adopt the following technical solutions:

[0006] A combined air-cooled and water-cooled radiator includes a housing. An internal ventilation shroud is provided within the housing. Both ends of the ventilation shroud penetrate the housing and extend into its interior. An air inlet shroud is fixedly connected to the bottom surface of the ventilation shroud. The bottom end of the air inlet shroud penetrates the housing and extends to the lower part of the housing. A semiconductor cooling chip is fixedly embedded in the inner wall of the housing. Multiple heat sinks are fixedly connected to the back of the semiconductor cooling chip. A water-cooling guide plate is fixedly embedded in the front of the housing. Two support covers are fixedly embedded in the outer surface of the ventilation shroud. Support plates are fixedly connected to the inner walls of both support covers. Cooling fans are fixedly installed on the sides of the two support plates that are close to each other. The two cooling fans are located inside the two support covers, respectively.

[0007] Preferably, a filter screen is provided below the air inlet hood, and two fixing screws are fixedly connected to the bottom surface of the housing. The bottom ends of the two fixing screws penetrate the filter screen and extend to the bottom of the filter screen. Locking nuts are threaded onto the outer surfaces of the two fixing screws, and the top ends of the two locking nuts are in contact with the bottom surface of the filter screen.

[0008] Preferably, the upper surface of the housing is provided with a liquid injection port, and a threaded sealing plug is provided above the liquid injection port, the outer surface of the threaded sealing plug being adapted to the inner wall of the liquid injection port.

[0009] Preferably, two sets of mounting components are fixedly connected to the outer surface of the housing, and mounting holes are provided on the outer surface of both sets of mounting components.

[0010] Preferably, the housing has fixing openings on both the left and right sides, and the inner walls of the two fixing openings are fixedly connected to the outer surface of the ventilation hood.

[0011] Preferably, two sets of reinforcing blocks are fixedly connected to the outer surface of the ventilation hood, and the back sides of the two sets of reinforcing blocks are fixedly connected to the front side of the shell.

[0012] The above-described technical solutions adopted in the embodiments of this application can achieve the following beneficial effects:

[0013] This combined air-cooling and water-cooling radiator, through its housing design, allows for the injection of coolant. Simultaneously, the use of semiconductor cooling chips enables the cooling of the liquid inside the housing. Water-cooling guide plates facilitate heat conduction and cooling of the surface of heat-generating objects, providing initial water-cooling. The design includes ventilation and intake shrouds, and the suction generated by two cooling fans allows external air to circulate within these shrouds. The coolant further cools the air circulating within these shrouds, and the cooling fans then expel the cooled air, achieving a final air-cooling effect on the surface of heat-generating objects. This combined air-cooling and water-cooling design effectively meets the heat dissipation needs of heat-generating objects and improves the speed of heat dissipation. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0015] Figure 1 The following is a three-dimensional structural schematic diagram of the front view of the air-cooled and water-cooled heat sink of this utility model;

[0016] Figure 2 See: A sectional view of the front view of the air-cooled and water-cooled combined radiator of this utility model;

[0017] Figure 3 See: A three-dimensional structural schematic diagram of the rear view of the air-cooled and water-cooled heat sink of this utility model;

[0018] Figure 4 This is a top view and cross-sectional view of the air-cooled and water-cooled heat sink of this utility model.

[0019] In the diagram: 1. Housing; 2. Ventilation hood; 3. Air inlet hood; 4. Filter screen; 5. Locking nut; 6. Fixing screw; 7. Fixing port; 8. Support cover; 9. Support plate; 10. Cooling fan; 11. Reinforcing block; 12. Water-cooled guide plate; 13. Liquid injection port; 14. Threaded sealing plug; 15. Mounting component; 16. Mounting hole; 17. Semiconductor cooling chip; 18. Heat sink. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] The technical solutions provided by the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0022] Please see Figure 1-4 This utility model provides a radiator solution that combines air cooling and water cooling:

[0023] A combined air-cooled and water-cooled radiator includes a housing 1. A ventilation hood 2 is located inside the housing 1. Both ends of the ventilation hood 2 penetrate the housing 1 and extend into its interior. An air inlet hood 3 is fixedly connected to the bottom surface of the ventilation hood 2. The bottom end of the air inlet hood 3 penetrates the housing 1 and extends below it. A semiconductor cooling chip 17 is fixedly embedded in the inner wall of the housing 1. The semiconductor cooling chip 17 is a known existing cooling device. Multiple heat sinks 18 are fixedly connected to the back of the semiconductor cooling chip 17. A water-cooling guide plate 12 is fixedly embedded in the front of the housing 1. Two support covers 8 are fixedly embedded in the outer surface of the ventilation hood 2. Support plates 9 are fixedly connected to the inner walls of both support covers 8. Cooling fans 10 are fixedly installed on the sides of the two support plates 9 that are close to each other. The two cooling fans 10 are located inside the two support covers 8. Through the housing 1 and the semiconductor cooling chip 17, the water inside the housing 1 can be cooled. Through the water-cooling guide plate 12, the coolant can conduct heat to the surface of the heat-generating object, achieving initial water-cooling and heat dissipation.

[0024] In this embodiment, a filter screen plate 4 is provided below the air inlet hood 3. Two fixing screws 6 are fixedly connected to the bottom surface of the housing 1. The bottom ends of the two fixing screws 6 penetrate the filter screen plate 4 and extend to the bottom of the filter screen plate 4. Locking nuts 5 are threadedly connected to the outer surfaces of the two fixing screws 6. The top ends of the two locking nuts 5 are in contact with the bottom surface of the filter screen plate 4. A liquid injection port 13 is provided on the upper surface of the housing 1. A threaded sealing plug 14 is provided above the liquid injection port 13. The outer surface of the threaded sealing plug 14 is adapted to the inner wall of the liquid injection port 13. Specifically, the filter screen plate 4 can be installed below the air inlet hood 3 by fixing screws 6 and locking nuts 5. The installation of the filter screen plate 4 plays the role of filtering dust during ventilation. The liquid injection port 13 can be used to inject coolant. The threaded sealing plug 14 can seal the liquid injection port 13 to prevent coolant leakage.

[0025] In this embodiment, two sets of mounting parts 15 are fixedly connected to the outer surface of the housing 1. The outer surfaces of the two sets of mounting parts 15 are provided with mounting holes 16. Fixing openings 7 are provided on both the left and right sides of the housing 1. The inner walls of the two fixing openings 7 are fixedly connected to the outer surface of the ventilation hood 2. Two sets of reinforcing blocks 11 are fixedly connected to the outer surface of the ventilation hood 2. The back sides of the two sets of reinforcing blocks 11 are fixedly connected to the front side of the housing 1. Specifically, the housing 1 can be installed and fixed through the mounting parts 15 and the mounting holes 16. The ventilation hood 2 can be easily installed using the fixing openings 7. The setting of the two sets of reinforcing blocks 11 will deepen the fixation of the ventilation hood 2, making the ventilation hood 2 more stable during heat dissipation.

[0026] Working principle: First, the housing 1 is installed and fixed through the mounting part 15 and mounting hole 16. Then, the threaded sealing plug 14 is removed, and coolant is injected into the interior of the housing 1 through the injection port 13. Then, the semiconductor cooling chip 17 is started to run, which can cool the water inside the housing 1. At the same time, the water cooling guide plate 12 can conduct and cool the surface of the heat-generating object through the coolant. The operation of the two cooling fans 10 can create a negative pressure state inside the ventilation hood 2, which will allow external air to flow into the interior of the housing 1 through the air inlet hood 3 and circulate inside the ventilation hood 2. Moreover, the coolant inside the housing 1 can cool the air circulating inside the ventilation hood 2 and the air inlet hood 3, forming low-temperature gas. This low-temperature gas can be better blown and cooled onto the surface of the heat-generating object by the cooling fans 10.

[0027] The above description is merely an embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this application should be included within the scope of the claims of this application. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that this utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model.

Claims

1. A combined air-cooled and water-cooled radiator, comprising a housing (1), characterized in that: The housing (1) is provided with a ventilation hood (2) inside. Both ends of the ventilation hood (2) penetrate the housing (1) and extend into the interior of the housing (1). The bottom surface of the ventilation hood (2) is fixedly connected to an air inlet hood (3). The bottom end of the air inlet hood (3) penetrates the housing (1) and extends to the bottom of the housing (1). A semiconductor cooling chip (17) is fixedly embedded in the inner wall of the housing (1). Multiple heat sinks (18) are fixedly connected to the back of the semiconductor cooling chip (17). A water-cooled guide plate (12) is fixedly embedded in the front of the housing (1). Two support covers (8) are fixedly embedded in the outer surface of the ventilation hood (2). A support plate (9) is fixedly connected to the inner wall of the two support covers (8). A cooling fan (10) is fixedly installed on the side of the two support plates (9) that are close to each other. The two cooling fans (10) are located inside the two support covers (8).

2. The air-cooled and water-cooled combined radiator according to claim 1, characterized in that: The air inlet hood (3) is provided with a filter screen plate (4) below it. The bottom surface of the housing (1) is fixedly connected with two fixing screws (6). The bottom ends of the two fixing screws (6) penetrate the filter screen plate (4) and extend to the bottom of the filter screen plate (4). The outer surfaces of the two fixing screws (6) are threaded with locking nuts (5). The top ends of the two locking nuts (5) are in contact with the bottom surface of the filter screen plate (4).

3. A combined air-cooled and water-cooled radiator according to claim 1, characterized in that: The upper surface of the housing (1) is provided with a liquid injection port (13), and a threaded sealing plug (14) is provided above the liquid injection port (13). The outer surface of the threaded sealing plug (14) is adapted to the inner wall of the liquid injection port (13).

4. A combined air-cooled and water-cooled radiator according to claim 1, characterized in that: Two sets of mounting parts (15) are fixedly connected to the outer surface of the housing (1), and mounting holes (16) are opened on the outer surface of both sets of mounting parts (15).

5. A combined air-cooled and water-cooled radiator according to claim 1, characterized in that: The housing (1) has fixing openings (7) on both the left and right sides, and the inner walls of the two fixing openings (7) are fixedly connected to the outer surface of the ventilation hood (2).

6. A combined air-cooled and water-cooled radiator according to claim 1, characterized in that: Two sets of reinforcing blocks (11) are fixedly connected to the outer surface of the ventilation hood (2), and the back sides of the two sets of reinforcing blocks (11) are fixedly connected to the front side of the shell (1).