Frame discharging device

Abstract

The utility model discloses a frame discharging device, and belongs to the field of semiconductor production equipment. The frame discharging device comprises a transfer table, a positioning jig, a moving assembly and a thickness clamping jaw, the transfer table is arranged on one side of the frame feeding device, the moving assembly and the positioning jig are arranged on one side of the transfer table, the thickness clamping jaw is connected with the moving assembly, and the moving assembly is used for driving the thickness clamping jaw to move between the transfer table and the positioning jig. The thickness clamping jaws are used for clamping the upper surface and the lower surface of the frame. According to the utility model, the thickness clamping jaw is matched with the thickness of the framework, so that the applicable framework types of the clamping jaw are greatly increased, and the problem that the applicable framework types of the clamping jaw in the prior art are few is solved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of semiconductor production equipment, and specifically relates to a frame discharging device. BACKGROUND

[0002] In the prior art, the frame discharging device of the semiconductor plastic packaging system comprises a transfer table, a three-axis moving assembly, a clamping jaw and a positioning jig. After the frame loading device pushes the frame in the material box onto the transfer table, the three-axis moving assembly drives the clamping jaw to move onto the positioning jig. The clamping jaw of the prior art cooperates with the width of the frame. When the semiconductor frame is adjusted and designed, the width structure of the frame generally needs to be adjusted, and the thickness of the frame is rarely adjusted. At this time, the clamping jaw structure needs to be adjusted together with the frame, and the problem of few types of frames suitable for the clamping jaw exists. SUMMARY

[0003] The utility model discloses a frame discharging device, the thickness of the clamping jaw cooperates with the thickness of the frame, the clamping jaw clamps the frame from the thickness direction of the frame, greatly increases the types of frames suitable for the clamping jaw, and solves the problem of few types of frames suitable for the clamping jaw in the prior art.

[0004] The technical scheme of the utility model is as follows: a frame discharging device is arranged on one side of a frame loading device.

[0005] The frame discharging device comprises a transfer table, a positioning jig, a moving assembly and a thickness clamping jaw.

[0006] The transfer table is arranged on one side of the frame loading device, the moving assembly and the positioning jig are arranged on one side of the transfer table, and the thickness clamping jaw is connected with the moving assembly.

[0007] The moving assembly is used for driving the thickness clamping jaw to move between the transfer table and the positioning jig.

[0008] The thickness clamping jaw is used for clamping the upper surface and the lower surface of the frame.

[0009] In a further embodiment, the moving assembly comprises a clamping jaw transverse moving mechanism and a clamping jaw vertical moving mechanism connected with the clamping jaw transverse moving mechanism.

[0010] The clamping jaw transverse moving mechanism is arranged on one side of the transfer table and the positioning jig, and the thickness clamping jaw is installed on the clamping jaw vertical moving mechanism.

[0011] The clamping jaw transverse moving mechanism is used for driving the thickness clamping jaw to move in the transverse direction.

[0012] The clamping jaw vertical moving mechanism is used for driving the thickness clamping jaw to move in the vertical direction.

[0013] In a further embodiment, the moving assembly further comprises a jig longitudinal moving mechanism.

[0014] The positioning jig is installed on a jig longitudinal movement mechanism for driving the positioning jig to move in a longitudinal direction, facilitating the semiconductor plastic packaging system to take materials from the positioning jig, releasing the space above the positioning jig, and facilitating adjustment of the structure of the positioning jig.

[0015] In a further embodiment, the movement assembly further comprises a jig rotating mechanism.

[0016] The jig rotating mechanism is installed between the jig longitudinal movement mechanism and the positioning jig, and is used for driving the positioning jig to rotate, so that the angle of the upper frame of the positioning jig can be adjusted, and the semiconductor plastic packaging system is further facilitated to take materials from the positioning jig.

[0017] In a further embodiment, the transfer station and the positioning jig are provided with track grooves.

[0018] The positioning jig is further provided with a positioning groove on the track groove.

[0019] In a further embodiment, support ribs are arranged between the track grooves of the frame placement track.

[0020] The upper surface of the support rib is in contact with the lower surface of the frame in the positioning groove, so that the support force can be provided for the frame when the semiconductor plastic packaging system takes materials from the positioning jig.

[0021] The beneficial effects of the present application are: the thickness clamping jaw is matched with the thickness of the frame, the thickness clamping jaw clamps the upper surface and the lower surface of the frame from the thickness direction of the frame, then the movement assembly drives the thickness clamping jaw to move the frame on the transfer station to the positioning jig, greatly increasing the types of frames suitable for the clamping jaw, and solving the problem of few types of frames suitable for the clamping jaw in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is an axial measurement schematic view of the frame material arrangement device of the present application, which is arranged on one side of the frame material loading device.

[0023] Figure 2 is an axial measurement schematic view of the frame material arrangement device of the present application.

[0024] Figure 3 is an axial measurement schematic view of the positioning jig of the present application.

[0025] Figure 4 is an axial measurement schematic view of the jig rotating mechanism installed on the jig longitudinal movement mechanism of the present application.

[0026] The attached figures are labeled as follows: frame feeding device 1, frame discharging device 2, transfer table 21, positioning fixture 22, track groove 221, positioning groove 222, support rib 223, moving component 23, gripper lateral moving mechanism 231, gripper vertical moving mechanism 232, fixture longitudinal moving mechanism 233, fixture rotating mechanism 234, and thickness gripper 24. Detailed Implementation

[0027] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the invention. However, it will be apparent to those skilled in the art that the invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid obscuring the invention.

[0028] This application discloses a frame feeding device 2, which is disposed on one side of a prior art frame feeding device 1. The frame feeding device 2 and the frame feeding device 1 are used in a semiconductor molding and packaging system. The power components such as motors and cylinders of the frame feeding device 2 and the frame feeding device 1, as well as the sensors, are connected to the control equipment such as PLC of the semiconductor molding and packaging system. The frame feeding device 2 uses a thickness gripper 24 to cooperate with the thickness of the frame, so that the gripper clamps the frame from the thickness direction of the frame, which greatly increases the types of frames that the gripper is applicable to and solves the problem of the limited types of frames that the gripper is applicable to in the prior art.

[0029] like Figures 1-3 The frame discharge device 2 shown includes: a transfer table 21, a positioning fixture 22, a moving component 23, and a thickness gripper 24.

[0030] The transfer station 21 is located on one side of the frame feeding device 1, the moving component 23 and the positioning fixture 22 are located on one side of the transfer station 21, and the thickness gripper 24 is connected to the moving component 23.

[0031] The moving component 23 is used to move the thickness gripper 24 between the transfer table 21 and the positioning fixture 22.

[0032] Thickness grippers 24 are used to clamp the upper and lower surfaces of the frame, such as... Figure 2 The thickness of the gripper 24 shown is a gripper cylinder.

[0033] like Figure 2 The moving assembly 23 shown for controlling the movement of the thickness gripper 24 includes: a gripper lateral moving mechanism 231, and a gripper vertical moving mechanism 232 connected to the gripper lateral moving mechanism 231.

[0034] The lateral movement mechanism 231 of the gripper is located on one side of the transfer table 21 and the positioning fixture 22, and the thickness gripper 24 is installed on the vertical movement mechanism 232 of the gripper.

[0035] The gripper lateral movement mechanism 231 is used to drive the thickness gripper 24 to move in the lateral direction, such as... Figure 2 The gripper lateral movement mechanism 231 shown is a lead screw mechanism that extends in the lateral direction.

[0036] The gripper vertical moving mechanism 232 is used to drive the thickness gripper 24 to move vertically, such as... Figure 2 The vertical moving mechanism 232 shown is a cylinder arranged in the vertical direction.

[0037] like Figure 2 The moving component 23 shown for controlling the movement of the positioning fixture 22 includes: a fixture longitudinal moving mechanism 233, on which the positioning fixture 22 is mounted, and the fixture longitudinal moving mechanism 233 is used to drive the positioning fixture 22 to move in the longitudinal direction, such as... Figure 2 The longitudinal movement mechanism 233 of the fixture shown is a combination of an electric cylinder and a guide rail mechanism that extend in the longitudinal direction. In other embodiments, a gear and rack mechanism, an electric cylinder, or other mechanisms can also be used as the lateral movement mechanism 231 of the gripper, the vertical movement mechanism 232 of the gripper, and the longitudinal movement mechanism 233 of the fixture.

[0038] like Figure 4 In a further embodiment shown, the moving component 23 for controlling the movement of the positioning fixture 22 further includes a fixture rotation mechanism 234, which is installed between the fixture longitudinal moving mechanism 233 and the positioning fixture 22. The fixture rotation mechanism 234 is used to drive the positioning fixture 22 to rotate, such as... Figure 4 The jig rotation mechanism 234 shown is a rotation mechanism combining a motor and a pulley. In other embodiments, a rotation mechanism combining a motor and gears, or a rotation mechanism such as a rotary cylinder, can also be used.

[0039] Regarding the transfer station 21 and the positioning fixture 22, such as Figure 2 The transfer platform 21 and the positioning fixture 22 shown are both track structures, and the transfer platform 21 and the positioning fixture 22 are provided with track grooves 221.

[0040] The positioning fixture 22 also has a positioning groove 222 on its track groove 221. The position of the positioning groove 222 can be designed and adjusted according to the position of the material handling mechanism of the semiconductor molding and packaging system, such as... Figure 2 The setup shown has two positioning fixtures 22 arranged side by side, such as... Figure 3 Each positioning fixture 22 shown has two positioning slots 222. When the positioning slot 222 of one positioning fixture 22 is full of semiconductor frames, the longitudinal moving mechanism 233 of the fixture can be used to drive the track slot 221 of the other positioning fixture 22 to align with the transfer table 21, and then place the semiconductor frames on the other positioning fixture 22.

[0041] likeFigure 3 In a further embodiment shown, support ribs 223 are arranged between the track slots 221 of the frame placement track.

[0042] The upper surface of the support ribs 223 is in contact with the lower surface of the frame in the positioning slot 222.

[0043] Working method: the frame feeding device 1 first places the semiconductor frame on the transfer table 21 of the frame discharging device 2, then moves the semiconductor frame on the transfer table 21 to the positioning jig 22 through the cooperation of the moving assembly 23, the thickness clamping jaw 24 and the positioning jig 22, when a predetermined number of semiconductor frames are placed on the positioning jig 22, the moving assembly 23 drives the positioning jig 22 to move to the end away from the thickness clamping jaw 24, and can drive the positioning jig 22 to rotate by a predetermined angle, so that the angle of the semiconductor frame on the positioning jig 22 is matched with the semiconductor plastic packaging system, which facilitates the semiconductor plastic packaging system to take the material from the positioning jig 22.

[0044] When it is necessary to adjust the positioning jig 22, the moving assembly 23 drives the positioning jig 22 to move to the end away from the thickness clamping jaw 24 to release the space above the positioning jig 22.

[0045] As described above, although the present application has been shown and described with respect to certain preferred embodiments, it is to be understood that the application is not to be limited to the specific embodiments shown and described. Various changes in form and detail can be made without departing from the spirit and scope of the application as defined in the appended claims.

Claims

1. A frame discharging device arranged on one side of a frame feeding device; characterized in that The frame discharging device comprises a transfer table, a positioning jig, a moving assembly and a thickness clamp jaw; The transfer table is arranged on one side of the frame feeding device, the moving assembly and the positioning jig are arranged on one side of the transfer table, and the thickness clamp jaw is connected with the moving assembly; The moving assembly is used to drive the thickness clamp jaw to move between the transfer table and the positioning jig; The thickness clamp jaw is used to clamp the upper surface and the lower surface of the frame.

2. A frame discharge apparatus according to claim 1, wherein The moving assembly comprises a clamp jaw transverse moving mechanism and a clamp jaw vertical moving mechanism connected with the clamp jaw transverse moving mechanism; The clamp jaw transverse moving mechanism is arranged on one side of the transfer table and the positioning jig, and the thickness clamp jaw is installed on the clamp jaw vertical moving mechanism; The clamp jaw transverse moving mechanism is used to drive the thickness clamp jaw to move in the transverse direction; The clamp jaw vertical moving mechanism is used to drive the thickness clamp jaw to move in the vertical direction.

3. The frame discharge apparatus of claim 1, wherein The moving assembly further comprises a jig longitudinal moving mechanism; The positioning jig is installed on the jig longitudinal moving mechanism, and the jig longitudinal moving mechanism is used to drive the positioning jig to move in the longitudinal direction.

4. The frame discharge apparatus of claim 3, wherein The moving assembly further comprises a jig rotating mechanism; The jig rotating mechanism is installed between the jig longitudinal moving mechanism and the positioning jig, and the jig rotating mechanism is used to drive the positioning jig to rotate.

5. The frame discharge apparatus of claim 1, wherein The transfer table and the positioning jig are provided with track grooves; The positioning jig is further provided with a positioning groove on the track groove.

6. A frame discharge apparatus according to claim 5, wherein Supporting ribs are arranged between the track grooves of the frame placing track; The upper surface of the supporting rib is in contact with the lower surface of the frame in the positioning groove.

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